CN117042394A - Light and thin type heat dissipation back clamp - Google Patents

Light and thin type heat dissipation back clamp Download PDF

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Publication number
CN117042394A
CN117042394A CN202310919721.1A CN202310919721A CN117042394A CN 117042394 A CN117042394 A CN 117042394A CN 202310919721 A CN202310919721 A CN 202310919721A CN 117042394 A CN117042394 A CN 117042394A
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CN
China
Prior art keywords
heat
heat dissipation
shell
fan
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310919721.1A
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Chinese (zh)
Inventor
杨俊逸
郭为强
李军锋
周文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jieyao Precision Hardware Shenzhen Co ltd
Southern Industrial Technology Research Institute Shenzhen
Original Assignee
Jieyao Precision Hardware Shenzhen Co ltd
Southern Industrial Technology Research Institute Shenzhen
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Application filed by Jieyao Precision Hardware Shenzhen Co ltd, Southern Industrial Technology Research Institute Shenzhen filed Critical Jieyao Precision Hardware Shenzhen Co ltd
Priority to CN202310919721.1A priority Critical patent/CN117042394A/en
Publication of CN117042394A publication Critical patent/CN117042394A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application relates to the technical field of heat dissipation, and discloses a light and thin heat dissipation back clamp, which comprises: the shell extends for a preset length along the length direction and is used for being connected to the back surface of the mobile terminal; the cooling fan and the cooling assembly are arranged in the shell and distributed side by side along the length direction of the shell, and the cooling assembly is positioned at the air outlet side of the cooling fan; the heat conducting pad is arranged on one side of the shell facing the mobile terminal and is connected with the heat radiating component; a side wall air port is formed in the side wall of one side of the shell in the length direction, and is positioned on the air outlet side of the heat radiation assembly; side walls on two sides of the shell in the width direction are provided with frame radiating air openings which are communicated with air outlets of the radiating fans. The mobile phone heat dissipation back splint solves the problem that in the prior art, the mobile phone frame is easy to overheat due to the fact that the mobile phone frame is not cooled, and therefore the mobile phone performance is affected.

Description

Light and thin type heat dissipation back clamp
Technical Field
The application relates to the technical field of heat dissipation, in particular to a light and thin heat dissipation back clip.
Background
Mobile terminals (e.g., cell phones, tablet computers, portable game consoles, etc.) have become an important tool for people to entertain and dispatch. Along with the continuous improvement of living standard, the requirements of people on entertainment experience are also continuously improved, games of various high-definition videos and high-quality pictures are continuously updated, and the requirements on the performance of the mobile phone are continuously improved, and meanwhile, the heating power consumption of the mobile phone is also increased. The heat dissipation system of the mobile phone is insufficient for processing the extra heat consumption caused by running the high-performance high-quality games. Therefore, a plurality of mobile phone heat dissipation back clamps are appeared in the market to assist the mobile phone in heat dissipation.
The temperature of the bezel during actual play also relatively affects the player's play experience. Particularly, in the process of running a high-performance high-quality game, the heat dissipation capacity of the mobile phone is greatly increased, the heat of the back of the mobile phone is more, the temperature of the mobile phone frame is also increased, and the existing mobile phone heat dissipation back clip generally dissipates heat aiming at the mobile phone back shell, and has no function of dissipating heat of the mobile phone frame, so that the frame is easy to overheat, and the mobile phone performance is affected.
Accordingly, the existing situation and technology is still in need of improvement and development.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present application is directed to a light and thin heat dissipation back clip, which solves the problem that the heat dissipation back clip of a mobile phone in the prior art does not dissipate heat of the mobile phone frame, which causes the frame to be overheated easily, thereby affecting the performance of the mobile phone.
The technical scheme of the application is as follows:
the application provides a light and thin heat dissipation back clip, which comprises: the shell extends for a preset length along the length direction and is used for being connected to the back surface of the mobile terminal;
the cooling fan and the cooling assembly are arranged in the shell and distributed side by side along the length direction of the shell, and the cooling assembly is positioned at the air outlet side of the cooling fan;
the heat conducting pad is arranged on one side of the shell facing the mobile terminal and is connected with the heat radiating component;
a side wall air port is formed in the side wall of one side of the shell in the length direction, and is positioned on the air outlet side of the heat radiation assembly;
side walls on two sides of the shell in the width direction are provided with frame radiating air openings which are communicated with air outlets of the radiating fans.
Optionally, lateral diversion parts are arranged on two sides of the width direction in the shell, lateral diversion channels are arranged in the lateral diversion parts, the lateral diversion channels are communicated with the frame cooling air inlet, and the inlet of the lateral diversion channels faces the air outlet of the cooling fan;
along the width direction of the shell, the outer side height of the frame heat dissipation air port is smaller than the inner side height of the frame heat dissipation air port.
