CN111739780B - Automatic sheet feeding machine - Google Patents
Automatic sheet feeding machine Download PDFInfo
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- CN111739780B CN111739780B CN202010740774.3A CN202010740774A CN111739780B CN 111739780 B CN111739780 B CN 111739780B CN 202010740774 A CN202010740774 A CN 202010740774A CN 111739780 B CN111739780 B CN 111739780B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Abstract
The invention belongs to the technical field of wafer loading, and provides an automatic wafer loading machine, which comprises a rack, wherein a wafer rack is arranged at one end of the rack, and a first wafer positioning mechanism is arranged on the wafer rack; the middle of the rack is provided with an upper wafer mechanical arm, the rack is also provided with a positioning table, and the positioning table is provided with a plurality of second wafer positioning mechanisms; a film turning mechanism is arranged between the positioning table and the wafer rack, a film shooting hole is formed in the rack, and a shooting mechanism corresponding to the film shooting hole is arranged on the rack; positioning support plates are slidably mounted on two sides of the loading mechanical arm, a carrier charging basket is arranged at the other end of the rack, and an inserting rod is mounted at one end, close to the carrier charging basket, of each positioning support plate; and a carrier lifting mechanism, a material tray cover taking mechanism, an automatic screw feeding mechanism and a screw feeder are sequentially arranged on the rack along the sliding direction of the positioning supporting plate. The automatic loading device can realize accurate automatic loading of the wafer, greatly improve the loading efficiency, and effectively ensure that the quality and the qualification rate of the wafer are not influenced in the loading process of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer loading, in particular to an automatic wafer loading machine.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. In the production and processing process of the wafer, according to the processing technology requirement, the ICP etching processing of the wafer is required, before the ICP etching technology, the wafer is generally required to be arranged and placed in a material tray, the process is called as loading of the wafer, and therefore the whole material tray loaded with the wafer is placed in a plasma etching machine for etching processing during the etching processing.
At present, the loading operation of a wafer in a tray is usually completed manually, the manual loading operation is high in labor intensity and low in loading efficiency, when the wafer is placed in the tray, the requirement of a specific placing angle needs to be met, otherwise, the wafer cannot be accurately placed in a wafer placing groove of the tray, so that the loading difficulty of workers is greatly increased, and in the loading process, due to various subjective reasons such as carelessness of a loader in operation and the like, the wafer is easily scratched, the wafer is directly scrapped or degraded, and the production quality and the product percent of pass of the wafer are directly influenced. Therefore, the development of an automatic chip feeder not only has urgent research value, but also has good economic benefit and industrial application potential, which is the basis and the impetus for the completion of the invention.
Disclosure of Invention
The present inventors have conducted intensive studies to overcome the above-identified drawbacks of the prior art, and as a result, have completed the present invention after having made a great deal of creative efforts.
Specifically, the technical problems to be solved by the present invention are: the automatic wafer feeding machine is provided to solve the technical problems that the labor intensity of manual wafer feeding is high, the wafer feeding efficiency is low, the wafer is easy to scratch, and the wafer quality is influenced.
In order to solve the technical problems, the technical scheme of the invention is as follows:
an automatic wafer loading machine comprises a rack, wherein a wafer rack is arranged at one end of the rack, a plurality of flower basket placing positions are arranged on the wafer rack, and a first wafer positioning mechanism is arranged on the wafer rack;
a wafer loading mechanical arm is arranged in the middle of the rack, a positioning table is further arranged on the rack close to the wafer loading mechanical arm and located between the wafer loading mechanical arm and the wafer rack and corresponds to the wafer rack, and a plurality of second wafer positioning mechanisms are arranged on the positioning table;
a wafer turning mechanism for taking, placing and turning wafers is arranged between the positioning table and the wafer rack, a wafer taking hole is formed in the rack between the positioning table and the wafer loading mechanical arm, and a shooting mechanism corresponding to the wafer taking hole is mounted on the rack;
positioning support plates driven by a first driving device are slidably mounted on two sides of the loading mechanical arm along the horizontal direction, a plurality of positioning shafts used for positioning and placing loading tools are arranged on the upper surfaces of the positioning support plates, carrier baskets respectively corresponding to the positioning support plates are arranged at the other end of the rack, and inserting rods used for taking and placing the loading tools are fixedly mounted at the bottom of one end, close to the carrier baskets, of each positioning support plate;
follow in the frame the slip direction of location layer board still is equipped with carrier lifting mechanism, charging tray in proper order and gets and cover mechanism, automatic screw mechanism and screw feeder, carrier lifting mechanism is close to the setting of carrier charging basket, the charging tray get cover mechanism with automatic screw mechanism of going up all is located the top of location layer board, just the charging tray get cover mechanism with carrier lifting mechanism corresponds the setting, the screw feeder is located location layer board one side, and with automatic screw mechanism of going up corresponds the setting.
As an improved technical scheme, the wafer rack is fixedly arranged on the rack, a plurality of flower basket mounting plates are arranged on the wafer rack, a plurality of horizontal adjusting bolts are arranged on the flower basket mounting plates in a threaded manner, threaded ends of the horizontal adjusting bolts are abutted against the wafer rack, and the flower basket mounting plates are fixedly arranged on the wafer rack by utilizing the mounting bolts;
the flower basket mounting plate is provided with positioning plates for positioning and placing a flower basket, the positioning plates are correspondingly arranged at two ends of the flower basket mounting plate respectively, the flower basket placing position is formed between the two correspondingly arranged positioning plates, strip-shaped holes are formed in the positioning plates, and the positioning plates are fixedly mounted on the flower basket mounting plate through the strip-shaped holes by utilizing positioning bolts;
still seted up first mounting groove on the basket of flowers mounting panel, be equipped with the first sensor that is used for detecting the basket of flowers in the first mounting groove.
As an improved technical scheme, the first wafer positioning mechanism is located in the middle of the wafer rack, the first wafer positioning mechanism comprises a first mounting seat fixedly mounted on the wafer rack, a first clamping jaw cylinder is mounted on the first mounting seat, a first positioning block is fixedly mounted on a clamping jaw of the first clamping jaw cylinder, and when the first positioning block is in a positioning state, a positioning area matched with a wafer is formed between the first positioning blocks;
a plurality of second wafer positioning mechanism in align to grid sets up on the location bench, second wafer positioning mechanism including fixed mounting in second clamping jaw cylinder on the location bench, the jack catch fixed mounting of second clamping jaw cylinder has the second locating piece, have the location on the second locating piece along, just location along with wafer external diameter looks adaptation.
As an improved technical scheme, the sheet turning mechanism comprises a first mounting plate driven by a second driving device and sliding along the X-axis direction, a second mounting plate driven by a third driving device is slidably mounted on the first mounting plate along the Y-axis direction, a third mounting plate driven by a fourth driving device is slidably mounted on the second mounting plate along the Z-axis direction, a rotary cylinder is fixedly mounted on the third mounting plate, a sheet taking plate is fixedly mounted on a rotary disc of the rotary cylinder, a sheet sucking hole and a sheet sucking groove connected with the sheet sucking hole are formed in one side of the end part of the sheet taking plate, the sheet sucking hole is located in the middle of the sheet sucking groove, and an air passage communicated with the sheet sucking hole is formed in the sheet taking plate;
and a second sensor for detecting the material condition of the wafer in the flower basket is fixedly mounted on the third mounting plate, and the second sensor faces the wafer rack.
As an improved technical scheme, the tail end of the loading mechanical arm is provided with a wafer taking and placing mechanism, the wafer taking and placing mechanism comprises a fixed seat fixedly mounted at the bottom end of a rotating rod of the loading mechanical arm, a third sensor is fixedly mounted on one side of the fixed seat, a side plate is fixedly mounted on the other side of the fixed seat, a first suction cup mounting plate is slidably mounted on the side plate along the vertical direction, a bernoulli suction cup is fixedly mounted at the bottom of the first suction cup mounting plate, a buffer spring is arranged between the first suction cup mounting plate and the fixed seat, and two ends of the buffer spring are respectively connected with the first suction cup mounting plate and the fixed seat.
