CN221010561U - Radiator - Google Patents

Abstract

The application relates to the technical field of heat dissipation, and discloses a heat radiator, which comprises: the shell extends for a preset length along the length direction and is used for being connected to the back surface of the mobile terminal; the cooling fan is arranged in the shell, and an air outlet of the cooling fan faces one side of the length direction of the shell; the heat dissipation assembly is arranged in the shell and positioned at the air outlet side of the heat dissipation fan, and the heat conduction pad is arranged at one side of the shell facing the mobile terminal and is connected with the heat dissipation assembly; a side wall air port is formed in the side wall of one side of the shell in the length direction, and the side wall air port is located on the air outlet side of the heat radiating component. The heat dissipation back splint solves the problems of small heat dissipation surface and poor heat dissipation effect caused by direct blowing of the fan of the heat dissipation back splint in the prior art.

Description

Radiator

Technical Field

The application relates to the technical field of heat dissipation, in particular to a heat radiator.

Background

Mobile terminals (e.g., cell phones, tablet computers, portable game consoles, etc.) have become an important tool for people to entertain and dispatch. Along with the continuous improvement of living standard, the requirements of people on entertainment experience are also continuously improved, games of various high-definition videos and high-quality pictures are continuously updated, and the requirements on the performance of the mobile terminal are continuously improved, and meanwhile, the heating power consumption of the mobile terminal is also increased. Taking a mobile phone as an example, a heat dissipation system of the mobile phone is insufficient in extra heat power consumption processing capability for running a high-performance high-quality game. Therefore, a plurality of mobile phone heat dissipation back clamps are appeared in the market to assist the mobile phone in heat dissipation.

The existing mobile phone heat dissipation back clip mainly adopts a fan direct blowing type heat dissipation mode, the fan direct blowing type heat dissipation mode generally utilizes an axial flow fan to blow air towards a heating point of a mobile phone back shell, heat is taken away by high-speed air flow, the fan direct blowing type heat dissipation surface is small, and the heat dissipation effect is poor.

Accordingly, the existing situation and technology is still in need of improvement and development.

Disclosure of utility model

In view of the above-mentioned shortcomings of the prior art, an object of the present application is to provide a radiator, which solves the problems of small radiating surface and poor radiating effect caused by direct blowing of a fan of a radiating back clip in the prior art.

The technical scheme of the application is as follows:

The application proposes a radiator comprising: the shell extends for a preset length along the length direction and is used for being connected to the back surface of the mobile terminal;

The cooling fan is arranged in the shell, and an air outlet of the cooling fan faces one side of the length direction of the shell;

The heat dissipation assembly is arranged in the shell and is positioned at the air outlet side of the heat dissipation fan;

the heat conducting pad is arranged on one side of the shell facing the mobile terminal and is connected with the heat radiating component;

a side wall air port is formed in the side wall of one side of the shell in the length direction, and the side wall air port is located on the air outlet side of the heat radiating component.

Optionally, the heat dissipation assembly includes: the first heat conducting fin is arranged on the heat conducting pad;

The plurality of first radiating fins are arranged at intervals along the width direction and are arranged on the first heat conducting fin;

A first heat dissipation air channel is formed between the adjacent first heat dissipation fins, and openings at two ends of the first heat dissipation air channel along the length direction face the air outlet and the side wall air outlet of the heat dissipation fan respectively.

Optionally, the first heat radiating fin extends in a thickness direction and is connected to an upper inner wall of the case.

Optionally, the heat dissipation assembly further comprises: the second heat conducting fins are arranged in parallel with the first heat conducting fins and are connected to one ends of the plurality of first heat radiating fins, which are away from the first heat conducting fins.

Optionally, a gap is formed between the second heat conducting fin and the upper inner wall of the shell, and the gap is communicated with the side wall air port.

Optionally, a plurality of second heat dissipation fins are arranged on the surface of the second heat conduction fin, which is away from the first heat dissipation fins, and the plurality of second heat dissipation fins are arranged at intervals along the width direction;

And a second heat dissipation air channel is formed between the adjacent second heat dissipation fins, and openings at two ends of the second heat dissipation air channel along the length direction face the air outlet and the side wall air outlet of the heat dissipation fan respectively.

Optionally, the second heat conducting fin is abutted against the upper inner wall of the shell.

