CN221065799U

CN221065799U - Automatic activation wafer wiping machine

Info

Publication number: CN221065799U
Application number: CN202322422496.9U
Authority: CN
Inventors: 程甜; 杨伟雄; 邵杰超
Original assignee: Dongguan Hanji Information Technology Co ltd
Current assignee: Dongguan Hanji Information Technology Co ltd
Priority date: 2023-09-07
Filing date: 2023-09-07
Publication date: 2024-06-04
Anticipated expiration: 2033-09-07

Abstract

The utility model discloses an automatic activation wafer wiping machine, which comprises a machine table, wherein the machine table is provided with a feeding mechanism, a discharging mechanism, a transferring mechanism, a wiping mechanism, a soaking mechanism and a drying mechanism; the transfer mechanism is arranged at the center of the machine table, and the feeding mechanism, the wiping mechanism, the soaking mechanism, the drying mechanism and the discharging mechanism are distributed on the periphery of the machine table in an annular array with the transfer mechanism as the center; the utility model has simple structure and convenient and quick use, and the whole wiping process is realized rapidly by collecting the materials, wiping, soaking, drying and discharging in one device, the whole device adopts a dust-free environment, the wafer is transferred by a fork manipulator, the wafer is wiped by a wiping grinding head with IPA solution, the wiped wafer is soaked in the IPA solution, and finally the wafer is dried by nitrogen to carry out concentrated discharging, so that the production efficiency is improved, and the production cost of enterprises is reduced.

Description

Automatic activation wafer wiping machine

Technical Field

The utility model relates to the technical field of wafer wiping machines, in particular to an automatic activation wafer wiping machine.

Background

In the chip processing and preparation process, the used wafer needs to be polished, a wafer polishing device is used, the surface of the wafer is polished, after polishing, the next wiping processing is performed, the IPA is wiped on the surface of the wafer to achieve the activation effect, and the next processing is performed.

At present, polishing equipment on the market has only an independent polishing function, after polishing treatment is carried out on a wafer, the wafer needs to be taken out and transferred to a next station for treatment, so that fine dust is easy to adhere to the outer surface of the wafer in the transfer process, a large amount of time and personnel are required to be consumed in the multiple transfer process, the production cost of enterprises is increased, and the process is quite inconvenient.

Therefore, a new technical solution is needed to solve the above problems.

Disclosure of utility model

In view of the above, the present utility model aims at overcoming the drawbacks of the prior art, and its main objective is to provide an automatic activated wafer cleaning machine.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

an automatic activation wafer wiping machine comprises a machine table, wherein a feeding mechanism, a discharging mechanism, a transferring mechanism, a wiping mechanism, a soaking mechanism and a drying mechanism are arranged on the machine table;

The transfer mechanism is arranged at the center of the machine table, the feeding mechanism, the wiping mechanism, the soaking mechanism, the drying mechanism and the discharging mechanism are sequentially distributed on the periphery of the machine table in an annular array mode by taking the transfer mechanism as a center, and the transfer mechanism is used for transferring and placing the wafer of the feeding mechanism on the wiping mechanism, the soaking mechanism and the drying mechanism for processing and processing, and then placing the wafer on the discharging mechanism after processing is finished.

Preferably, the feeding mechanism comprises a feeding base and a feeding disc, the feeding base is fixedly mounted on the machine table through bolts, the feeding disc is slidably mounted on the feeding base, and a first stop mechanism which extends upwards and is used for preventing the feeding disc from moving backwards is arranged on the lower end face of the feeding base.

Preferably, the transferring mechanism comprises a first transferring manipulator and a second transferring manipulator, the first transferring manipulator and the second transferring manipulator are arranged side by side, the first transferring manipulator is used for transferring the wafer on the feeding mechanism to the wiping mechanism, and the second transferring manipulator is used for transferring the wafer after wiping treatment from the wiping mechanism to the soaking mechanism;

The first transfer manipulator and the second transfer manipulator are both provided with a tooth fork mechanism, the tooth fork mechanism comprises a tooth fork base and a tooth fork arm, one end of the tooth fork base is arranged on the first transfer manipulator and the second transfer manipulator, the tooth fork arm is arranged at the other end of the tooth fork base and is controlled by the tooth fork arm to rotate, the front end of the tooth fork arm is provided with a vacuum suction nozzle, the tooth fork arm rotates to extend into the lower part of a wafer and gradually upwards approaches the wafer, and the vacuum suction nozzle is used for adsorbing the lower end face of the fixed wafer to prevent falling off when moving.