As an improved technical scheme, the shooting mechanism comprises a camera, a second mounting seat is fixedly mounted on the frame, and the camera is fixedly mounted on the second mounting seat and is arranged corresponding to the shooting hole;
a light source is fixedly arranged on the second mounting seat, is positioned between the camera and the film shooting hole and is arranged corresponding to the film shooting hole;
still fixed mounting has the reflector panel on the fixing base, just the reflector panel is located the fixing base top.
As an improved technical scheme, the carrier charging basket is driven by a fifth driving device respectively and is installed on the rack in a sliding manner along the vertical direction, a plurality of carrier supporting plates are arranged on two inner sides of the carrier charging basket, the carrier supporting plates are arranged in pairs in a corresponding manner, and a carrier placing position for placing a loading carrier is formed between the two correspondingly arranged carrier supporting plates;
two first photoelectric switches are arranged at one end, far away from the positioning supporting plate, of the carrier charging basket, and are respectively and correspondingly arranged at the top and the bottom of the carrier charging basket;
the side position of carrier charging basket one end still is equipped with a plurality of button indicating switches, button indicating switch respectively with the carrier layer board corresponds the setting.
As a modified technical scheme, carrier lifting mechanism includes the lifting cylinder, fixed mounting has two third mount pads, two in the frame the third mount pad respectively in the both sides of location layer board correspond the setting, the lifting cylinder respectively fixed mounting in relative one side of third mount pad, fixed mounting has T shape mounting panel on the slip table of lifting cylinder, the top fixed mounting of T shape mounting panel has the carrier die-pin, two the carrier die-pin corresponds the setting.
As an improved technical scheme, a mounting frame is fixedly mounted on the rack, a fourth mounting plate is fixedly mounted on one side, facing the carrier charging basket, of the mounting frame, the charging tray cover taking mechanism is mounted on the fourth mounting plate, and the automatic screw feeding mechanism is located on the other side of the mounting frame;
the cover taking mechanism of the charging tray comprises a second sucker mounting plate which is driven by a sixth driving device and is arranged in a sliding mode along the vertical direction, a cover plate sucker is fixedly mounted at the bottom end of the second sucker mounting plate, a code scanner is fixedly mounted on the upper surface of the cover plate sucker, close to the position of the carrier charging basket, and a plurality of suction nozzles are uniformly arranged on the bottom surface of the cover plate sucker along the circumferential direction;
the automatic screw mechanism of going up includes by the drive of seventh drive arrangement, and along the fifth mounting panel of horizontal direction slip setting, it has the driven electricity of eighth drive arrangement to criticize along vertical direction slidable mounting on the fifth mounting panel, electricity criticize with the screw feeder corresponds the setting.
As an improved technical scheme, extension springs are further arranged on two sides of the second sucker mounting plate respectively, a first hanging rod used for achieving hanging of the extension springs is fixedly mounted on the fourth mounting plate, a second hanging rod used for achieving hanging of the extension springs is fixedly mounted on the cover plate sucker, the hanging ends of the first hanging rod and the second hanging rod are correspondingly arranged, the extension springs are located between the first hanging rod and the second hanging rod correspondingly, and two ends of each extension spring are hung at the hanging ends of the first hanging rod and the second hanging rod respectively.
As a modified technical scheme, carrier lifting mechanism with still be equipped with the apron that is used for preventing that the charging tray apron from dropping between the mechanism is got to the charging tray and prevent falling the mechanism, the apron prevents falling the mechanism including respectively fixed mounting in the telescopic cylinder at third mount pad top, and two telescopic cylinder respectively in one side that the third mount pad is relative sets up, telescopic cylinder's the terminal fixed mounting of piston shaft has the apron layer board, two the apron layer board corresponds the setting, and when being in the last piece state, two the interval of apron layer board and the external diameter looks adaptation of charging tray apron.
After the technical scheme is adopted, the invention has the beneficial effects that:
this automatic loading machine, each mechanism cooperation action, realize the automatic loading of integration of wafer, compare the traditional manual work and carry out the loading mode of wafer loading, the effective substitution of hand labor has been realized, not only can ensure the accurate angle of wafer in the charging tray, the placing of position, the loading efficiency improves greatly, and effectively avoided the emergence of the unexpected fish tail wafer phenomenon at last piece in-process, it is not influenced to ensure wafer loading in-process wafer quality and qualification rate, in addition, can realize the effective location to wafer in each charging tray and the charging tray, be convenient for follow-up the accurate of wafer seek after the loading.
Drawings
In order to more clearly illustrate the detailed description of the invention or the technical solutions in the prior art, the drawings that are needed in the detailed description of the invention or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a schematic structural view of a wafer holder and a wafer turning mechanism according to the present invention;
FIG. 4 is a schematic view of the construction of the loading robot and positioning table portion of the present invention;
FIG. 5 is a schematic structural diagram of the sheet turnover mechanism of the present invention;
FIG. 6 is a schematic view of a wafer pick and place mechanism according to the present invention;
FIG. 7 is a schematic view of the carrier basket portion of the present invention;
FIG. 8 is a schematic view of the upper plate portion of the present invention;
FIG. 9 is another perspective view of the upper plate portion of the present invention;
FIG. 10 is a schematic view of the mounting structure of the retainer plate of the present invention;
FIG. 11 is a schematic view of the construction of the mount portion of the present invention;
FIG. 12 is a schematic structural view of a second positioning mechanism according to the present invention;
FIG. 13 is a schematic structural view of the flower basket mounting plate of the present invention;
FIG. 14 is a schematic structural diagram of a first positioning mechanism according to the present invention;
FIG. 15 is a schematic view of a partial structure of the sheet taking plate according to the present invention;
FIG. 16 is a schematic view of a substrate carrier according to the present invention;
FIG. 17 is a schematic view of the loading carrier of the present invention;
FIG. 18 is a schematic structural view of a tray of the present invention;
FIG. 19 is a schematic view of the cover plate of the present invention;
reference numerals: 1-a frame; 101-a film taking hole; 2-a wafer rack; 3-a flower basket mounting plate; 301-a first mounting groove; 4-horizontal adjusting bolt; 5, positioning a plate; 501-strip-shaped holes; 6-a first sensor; 7-a first mount; 8-a first jaw cylinder; 9-a first positioning block; 10-a positioning table; 11-a second jaw cylinder; 12-a second locating block; 1201-positioning edge; 13-a second electric cylinder; 14-a second guide rail; 15-a second slide; 16-a first mounting plate; 17-a third electric cylinder; 18-a second mounting plate; 19-a fourth electric cylinder; 20-a third mounting plate; 21-a rotary cylinder; 22-taking a sheet plate; 2201-suction hole; 2202-suction slice groove; 23-a second sensor; 24-a sheet feeding mechanical arm; 25-a fixed seat; 26-a third sensor; 27-side plate; 28-a first suction cup mounting plate; 29-bernoulli chuck; 30-a buffer spring; 31-a second mount; 32-a camera; 33-a light source; 34-a reflector; 35-a first electric cylinder; 36-a first guide rail; 37-a first slider; 38-positioning the pallet; 3801-positioning shaft; 39-a plunger; 40-carrier basket; 4001-carrier pallet; 41-button indication switch; 42-a first opto-electronic switch; 43-a shaft sleeve; 44-a slide bar mounting plate; 45-guiding the sliding rod; 46-electric pushing cylinder; 47-a third mount; 48-lifting the cylinder; 49-T shaped mounting plate; 50-carrier support rod; 51-a mounting frame; 52-a fourth mounting plate; 53-fifth electric cylinder; 54-a second suction cup mounting plate; 55-cover plate sucker; 56-a code scanner; 57-suction nozzle; 58-a first hanging rod; 59-a second hanging rod; 60-extension spring; 61-telescopic cylinder; 62-cover plate supporting plate; 63-a sixth electric cylinder; 64-a fifth mounting plate; 65-a seventh electric cylinder; 66-electric batch; 67-screw feeder; 68-fixed block; 69-guide adjusting bolt; 70-a second opto-electronic switch; 71-a tray; 7101-a holding tank; 7102-a first positioning groove; 7103-a second mounting groove; 7104 locking block; 7105-compression spring; 7106 tabletting; 7107-a disc-lifting hole; 7108-vent holes; 7109-pressure relief groove; 7110-pallet locating holes; 72-slide plate; 7201-a wafer placing groove; 7202-cover plate positioning holes; 73-a cover plate; 7301 pressing edge; 7302-positioning bumps; 74-display screen; 75-a viewing window; 76-Freund horse wheel.