Optionally, the housing comprises: a fan housing in which the heat radiation fan is disposed;

The upper shell is connected with the fan shell, extends for a preset length along the length direction, and an inner cavity surrounded by the upper shell is communicated with the inner cavity of the fan shell;

the bottom shell bracket is arranged at the bottom edge of the upper shell;

The heat dissipation component is connected to the bottom shell bracket and extends to the edge of the fan shell;

The heat conduction pad is arranged at the bottom of the heat dissipation component.

Optionally, the housing comprises: an upper shell which encloses an inner cavity, a heat radiation fan is arranged in the inner cavity,

The bottom shell bracket is arranged at the bottom of the heat radiation component and covers the area opposite to the heat radiation fan;

the bottom of the heat radiation component extends along the length direction and respectively abuts against two side walls of the upper shell in the length direction;

the bottom shell support is provided with a window, the window is staggered with the heat dissipation fan, and the heat conduction pad is arranged in the window and is connected with the bottom of the heat dissipation component.

Optionally, a magnetic attraction piece is arranged at the bottom of the shell and is connected with the back surface of the mobile terminal through the magnetic attraction piece;

The inside of the shell is also provided with a chargeable battery which is electrically connected with the cooling fan.

The beneficial effects are that: compared with the prior art, the radiator is attached to the back of the mobile terminal to radiate heat, the heat conducting pad is closely attached to the rear shell of the mobile terminal, and the heat radiating component extends for a preset distance in the length direction because the heat conducting pad is connected with the heat radiating component. The wind generated after the cooling fan on one side of the length direction is started blows towards the cooling component to take away the heat conducted on the cooling component and blow out from the side wall air port, so that the air cooling process is realized.

Drawings

Fig. 1 is a schematic structural diagram of a radiator according to an embodiment of the application;

FIG. 2 is an exploded view of a heat sink according to an embodiment of the present application;

FIG. 3 is a cross-sectional view of a heat sink employing a second shell according to an embodiment of the present application;

Fig. 4 is a cross-sectional view of a radiator according to an embodiment of the present application using a first type of heat dissipating assembly, wherein a is a cross-sectional view of a first structure of the first type of heat dissipating assembly, and b is a cross-sectional view of a second structure of the first type of heat dissipating assembly;

Fig. 5 is a cross-sectional view of a radiator according to an embodiment of the present application using a second type of heat dissipating assembly, wherein c is a cross-sectional view of a first structure of the second type of heat dissipating assembly, d is a cross-sectional view of a second structure of the second type of heat dissipating assembly, and e is a cross-sectional view of a third structure of the second type of heat dissipating assembly;

Fig. 6 is a cross-sectional view of a heat sink employing a first shell according to an embodiment of the present application.

The reference numerals in the drawings: 100. a housing; 110. a fan housing; 111. a fan air inlet; 120. an upper case; 121. a sidewall tuyere; 130. a bottom shell bracket; 131. windowing; 200. a heat radiation fan; 300. a heat dissipation assembly; 310. a first heat conductive sheet; 320. a first heat radiating fin; 321. a first heat dissipation air duct; 330. a second heat conductive sheet; 340. a second heat radiating fin; 341. the second heat dissipation air duct; 400. a thermal pad; 500. and a magnetic attraction piece.

Detailed Description

The application provides a radiator, and in order to make the purpose, technical scheme and effect of the application clearer and more definite, the application is optionally described in detail below by referring to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