As one preference, still be equipped with positioning mechanism between feed mechanism and the wiping mechanism, positioning mechanism includes supporting seat, mobilizable location movable seat and is used for driving the location cylinder that the movable seat removed, the movable seat sets up respectively at the left and right sides both ends of supporting seat, the location cylinder is placed in the below of supporting seat and is connected the location movable seat of drive both sides simultaneously, first transfer manipulator is placed the wafer transfer on the feed mechanism on positioning mechanism through tooth fork mechanism, and the location movable seat that is located both sides end draws close to and makes the wafer move in the centre simultaneously, and after the location finishes, the location movable seat is removed to both sides outer end, is passed through tooth fork mechanism again and is placed the wafer transfer on the wiping mechanism by first transfer manipulator.

As one preferable mode, the wiping mechanism comprises a protective shell, a wiping turntable and a wiping grinding head, wherein the wiping turntable is arranged in the protective shell, the wiping grinding head is arranged outside the protective shell, a first wiping driving mechanism for driving the wiping turntable to rotate is arranged below the wiping turntable, a plurality of fixing holes for placing and fixing wafers are formed in the wiping turntable, an upward jacking mechanism and a vacuum chuck are arranged in the fixing holes, the jacking mechanism moves upwards and is abutted against the lower end face of the wafers, a first transfer manipulator places the wafers on the jacking mechanism, and the jacking mechanism recovers downwards and enables the wafers to slowly move to be placed in the fixing holes and to be adsorbed and fixed by the vacuum chuck;

The cleaning grinding head is provided with a grinding head lifting mechanism for controlling the cleaning grinding head to move up and down and a second cleaning driving mechanism for controlling the running state of the cleaning grinding head, dust-free cleaning cloth is arranged on the cleaning grinding head, the grinding head lifting mechanism controls the cleaning grinding head to move downwards and approach the cleaning turntable, and the cleaning grinding head is used for cleaning a wafer fixed on the cleaning turntable; the wiped wafer is lifted up by the lifting mechanism, and the second transfer manipulator controls the tooth fork mechanism to transfer the wafer to the soaking mechanism for soaking treatment.

Preferably, the soaking mechanism comprises a soaking tank, a soaking rack and a soaking lifting mechanism, wherein the soaking lifting mechanism is arranged at the side end of the soaking tank, the soaking lifting mechanism controls the soaking rack to move up and down and enable the soaking rack to be located above the soaking tank, and the soaking rack is used for receiving the processed wafers and enabling the adjacent wafers to be placed in the soaking tank at a certain interval for soaking treatment.

Preferably, the soaking tank is provided with a liquid inlet hole and a liquid outlet hole for allowing the solution to enter/flow out, the outer end of the soaking tank is provided with an electromagnetic control valve and a solution flow switch for detecting whether the solution flows in or not, the electromagnetic control valve is used for controlling the liquid to enter/flow out of the soaking tank, and the soaking tank is also internally provided with a liquid level detection device for detecting the liquid level height position of the internal liquid; the liquid used in the soaking tank is IPA solution.

As one preferable mode, a protective cover is arranged above the drying mechanism and covers the protective cover, transfer windows are arranged on two sides of the protective cover for the second transfer manipulator to transfer the soaked wafer to the drying mechanism, the drying mechanism is provided with a plurality of drying frames for bearing the wafer to be dried, a nitrogen supply device for injecting nitrogen into the protective cover is arranged at the lower end of the machine, and the second transfer manipulator stretches the wafer from the transfer windows on the protective cover and places the wafer on the drying frames, and the nitrogen supply device injects nitrogen into the protective cover for wafer drying treatment.

Preferably, the outer side end of the drying mechanism is further provided with a discharging and transferring manipulator, the discharging and transferring manipulator is provided with a tooth fork mechanism, and the discharging and transferring manipulator stretches into the protective cover through the transmission window and transfers and places the dried wafer on the discharging mechanism.