Detailed Description
The invention is further illustrated by the following specific examples. The use and purpose of these exemplary embodiments are to illustrate the present invention, not to limit the actual scope of the present invention in any way, and not to limit the scope of the present invention in any way.
As shown in fig. 1 to 15, the embodiment provides an automatic loading machine, which includes a frame 1, wherein one end of the frame 1 is provided with a wafer rack 2, the wafer rack 2 is provided with a plurality of flower basket placing positions for placing flower baskets, and the wafer rack 2 is provided with a first wafer positioning mechanism.
The middle of the rack 1 is provided with a wafer loading mechanical arm 24, the position of the rack 1, which is close to the wafer loading mechanical arm 24, is also provided with a positioning table 10, the positioning table 10 is positioned between the wafer loading mechanical arm 24 and the wafer rack 2 and is arranged corresponding to the wafer rack 2, and the positioning table 10 is provided with a plurality of second wafer positioning mechanisms.
A wafer turning mechanism for taking, placing and turning the wafer is arranged between the positioning table 10 and the wafer rack 2, a wafer shooting hole 101 is formed in the rack 1 between the positioning table 10 and the wafer loading mechanical arm 24, and a shooting mechanism corresponding to the wafer shooting hole 101 is installed on the rack 1.
Positioning support plates 38 driven by a first driving device are slidably mounted on two sides of the loading mechanical arm 24 along the horizontal direction, a plurality of positioning shafts 3801 used for positioning and placing loading carriers are arranged on the upper surfaces of the positioning support plates 38, carrier baskets 40 respectively corresponding to the positioning support plates 38 are arranged at the other end of the rack 1, the carrier baskets 40 are used for placing the loading carriers, and insertion rods 39 used for taking and placing the loading carriers are fixedly mounted at the bottoms of the positioning support plates 38 close to one ends of the carrier baskets 40; the inserted bar 39 that the tip fixed mounting of location layer board 38 was equipped with is convenient for carry out getting of last piece carrier from carrier charging basket 40 and is got and put, and the location axle 3801 that is equipped with on the location layer board 38 provides convenience for the location of last piece carrier on location layer board 38 is placed, ensures that the piece carrier can not take place the offset in last piece and transportation process, provides reliable guarantee for the accurate piece of putting of wafer.
In this embodiment, as shown in fig. 10, the first driving device includes a first electric cylinder 35 fixedly mounted on the frame 1, a first guide rail 36 arranged in parallel with the first electric cylinder 35 is further fixedly mounted on the frame 1, a first slider 37 is slidably mounted on the first guide rail 36, and a positioning supporting plate 38 is fixedly connected to the first slider 37 and the sliding plate of the first electric cylinder 35.
As shown in fig. 3 to 5 and fig. 12 to 15, the wafer rack 2 is fixedly mounted on the frame 1, the wafer rack 2 is provided with a plurality of flower basket mounting plates 3, the flower basket mounting plates 3 are provided with a plurality of horizontal adjusting bolts 4 through threads, the threaded ends of the horizontal adjusting bolts 4 are abutted against the wafer rack 2, and the flower basket mounting plates 3 are fixedly mounted on the wafer rack 2 through the mounting bolts; in this embodiment, a plurality of counter bores have been seted up on the basket of flowers mounting panel 3 for realize mounting bolt's installation, of course, also can set up the installation through-hole along its axial on horizontal adjusting bolt 4, for realize mounting bolt's installation, mounting bolt cartridge is in horizontal adjusting bolt 4 promptly, and the screw thread end is with 2 threaded connection of wafer work or material rest. The basket of flowers mounting panel 3 that is equipped with revolves to twist each horizontal adjustment bolt 4 and carries out the horizontal adjustment of basket of flowers mounting panel 3, ensures 3 installation levels of basket of flowers mounting panel, not slope, and adjusts easy operation convenience, adjusts and screws the installation bolt after finishing and can realize adjusting the after-fixing, and the basket of flowers mounting panel 3 level after can guaranteeing to place keeps the level, and then provides reliable guarantee for the accurate piece operation of getting of wafer.
The flower basket mounting plate 3 is provided with positioning plates 5 for positioning and placing a flower basket, the positioning plates 5 are respectively arranged at two ends of the flower basket mounting plate 3 correspondingly, a flower basket placing position is formed between the two correspondingly arranged positioning plates 5, the positioning plates 5 are provided with strip-shaped holes 501 respectively, the positioning plates 5 are fixedly arranged on the flower basket mounting plate 3 through the strip-shaped holes 501 by utilizing positioning bolts, and in the embodiment, the positioning bolts are not shown in the attached drawings; locating plate 5 of installing on basket of flowers mounting panel 3, two locating plates 5 form and the basket of flowers of basket of flowers bottom looks adaptation place, the basket of flowers of being convenient for is placed and the location after placing in the accuracy on basket of flowers mounting panel 3, spacing, and set up some bar holes 501 on locating plate 5, loosen positioning bolt and can realize the fine setting of two locating plate 5 intervals, adjust the back relocking positioning bolt can, the basket of flowers that can the different specifications of adaptation is placed, the commonality is strong.
A first mounting groove 301 is further formed in the basket mounting plate 3, a first sensor 6 for detecting a basket is arranged in the first mounting groove 301, and in the embodiment, the first sensor 6 is a contact sensor; the first sensor 6 of installation can detect the basket of flowers and have or not, reminds the staff to carry out the basket of flowers of relevant position and places.
The sheet turning mechanism comprises a first mounting plate 16 driven by a second driving device and sliding along the X-axis direction, a second mounting plate 18 driven by a third driving device is arranged on the first mounting plate 16 in a sliding manner along the Y-axis direction, a third mounting plate 20 driven by a fourth driving device is arranged on the second mounting plate 18 in a sliding manner along the Z-axis direction, a rotary cylinder 21 is fixedly arranged on the third mounting plate 20, a sheet taking plate 22 is fixedly arranged on a rotary table of the rotary cylinder 21, a sheet sucking hole 2201 and a sheet sucking groove 2202 connected with the sheet sucking hole 2201 are formed in one side of the end part of the sheet taking plate 22, the sheet sucking hole 2201 is located in the middle of the sheet sucking groove 2202, an air passage communicated with the sheet sucking hole 2201 is formed in the sheet taking plate 22, and the sheet taking plate is connected with an air pipe of an air supply device through an air connecting port of the air passage; the wafer taking plate 22 is provided with a wafer sucking hole 2201 and a wafer sucking groove 2202, so that the back of the wafer can be firmly adsorbed, and the wafer can be prevented from being shifted or even falling in the processes of taking, placing and overturning.
The third mounting plate 20 is also fixedly provided with a second sensor 23 for detecting the material condition of the wafers in the basket, the second sensor 23 is arranged towards the wafer rack 2, in this embodiment, the second sensor 23 is a digital sensor; the second sensor 23 of installation can detect basket of flowers material condition when getting the interior wafer of basket of flowers, if detect in the basket of flowers not have the wafer after, remind the staff to carry out the basket of flowers through corresponding alarm device and change.
The second driving device comprises a second electric cylinder 13 fixedly mounted on the frame 1, a second guide rail 14 arranged in parallel with the second electric cylinder 13 is further fixedly mounted on the frame 1, a second sliding block 15 is slidably mounted on the second guide rail 14, and a first mounting plate 16 is fixedly connected with the second sliding block 15 and a sliding plate of the second electric cylinder 13.