Example 1

As shown in fig. 1, 2 and 3, the present embodiment proposes a heat sink, which is used for being connected to a mobile terminal and attached to the back of the mobile terminal so as to dissipate heat of the mobile terminal. In this embodiment, a mobile phone is taken as an example for structural description, a direction in which a long side of the mobile phone is located is taken as a length direction, a direction in which a short side is located is taken as a width direction, a direction in which a thickness of the mobile phone is located is taken as a thickness direction, and each component in this embodiment is structurally described in the above directions. The radiator mainly comprises: the heat sink comprises a housing 100, a heat dissipation fan 200, a heat dissipation assembly 300 and a heat conduction pad 400. The housing 100 extends a predetermined length in a length direction, for example, the length may be 80-150mm (the length refers to a length from one end vertex to the other end vertex), and the housing 100 is used for being connected to the back of the mobile terminal, and the connection manner may be magnetic attraction type, adhesive type, or the like. The heat dissipation fan 200 is disposed in the housing 100, and an air outlet of the heat dissipation fan 200 faces one side of the housing 100 in the length direction; the cooling fan 200 may be specifically located at one end of the housing 100 in the length direction, and located at the other end of the air outlet of the housing 100 facing the length direction, and is configured to discharge air toward the other end. The heat dissipation assembly 300 is arranged in the shell 100 and is positioned at the air outlet side of the heat dissipation fan 200, and the heat dissipation assembly 300 and the heat dissipation fan 200 are arranged side by side in the shell 100 along the length direction, so that the problem of excessive thickness of the heat dissipation device caused by stacking arrangement along the thickness direction is avoided, and the centrifugal fan used by the heat dissipation device and the heat dissipation assembly 300 are positioned at the same horizontal position, so that the whole thickness of the heat dissipation device can be within 10 mm. The heat dissipation assembly 300 is disposed along a length direction, and the size of the mobile phone along the length direction is long, so that there is enough space for structural design, and thus the heat dissipation assembly 300 disposed along the length direction extends for a predetermined length, thereby improving heat dissipation area and efficiency. The heat conduction pad 400 is arranged at one side of the shell 100 facing the mobile terminal and is connected with the heat dissipation assembly 300, the heat conduction pad 400 has strong heat conduction capability, is extended and paved along the length direction, and has larger heat conduction area when attached to the back of the mobile phone, so that the heat conduction efficiency is improved, and more heat can be led into the heat dissipation assembly 300 for heat dissipation. A sidewall air port 121 is formed in a sidewall of one side of the housing 100 in the length direction, and the sidewall air port 121 is located at an air outlet side of the heat dissipation assembly 300. The wind generated after the start of the cooling fan 200 blows along the length direction towards the cooling assembly 300, and takes away the heat conducted on the cooling assembly 300 in the process of passing through the cooling assembly 300, and finally blows out from the side wall air port, thereby realizing the air cooling process.

As shown in fig. 3, in the solution of this embodiment, when the radiator is in operation, the radiator is attached to the back of the mobile terminal to radiate heat, and the heat conducting pad 400 is closely attached to the rear shell of the mobile terminal, because the heat conducting pad 400 is connected with the heat radiating component 300, the heat radiating component 300 extends a predetermined distance in the length direction, when the heat conducting pad 400 covers the heat generating area and conducts the heat of the back, the heat of the back of the mobile terminal is transferred to the heat radiating component 300 through the heat conducting pad 400 and is diffused through the heat radiating component 300, and the heat radiating component 300 is arranged along the length direction, so that a sufficient heat radiating length can be set to radiate heat. The wind generated after the cooling fan 200 positioned at one side of the length direction is started blows towards the cooling component 300 to take away the heat conducted by the cooling component 300 and blow out from the side wall air port, so that the air cooling process is realized, and the thickness dimension of the whole radiator is reduced, the heat radiating area is improved, the heat radiating effect is greatly improved, and the heat radiating requirement of the mobile terminal in running a high-performance high-quality game can be met.

As shown in fig. 2, further, the thermal pad 400 in this embodiment may be a copper-based composite thermal pad or an aluminum-based composite thermal pad, which has a higher thermal conductivity and can further improve heat dissipation performance.

As shown in fig. 2 and 4, further, the substrate structure of the heat dissipation assembly 300 in the present embodiment specifically includes: the first heat conductive sheet 310 and the plurality of first heat dissipation fins 320. The first heat conductive sheet 310 may be mounted on the case 100, and the heat conductive pad 400 may be adhesively fixed to the bottom of the first heat conductive sheet 310. The plurality of first heat dissipation fins 320 are arranged at intervals along the width direction and are welded on the first heat conduction fin 310, the plurality of first heat dissipation fins 320 can be parallel to each other, and a first heat dissipation air duct 321 is formed between the adjacent first heat dissipation fins 320, so that a plurality of first heat dissipation air ducts 321 are formed, and openings at two ends of the first heat dissipation air duct 321 along the length direction face the air outlet and the side wall air outlet of the heat dissipation fan 200 respectively. When the wind generated by the heat radiation fan 200 blows to the heat radiation assembly 300, the cold wind passes through the first heat radiation air duct 321 and takes away the heat on the first heat radiation fins 320 and the first heat conduction fins 310, thereby realizing heat radiation. The first heat conducting fin 310 is not only used as a heat conducting part to be connected with the heat conducting pad 400 for conducting heat, but also used as a mounting position to be connected with the shell 100, and the first heat radiating fin 320 and the first heat conducting fin 310 are contacted with cold air, so that the contact area of the cold air is increased, and the heat radiating performance is improved.