Optionally, the inner wall of the lateral flow guiding part extends to the frame cooling air port and is connected with the inner wall of the shell;
the height of the lateral flow guide channel is as follows: 1-3mm, the length of the frame cooling air port is L, and the width of the inlet of the lateral flow guide channel is W, wherein L=2.5-5W.
Optionally, the width of the lateral flow guide channel gradually decreases along the direction from the inlet to the frame cooling air port;
the height of the lateral flow guide channel gradually decreases along the direction from the inlet to the frame cooling air port.
Optionally, the heat dissipation assembly includes: the first heat conducting fin is arranged on the heat conducting pad;
the plurality of first radiating fins are arranged at intervals along the width direction and are arranged on the first heat conducting fin;
a first heat dissipation air channel is formed between the adjacent first heat dissipation fins, and openings at two ends of the first heat dissipation air channel along the length direction face the air outlet and the side wall air outlet of the heat dissipation fan respectively.
Optionally, the first heat radiating fin extends in a thickness direction and is connected to an upper inner wall of the case.
Optionally, the heat dissipation assembly further comprises: the second heat conducting fins are arranged in parallel with the first heat conducting fins and are connected to one ends of the plurality of first heat radiating fins, which are away from the first heat conducting fins.
Optionally, a gap is formed between the second heat conducting fin and the upper inner wall of the shell, and the gap is communicated with the side wall air port;
or,
a plurality of second radiating fins are arranged on the surface of the second heat conducting fin, which is away from the first radiating fins, and the plurality of second radiating fins are arranged at intervals along the width direction;
a second heat dissipation air channel is formed between the adjacent second heat dissipation fins, and openings at two ends of the second heat dissipation air channel along the length direction face the air outlet and the side wall air outlet of the heat dissipation fan respectively;
or,
the second heat conducting fin is abutted against the upper inner wall of the shell.
Optionally, the housing comprises: a fan housing in which the heat radiation fan is disposed;
the upper shell is connected with the fan shell, extends for a preset length along the length direction, and an inner cavity surrounded by the upper shell is communicated with the inner cavity of the fan shell;
the bottom shell bracket is arranged at the bottom edge of the upper shell;
the heat dissipation component is connected to the bottom shell bracket and extends to the edge of the fan shell;
the heat conducting pad is arranged at the bottom of the heat radiating component;
or,
the housing includes: an upper shell which encloses an inner cavity, a heat radiation fan is arranged in the inner cavity,
the bottom shell bracket is arranged at the bottom of the heat radiation component and covers the area opposite to the heat radiation fan;
the bottom of the heat radiation component extends along the length direction and respectively abuts against two side walls of the upper shell in the length direction;
the bottom shell support is provided with a window, the window is staggered with the heat dissipation fan, and the heat conduction pad is arranged in the window and is connected with the bottom of the heat dissipation component.
Optionally, a magnetic attraction piece is arranged at the bottom of the shell and is connected with the back surface of the mobile terminal through the magnetic attraction piece;
the inside of the shell is also provided with a chargeable battery which is electrically connected with the cooling fan.
The beneficial effects are that: compared with the prior art, the light and thin type heat dissipation back clip is attached to the back of the mobile terminal to dissipate heat, the heat conduction pad is closely attached to the rear shell of the mobile terminal, and the heat dissipation assembly extends for a preset distance in the length direction. The air generated after the cooling fan positioned at one side of the length direction is started is divided into two paths of air blowing, wherein one path of cold air blows towards the cooling component to take away heat conducted by the cooling component and blow out from the side wall air port, so that the air cooling process of the back surface of the mobile terminal is realized; the second path of cold air blows out towards the frame cooling air port, and the frame cooling air port is located on the side face of the width direction of the shell, so that the cold air blown out from the frame cooling air port can blow to the side face edge of the mobile terminal, even blow through the side face edge to reach the screen side of the mobile terminal, and the side face frame of the mobile terminal is blown to dissipate heat. The heat radiating assembly and the heat radiating fan are arranged along the length direction, so that the thickness dimension of the whole light and thin heat radiating back clamp is reduced, and the heat radiating area is increased; in addition, the cooling air is blown from the frame cooling air openings on two sides, so that heat of the frame of the mobile terminal is taken away. Therefore, the cooling effect of the back and the frame of the mobile terminal is realized, the heat dissipation effect is greatly improved, the condition that the screen and the frame are easy to overheat is avoided, and the heat dissipation requirement of the mobile terminal when a high-performance high-quality game is operated can be met.