In this embodiment, in order to facilitate the adjustment of the guide rail to be parallel to the electric cylinder during the installation of the guide rail, the frame 1 is further provided with adjusting mechanisms for realizing the parallel adjustment of the first guide rail 36 and the second guide rail 14, each adjusting mechanism comprises three fixed blocks 68 and guide rail adjusting bolts 69, the three fixed blocks 68 are fixedly installed on the frame 1, two of the fixed blocks 68 are respectively located at two ends of one side of the guide rail, the other fixed block 68 is located at the middle position of the other side of the guide rail, the guide rail adjusting bolts 69 are respectively installed on the fixed blocks 68 in a threaded fit manner, and the threaded ends of the guide rail adjusting bolts 69 are abutted against the guide; the adjusting mechanism is provided, and the fine adjustment of the guide rail can be realized by screwing the guide rail adjusting bolt 69, so that the parallel adjustment operation between the first guide rail 36 and the first electric cylinder 35 and between the second guide rail 14 and the second electric cylinder 13 is simple and convenient.
The third driving device comprises a third electric cylinder 17 fixedly mounted on the first mounting plate 16, and a second mounting plate 18 fixedly mounted on a sliding plate of the third electric cylinder 17.
The fourth driving device comprises a fourth electric cylinder 19 fixedly mounted on the second mounting plate 18, and a third mounting plate 20 is fixedly mounted on a sliding plate of the fourth electric cylinder 19.
The first wafer positioning mechanism is positioned in the middle of the wafer rack 2 and comprises a first mounting seat 7 fixedly mounted on the wafer rack 2, a first clamping jaw cylinder 8 is mounted on the first mounting seat 7, a clamping jaw of the first clamping jaw cylinder 8 is fixedly mounted with a first positioning block 9, and when the first positioning block is in a positioning state, a positioning area matched with a wafer is formed between the first positioning blocks 9; this first wafer positioning mechanism who is equipped with realizes the smart location of wafer through each first locating piece 9 of first clamping jaw cylinder 8 driven, ensures to get piece board 22 accurate to wafer actuation position, and the actuation fastness is good, satisfies wafer upset demand, has guaranteed simultaneously that the wafer is placed in the accuracy of second wafer positioning mechanism position department.
The plurality of second wafer positioning mechanisms are uniformly arranged on the positioning table 10, each second wafer positioning mechanism comprises a second clamping jaw cylinder 11 fixedly installed on the positioning table 10, a second positioning block 12 is fixedly installed on a clamping jaw of each second clamping jaw cylinder 11, a positioning edge 1201 is arranged on each second positioning block 12, and the positioning edges 1201 are matched with the outer diameter of the wafer; this second wafer positioning mechanism that is equipped with, the second locating piece 12 through the drive of second clamping jaw cylinder 11 realizes the accurate location once more of placing the wafer, ensure the accurate absorption of last piece arm 24 to the wafer, and then realize the accurate placing of wafer in the charging tray, in addition, the location that has on the second locating piece 12 is followed 1201, when the wafer is placed in the second wafer positioning mechanism location, only the positive border position of wafer contacts with second locating piece 12, area of contact is little, and be edge contact, pollution or damage because of the contact probably leads to of wafer front has been avoided, ensure that the wafer quality is not influenced.
In this embodiment, the first clamping jaw cylinder 8 and the second clamping jaw cylinder 11 may both adopt commercially available pneumatic clamping jaws, which are not described herein.
In this embodiment, the top of the positioning side of the first positioning block 9 and the second positioning block 12 are both inclined chamfer structures, which plays a role in guiding the wafer during placement, so that the wafer is more easily placed.
As shown in fig. 4 and fig. 6, the loading robot 24 is fixedly mounted on the frame 1, and a commercially available four-degree-of-freedom robot may be used, which is not described herein again; the tail end of the upper piece mechanical arm 24 is provided with a wafer taking and placing mechanism, the wafer taking and placing mechanism comprises a fixed seat 25 fixedly installed at the bottom end of a rotating rod of the upper piece mechanical arm 24, a third sensor 26 is fixedly installed on one side of the fixed seat 25, the third sensor 26 is a photoelectric sensor, a side plate 27 is fixedly installed on the other side of the fixed seat 25, a first sucking disc installation plate 28 is installed on the side plate 27 in a sliding mode along the vertical direction, a Bernoulli sucking disc 29 is fixedly installed at the bottom of the first sucking disc installation plate 28, a buffer spring 30 is arranged between the first sucking disc installation plate 28 and the fixed seat 25, and two ends of the buffer spring 30 are respectively connected with the first; the wafer taking and placing mechanism is low in air consumption and large in adsorption force of the Bernoulli chuck 29, the wafer can be sucked up when a small gap exists between the Bernoulli chuck and the wafer, contact with the wafer can be reduced to the maximum degree, the wafer is grabbed softly, the buffer spring 30 arranged between the first chuck mounting plate 28 and the fixing seat 25 plays a role in buffering when the wafer is taken, damage to the wafer when the wafer is grabbed is effectively avoided, the third sensor 26 arranged on the fixing seat 25 can detect whether the wafer is sucked up, and the phenomenon of missing of wafer placing caused by the fact that the wafer is not sucked up is avoided.
The shooting mechanism comprises a camera 32, a second mounting seat 31 is fixedly mounted on the frame 1, and the camera 32 is fixedly mounted on the second mounting seat 31 and is arranged corresponding to the shooting hole 101; according to the shooting mechanism, after the wafer is taken by the wafer taking and placing mechanism, the wafer feeding mechanical arm 24 moves the wafer to the position of the wafer taking hole 101, the information of the taken wafer is shot by the camera 32 and is compared with the template wafer, and corresponding angular rotation is carried out by the wafer feeding mechanical arm 24, so that the wafer can be accurately placed in a material tray, and the requirement that the wafer needs to be arranged at a specific angle is met.
The second mounting seat 31 is also fixedly provided with a light source 33, the light source 33 is positioned between the camera 32 and the film shooting hole 101 and is arranged corresponding to the film shooting hole 101, the fixed seat 25 is also fixedly provided with a reflecting plate 34, and the reflecting plate 34 is positioned above the fixed seat 25; the light source 33 and the reflector 34 are provided to ensure the camera 32 to have a more appropriate exposure, so that the image taken by the camera 32 on the wafer is clearer.
As shown in fig. 7, the carrier basket 40 is driven by the fifth driving device and is slidably mounted on the frame 1 along the vertical direction, a plurality of carrier supporting plates 4001 are disposed on two inner sides of the carrier basket 40, and the carrier supporting plates 4001 are disposed in pairs, and a carrier placing position for placing the upper carrier is formed between the two correspondingly disposed carrier supporting plates 4001.
In order to realize the lifting and sliding of the carrier material basket 40 in the vertical direction, a plurality of shaft sleeves 43 are fixedly installed on the frame 1, a slide bar installation plate 44 is arranged below the shaft sleeves 43, a plurality of guide slide bars 45 arranged corresponding to the shaft sleeves 43 are fixedly installed on the slide bar installation plate 44, the guide slide bars 45 penetrate through the shaft sleeves 43, and the top ends of the guide slide bars are respectively fixedly connected with the carrier material basket 40; the provided shaft sleeve 43 and the guide slide rod 45 are arranged, and the guide slide rod 45 slides in the shaft sleeve 43 in a limiting way, so that the carrier charging basket 40 can be stably lifted in the vertical direction.
In this embodiment, the fifth driving device includes an electric pushing cylinder 46, the electric pushing cylinder 46 is fixedly installed on the frame 1, and the top end of the pushing rod of the electric pushing cylinder 46 is fixedly connected with the carrier basket 40; in this embodiment, the push rod of the electric pushing cylinder 46 is fixedly connected to the bottom middle position of the carrier basket 40, and the electric pushing cylinder 46 works to realize the lifting of the carrier basket 40 under the driving of the electric pushing cylinder 46.
A limit stop is fixedly mounted at one end of the carrier supporting plate 4001 close to the positioning supporting plate 38, and in the embodiment, the limit stop is not shown in the drawing; the carrier layer board 4001 that carrier charging basket 40 was equipped with and the limit stop who is fixed mounting on carrier layer board 4001, when placing the overhead piece carrier, push the piece carrier along the support rail that two carrier layer boards 4001 formed, it can to support the dog to supreme piece carrier, when needing to take out the piece carrier after the piece completion, directly with the piece carrier follow carrier charging basket 40 in take out can, get and put easy operation convenience.