The first heat conductive sheet 310 in this embodiment may be a temperature equalizing plate or other high heat conductive metal such as a copper sheet or an aluminum sheet. The first heat dissipation fins 320 are made of copper or other high heat conduction metals such as aluminum sheets, the thickness of the first heat dissipation fins 320 is 0.2-0.5mm, and the interval between the first heat dissipation fins 320 is 1.0-2.0mm (the width of the first heat dissipation air duct 321). By verifying that the above-mentioned size structure is adopted, the heat dissipation assembly 300 has good heat dissipation performance and strong structural stability.

On the basis of the above basic structure, the structure of the heat dissipation assembly 300 in the present embodiment may be provided in various forms, specifically as follows:

as shown in fig. 4, the first form is based on the above basic structure, forming the following two structures:

As shown in fig. 4 a, the first form of the first structure: the first heat dissipation fin 320 extends a certain length in the thickness direction and is not connected to the upper inner wall of the case 100. The upper inner wall of the housing 100 is an inner wall of the inner cavity of the housing 100 on a side away from the mobile phone, and is an inner wall of the housing on a side away from the mobile phone in the thickness direction. The heat dissipation panel adopting the structure is smaller, and the bearing capacity of the whole heat dissipation assembly 300 is not strong, but the structure is simple, and the heat dissipation function can be realized.

As shown in fig. 4 b, the first form of the second structure: the first heat radiating fin 320 extends in the thickness direction and is connected to the upper inner wall of the case 100. The upper end of the first heat dissipation fin 320 may be welded to the upper inner wall of the case 100, and since the first heat dissipation fin 320 extends a long distance in the thickness direction, thereby increasing a contact area with cold air during heat dissipation, thereby improving heat dissipation efficiency, and the first heat dissipation fin 320 is fixed to the upper inner wall of the case 100, so that the structural strength of the entire heat dissipation assembly 300 is increased, and the structural design is optimized.

As shown in fig. 5, the second form of the improved base structure, the heat dissipation assembly 300 further comprises: the second heat conductive sheet 330 is disposed parallel to the first heat conductive sheet 310 and connected to one end of the plurality of first heat dissipation fins 320 facing away from the first heat conductive sheet 310. By providing the second heat conductive sheet 330, the heat dissipation area of the upper portion can be increased and the connection can be made at the upper end of the first heat dissipation fin 320, so that the assembly on the production line after the module formation is facilitated.

On the basis of the second form, the following three structures can be specifically formed:

As shown in fig. 5 c, the first structure of the second form: the second heat conductive sheet 330 has a gap with the upper inner wall of the case 100, the gap being in communication with the sidewall tuyere. The lower surface of the second heat conducting fin 330 is welded and fixed with the upper ends of the first heat radiating fins 320, heat can be dispersed through the first heat radiating fins 320, and meanwhile, the second heat conducting fin 330 and the first heat conducting fin 310 are matched, so that the whole heat radiating assembly 300 is high in bearing capacity, not easy to deform and damage, good in integrity and convenient to assemble.

As shown in fig. 5 d, a second structure of a second form: the surface of the second heat conducting fin 330, which is away from the first heat radiating fin 320, is welded with a plurality of second heat radiating fins 340, the plurality of second heat radiating fins 340 are arranged at intervals along the width direction, the plurality of second heat radiating fins 340 can be arranged forward or obliquely along the length direction, a second heat radiating air channel 341 is formed between the adjacent second heat radiating fins 340, and two ends of the second heat radiating air channel 341 along the length direction are opened towards the air outlet and the side wall air outlet of the heat radiating fan 200 respectively. On the basis of the advantages of the above structure, more air channels can be provided through the second heat radiating fins 340, thereby further enhancing heat radiating performance and effectively utilizing the space inside the case 100.

The first heat conductive sheet 310, the first heat dissipation fin 320, the second heat conductive sheet 330, and the second heat dissipation fin 340 are welded together, so that structural stability can be enhanced. The thickness of the second heat dissipation fins 340 is 0.2-0.5mm, and the interval of the second heat dissipation fins 340 is 1.0-2.0mm. By verifying that the above-mentioned size structure is adopted, the heat dissipation assembly 300 has better heat dissipation performance and structural stability.

It is easily conceivable that the first heat radiating fin 320 and the second heat radiating fin 340 may also be provided in a wave shape, or a bent shape, in order to increase the contact area.