Drawings
Fig. 1 is a schematic structural diagram of a radiator according to an embodiment of the application;
FIG. 2 is an exploded view of a heat sink according to an embodiment of the present application;
FIG. 3 is a cross-sectional view of a heat sink according to an embodiment of the present application;
FIG. 4 is a cross-sectional view of a heat sink employing a second shell according to an embodiment of the present application;
fig. 5 is a cross-sectional view of a radiator according to an embodiment of the present application using a first type of heat dissipating assembly, wherein a is a cross-sectional view of a first structure of the first type of heat dissipating assembly, and b is a cross-sectional view of a second structure of the first type of heat dissipating assembly;
fig. 6 is a cross-sectional view of a radiator according to an embodiment of the present application using a second type of heat dissipating assembly, wherein c is a cross-sectional view of a first structure of the second type of heat dissipating assembly, d is a cross-sectional view of a second structure of the second type of heat dissipating assembly, and e is a cross-sectional view of a third structure of the second type of heat dissipating assembly;
fig. 7 is a cross-sectional view of a heat sink employing a first shell according to an embodiment of the present application.
The reference numerals in the drawings: 100. a housing; 110. a fan housing; 111. a fan air inlet; 120. an upper case; 121. a sidewall tuyere; 122. a frame heat dissipation air port; 130. a bottom shell bracket; 131. windowing; 140. a lateral flow guiding part; 141. a lateral flow guide channel; 142. an inlet; 200. a heat radiation fan; 300. a heat dissipation assembly; 310. a first heat conductive sheet; 311. a mounting groove; 320. a first heat radiating fin; 321. a first heat dissipation air duct; 330. a second heat conductive sheet; 340. a second heat radiating fin; 341. the second heat dissipation air duct; 400. a thermal pad; 500. a magnetic attraction piece; 510. and a fixing plate.
Detailed Description
The application provides a light and thin heat dissipation back clip, which is used for making the purposes, technical schemes and effects of the application clearer and more definite, and the application is optionally described in detail below by referring to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
Example 1
As shown in fig. 1 and 2, the present embodiment provides a light and thin heat dissipation back clip for connecting to a mobile terminal and attaching to the back of the mobile terminal to dissipate heat of the mobile terminal. In this embodiment, a mobile phone is taken as an example for structural description, a direction in which a long side of the mobile phone is located is taken as a length direction, a direction in which a short side is located is taken as a width direction, a direction in which a thickness of the mobile phone is located is taken as a thickness direction, and each component in this embodiment is structurally described in the above directions. This frivolous heat dissipation back splint mainly includes: the heat sink comprises a housing 100, a heat dissipation fan 200, a heat dissipation assembly 300 and a heat conduction pad 400. The housing 100 extends a predetermined length in a length direction, for example, the length may be 80-150mm (the length refers to a length from one end vertex to the other end vertex), and the housing 100 is used for being connected to the back of the mobile terminal, and the connection manner may be magnetic attraction type, adhesive type, or the like. The heat dissipation fan 200 is disposed in the housing 100, and an air outlet of the heat dissipation fan 200 faces one side of the housing 100 in the length direction; the cooling fan 200 may be specifically located at one end of the housing 100 in the length direction, and located at the other end of the air outlet of the housing 100 facing the length direction, and is configured to discharge air toward the other end. The heat dissipation assembly 300 is disposed in the housing 100 and is located at the air outlet side of the heat dissipation fan 200, and the heat dissipation assembly 300 and the heat dissipation fan 200 are disposed side by side in the longitudinal direction in the housing 100, so that the problem that the light and thin heat dissipation back clip is too thick due to lamination arrangement in the thickness direction is avoided, and the centrifugal fan and the heat dissipation assembly 300 used by the light and thin heat dissipation back clip are located at the same horizontal position, so that the overall thickness of the light and thin heat dissipation back clip can be within 10 mm. The heat dissipation assembly 300 is disposed along a length direction, and the size of the mobile phone along the length direction is long, so that there is enough space for structural design, and thus the heat dissipation assembly 300 disposed along the length direction extends for a predetermined length, thereby improving heat dissipation area and efficiency. The heat conduction pad 400 is arranged at one side of the shell 100 facing the mobile terminal and is connected with the heat dissipation assembly 300, the heat conduction pad 400 has strong heat conduction capability, is extended and paved along the length direction, and has larger heat conduction area when attached to the back of the mobile phone, so that the heat conduction efficiency is improved, and more heat can be led into the heat dissipation assembly 300 for heat dissipation. A sidewall air port 121 is formed in a sidewall of one side of the housing 100 in the length direction, and the sidewall air port 121 is located at an air outlet side of the heat dissipation assembly 300. The wind generated after the start of the cooling fan 200 blows along the length direction toward the cooling module 300, and takes away the heat conducted on the cooling module 300 in the process of passing through the cooling module 300, and finally blows out from the side wall air port 121, thereby realizing the air cooling process. The side walls on two sides of the width direction of the shell 100 are provided with the frame radiating air openings 122, the frame radiating air openings 122 are communicated with the air outlets of the radiating fans 200, and the frame radiating air openings 122 face the frame of the mobile phone, so that blown cold air can be blown downwards to the frame in an inclined manner, even can be blown to the front side of a screen, and cold air generated by the radiating fans 200 can be blown downwards in an inclined manner from the frame radiating air openings 122, so that cold air can be blown towards the frame of the mobile phone to radiate heat of the frame of the mobile phone.