Two first photoelectric switches 42 are arranged at one end of the carrier charging basket 40 far away from the positioning supporting plate 38, and the two first photoelectric switches 42 are respectively and correspondingly arranged at the top and the bottom of the carrier charging basket 40; the two first photoelectric switches are arranged to be opposite to each other and used for detecting whether the loading carrier is placed in place or not, if the loading carrier is not placed in place, the end part of the loading carrier is exposed out of the carrier charging basket 40, the first photoelectric switch 42 detects the loading carrier, the loading carrier is not placed in place so as to prompt a worker to place the loading carrier again, the loading carrier is placed in place through detection of the loading carrier by the first photoelectric switch 42, and therefore the insertion rod 39 can be used for accurately taking the loading carrier.
A plurality of button indicating switches 41 are further arranged at the side edge position of one end of the carrier charging basket 40, and the button indicating switches 41 are respectively arranged corresponding to the carrier supporting plates 4001; the button indicating switch 41 is arranged, when the empty film loading carrier is placed in the carrier basket 40, the corresponding button indicating switch 41 is pressed, the controller receives the material level information, and the automatic film loading operation of the placed empty film loading carrier is realized.
As shown in fig. 8 to 11, the carrier lifting mechanism includes a lifting cylinder 48, two third mounting seats 47 are fixedly mounted on the frame 1, the two third mounting seats 47 are respectively and correspondingly disposed on two sides of the positioning support plate 38, the lifting cylinder 48 is respectively and fixedly mounted on one side opposite to the third mounting seats 47, a T-shaped mounting plate 49 is fixedly mounted on a sliding table of the lifting cylinder 48, a carrier support rod 50 is fixedly mounted on the top of the T-shaped mounting plate 49, the two carrier support rods 50 are correspondingly disposed, and an interval adapted to the width of the upper carrier is formed between the two carrier support rods 50, the lifting cylinder 48 acts to drive the carrier support rod 50 to move up and down, so as to lift and lower the upper carrier.
A mounting frame 51 is fixedly mounted on the frame 1, the mounting frame 51 spans the first electric cylinder 35 and the first guide rail 36, a fourth mounting plate 52 is fixedly mounted on one side of the mounting frame 51 facing the carrier basket 40, the tray cover taking mechanism is mounted on the fourth mounting plate 52, and the automatic screw screwing mechanism is located on the other side of the mounting frame 51.
The tray cover taking mechanism comprises a second sucker mounting plate 54 which is driven by a sixth driving device and slides along the vertical direction, a cover plate sucker 55 is fixedly mounted at the bottom end of the second sucker mounting plate 54, a plurality of suction nozzles 57 are uniformly arranged on the bottom surface of the cover plate sucker 55 along the circumferential direction, and the suction nozzles 57 are communicated with the gas supply device to suck and release the cover plate 73.
In this embodiment, the sixth driving device includes a fifth electric cylinder 53, the fifth electric cylinder 53 is vertically and fixedly mounted on the fourth mounting plate 52, and the second suction cup mounting plate 54 is fixedly mounted on the sliding plate of the fifth electric cylinder 53.
In this embodiment, the upper surface of the cover plate suction cup 55 is fixedly provided with a code scanner 56 near the carrier basket 40, the code scanner 56 can select a commercially available profit smart code scanner 56, and when a loading carrier is taken and placed, the loading carrier can be scanned and identified, so that effective positioning of each tray and wafers in the tray is realized, and subsequent accurate searching of the loaded wafers is facilitated.
The two sides of the second sucker mounting plate 54 are respectively provided with an extension spring 60, the fourth mounting plate 52 is fixedly provided with a first hanging rod 58 for hanging the extension spring 60, the cover plate sucker 55 is fixedly provided with a second hanging rod 59 for hanging the extension spring 60, the hanging ends of the first hanging rod 58 and the second hanging rod 59 are correspondingly arranged, the extension spring 60 is respectively positioned between the correspondingly arranged first hanging rod 58 and the second hanging rod 59, and the two ends of the extension spring 60 are respectively hung at the hanging ends of the first hanging rod 58 and the second hanging rod 59; extension spring 60 that is equipped with realizes through extension spring 60 that the dress of hanging between apron sucking disc 55 and the mounting bracket 51 is connected, under extension spring 60's pulling force effect, can offset apron sucking disc 55's gravity to a certain extent for it is more laborsaving to the lift drive of apron sucking disc 55, and the low-power electric jar can be realized, has satisfied energy saving and consumption reduction's demand.
A cover plate falling prevention mechanism for preventing the material tray cover plate 73 from falling is further arranged between the carrier lifting mechanism and the material tray cover taking mechanism, the cover plate falling prevention mechanism comprises telescopic cylinders 61 fixedly mounted at the tops of the third mounting seats 47 respectively, the two telescopic cylinders 61 are arranged on one sides opposite to the third mounting seats 47 respectively, cover plate supporting plates 62 are fixedly mounted at the tail ends of piston shafts of the telescopic cylinders 61, the two cover plate supporting plates 62 are correspondingly arranged, and when the material tray cover plate is in a loading state, the distance between the two cover plate supporting plates 62 is matched with the outer diameter of the material tray cover plate 73; according to the cover plate falling prevention mechanism, after the cover plate 73 of the material tray is sucked up by the cover plate sucking disc 55, the telescopic air cylinder 61 drives the cover plate supporting plate 62 to stretch out to the lower side of the cover plate 73, and in the wafer loading process, when an air supply device of the suction nozzle 57 has an unexpected fault, the sucked cover plate 73 is prevented from falling.
The automatic screwing mechanism comprises a fifth mounting plate 64 which is driven by a seventh driving device and is arranged in a sliding manner along the horizontal direction, an electric screwdriver 66 driven by an eighth driving device is arranged on the fifth mounting plate 64 in a sliding manner along the vertical direction, and the electric screwdriver 66 is arranged corresponding to the screw feeder 67; in this embodiment, the seventh driving device includes a sixth electric cylinder 63, the sixth electric cylinder 63 is horizontally and fixedly mounted on the mounting frame 51, the fifth mounting plate 64 is fixedly mounted on the sliding plate of the sixth electric cylinder 63, the eighth driving device includes a seventh electric cylinder 65, the seventh electric cylinder 65 is vertically and fixedly mounted on the fifth mounting plate 64, and the electric batch 66 is fixedly mounted on the sliding plate of the seventh electric cylinder 65; the screwdriver 66 and the screw feeder 67 are commercially available products, which are well known to those skilled in the art and thus will not be described herein. The automatic screw feeding mechanism is arranged, screws are taken from the screw feeder 67 through the electric screwdriver 66, and the screws are accurately placed at various mounting positions and screwed and fixed under the coordination of displacement driving of the first electric cylinder 35 on the positioning supporting plate 38 and displacement driving of the sixth electric cylinder 63 and the seventh electric cylinder 65 on the electric screwdriver 66, so that the mounting and fixing efficiency of the cover plate 73 is greatly improved.
In this embodiment, realize displacement drive through each electric jar, the precision is high, and more environmental protection, clean, when guaranteeing the rigidity, has effectively reduced the pollution of cylinder lubricating grease to dustless environment.
In this embodiment, two end portions of one side of each electric cylinder are fixedly provided with a second photoelectric switch 70, the second photoelectric switch 70 is a U-shaped photoelectric switch, and a slide plate of the electric cylinder is fixedly provided with an in-place detection sheet convenient for detection of the second photoelectric switch 70, which is not shown in the drawing; the second photoelectric switch 70 and the in-place detection piece are arranged, and the second photoelectric switch 70 detects the electric cylinder sliding plate through the detection of the in-place detection piece, so that the accuracy of the sliding in-place is ensured, and the sliding of the electric cylinder sliding plate is prevented from exceeding the stroke.
