CN211577841U

CN211577841U - Heat abstractor and computer equipment

Info

Publication number: CN211577841U
Application number: CN202020700569.XU
Authority: CN
Inventors: 王国峰
Original assignee: Shenzhen Jimete Times Technology Co ltd
Current assignee: Shenzhen Jimete Times Technology Co ltd
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2020-09-25
Anticipated expiration: 2030-04-30

Abstract

The embodiment of the utility model discloses heat abstractor and computer equipment, this heat abstractor includes: the bracket can move along a first direction so that the bracket pushes the heating body to abut against the cooling assembly, so that the clamping buckle can be clamped with one of the clamping grooves, the bracket is fixed on the cooling assembly, and the heating body is limited between the cooling assembly and the bracket; the bracket can also move along the second direction to make the joint buckle leave from the joint inslot, in order to separate bracket and heat-generating body and radiator unit, first direction and second opposite direction, the joint buckle can realize the joint with a plurality of joint grooves respectively, in order to realize the heat-generating body installation of different dimensions, and then promoted heat abstractor's suitability.

Description

Heat abstractor and computer equipment

Technical Field

The utility model relates to a heat radiation structure technical field especially relates to a heat abstractor and computer equipment.

Background

The heat sink can be installed on a heat-generating body such as a hard disk as a cooling device, for example, the hard disk is connected with the heat sink as a heat-generating body, the hard disk can be rotated at a high speed during operation to raise the temperature in the hard disk, and the heat sink can lower the temperature of the hard disk during operation.

At present, heat abstractor includes the heat-conducting plate, and the both sides of heat-conducting plate are provided with radiating fin and buckle structure respectively, and under the general condition, adopt buckle structure and heat-generating body can dismantle and be connected, but can only realize the heat-generating body installation of appointed model size, and the suitability is relatively poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat abstractor and computer equipment aims at solving current heat abstractor and only can realize the heat-generating body installation of appointed model size, the relatively poor problem of suitability.

A heat dissipation device, comprising: the heat dissipation assembly comprises a plurality of clamping grooves and is used for reducing the temperature of a heating body, the bracket comprises a clamping buckle and is used for bearing the heating body, the bracket can move along a first direction, so that the bracket pushes the heating body to be abutted against the heat dissipation assembly, the clamping buckle can be clamped with one of the clamping grooves, the bracket is fixed on the heat dissipation assembly, and the heating body is limited between the heat dissipation assembly and the bracket;

the bracket can also move along a second direction, so that the clamping buckle leaves from the clamping groove to separate the bracket and the heating body from the heat dissipation assembly, and the first direction is opposite to the second direction.

In one of them embodiment, radiator unit still includes spacing portion, the joint is detained and is included guide portion, guide portion with spacing portion clearance fit to the guide the joint is detained and is followed first direction removes, so that the joint is detained can with a plurality of joint in the joint groove.

In one embodiment, the buckle further comprises a buckle main body and a buckle portion, wherein a through groove is formed in the buckle main body, the buckle portion is arranged in the through groove and elastically connected with the buckle main body, the buckle portion can elastically deform in the direction of the buckle groove to leave the buckle groove, and the buckle portion can also reset in the direction of the buckle groove to be connected with the buckle groove in a clamping mode.

In one embodiment, a deformation groove is arranged on one side, away from the clamping groove, of the clamping portion, and the deformation groove extends in a direction parallel to the extending direction of the clamping groove.

In one embodiment, the plurality of clamping grooves are arranged at intervals along the first direction and extend along a third direction, and the first direction is perpendicular to the third direction.

In one of them embodiment, radiator unit still include the apron and with the shell seat of apron detachable connection, be equipped with multichannel fin in the shell seat, and adjacent form the heat dissipation channel with outside intercommunication between the fin.

In one embodiment, the heat dissipation assembly further includes a heat dissipation fan disposed in the heat dissipation sheet and configured to drive the heat dissipation channel to exchange with the external air so as to reduce the temperature in the heat dissipation channel.

In one embodiment, the heat dissipation assembly further includes an electrical connector electrically connected to the heat dissipation fan and configured to supply power to the heat dissipation fan.