Preferably, the blanking mechanism comprises a blanking base and a blanking disc, the blanking base is fixedly mounted on the machine table through bolts, the blanking disc is slidably mounted on the blanking base, and a second stop mechanism which extends upwards and is used for preventing the blanking disc from moving backwards is arranged on the lower end face of the blanking base.

Compared with the prior art, the utility model has obvious advantages and beneficial effects, and in particular, the technical scheme can be as follows: the utility model has simple structure and convenient and quick use, and the whole wiping process is realized rapidly by collecting the materials, wiping, soaking, drying and discharging in one device, the whole device adopts a dust-free environment, the wafer is transferred by a fork manipulator, the wafer is wiped by a wiping grinding head with IPA solution, the wiped wafer is soaked in the IPA solution, and finally the wafer is dried by nitrogen to carry out centralized discharging, so that the number of personnel is reduced, the production efficiency is improved, the time in the transferring process is reduced, and the production cost of enterprises is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view of the overall structure of the present utility model.

Fig. 2 is a schematic top view of the present utility model.

Fig. 3 is a schematic diagram of a feeding mechanism of the present utility model.

FIG. 4 is a schematic view of the structure of the wiping mechanism of the present utility model.

FIG. 5 is a schematic view of the soaking mechanism of the present utility model.

FIG. 6 is a schematic diagram of a drying mechanism according to the present utility model.

Fig. 7 is a schematic structural diagram of the blanking transfer manipulator of the present utility model.

Fig. 8 is a schematic structural view of the blanking mechanism of the present utility model.

Wherein, each reference sign in the figure:

100. A machine table;

200. A feeding mechanism; 210. a feeding base; 220. a feeding disc; 230. a first stop mechanism;

300. A blanking mechanism; 310. a blanking base; 320. a blanking disc; 330. a second stop mechanism;

400. A transfer mechanism; 410. a first transfer robot; 420. a second transfer robot;

500. A wiping mechanism; 510. a protective cover; 520. wiping the turntable; 521. a fixing hole; 530. wiping the grinding head; 540. a first wiping driving mechanism; 550. a jacking mechanism; 560. a second wiping driving mechanism; 570. a grinding head lifting mechanism;

600. A soaking mechanism; 610. a soaking pool; 620. soaking a placing frame; 630. a soaking lifting mechanism;

700. a drying mechanism; 710. a protective cover; 711. a transfer window; 720. drying the frame;

800. A positioning mechanism; 900. and a blanking transfer manipulator.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent.

Referring to fig. 1-2, there is shown: the utility model provides an automatic activation wafer wiping machine, includes board 100, is equipped with feed mechanism 200, unloading mechanism 300, transfer mechanism 400, wiping mechanism 500, soaking mechanism 600 and stoving mechanism 700 on the board 100, through integrating a plurality of mechanisms in an equipment, realizes automatic wiping stoving unloading, reduces the extravagant time in the transportation process to and reduce workman's quantity, improve production efficiency.

In this embodiment, by arranging the transfer mechanism 400 at the center of the machine 100, and sequentially distributing the feeding mechanism 200, the wiping mechanism 500, the soaking mechanism 600, the drying mechanism 700 and the discharging mechanism 300 around the transfer mechanism 400 in an annular array with the center, the specific operation flow is as follows: the feeding mechanism 200 stacks the wafers after the incoming material, transfers the wafers on the feeding mechanism 200 through the transfer mechanism 400 and places the wafers on the wiping mechanism 500 for wiping treatment, transfers the wiped wafers through the transfer mechanism 400 and places the wafers on the soaking mechanism 600 for soaking treatment, transfers the soaked wafers through the transfer mechanism 400 and places the wafers in the drying mechanism 700 for drying treatment, and transfers the wafers to the discharging mechanism 300 for packing treatment after the drying is finished.