As shown in fig. 16 to 19, in the present embodiment, the wafer loading carrier for loading the wafer includes a tray 71 and a tray clamped in the tray 71, a plurality of positioning pins for positioning the tray and a clamping mechanism for fixing the tray are disposed on the tray 71, a tray lifting hole 7107 for pushing out the tray from the tray 71 is further disposed on the tray 71, the wafer loading carrier is slidably mounted between two carrier supporting plates 4001 disposed correspondingly through the tray 71, and a code for facilitating scanning and identification of the barcode scanner 56 is disposed on the tray 71.
The charging tray comprises a carrying plate 72 and a cover plate 73 which is matched with the carrying plate 72 in a covering mode, a plurality of wafer placing grooves 7201 used for placing wafers are evenly formed in the carrying plate 72, a second positioning groove corresponding to the first positioning groove 7102 is formed in the outer peripheral wall of the carrying plate 72, the charging tray is convenient to position after being clamped in the tray 71, and the carrying plate 72 is positioned and clamped in the accommodating groove 7101 through the second positioning groove and the positioning pin.
In order to fix the cover plate 73 on the slide plate 72 after the wafer is placed, a plurality of bolt holes are formed in the slide plate 72, and a plurality of counter bores corresponding to the bolt holes are formed in the cover plate 73; in this embodiment, the slide plate 72 is provided with a cover plate positioning hole 7202, the cover plate 73 is provided with a pressing edge 7301 corresponding to the wafer placing groove 7201 and a positioning protrusion 7302 corresponding to the cover plate positioning hole 7202, and the cover plate 73 is adapted to cover the slide plate 72 through the positioning protrusion 7302 and the cover plate positioning hole 7202. The cover plate positioning hole 7202 formed in the slide carrying plate 72 and the corresponding positioning protrusion 7302 formed in the cover plate 73 realize the positioning of the cover plate 73 when the cover plate 72 is covered, after the cover plate 73 is covered on the slide carrying plate 72, counter bores in the cover plate 73 correspond to bolt holes in the slide carrying plate 72 one by one, the cover plate 73 is conveniently and automatically screwed and fixed by a screw screwing mechanism, the pressing edge 7301 formed in the cover plate 73 and corresponding to the wafer placing groove 7201 is formed, after the cover plate 73 is covered and fixed, the pressing edge 7301 is attached to a wafer, the wafer can be prevented from shaking in the charging tray, and the subsequent etching process is prevented from being influenced.
The clamping mechanisms are arranged along the circumferential direction of the accommodating groove 7101 respectively, each clamping mechanism comprises a locking block 7104, a compression spring 7105 and a pressing sheet 7106, a second mounting groove 7103 connected with the accommodating groove 7101 is formed in the tray 71, the second mounting groove 7103 is lower than the accommodating groove 7101, a limiting blocking edge used for realizing sliding limiting of the locking blocks 7104 is formed by the second mounting groove 7101, the locking blocks 7104 are slidably mounted in the second mounting groove 7103, the top of one end, close to the accommodating groove 7101, of the locking blocks 7104 is of an inclined surface structure, the compression spring 7105 is located between the locking blocks 7104 and the tray 71, the pressing sheets 7106 are fixedly mounted on the tray 71, cavities for accommodating the locking blocks 7104 and the compression spring 7105 are formed by the second mounting groove 7103, and one end, close to the accommodating groove 7101, of the locking blocks 7104 extends into the accommodating groove 7101 under the action of the; this fixture that is equipped with on the tray 71, second mounting groove 7103 is less than holding tank 7101, ensure that latch segment 7104 can not the roll-off, the charging tray clamps back in holding tank 7101, latch segment 7104 is under compression spring 7105's effect, exert a clamping-force to the charging tray all the time, ensure that the charging tray can not deviate from in the tray 71 easily, also can not cause the centre gripping damage to the charging tray simultaneously, and when exerting the ejecting power along the charging tray axial, can be ejecting with the charging tray, it is simple and convenient to take out the operation, the inclined plane structure that latch segment 7104 is close to the one end top of holding tank 7101 and is equipped with, play the guide effect, it provides convenience to clamp in tray 71 for the charging tray, and in the time of clamping, because the existence of inclined plane structure, be convenient for pressing the back latch segment 7104.
The middle position of the tray 71 is provided with the vent hole 7108, the bottom surface of the containing groove 7101 is provided with the pressure relief groove 7109, the tray 71 is provided with the vent hole 7108 and the pressure relief groove 7109, when the tray is taken out from the containing groove 7101, the generation of negative pressure can be avoided, and the ejection of the tray is easier.
The charging tray is clamped in the tray 71 to form the upper sheet carrier, so that the charging tray is accurately positioned and firmly clamped in the tray 71, and the clamping and taking-out operations are simple and convenient; tray 71 corner position department sets up tray locating hole 7110 that has, when the piece was gone up to the wafer, it provides convenience to place in the location on location layer board 38, locating pin through the installation of first constant head tank 7102, the location of the charging tray when placing in tray 71 of being convenient for, prevent that the charging tray from rotating, fixture realizes that the chucking of charging tray is fixed, can prevent that the charging tray from deviating from, the dish hole 7107 that plays that sets up on tray 71, the wafer is gone up the piece in the charging tray and is accomplished the back, be convenient for ejecting the charging tray from tray 71.
The automatic chip feeder realizes the coordination control of each mechanism through controllers respectively connected with a first electric cylinder 35, a first sensor 6, a first clamping jaw air cylinder 8, a second clamping jaw air cylinder 11, a second electric cylinder 13, a third electric cylinder 17, a fourth electric cylinder 19, a rotary air cylinder 21, a second sensor 23, a button indication switch 41, a first photoelectric switch 42, an electric push cylinder 46, a lifting air cylinder 48, a code scanner 56, a fifth electric cylinder 53, a telescopic air cylinder 61, a sixth electric cylinder 63, a seventh electric cylinder 65, a second photoelectric switch 70, a camera 32 and a chip feeding mechanical arm 24, and the controllers can be commercially available PLC controllers and are not described herein.
As shown in fig. 1, in this embodiment, a display screen 74 and an observation window 75 are further disposed on an outer protective shell of the rack 1, the display screen 74 is connected to the controller for displaying the loading information, the observation window 75 is a transparent glass window, so that an operator can observe the loading process and the working state of the loading machine while effectively sealing the inside of the rack 1, and manual operation of a corresponding part of the loading machine can be achieved by opening the corresponding observation window 75.
In this embodiment, the bottom of the frame 1 is further provided with a horse wheel 76, and the horse wheel 76 provides convenience for moving, carrying, placing and fixing the film feeding machine.
When loading wafers, in the wafer loading part, placing the flower basket at each flower basket placing position of the wafer rack 2, matching the second electric cylinder 13, the third electric cylinder 17 and the fourth electric cylinder 19 to realize accurate displacement of the rotary cylinder 21, taking out the wafer in the flower basket through the wafer taking plate 22, placing the wafer in the first wafer positioning mechanism, after accurate positioning of the wafer, displacing the wafer to the positioning table 10, and in the process of transferring from the first wafer positioning mechanism to the second wafer positioning mechanism, the rotary cylinder 21 acts to complete turnover of the wafer, turning over the wafer from the front side to the back side, after the turnover is completed, placing the wafer in each second wafer positioning mechanism to realize positioning and placing, completing taking, turnover and positioning and placing of one wafer, then the rotary cylinder 21 drives the wafer taking plate 22 to reset to carry out taking of the next wafer, thus, sequentially taking and placing the wafer from the flower basket to the second wafer positioning mechanism for positioning and placing, and realizing wafer loading.