In one embodiment, the heat dissipation assembly further includes a heat conductor disposed between the housing and the heat generating body.

A computer device, comprising: the heat dissipation device is arranged on the hard disk and used for reducing the temperature of the hard disk.

Adopt the embodiment of the utility model provides a, following beneficial effect has:

by adopting the heat dissipation device of the utility model, the bracket can move along the first direction, so that the bracket pushes the heating element to abut against the heat dissipation component, so that the clamping buckle can be clamped with one of the plurality of clamping grooves, the bracket is fixed on the heat dissipation component, and the heating element is limited between the heat dissipation component and the bracket, thereby realizing the installation of the heating element; the bracket can also move along the second direction to make the joint buckle leave from the joint inslot, in order to with bracket and heat-generating body and radiator unit separation, realize the dismantlement of heat-generating body, the joint is buckled and can be realized the joint with a plurality of joint grooves respectively, in order to realize the heat-generating body installation of different dimensions, and then has promoted heat abstractor's suitability.

The heat dissipation device is applied to the computer equipment, and can be installed on the hard disks of different sizes to realize the cooling of the hard disks, so that the performance of the hard disks is ensured, and the performance of the computer equipment is further improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Wherein:

fig. 1 is a schematic diagram of a heat dissipation device according to an embodiment.

Fig. 2 is an enlarged view of a portion a of the heat dissipating device shown in fig. 1.

Fig. 3 is a front view of the heat dissipation device of fig. 1.

Fig. 4 is a side view of the heat sink of fig. 1.

Fig. 5 is a top view of the heat dissipation device of fig. 1.

Fig. 6 is a cross-sectional view B-B of the heat dissipating device shown in fig. 5.

Fig. 7 is an exploded view of the heat sink shown in fig. 1.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1, 3, 4 and 5, a heat sink according to an embodiment is mainly used for reducing the temperature of a heat generating body 300 such as a hard disk, and includes: the heat dissipation assembly 100 comprises a plurality of clamping grooves 111 and is used for reducing the temperature of the heating element 300, the bracket 200 comprises a clamping buckle 210 and is used for bearing the heating element 300, the bracket 200 can move along a first direction, so that the bracket 200 pushes the heating element 300 to abut against the heat dissipation assembly 100, the clamping buckle 210 can be clamped with one of the clamping grooves 111, the bracket 200 is fixed on the heat dissipation assembly 100, the heating element 300 is limited between the heat dissipation assembly 100 and the bracket 200, and the heating element 300 is installed; bracket 200 can also be followed the second direction and removed to make joint buckle 210 leave from joint inslot 111, in order to separate bracket 200 and heat-generating body 300 and radiator unit 100, realize the dismantlement of heat-generating body 300, first direction is opposite with the second direction, joint buckle 210 can realize the joint with a plurality of joint grooves 111 respectively, in order to realize the installation of heat-generating body 300 of different dimensions, and then has promoted heat abstractor's suitability.

Preferably, the heat generating body 300 may extend out of the bracket 200 so that the bracket 200 can be installed in accordance with heat generating bodies 300 of various sizes and models.

Referring to fig. 2, the heat dissipating assembly 100 further includes a limiting portion 121, the clip buckle 210 includes a guiding portion 211, the guiding portion 211 is in clearance fit with the limiting portion 121 to guide the clip buckle 210 to move along a first direction, so that the clip buckle 210 can be clipped in one of the plurality of clip grooves 111, and the mounting stroke of the heat dissipating assembly 100 and the bracket 200 is controlled. Of course, in other embodiments, the first direction may also be disposed at an angle to a plane where the bottom surface of the heat sink assembly 100 is located, and the clamping between the clamping buckle 210 and the clamping groove 111 may also be completed.