Referring to fig. 3, it is shown: in this embodiment, the feeding mechanism 200 includes a feeding base 210 and a feeding tray 220, the feeding base 210 is fixedly mounted on the machine 100 through bolts, the feeding tray 220 is slidably mounted on the feeding base 210, a first stop mechanism 230 extending upwards and used for preventing the feeding tray 220 from moving backwards is disposed on the lower end surface of the feeding base 210, the feeding tray 220 is placed on the feeding base 210 through manual feeding, and the backward movement of the feeding tray 220 is limited through the first stop mechanism 230, so that the feeding tray 220 moves backwards in the process of transferring wafers, the whole tray of wafers falls down, and resource waste is caused.

In this embodiment, the transfer mechanism 400 includes a first transfer manipulator 410 and a second transfer manipulator 420, where the first transfer manipulator 410 and the second transfer manipulator 420 are arranged side by side, so that the first transfer manipulator 410 can transfer a wafer located on the feeding mechanism 200 to the wiping mechanism 500, and then the second transfer manipulator 420 can transfer the wafer after wiping treatment from the wiping mechanism 500 to the soaking mechanism 600, thereby realizing automatic transfer, eliminating the need of manual handling, reducing the number of workers, and improving the production efficiency.

Specifically, the first transfer manipulator 410 and the second transfer manipulator 420 are further provided with a fork mechanism, wherein the fork mechanism comprises a fork base and a fork arm, one end of the fork base is arranged on the first transfer manipulator 410 and the second transfer manipulator 420, the fork arm is arranged at the other end of the fork base and is controlled by the fork arm to rotate, the front end of the fork arm is provided with a vacuum suction nozzle, and when the fork arm rotates to extend into the lower part of a wafer and gradually approaches the wafer upwards, the vacuum suction nozzle can adsorb and fix the lower end face of the wafer to prevent falling off when moving.

In this embodiment, a positioning mechanism 800 is further disposed between the feeding mechanism 200 and the wiping mechanism 500, where the positioning mechanism 800 includes a supporting seat, a movable positioning movable seat and a positioning cylinder for driving the movable seat to move, the movable seat is respectively disposed at the left and right ends of the supporting seat, the positioning cylinder is disposed below the supporting seat and can be simultaneously connected to the positioning movable seats on two sides to move, during operation, the first transfer manipulator 410 moves to the feeding mechanism 200 and transfers and places the wafer on the feeding mechanism 200 on the positioning mechanism 800 through the fork mechanism, the positioning movable seat on two sides is driven by the positioning cylinder and moves towards the center at the same time, so that the wafer is in a centered position, after positioning, the positioning movable seat moves towards the outer ends on two sides, at this time, the first transfer manipulator 410 moves again, and transfers and places the wafer on the wiping mechanism 500 through the fork mechanism.

Referring to fig. 4: in this embodiment, the wiping mechanism 500 includes a protective case 510, a wiping turntable 520 and a wiping grinding head 530, the wiping turntable 520 is disposed in the protective case 510, the wiping grinding head 530 is disposed outside the protective case 510, a first wiping driving mechanism 540 for driving the wiping turntable 520 to rotate is disposed below the wiping turntable 520, a plurality of fixing holes 521 for placing and fixing the wafer are disposed on the wiping turntable 520, and a jacking mechanism 550 and a vacuum chuck are disposed in the fixing holes 521 for jacking up, when in use, the jacking mechanism 550 moves upwards and props against the lower end surface of the wafer, at this time, the first transfer manipulator 410 places the wafer on the jacking mechanism 550 and withdraws the wafer, the jacking mechanism 550 slowly moves and places the wafer into the fixing holes 521, and then the wiping grinding head 530 starts to perform wiping processing after a plurality of wafers are placed and fixed on the wiping mechanism 500.

Further, a grinding head lifting mechanism 570 for controlling the grinding head 530 to move up and down and a second wiping driving mechanism 560 for controlling the running state of the grinding head are arranged on the wiping grinding head 530, and when the cleaning machine is in use, an IPA solution is smeared on the dust-free wiping cloth, and the grinding head 530 is controlled to move downwards and approach the wiping turntable 520 by the grinding head lifting mechanism 570, so that the wiping grinding head 530 can carry out wiping treatment on a wafer fixed on the wiping turntable 520;

At this time, the wiped wafer is slowly lifted up by the lifting mechanism 550, and the second transfer manipulator 420 controls the fork mechanism to transfer the wafer to the soaking mechanism 600 for soaking.