As shown in fig. 2 and 3, in the solution of this embodiment, when the light and thin heat dissipation back clip is in operation, the light and thin heat dissipation back clip is attached to the back of the mobile terminal to dissipate heat, and the heat dissipation pad 400 is closely attached to the rear shell of the mobile terminal, because the heat dissipation assembly 300 is connected to the heat dissipation assembly 400, the heat dissipation assembly 300 extends a predetermined distance in the length direction, when the heat dissipation pad 400 covers the heat generating area and conducts the heat of the back, the heat of the back of the mobile terminal is transferred to the heat dissipation assembly 300 through the heat dissipation pad 400 and is diffused through the heat dissipation assembly 300, and the heat dissipation assembly 300 is arranged along the length direction, so that a sufficient heat dissipation length can be set to dissipate heat. The wind generated after the cooling fan 200 positioned at one side in the length direction is started is divided into two paths of wind, wherein one path of cold wind blows towards the cooling component 300 to take away the heat conducted by the cooling component 300 and blows out from the side wall wind gap 121, so that the process of air cooling the back surface of the mobile terminal is realized; the second path of cold air blows out towards the frame cooling air port 122, and the frame cooling air port 122 is located on the side face of the width direction of the shell 100, so that the cold air blown out from the frame cooling air port 122 can blow to the side face edge of the mobile terminal, and even blow to the side face edge to reach the screen side of the mobile terminal under the condition that the wind power is strong, and the side face frame and the screen side of the mobile terminal are blown to dissipate heat. Because the heat radiation component 300 and the heat radiation fan 200 are arranged along the length direction, the thickness dimension of the whole light and thin heat radiation back clamp is reduced, and the heat radiation area is increased; in addition, in combination with blowing cold air from the side frame heat dissipation vents 122, heat on the side frame and even the screen of the mobile terminal is taken away. Therefore, the cooling effect of the back and the frame of the mobile terminal is realized, the heat dissipation effect is greatly improved, the situation that the frame is easy to overheat is avoided, and the heat dissipation requirement of the mobile terminal when a high-performance high-quality game is operated can be met.
As shown in fig. 2 and 3, further, lateral flow guiding portions 140 are provided on both sides in the width direction in the housing 100, and the flow guiding portions on both sides are symmetrically provided, and the structures thereof are the same. Taking the lateral flow guiding portion 140 at one side as an example for structural illustration, the lateral flow guiding portion 140 has a lateral flow guiding channel 141 therein, the lateral flow guiding channel 141 can extend along the length direction, one end of the lateral flow guiding channel 141 is communicated with the frame cooling air inlet 122, the other end forms an inlet 142 of the lateral flow guiding channel 141, and the inlet 142 of the lateral flow guiding channel 141 faces the air outlet of the cooling fan 200. The cold air formed after the cooling fan 200 is turned on enters from the inlet 142 of the lateral flow guiding channel 141 and is guided by the lateral flow guiding channel 141, so that the cold air is blown out from the frame cooling air inlet 122 and is blown to the frames at two sides in the width direction.
As shown in fig. 5, the outside height of the rim heat dissipation air port 122 is smaller than the inside height of the rim heat dissipation air port 122 in the width direction of the housing 100. The inner side of the frame cooling tuyere 122 is a side near the midpoint of the width of the case 100; the outer side of the rim heat dissipation port 122 is a side facing the outside of the case 100. In this way, the frame cooling air port 122 is set to be in a form of being wide in the inner side and narrow in the outer side, so that the upper inner wall of the frame cooling air port 122 is obliquely arranged or/and the lower inner wall of the frame cooling air port 122 is obliquely arranged, and therefore air flows downwards obliquely when flowing outwards, more cool air is blown out towards the frame direction, and the cool air quantity flowing downwards is improved.