In this embodiment, the clip 210 further includes a clip body 212 and a clip portion 213, a through groove 2121 is formed in the clip body 212, the clip portion 213 is disposed in the through groove 2121 and elastically connected to the clip body 212, the clip portion 213 can elastically deform in a direction away from the clip groove 111 to leave the clip groove 111, the clip portion 213 can also reset in a direction close to the clip groove 111 to clip to the clip groove 111, so as to realize the clip connection between the clip 210 and the clip grooves 111, when the bracket 200 carries the heat-generating body 300 and is mounted on the heat-dissipating assembly 100 along the first direction, the clip portion 213 can be connected to the designated clip groove 111 according to the type and size of the heat-generating body 300, so as to realize the mounting of the heat-generating body 300, so that the heat-dissipating device is mounted on the heat-generating body 300, and the adaptability is high. The heat dissipation of the heating bodies 300 with different models and sizes can be realized by adopting one heat dissipation device, and the production cost of the mold opening processing of the heat dissipation device is reduced.

Referring to fig. 6, a deformation groove 2131 is disposed on a side of the fastening portion 213 away from the fastening groove 111, and the deformation groove 2131 extends in a direction parallel to the extending direction of the fastening groove 111, so as to facilitate the elastic deformation of the fastening portion 213 away from the fastening groove 111 and ensure that the elastic deformation is not damaged.

In this embodiment, the plurality of engaging grooves 111 are spaced along a first direction and extend along a third direction, the first direction is perpendicular to the third direction, and the plurality of engaging grooves 111 are regularly arranged to engage with the engaging buckle 210. Of course, in other embodiments, the first direction may also be disposed at an acute angle with respect to the third direction, and the clamping between the clamping groove 111 and the clamping buckle 210 may also be implemented.

Preferably, the inner wall of the fastening groove 111 is provided with a damping layer to prevent the fastening buckle 210 from moving along a straight line in the third direction, so as to ensure the stability of the connection between the fastening groove 111 and the fastening buckle 210, and the damping layer may be a rubber layer. Of course, in other embodiments, the damping layer may be disposed at other positions of the heat dissipation assembly 100, for example, a protrusion portion is formed between adjacent clamping grooves 111, and the damping layer is disposed on the protrusion portion.

Referring to fig. 7, the heat dissipation assembly 100 further includes a cover plate 120 and a housing 110 detachably connected to the cover plate 120, a plurality of heat dissipation fins 112 are disposed in the housing 110, and a heat dissipation channel 140 is formed between adjacent heat dissipation fins 112 and is communicated with the outside, the arrangement of the heat dissipation fins 112 increases the heat dissipation area of the housing 110, improves the heat dissipation efficiency, and is used to reduce the temperature in the heat dissipation device and achieve the heat dissipation and cooling of the heat dissipation device.

Preferably, the position-limiting part 121 is opened on the cover plate 120 to realize the clearance fit between the position-limiting part 121 and the guiding part 211. Of course, in other embodiments, the limiting portion 121 may also be disposed on the housing seat 110.

Preferably, the plurality of engaging grooves 111 are formed on the outer side of the housing base 110, and the protruding portion of the engaging portion 213 is located on the inner side of the bracket 200, so as to engage the engaging grooves 111 with the engaging buckles 210. Of course, in other embodiments, the clamping groove 111 may also be opened on the inner side of the housing base 110 or the cover plate 120, and at this time, the protruding portion of the clamping portion 213 is located on the outer side of the bracket 200, so as to realize the clamping of the clamping groove 111 and the clamping buckle 210.

In the present embodiment, the inner wall and the bottom surface of the bracket 200 are provided with damping layers to increase the frictional force between the bracket 200 and the heating element 300, to prevent the heating element 300 from falling off the bracket 200, and to realize stable bearing of the bracket 200 on the heating element 300. In addition, the upper surface of the bracket 200 may be attached to the heating element 300 to exchange heat with the heating element 300, thereby further improving the heat radiation efficiency of the heating element 300.

In this embodiment, the heat dissipation assembly 100 further includes a heat dissipation fan 130, the heat dissipation fan 130 is disposed in the heat dissipation plate 112 and used for driving the heat dissipation channel 140 to exchange with the external air to reduce the temperature in the heat dissipation channel 140, the cover plate 120 is provided with an air inlet 122 opposite to the heat dissipation fan 130, a plurality of accommodating grooves for accommodating the heat dissipation fan 130 are disposed in the heat dissipation plates 112, and an air outlet of the heat dissipation fan 130 is communicated with the heat dissipation channel 140 to accelerate the heat dissipation speed of the heat dissipation device.