Referring to fig. 5, it is shown: in this embodiment, the soaking mechanism 600 includes a soaking tank 610, a soaking rack 620 and a soaking lifting mechanism 630, the soaking lifting mechanism 630 is disposed at a side end of the soaking tank 610, and the soaking rack 620 is controlled to move up and down by the soaking lifting mechanism 630, so that the soaking rack 620 can be located above the soaking tank 610 and soaked in the soaking tank 610 for soaking, the soaking rack 620 is used for receiving wafers after wiping treatment, and a certain interval is kept between the wafers adjacent to each other up and down, and then the wafers are placed in the soaking tank 610 for soaking treatment.

Specifically, the soaking tank 610 is provided with a liquid inlet hole and a liquid outlet hole for allowing the solution to enter/flow out, an electromagnetic control valve and a solution flow switch for detecting whether the solution flows in or not are arranged at the outer end of the soaking tank 610, the liquid can be controlled to enter/flow out of the soaking tank 610 through the electromagnetic control valve, and a liquid level detection device is further arranged in the soaking tank 610 and can detect the liquid level height position of the internal liquid, so that when the internal solution is insufficient, a warning signal is timely sent out, and the solution can be conveniently supplemented in time.

Further, the liquid used in the soak tank 610 is an IPA solution, which has the effect of activating the wafer.

Referring to fig. 6, it is shown: in this embodiment, a protective cover 710 is disposed above and covers the drying mechanism 700, and a transfer window 711 is disposed at two sides of the protective cover 710 to allow the second transfer robot 420 to transfer and place the soaked wafer onto the drying mechanism 700, wherein the drying mechanism 700 has a plurality of drying frames 720 for carrying the wafer to be dried, and a nitrogen supply device for injecting nitrogen into the protective cover 710 is disposed at the lower end of the machine 100; in use, the second transfer robot 420 extends the wafer from the transfer window 711 on the protective cover 710 and places the wafer on the drying rack 720, and then the nitrogen supplying device injects nitrogen into the protective cover 710 for wafer drying.

Referring to fig. 7: in this embodiment, a discharging transfer manipulator 900 is further disposed between the drying mechanism 700 and the discharging mechanism 300, and the discharging transfer manipulator 900 also has a tooth fork mechanism, and the discharging transfer manipulator 900 extends into the protective cover 710 through the transmission window 711 and transfers the dried wafer to the discharging mechanism 300.

Referring to fig. 8, it is shown: in this embodiment, the blanking mechanism 300 includes a blanking base 310 and a blanking disc 320, the blanking base 310 is fixedly mounted on the machine 100 through bolts, the blanking disc 320 is slidably mounted on the blanking base 310, a second stop mechanism 330 extending upwards and used for preventing the blanking disc 320 from moving backwards is further arranged on the lower end surface of the blanking base 310, after the blanking disc 320 is filled with wafers, the blanking disc 320 is manually removed, and an empty blanking disc 320 is replaced at the upper end to collect blanking again.

The foregoing description of the preferred embodiments of the present utility model has been provided for the purpose of illustrating the general principles of the present utility model and is not to be construed as limiting the scope of the utility model in any way. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model, and other embodiments of the present utility model as will occur to those skilled in the art without the exercise of inventive faculty, are intended to be included within the scope of the present utility model.

Claims

1. An automatic activation wafer wiping machine, includes board, its characterized in that: the machine table is provided with a feeding mechanism, a discharging mechanism, a transferring mechanism, a wiping mechanism, a soaking mechanism and a drying mechanism;

2. The automated activated wafer wipe machine of claim 1, wherein: the feeding mechanism comprises a feeding base and a feeding disc, wherein the feeding base is fixedly arranged on the machine table through bolts, the feeding disc is slidably arranged on the feeding base, and a first stop mechanism which extends upwards and is used for preventing the feeding disc from moving backwards is arranged on the lower end face of the feeding base.