In the wafer loading part, a loading carrier is placed at each carrier placing position in a carrier basket 40, a corresponding button indicating switch 41 is pressed, a first electric cylinder 35 drives a positioning support plate 38 to slide and displace, an insertion rod 39 arranged at the end part of the positioning support plate 38 is inserted below the loading carrier to be loaded, an electric pushing cylinder 46 drives the carrier basket 40 to descend to the insertion rod 39 to support the loading carrier, after the loading carrier is taken on the insertion rod 39, the first electric cylinder 35 drives the positioning support plate 38 to slide, the loading carrier supported on the insertion rod 39 is moved to a position corresponding to a carrier lifting mechanism, then a lifting cylinder 48 drives a carrier support rod 50 to lift the loading carrier to the upper part of the positioning support plate 38, then the first electric cylinder 35 drives the positioning support plate 38 to displace to the position under the loading carrier, the lifting cylinder 48 drives the carrier support rod 50 to descend and reset, the loading carrier is placed on the positioning support plate 38, and under the action of a positioning shaft 3801 arranged on the positioning support plate 38, after the positioning of the upper wafer carrier is realized, after the upper wafer carrier is positioned and placed on the positioning support plate 38, the fifth electric cylinder 53 drives the cover plate sucker 55 to descend, the cover plate 73 of the tray is sucked by the suction nozzle 57 and ascends to reset to suck the cover plate 73, then the telescopic air cylinder 61 drives the cover plate support plate 62 to extend out, the extended cover plate support plate 62 is positioned below the sucked rear cover plate 73 to prevent the cover plate 73 from accidentally falling, meanwhile, the first electric cylinder 35 drives the positioning support plate 38 to move, the upper wafer carrier with the cover plate 73 taken off is conveyed to the other end of the stroke, the upper wafer mechanical arm 24 sucks the wafer after fine positioning from the position of the second wafer positioning mechanism through the wafer picking and placing mechanism, the wafer is firstly moved to the position of the wafer taking hole 101, the information of the taken wafer is shot through the camera 32 and is compared with the template wafer, and after the upper wafer mechanical arm 24 rotates by a corresponding angle, the wafer is accurately placed in the upper wafer carrier, and filling the wafer in the material tray.
After the wafer is placed, the first electric cylinder 35 drives the positioning support plate 38 to convey the upper piece carrier on which the wafer is placed to the tray cover taking mechanism, then the telescopic air cylinder 61 drives the cover plate support plate 62 to reset, the fifth electric cylinder 53 drives the cover plate sucker 55 to reset the cover plate 73 on the upper piece carrier, finally the first electric cylinder 35 drives the positioning support plate 38 to convey the upper piece carrier to the position corresponding to the automatic screwing mechanism, the cover plate 73 is screwed and fixed through the automatic screwing mechanism and the screw feeder 67, after the cover plate 73 is fixed, the first electric cylinder 35 drives the positioning support plate 38 to convey the upper piece carrier to the position corresponding to the carrier lifting mechanism again, after the upper piece carrier on which the wafer is placed is lifted through the lifting mechanism, the first electric cylinder 35 drives the positioning support plate 38 to displace until the inserted rod 39 is positioned right below the upper piece carrier, the lifting electric cylinder drives the carrier support rod 50 to place the upper piece carrier on the inserted rod 39, finally, under the driving of the first electric cylinder 35, the loading carrier which completes loading is placed in the loading carrier material basket 40 in situ, so that automatic loading of the wafer is realized; then the electric pushing cylinder 46 drives the carrier charging basket 40 to ascend/descend by a height to carry out the loading of the next loading carrier, the loading carrier after the loading is finished is taken out from the carrier charging basket 40, the tray filled with the wafer is pushed out from the tray 71 by using the jacking tool, and after the loading carrier after the loading is finished is taken out, a new empty loading carrier can be placed in the carrier charging basket 40 again, so that the uninterrupted automatic loading of the wafer is realized.
The automatic wafer feeding machine is used for automatically feeding wafers, all mechanisms are matched to act, a basket containing the wafers is placed on the wafer material rack 2, the rotating electric cylinders are coordinated and matched to realize accurate displacement of the rotating electric cylinders through the wafer turning mechanism, the wafer taking and placing are realized through the wafer taking plate 22, and after the wafer is accurately positioned by the first wafer positioning mechanism, the wafer is turned over and positioned to be placed at the second wafer positioning mechanism; the storage of the loading carrier is realized through the carrier material basket 40, the loading and the unloading of the loading carrier in the carrier material basket 40 are realized through the inserted link 39, the positioning, the placement and the conveying of the loading carrier are realized through the positioning supporting plate 38, the lifting and the unloading of the cover plate 73 are realized through the material tray cover taking mechanism, the absorption of the wafer after the fine positioning at the position of the second wafer positioning mechanism is realized through the loading mechanical arm 24, the wafer is shot and identified through the shooting mechanism, the wafer is accurately placed in the material tray after the corresponding angle rotation is carried out, the fixation of the cover plate 73 after the loading is realized through the automatic screw loading mechanism and the screw feeder 67, and finally the loading carrier loaded with the wafer is put back into the carrier material basket 40 in situ again, so that the integrated automatic loading of the; compared with the traditional manual wafer feeding mode, the wafer feeding method has the advantages that the manual labor force is effectively replaced, the wafers can be placed at accurate angles and positions in the charging tray, the wafer feeding efficiency is greatly improved, the phenomenon that the wafers are accidentally scratched in the wafer feeding process is effectively avoided, the quality and the qualification rate of the wafers are not affected in the wafer feeding process, in addition, the effective positioning of the wafers in the charging trays and the charging tray can be realized, and the follow-up accurate searching of the wafers after wafer feeding is facilitated.
It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should also be understood that various alterations, modifications and/or variations can be made to the present invention by those skilled in the art after reading the technical content of the present invention, and all such equivalents fall within the protective scope defined by the claims of the present application.
Claims (10)
1. The utility model provides an automatic loading machine, includes the frame, its characterized in that: one end of the rack is provided with a wafer rack, the wafer rack is provided with a plurality of flower basket placing positions, and the wafer rack is provided with a first wafer positioning mechanism;
a wafer loading mechanical arm is arranged in the middle of the rack, a positioning table is further arranged on the rack close to the wafer loading mechanical arm and located between the wafer loading mechanical arm and the wafer rack and corresponds to the wafer rack, and a plurality of second wafer positioning mechanisms are arranged on the positioning table;
a wafer turning mechanism for taking, placing and turning wafers is arranged between the positioning table and the wafer rack, a wafer taking hole is formed in the rack between the positioning table and the wafer loading mechanical arm, and a shooting mechanism corresponding to the wafer taking hole is mounted on the rack;
positioning support plates driven by a first driving device are slidably mounted on two sides of the loading mechanical arm along the horizontal direction, a plurality of positioning shafts used for positioning and placing loading tools are arranged on the upper surfaces of the positioning support plates, carrier baskets respectively corresponding to the positioning support plates are arranged at the other end of the rack, and inserting rods used for taking and placing the loading tools are fixedly mounted at the bottom of one end, close to the carrier baskets, of each positioning support plate;
follow in the frame the slip direction of location layer board still is equipped with carrier lifting mechanism, charging tray in proper order and gets and cover mechanism, automatic screw mechanism and screw feeder, carrier lifting mechanism is close to the setting of carrier charging basket, the charging tray get cover mechanism with automatic screw mechanism of going up all is located the top of location layer board, just the charging tray get cover mechanism with carrier lifting mechanism corresponds the setting, the screw feeder is located location layer board one side, and with automatic screw mechanism of going up corresponds the setting.
2. The automatic sheet feeder of claim 1, wherein: the wafer material rack is fixedly arranged on the rack, a plurality of flower basket mounting plates are arranged on the wafer material rack, a plurality of horizontal adjusting bolts are arranged on the flower basket mounting plates in a threaded mode, threaded ends of the horizontal adjusting bolts abut against the wafer material rack, and the flower basket mounting plates are fixedly arranged on the wafer material rack through the mounting bolts;
the flower basket mounting plate is provided with positioning plates for positioning and placing a flower basket, the positioning plates are correspondingly arranged at two ends of the flower basket mounting plate respectively, the flower basket placing position is formed between the two correspondingly arranged positioning plates, strip-shaped holes are formed in the positioning plates, and the positioning plates are fixedly mounted on the flower basket mounting plate through the strip-shaped holes by utilizing positioning bolts;
still seted up first mounting groove on the basket of flowers mounting panel, be equipped with the first sensor that is used for detecting the basket of flowers in the first mounting groove.