In this embodiment, the heat dissipation assembly 100 further includes an electrical connector 131, and the electrical connector 131 is electrically connected to the heat dissipation fan 130 and is used for supplying power to the heat dissipation fan 130, so as to implement the operation of the heat dissipation fan 130 and accelerate the heat dissipation of the heat dissipation apparatus.

In this embodiment, the heat dissipation assembly 100 further includes a heat conductor 150, and the heat conductor 150 is disposed between the housing 110 and the heat generating body 300 to accelerate the heat exchange between the heat dissipation assembly 100 and the heat generating body 300, so as to improve the heat dissipation efficiency of the heat dissipation assembly 100. Preferably, the heat conductor 150 is a heat conductive silica gel, and has good properties such as high thermal conductivity, excellent thermal conductivity, good electrical insulation, wide application temperature, good application stability, low consistency and easy construction. Of course, in other embodiments, the heat conductor 150 may be omitted, and the heat generating element 300 may be attached to the bottom surface of the case base 110, thereby achieving a good heat exchange effect.

A computer device of an embodiment, comprising: the heat dissipation device is arranged on the hard disk and used for reducing the temperature of the hard disk, and can be arranged on the hard disks with different sizes, so that the performance of the hard disks can be ensured by cooling, and the performance of computer equipment can be improved.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.

Claims

1. A heat dissipating device, comprising: the heat dissipation assembly comprises a plurality of clamping grooves and is used for reducing the temperature of a heating body, the bracket comprises a clamping buckle and is used for bearing the heating body, the bracket can move along a first direction, so that the bracket pushes the heating body to be abutted against the heat dissipation assembly, the clamping buckle can be clamped with one of the clamping grooves, the bracket is fixed on the heat dissipation assembly, and the heating body is limited between the heat dissipation assembly and the bracket;

2. The heat dissipation device of claim 1, wherein the heat dissipation assembly further comprises a limiting portion, the clip buckle comprises a guiding portion, and the guiding portion is in clearance fit with the limiting portion to guide the clip buckle to move along the first direction, so that the clip buckle can be clipped with one of the plurality of clip grooves.

3. The heat dissipation device of claim 2, wherein the clip further comprises a clip body and a clip portion, a through groove is formed in the clip body, the clip portion is disposed in the through groove and elastically connected to the clip body, the clip portion can elastically deform in a direction away from the clip groove to leave the clip groove, and the clip portion can also reset in a direction close to the clip groove to clip with the clip groove.

4. The heat dissipating device as claimed in claim 3, wherein a deformation groove is formed on a side of the clip portion away from the clip groove, and the deformation groove extends in a direction parallel to an extending direction of the clip groove.

5. The heat dissipating device of claim 1, wherein the plurality of clip slots are spaced apart along the first direction and extend along a third direction, the first direction being perpendicular to the third direction.

6. The heat dissipating device of claim 1, wherein the heat dissipating assembly further comprises a cover plate and a housing detachably connected to the cover plate, a plurality of heat dissipating fins are disposed in the housing, and a heat dissipating channel communicated with the outside is formed between adjacent heat dissipating fins.

7. The heat dissipating device of claim 6, wherein the heat dissipating assembly further comprises a heat dissipating fan disposed in the heat dissipating plate and configured to drive the heat dissipating channel to exchange with the outside air so as to reduce the temperature in the heat dissipating channel.

8. The heat dissipating device of claim 7, wherein the heat dissipating assembly further comprises an electrical connector electrically connected to the heat dissipating fan and configured to provide power to the heat dissipating fan.

9. The heat dissipating device according to claim 6, wherein the heat dissipating assembly further comprises a heat conductor disposed between the case base and the heat generating body.

10. A computer device, comprising: a hard disk and the heat sink of any one of claims 1 to 9, said heat sink being mounted on said hard disk and adapted to reduce the temperature of said hard disk.