As shown in fig. 3, further, the inner wall of the lateral flow guiding portion 140 extends to the frame cooling air port 122 and is connected to the inner side wall of the housing 100, and the height of the lateral flow guiding channel 141 is: 1-3mm, the length of the frame cooling tuyere 122 is L, and the width of the inlet 142 of the lateral flow guide channel 141 is W, where l=2.5-5W. Because of the need to control the amount of cool air blown out in the frame direction, if too large a length of the frame cooling air port 122 or too narrow a width of the inlet 142 is adopted, insufficient air volume is caused, less air volume flows out to the frame, and even the front of the screen is not reached. Thus, by simulation and experimental summary, the height at the lateral flow guide 141 is: under the condition of 1-3mm, the relationship of L=2.5-5W needs to be satisfied for the length of the frame cooling air port 122 and the width W of the inlet 142 of the lateral flow guide channel 141, so that the mobile phone frame can be cooled by air cooling. Otherwise, under the condition of adopting wider W, the amount of air blown into the radiator can be reduced, so that the influence is caused on the heat radiation performance of the back of the mobile phone, and the narrower W cannot blow cold air to the frame position, so that a better frame and even a screen cooling effect cannot be realized, therefore, the parameters capable of playing the optimal heat radiation performance in the embodiment are as follows: w is 3-10mm, L is 15-25mm.
Further, as shown in fig. 3, the width of the lateral flow guide channel 141 gradually decreases in the direction from the inlet 142 to the rim heat dissipation air port 122; or/and the height of the lateral flow guide 141 gradually decreases in the direction from the inlet 142 to the rim heat dissipation tuyere 122. The lateral flow guide channel 141 is gradually reduced, so that the air flow is led to flow out towards the lateral lower part, and the air flow is more and more concentrated, so that the cold air flowing out has stronger impulsive force and flows to the frame.
As shown in fig. 2 and 4, further, the thermal pad 400 in this embodiment may be a copper-based composite thermal pad or an aluminum-based composite thermal pad, which has a higher thermal conductivity and can further improve heat dissipation performance.
As shown in fig. 5, further, the substrate structure of the heat dissipation assembly 300 in this embodiment specifically includes: the first heat conductive sheet 310 and the plurality of first heat dissipation fins 320. The first heat conductive sheet 310 may be mounted on the case 100, and the heat conductive pad 400 may be adhesively fixed to the bottom of the first heat conductive sheet 310. The plurality of first heat dissipation fins 320 are arranged at intervals along the width direction and are welded on the first heat conduction fin 310, the plurality of first heat dissipation fins 320 can be parallel to each other, and a first heat dissipation air duct 321 is formed between the adjacent first heat dissipation fins 320, so that a plurality of first heat dissipation air ducts 321 are formed, and openings at two ends of the first heat dissipation air duct 321 along the length direction face the air outlet and the side wall air outlet 121 of the heat dissipation fan 200 respectively. When the wind generated by the heat radiation fan 200 blows to the heat radiation assembly 300, the cold wind passes through the first heat radiation air duct 321 and takes away the heat on the first heat radiation fins 320 and the first heat conduction fins 310, thereby realizing heat radiation. The first heat conducting fin 310 is not only used as a heat conducting part to be connected with the heat conducting pad 400 for conducting heat, but also used as a mounting position to be connected with the shell 100, and the first heat radiating fin 320 and the first heat conducting fin 310 are contacted with cold air, so that the contact area of the cold air is increased, and the heat radiating performance is improved.
The first heat conductive sheet 310 in this embodiment may be a temperature equalizing plate or other high heat conductive metal such as a copper sheet or an aluminum sheet. The first heat dissipation fins 320 are made of copper or other high heat conduction metals such as aluminum sheets, the thickness of the first heat dissipation fins 320 is 0.2-0.5mm, and the interval between the first heat dissipation fins 320 is 1.0-2.0mm (the width of the first heat dissipation air duct 321). By verifying that the above-mentioned size structure is adopted, the heat dissipation assembly 300 has good heat dissipation performance and strong structural stability.
On the basis of the above basic structure, the structure of the heat dissipation assembly 300 in the present embodiment may be provided in various forms, specifically as follows:
the first form is based on the basic structure described above, forming two structures:
as shown in fig. 5 a, the first form of the first structure: the first heat dissipation fin 320 extends a certain length in the thickness direction and is not connected to the upper inner wall of the case 100. The upper inner wall of the housing 100 is an inner wall of the inner cavity of the housing 100 on a side away from the mobile phone, and is an inner wall of the housing on a side away from the mobile phone in the thickness direction. The heat dissipation panel adopting the structure is smaller, and the bearing capacity of the whole heat dissipation assembly 300 is not strong, but the structure is simple, and the heat dissipation function can be realized.
As shown in fig. 5 b, the first form of the second structure: the first heat radiating fin 320 extends in the thickness direction and is connected to the upper inner wall of the case 100. The upper end of the first heat dissipation fin 320 may be welded to the upper inner wall of the case 100, and since the first heat dissipation fin 320 extends a long distance in the thickness direction, thereby increasing a contact area with cold air during heat dissipation, thereby improving heat dissipation efficiency, and the first heat dissipation fin 320 is fixed to the upper inner wall of the case 100, so that the structural strength of the entire heat dissipation assembly 300 is increased, and the structural design is optimized.