3. The automated activated wafer wipe machine of claim 1, wherein: the transfer mechanism comprises a first transfer manipulator and a second transfer manipulator, the first transfer manipulator and the second transfer manipulator are arranged side by side, the first transfer manipulator is used for transferring the wafer positioned on the feeding mechanism to the wiping mechanism, and the second transfer manipulator is used for transferring the wafer after wiping treatment from the wiping mechanism to the soaking mechanism;

4. The automated activated wafer wipe machine of claim 3, wherein: the wafer cleaning device is characterized in that a positioning mechanism is further arranged between the feeding mechanism and the wiping mechanism, the positioning mechanism comprises a supporting seat, a movable positioning movable seat and a positioning cylinder used for driving the movable seat to move, the movable seats are respectively arranged at the left end and the right end of the supporting seat, the positioning cylinder is placed below the supporting seat and is simultaneously connected with the positioning movable seats at the two sides of the supporting seat, the first transfer manipulator transfers and places the wafer on the feeding mechanism on the positioning mechanism through the tooth fork mechanism, the positioning movable seats at the two side ends simultaneously draw close to each other and enable the wafer to move to the middle, the positioning movable seat moves to the outer ends at the two sides of the wafer after positioning is finished, and the first transfer manipulator transfers and places the wafer on the wiping mechanism through the tooth fork mechanism.

5. The automated activated wafer wipe machine of claim 4, wherein: the cleaning mechanism comprises a protective shell, a cleaning turntable and a cleaning grinding head, wherein the cleaning turntable is arranged in the protective shell, the cleaning grinding head is arranged outside the protective shell, a first cleaning driving mechanism for driving the cleaning turntable to rotate is arranged below the cleaning turntable, a plurality of fixing holes for placing and fixing wafers are formed in the cleaning turntable, an upward jacking mechanism and a vacuum chuck are arranged in the fixing holes, the jacking mechanism moves upwards and props against the lower end face of the wafers, the first transfer manipulator places the wafers on the jacking mechanism, and the jacking mechanism recovers downwards and enables the wafers to slowly move to be placed in the fixing holes and are adsorbed and fixed by the vacuum chuck;

6. The automated activated wafer wipe machine of claim 5, wherein: the soaking mechanism comprises a soaking tank, a soaking placing rack and a soaking lifting mechanism, wherein the soaking lifting mechanism is arranged at the side end of the soaking tank, the soaking lifting mechanism controls the soaking placing rack to move up and down and enable the soaking placing rack to be located above the soaking tank, and the soaking placing rack is used for receiving processed wafers and enabling adjacent wafers to be placed in the soaking tank at a certain interval for soaking.

7. The automated activated wafer wipe machine of claim 6, wherein: the soaking tank is provided with a liquid inlet hole and a liquid outlet hole for allowing a solution to enter/flow out, the outer end of the soaking tank is provided with an electromagnetic control valve and a solution flow switch for detecting whether the solution flows in or not, the electromagnetic control valve is used for controlling the liquid to enter/flow out of the soaking tank, and a liquid level detection device is also arranged in the soaking tank and used for detecting the liquid level height position of the internal liquid; the liquid used in the soaking tank is IPA solution.

8. The automated activated wafer wipe machine of claim 6, wherein: the top of stoving mechanism is equipped with a protection cover and locates in with its lid, the both sides of protection cover are equipped with the transfer window in order for the second to shift the wafer after soaking and place stoving mechanism on, stoving mechanism has the several and is used for bearing the stoving frame of waiting to dry the wafer, the lower extreme of board is equipped with the nitrogen supply device of injection nitrogen gas in to the protection cover, the second shifts the transfer window on the mechanical arm follow protection cover stretches into and places on the stoving frame for the wafer, and nitrogen supply device injects nitrogen gas in to the protection cover for the wafer stoving processing.

9. The automated activated wafer wipe machine of claim 8, wherein: the outer side end of the drying mechanism is also provided with a discharging and transferring manipulator which is provided with a tooth fork mechanism, and the discharging and transferring manipulator stretches into the protective cover through the transmission window and transfers and places the dried wafer on the discharging mechanism.

10. The automated activated wafer wipe machine of claim 9, wherein: the blanking mechanism comprises a blanking base and a blanking disc, wherein the blanking base is fixedly arranged on the machine table through bolts, the blanking disc is slidably arranged on the blanking base, and a second stop mechanism which extends upwards and is used for preventing the blanking disc from moving backwards is arranged on the lower end face of the blanking base.