3. The automatic sheet feeder of claim 2, wherein: the first wafer positioning mechanism is located in the middle of the wafer rack and comprises a first mounting seat fixedly mounted on the wafer rack, a first clamping jaw air cylinder is mounted on the first mounting seat, a clamping jaw of the first clamping jaw air cylinder is fixedly mounted with a first positioning block, and when the first positioning block is in a positioning state, a positioning area matched with a wafer is formed between the first positioning blocks;
a plurality of second wafer positioning mechanism in align to grid sets up on the location bench, second wafer positioning mechanism including fixed mounting in second clamping jaw cylinder on the location bench, the jack catch fixed mounting of second clamping jaw cylinder has the second locating piece, have the location on the second locating piece along, just location along with wafer external diameter looks adaptation.
4. The automatic sheet feeder of claim 3, wherein: the sheet turning mechanism comprises a first mounting plate driven by a second driving device and sliding along the X-axis direction, a second mounting plate driven by a third driving device is slidably mounted on the first mounting plate along the Y-axis direction, a third mounting plate driven by a fourth driving device is slidably mounted on the second mounting plate along the Z-axis direction, a rotary cylinder is fixedly mounted on the third mounting plate, a sheet taking plate is fixedly mounted on a rotary disc of the rotary cylinder, a sheet sucking hole and a sheet sucking groove connected with the sheet sucking hole are formed in one side of the end part of the sheet taking plate, the sheet sucking hole is located in the middle of the sheet sucking groove, and an air passage communicated with the sheet sucking hole is formed in the sheet taking plate;
and a second sensor for detecting the material condition of the wafer in the flower basket is fixedly mounted on the third mounting plate, and the second sensor faces the wafer rack.
5. The automatic sheet feeder of claim 4, wherein: the terminal of going up the piece arm is equipped with the wafer and gets and put the mechanism, the wafer is got and is put the mechanism including fixed mounting in the fixing base of going up piece arm bull stick bottom, one side fixed mounting of fixing base has the third sensor, the opposite side fixed mounting of fixing base has the curb plate, there is first sucking disc mounting panel along vertical direction slidable mounting on the curb plate, the bottom fixed mounting of first sucking disc mounting panel has the bernoulli sucking disc, just first sucking disc mounting panel with be equipped with buffer spring between the fixing base, buffer spring's both ends respectively with first sucking disc mounting panel the fixing base links to each other.
6. The automatic sheet feeder of claim 5, wherein: the shooting mechanism comprises a camera, a second mounting seat is fixedly mounted on the rack, and the camera is fixedly mounted on the second mounting seat and corresponds to the shooting hole;
a light source is fixedly arranged on the second mounting seat, is positioned between the camera and the film shooting hole and is arranged corresponding to the film shooting hole;
still fixed mounting has the reflector panel on the fixing base, just the reflector panel is located the fixing base top.
7. The automatic sheet feeder of claim 6, wherein: the carrier charging basket is driven by a fifth driving device respectively and is installed on the rack in a sliding mode along the vertical direction, a plurality of carrier supporting plates are arranged on the two inner sides of the carrier charging basket, the carrier supporting plates are arranged in a pairwise corresponding mode, and a carrier placing position for placing a loading carrier is formed between the two correspondingly arranged carrier supporting plates;
two first photoelectric switches are arranged at one end, far away from the positioning supporting plate, of the carrier charging basket, and are respectively and correspondingly arranged at the top and the bottom of the carrier charging basket;
the side position of carrier charging basket one end still is equipped with a plurality of button indicating switches, button indicating switch respectively with the carrier layer board corresponds the setting.
8. The automatic sheet feeder of claim 7, wherein: carrier lifting mechanism includes the lifting cylinder, fixed mounting has two third mount pads, two in the frame the third mount pad respectively in the both sides of location layer board correspond the setting, the lifting cylinder respectively fixed mounting in the relative one side of third mount pad, fixed mounting has T shape mounting panel on the slip table of lifting cylinder, the top fixed mounting of T shape mounting panel has the carrier die-pin, two the carrier die-pin corresponds the setting.
9. The automatic sheet feeder of claim 8, wherein: the rack is fixedly provided with an installation frame, one side of the installation frame, which faces the carrier charging basket, is fixedly provided with a fourth installation plate, the charging tray cover taking mechanism is installed on the fourth installation plate, and the automatic screw feeding mechanism is positioned on the other side of the installation frame;
the cover taking mechanism of the charging tray comprises a second sucker mounting plate which is driven by a sixth driving device and is arranged in a sliding mode along the vertical direction, a cover plate sucker is fixedly mounted at the bottom end of the second sucker mounting plate, a code scanner is fixedly mounted on the upper surface of the cover plate sucker, close to the position of the carrier charging basket, and a plurality of suction nozzles are uniformly arranged on the bottom surface of the cover plate sucker along the circumferential direction;
the two sides of the second sucker mounting plate are respectively provided with an extension spring, the fourth mounting plate is fixedly provided with a first hanging rod for hanging the extension spring, the cover plate sucker is fixedly provided with a second hanging rod for hanging the extension spring, the hanging ends of the first hanging rod and the second hanging rod are correspondingly arranged, the extension springs are respectively positioned between the correspondingly arranged first hanging rod and the second hanging rod, and the two ends of each extension spring are respectively hung at the hanging ends of the first hanging rod and the second hanging rod;
the automatic screw mechanism of going up includes by the drive of seventh drive arrangement, and along the fifth mounting panel of horizontal direction slip setting, it has the driven electricity of eighth drive arrangement to criticize along vertical direction slidable mounting on the fifth mounting panel, electricity criticize with the screw feeder corresponds the setting.
10. The automatic sheet feeder of claim 9, wherein: carrier lifting mechanism with still be equipped with the apron anti-falling mechanism that is used for preventing that the charging tray apron from dropping between the mechanism is got to the charging tray, apron anti-falling mechanism including respectively fixed mounting in the telescopic cylinder at third mount pad top, and two telescopic cylinder respectively in one side that the third mount pad is relative sets up, telescopic cylinder's the terminal fixed mounting of piston shaft has the apron layer board, two the apron layer board corresponds the setting, and when being in the last piece state, two the interval of apron layer board and the external diameter looks adaptation of charging tray apron.
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| CN202010740774.3A CN111739780B (en) | 2020-07-29 | 2020-07-29 | Automatic sheet feeding machine |
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| CN202010740774.3A CN111739780B (en) | 2020-07-29 | 2020-07-29 | Automatic sheet feeding machine |
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| CN111739780B true CN111739780B (en) | 2020-12-01 |
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| CN112404945B (en) * | 2021-01-22 | 2021-04-16 | 山东元旭光电股份有限公司 | Automatic screw device down of wafer carrier |
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| TWI786019B (en) * | 2022-04-28 | 2022-12-01 | 台灣富創得工程股份有限公司 | Wafer holder and method of using the same |
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| CN116564865A (en) * | 2023-06-27 | 2023-08-08 | 深圳市骜行智能装备有限公司 | Automatic rocking disc material taking and discharging mechanism for processing semiconductor chips |
| CN116493838B (en) * | 2023-06-29 | 2023-09-12 | 苏州安嘉自动化设备有限公司 | Automatic welding device |
| CN117316845B (en) * | 2023-11-28 | 2024-02-13 | 众驼工业科技(苏州)有限公司 | Battery piece conveying device |
| CN117672938A (en) * | 2024-02-01 | 2024-03-08 | 苏州锐杰微科技集团有限公司 | Substrate picking and placing equipment for chip production and working method thereof |
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| CN111739780A (en) | 2020-10-02 |
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Address after: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee after: Yuanxu Semiconductor Technology Co.,Ltd. Address before: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee before: SHANDONG NOVOSHINE OPTOELECTRONICS Co.,Ltd. |
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Denomination of invention: An automatic film loading machine Granted publication date: 20201201 Pledgee: Weifang Jinma road sub branch of Bank of Weifang Co.,Ltd. Pledgor: Yuanxu Semiconductor Technology Co.,Ltd. Registration number: Y2024980007536 |