As shown in fig. 6, the second form of the improved base structure, the heat dissipation assembly 300 further comprises: the second heat conductive sheet 330 is disposed parallel to the first heat conductive sheet 310 and connected to one end of the plurality of first heat dissipation fins 320 facing away from the first heat conductive sheet 310. By providing the second heat conductive sheet 330, the heat dissipation area of the upper portion can be increased and the connection can be made at the upper end of the first heat dissipation fin 320, so that the assembly on the production line after the module formation is facilitated.
On the basis of the second form, the following three structures can be specifically formed:
as shown in fig. 6 c, the first structure of the second form: the second heat conductive sheet 330 has a gap with the upper inner wall of the case 100, and the gap communicates with the sidewall tuyere 121. The lower surface of the second heat conducting fin 330 is welded and fixed with the upper ends of the first heat radiating fins 320, heat can be dispersed through the first heat radiating fins 320, and meanwhile, the second heat conducting fin 330 and the first heat conducting fin 310 are matched, so that the whole heat radiating assembly 300 is high in bearing capacity, not easy to deform and damage, good in integrity and convenient to assemble.
As shown in fig. 6 d, a second structure of a second form: the surface of the second heat conducting fin 330, which is away from the first heat radiating fin 320, is welded with a plurality of second heat radiating fins 340, the plurality of second heat radiating fins 340 are arranged at intervals along the width direction, the plurality of second heat radiating fins 340 can be arranged forward or obliquely along the length direction, a second heat radiating air channel 341 is formed between the adjacent second heat radiating fins 340, and two ends of the second heat radiating air channel 341 along the length direction are opened towards the air outlet and the side wall air outlet 121 of the heat radiating fan 200 respectively. On the basis of the advantages of the above structure, more air channels can be provided through the second heat radiating fins 340, thereby further enhancing heat radiating performance and effectively utilizing the space inside the case 100.
The first heat conductive sheet 310, the first heat dissipation fin 320, the second heat conductive sheet 330, and the second heat dissipation fin 340 are welded together, so that structural stability can be enhanced. The thickness of the second heat dissipation fins 340 is 0.2-0.5mm, and the interval of the second heat dissipation fins 340 is 1.0-2.0mm. By verifying that the above-mentioned size structure is adopted, the heat dissipation assembly 300 has better heat dissipation performance and structural stability.
It is easily conceivable that the first heat radiating fin 320 and the second heat radiating fin 340 may also be provided in a wave shape, or a bent shape, in order to increase the contact area.
As shown in fig. 6 e, a third structure of the second form: the second heat conductive sheet 330 is abutted against the upper inner wall of the case 100. Then the lower surface of the second heat conducting fin 330 is used for heat dissipation after heat conduction, and the upper surface of the second heat conducting fin 330 is attached to the housing 100, so that assembly is more convenient, if the housing 100 adopts a metal part, the heat dissipation of the housing 100 can be realized by the heat conduction of the second heat conducting fin 330, the practicability of the housing 100 is enhanced, and the heat dissipation performance is further improved.
Further, on the basis of the above-described structure, the housing 100 in the present embodiment may also include various forms, specifically as follows:
as shown in fig. 7, the first type of housing specifically includes: fan case 110, upper case 120, and bottom case holder 130. The heat radiation fan 200 is disposed in the fan housing 110 such that the heat radiation fan 200 and the fan housing 110 can be produced as one module and assembled with the upper case 120 in the following. The upper case 120 is connected to the fan housing 110 and extends a predetermined length in a length direction, and an inner cavity defined by the upper case 120 is communicated with the inner cavity of the fan housing 110, and the upper case 120 is positioned at one side of the fan housing 110 in the length direction and can be assembled with the fan housing 110, so that the inner cavity of the housing is communicated with the inner cavity of the fan housing 110, thereby forming an inner space of the housing 100. The upper surface of the fan housing 110 is provided with a fan air inlet 111, and after the cooling fan 200 is started, cold air enters the housing 100 from the fan air inlet 111 and cools the cooling assembly 300. The bottom chassis bracket 130 is disposed at the bottom edge of the upper case 120, the bottom chassis bracket 130 is connected to the upper case 120 as a rim, and the bottom chassis bracket 130, the upper case 120 and the fan housing 110 together enclose an inner space of the case 100. The heat dissipation assembly 300 is connected to the bottom chassis bracket 130 and extends to the edge of the fan housing 110, and the edge of the first heat conductive sheet 310 of the heat dissipation assembly 300 may be fixed to the bottom chassis bracket 130 by screws, so that the first heat conductive sheet 310 of the heat dissipation assembly 300 extends along the length direction and abuts against the edge of the bottom of the fan housing 110, and the inner space of the casing 100 is sealed, thereby ensuring structural integrity. And the first heat conductive sheet 310 of the heat dissipation assembly 300 may extend a sufficient distance to accelerate the heat dissipation efficiency. The heat conduction pad 400 is disposed at the bottom of the heat dissipation assembly 300 and is matched with the heat dissipation assembly 300, and can cover the bottom of the first heat conduction sheet 310 of the whole heat dissipation assembly 300, so that the heat conduction area can be increased, and the heat conduction efficiency is higher.