As shown in fig. 5 e, a third structure of the second form: the second heat conductive sheet 330 is abutted against the upper inner wall of the case 100. Then the lower surface of the second heat conducting fin 330 is used for heat dissipation after heat conduction, and the upper surface of the second heat conducting fin 330 is attached to the housing 100, so that assembly is more convenient, if the housing 100 adopts a metal part, the heat dissipation of the housing 100 can be realized by the heat conduction of the second heat conducting fin 330, the practicability of the housing 100 is enhanced, and the heat dissipation performance is further improved.

Further, on the basis of the above-described structure, the housing 100 in the present embodiment may also include various forms, specifically as follows:

As shown in fig. 6, the first type of housing specifically includes: fan case 110, upper case 120, and bottom case holder 130. The heat radiation fan 200 is disposed in the fan housing 110 such that the heat radiation fan 200 and the fan housing 110 can be produced as one module and assembled with the upper case 120 in the following. The upper case 120 is connected to the fan housing 110 and extends a predetermined length in a length direction, and an inner cavity defined by the upper case 120 is communicated with the inner cavity of the fan housing 110, and the upper case 120 is positioned at one side of the fan housing 110 in the length direction and can be assembled with the fan housing 110, so that the inner cavity of the housing is communicated with the inner cavity of the fan housing 110, thereby forming an inner space of the housing 100. The upper surface of the fan housing 110 is provided with a fan air inlet 111, and after the cooling fan 200 is started, cold air enters the housing 100 from the fan air inlet 111 and cools the cooling assembly 300. The bottom chassis bracket 130 is disposed at the bottom edge of the upper case 120, the bottom chassis bracket 130 is connected to the upper case 120 as a rim, and the bottom chassis bracket 130, the upper case 120 and the fan housing 110 together enclose an inner space of the case 100. The heat dissipation assembly 300 is connected to the bottom chassis bracket 130 and extends to the edge of the fan housing 110, and the edge of the first heat conductive sheet 310 of the heat dissipation assembly 300 may be fixed to the bottom chassis bracket 130 by screws, so that the first heat conductive sheet 310 of the heat dissipation assembly 300 extends along the length direction and abuts against the edge of the bottom of the fan housing 110, and the inner space of the casing 100 is sealed, thereby ensuring structural integrity. And the first heat conductive sheet 310 of the heat dissipation assembly 300 may extend a sufficient distance to accelerate the heat dissipation efficiency. The heat conduction pad 400 is disposed at the bottom of the heat dissipation assembly 300 and is matched with the heat dissipation assembly 300, and can cover the bottom of the first heat conduction sheet 310 of the whole heat dissipation assembly 300, so that the heat conduction area can be increased, and the heat conduction efficiency is higher.

As shown in fig. 2 and 3, the second type of housing specifically includes: upper shell 120 and bottom shell support 130. The upper case 120 encloses an inner cavity, the heat dissipating fan 200 is disposed in the inner cavity, the bottom case bracket 130 is fixed at the bottom of the upper case 120 by screws or adhesion and is located at the bottom of the heat dissipating component 300, the bottom case bracket 130 is disposed around the bottom of the upper case 120, and the bottom is provided with a sealing case and a window 131. The bottom case bracket 130 covers the region opposite to the cooling fan 200 through the sealing case at the bottom, and the window 131 is arranged by staggering the cooling fan 200, and can be arranged side by side with the sealing case along the length direction, and the window 131 is communicated with the inner cavity of the housing 100 due to staggering with the cooling fan 200. The first heat conductive sheet 310 at the bottom of the heat dissipation assembly 300 extends along the length direction and respectively abuts against two side walls of the upper case 120 in the length direction, so that the coverage area of the first heat conductive sheet 310 reaches almost the entire lower surface of the case 100, and the heat conductive pad 400 is disposed in the open window 131 and connected to the first heat conductive sheet 310 at the bottom of the heat dissipation assembly 300.

The air duct of the cooling fan 200 is designed as a part of the upper case 120, so that the whole housing 100 is integrated, the thickness of the whole product can be reduced, the area of the first heat conducting fin 310 can be expanded, and the cooling effect can be improved.

The upper case 120 in this embodiment may be plastic or metal, and if metal is used, the heat dissipation performance and the structural performance are better. The bottom chassis bracket 130 is plastic or metal.