As shown in fig. 2 and 4, the second type of housing specifically includes: upper shell 120 and bottom shell support 130. The upper case 120 encloses an inner cavity, the heat dissipating fan 200 is disposed in the inner cavity, the bottom case bracket 130 is fixed at the bottom of the upper case 120 by screws or adhesion and is located at the bottom of the heat dissipating component 300, the bottom case bracket 130 is disposed around the bottom of the upper case 120, and the bottom is provided with a sealing case and a window 131. The bottom case bracket 130 covers the region opposite to the cooling fan 200 through the sealing case at the bottom, and the window 131 is arranged by staggering the cooling fan 200, and can be arranged side by side with the sealing case along the length direction, and the window 131 is communicated with the inner cavity of the housing 100 due to staggering with the cooling fan 200. The first heat conductive sheet 310 at the bottom of the heat dissipation assembly 300 extends along the length direction and respectively abuts against two side walls of the upper case 120 in the length direction, so that the coverage area of the first heat conductive sheet 310 reaches almost the entire lower surface of the case 100, and the heat conductive pad 400 is disposed in the open window 131 and connected to the first heat conductive sheet 310 at the bottom of the heat dissipation assembly 300.
The air duct of the cooling fan 200 is designed as a part of the upper case 120, so that the whole housing 100 is integrated, the thickness of the whole product can be reduced, the area of the first heat conducting fin 310 can be expanded, and the cooling effect can be improved.
The upper case 120 in this embodiment may be plastic or metal, and if metal is used, the heat dissipation performance and the structural performance are better. The bottom chassis bracket 130 is plastic or metal.
As shown in fig. 2, further, the bottom of the housing 100 in the present embodiment is provided with a magnetic attraction member 500, and is magnetically attracted to the back of the mobile terminal through the magnetic attraction member 500. The mode of adopting magnetism to inhale the connection is more convenient this frivolous heat dissipation back splint and cell-phone back to dismantle the connection, and it is more convenient to use. In a specific structure, the magnetic attraction piece 500 may be connected to the first heat conductive sheet 310 through the fixing plate 510, and the magnetic attraction piece 500 is located at the back of the housing 100, so that connection with the mobile phone is more stable when connection is performed through the magnetic attraction piece 500. The first heat conductive sheet 310 is provided with a plurality of mounting grooves 311, and the magnetic attraction member 500 is embedded in the mounting grooves 311 and fixed on the first heat conductive sheet 310 by a fixing plate 510, thereby realizing the mounting of the magnetic attraction member 500.
Further, a rechargeable battery is further provided in the housing 100, and the rechargeable battery is electrically connected to the heat dissipation fan 200. There is no worry about no external power supply, and high-quality games are convenient to experience anytime and anywhere.
It is easy to think that it can also adopt external power source type, connect with mobile phone or external plug after connecting the cable through the connection interface.
In summary, the light and thin heat dissipation back clip provided by the application reduces the thickness dimension of the whole light and thin heat dissipation back clip, and improves the heat dissipation area, thereby greatly improving the heat dissipation effect and meeting the heat dissipation requirement of the mobile terminal when running high-performance high-quality games. And realize the cooling in the back of the cell-phone and frame even screen simultaneously, can alleviate the screen high temperature and to the burning sensation of player's finger, improve the use experience of cell-phone. The scheme of the application overcomes the defects of thick and solid existing products, large power consumption, small heat dissipation area and insufficient heat dissipation performance. The whole thickness of the light and thin heat dissipation back clip can be below 10mm, and the weight of the light and thin heat dissipation back clip is equal to that of the light and thin heat dissipation back clip<80g, heat dissipation area>3000mm 2 The heat radiator has the advantages of simple and light structure and good heat radiation effect.
It is to be understood that the application is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.

Claims (10)

1. A lightweight and thin heat sink clip, comprising: the shell extends for a preset length along the length direction and is used for being connected to the back surface of the mobile terminal;
the cooling fan and the cooling assembly are arranged in the shell and distributed side by side along the length direction of the shell, and the cooling assembly is positioned at the air outlet side of the cooling fan;
the heat conducting pad is arranged on one side of the shell, facing the mobile terminal, and is connected with the heat radiating component;
a side wall air port is formed in the side wall of one side of the shell in the length direction, and the side wall air port is positioned on the air outlet side of the heat dissipation assembly;
and side walls on two sides of the width direction of the shell are provided with frame radiating air openings which are communicated with air outlets of the radiating fans.