As shown in fig. 2, further, the bottom of the housing 100 in the present embodiment is provided with a magnetic attraction member 500, and is magnetically attracted to the back of the mobile terminal through the magnetic attraction member 500. The mode of adopting magnetism to inhale the connection is more convenient this radiator and the cell-phone back carries out dismantlement formula and is connected, and it is more convenient to use.

Further, a rechargeable battery is further provided in the housing 100, and the rechargeable battery is electrically connected to the heat dissipation fan 200. There is no worry about no external power supply, and high-quality games are convenient to experience anytime and anywhere.

In summary, the radiator provided by the application reduces the thickness of the whole radiator and improves the radiating area, thereby greatly improving the radiating effect and meeting the radiating requirement of the mobile terminal when running high-performance high-quality games. The scheme of the application overcomes the defects of thick and solid existing products, large power consumption, small heat dissipation area and insufficient heat dissipation performance. The radiator has the overall thickness of below 10mm, the weight of less than 80g, the radiating area of more than 3000mm ², and has the advantages of simple and light structure and good radiating effect.

It is to be understood that the application is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.

Claims (10)

1. A heat sink, comprising: the shell extends for a preset length along the length direction and is used for being connected to the back surface of the mobile terminal;

The cooling fan is arranged in the shell, and an air outlet of the cooling fan faces one side of the length direction of the shell;

The heat dissipation component is arranged in the shell and positioned at the air outlet side of the heat dissipation fan,

The heat conducting pad is arranged on one side of the shell, facing the mobile terminal, and is connected with the heat radiating component;

And a side wall air port is formed in the side wall of one side of the shell in the length direction, and is positioned on the air outlet side of the heat radiating component.

2. The heat sink of claim 1, wherein the heat dissipating assembly comprises: a first heat conductive sheet disposed on the heat conductive pad;

a plurality of first heat dissipation fins which are arranged at intervals along the width direction and are arranged on the first heat conduction fins;

And a first heat dissipation air channel is formed between the adjacent first heat dissipation fins, and openings at two ends of the first heat dissipation air channel along the length direction face the air outlet of the heat dissipation fan and the side wall air outlet respectively.

3. The heat sink of claim 2, wherein the first heat radiating fin extends in a thickness direction and is connected to an upper inner wall of the housing.

4. The heat sink of claim 2, wherein the heat dissipating assembly further comprises: the second heat conducting fins are arranged in parallel with the first heat conducting fins and are connected to one ends of the plurality of first heat radiating fins, which are away from the first heat conducting fins.

5. The heat sink of claim 4, wherein the second thermally conductive sheet has a gap with an upper inner wall of the housing, the gap being in communication with the sidewall tuyere.

6. The heat sink of claim 5, wherein a plurality of second heat radiating fins are provided on a surface of the second heat conducting fin facing away from the first heat radiating fin, the plurality of second heat radiating fins being arranged at intervals in a width direction;

and a second heat dissipation air channel is formed between the adjacent second heat dissipation fins, and openings at two ends of the second heat dissipation air channel along the length direction face the air outlet of the heat dissipation fan and the side wall air outlet respectively.

7. The heat sink of claim 4, wherein the second thermally conductive sheet abuts an upper inner wall of the housing.

8. The heat sink of any one of claims 1-7, wherein the housing comprises: a fan housing in which the heat radiation fan is disposed;

The upper shell is connected with the fan shell, extends for a preset length along the length direction, and an inner cavity surrounded by the upper shell is communicated with the inner cavity of the fan shell;

a bottom case bracket disposed at a bottom edge of the upper case;

The heat dissipation component is connected to the bottom shell bracket and extends to the edge of the fan shell;

the heat conducting pad is arranged at the bottom of the heat radiating component.

9. The heat sink of any one of claims 1-7, wherein the housing comprises: an upper shell, wherein the upper shell encloses an inner cavity, the heat radiation fan is arranged in the inner cavity,

The bottom shell bracket is arranged at the bottom of the heat radiation assembly and covers the area opposite to the heat radiation fan;

The bottom of the heat dissipation assembly extends along the length direction and respectively abuts against two side walls of the upper shell in the length direction;

The bottom shell support is provided with a window, the window is staggered with the heat dissipation fan, and the heat conduction pad is arranged in the window and connected with the bottom of the heat dissipation assembly.

10. The heat sink of claim 9, wherein a magnetic attraction piece is arranged at the bottom of the shell and is magnetically attracted to the back of the mobile terminal through the magnetic attraction piece;

And a rechargeable battery is further arranged in the shell, and the rechargeable battery is electrically connected with the cooling fan.