2. The light and thin heat dissipation back clip according to claim 1, wherein lateral flow guiding parts are arranged on two sides of the width direction in the shell, lateral flow guiding parts are internally provided with lateral flow guiding channels, the lateral flow guiding channels are communicated with the frame heat dissipation air port, and an inlet of each lateral flow guiding channel faces to an air outlet of the heat dissipation fan;
and the outer side height of the frame cooling air port is smaller than the inner side height of the frame cooling air port along the width direction of the shell.
3. The light and thin heat dissipation back clip according to claim 2, wherein the inner wall of the lateral flow guiding part extends to the frame heat dissipation air port and is connected with the inner wall of the shell;
the height of the lateral flow guide channel is as follows: 1-3mm, wherein the length of the frame cooling air port is L, and the width of the inlet of the lateral flow guide channel is W, wherein L=2.5-5W.
4. The lightweight and thin heat sink clip as set forth in claim 3, wherein the width of the lateral flow guide channel decreases gradually in the direction from the inlet to the rim heat sink vent;
the height of the lateral flow guide channel gradually decreases along the direction from the inlet to the frame cooling air port.
5. The lightweight and thin heat sink clip as set forth in claim 1, wherein the heat sink assembly comprises: a first heat conductive sheet disposed on the heat conductive pad;
a plurality of first heat dissipation fins which are arranged at intervals along the width direction and are arranged on the first heat conduction fins;
and a first heat dissipation air channel is formed between the adjacent first heat dissipation fins, and openings at two ends of the first heat dissipation air channel along the length direction face the air outlet of the heat dissipation fan and the side wall air outlet respectively.
6. The lightweight and thin heat sink clip as set forth in claim 5, wherein the first heat sink fin extends in a thickness direction and is connected to an upper inner wall of the housing.
7. The lightweight and thin heat sink clip as set forth in claim 5, wherein the heat sink assembly further comprises: the second heat conducting fins are arranged in parallel with the first heat conducting fins and are connected to one ends of the plurality of first heat radiating fins, which are away from the first heat conducting fins.
8. The lightweight and thin heat sink clip as set forth in claim 7, wherein a gap is provided between the second thermally conductive sheet and the upper inner wall of the housing, the gap being in communication with the sidewall tuyere;
or,
a plurality of second radiating fins are arranged on the surface, facing away from the first radiating fins, of the second heat conducting fins, and the second radiating fins are arranged at intervals along the width direction;
a second heat dissipation air channel is formed between the adjacent second heat dissipation fins, and openings at two ends of the second heat dissipation air channel along the length direction face the air outlet of the heat dissipation fan and the side wall air outlet respectively;
or,
the second heat conducting fin is abutted against the upper inner wall of the shell.
9. The lightweight and thin heat sink clip as in any one of claims 1-7, wherein said housing comprises: a fan housing in which the heat radiation fan is disposed;
the upper shell is connected with the fan shell, extends for a preset length along the length direction, and an inner cavity surrounded by the upper shell is communicated with the inner cavity of the fan shell;
a bottom case bracket disposed at a bottom edge of the upper case;
the heat dissipation component is connected to the bottom shell bracket and extends to the edge of the fan shell;
the heat conducting pad is arranged at the bottom of the heat radiating component;
or,
the housing includes: an upper shell, wherein the upper shell encloses an inner cavity, the heat radiation fan is arranged in the inner cavity,
the bottom shell bracket is arranged at the bottom of the heat radiation assembly and covers the area opposite to the heat radiation fan;
the bottom of the heat dissipation assembly extends along the length direction and respectively abuts against two side walls of the upper shell in the length direction;
the bottom shell support is provided with a window, the window is staggered with the heat dissipation fan, and the heat conduction pad is arranged in the window and connected with the bottom of the heat dissipation assembly.
10. The light and thin heat dissipation back clip according to claim 9, wherein a magnetic attraction piece is arranged at the bottom of the shell and is magnetically attracted and connected with the back surface of the mobile terminal through the magnetic attraction piece;
and a rechargeable battery is further arranged in the shell, and the rechargeable battery is electrically connected with the cooling fan.
CN202310919721.1A 2023-07-24 2023-07-24 Light and thin type heat dissipation back clamp Pending CN117042394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310919721.1A CN117042394A (en) 2023-07-24 2023-07-24 Light and thin type heat dissipation back clamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310919721.1A CN117042394A (en) 2023-07-24 2023-07-24 Light and thin type heat dissipation back clamp

Publications (1)

Publication Number Publication Date
CN117042394A true CN117042394A (en) 2023-11-10

Family

ID=88636399

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310919721.1A Pending CN117042394A (en) 2023-07-24 2023-07-24 Light and thin type heat dissipation back clamp

Country Status (1)

Country Link
CN (1) CN117042394A (en)

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