CN220984486U - High-strength silicon wafer boat - Google Patents
High-strength silicon wafer boat Download PDFInfo
- Publication number
- CN220984486U CN220984486U CN202322532423.5U CN202322532423U CN220984486U CN 220984486 U CN220984486 U CN 220984486U CN 202322532423 U CN202322532423 U CN 202322532423U CN 220984486 U CN220984486 U CN 220984486U
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- Prior art keywords
- silicon wafer
- silicon
- bottom plate
- top plate
- boat
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 162
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 159
- 239000010703 silicon Substances 0.000 title claims abstract description 159
- 239000013078 crystal Substances 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 239000002210 silicon-based material Substances 0.000 abstract description 11
- 238000004140 cleaning Methods 0.000 abstract description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 230000003749 cleanliness Effects 0.000 abstract description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 abstract description 2
- 150000003376 silicon Chemical class 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 86
- 239000000463 material Substances 0.000 description 6
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of semiconductor manufacturing devices, and discloses a high-strength silicon wafer boat, which comprises a top plate, wherein a bottom plate is arranged on the right side of the top plate, a plurality of mechanical arms are fixedly connected with the left side of the top plate and the right side of the bottom plate, a plurality of silicon wafer groove bars are fixedly connected between the top plate and the bottom plate, and a plurality of silicon wafer placing grooves are formed in the surface of the silicon wafer groove bars. This silicon wafer silicon boat of high strength, silicon wafer slot stick slope sets up, be convenient for place the silicon chip slope between silicon wafer slot stick, silicon chip slope crisscross placing, can bear more silicon chips, production efficiency is high, roof, bottom plate, backplate and silicon wafer slot stick all adopt silicon crystal to make, through using monocrystalline silicon and polycrystalline silicon material components of a whole that can function independently processing each subassembly, adopt high strength high temperature resistant special glue to splice each part equipment after the processing is accomplished, the preparation is accomplished after the cleanliness factor requirement is reached through chemical cleaning, the high temperature stability of silicon material is better, non-deformable.
Description
Technical Field
The utility model relates to the technical field of semiconductor manufacturing devices, in particular to a high-strength silicon wafer boat.
Background
Silicon wafers are one of the most basic materials in semiconductor fabrication. It is typically made of high purity single crystal silicon material, having a circular flat shape. The main function of silicon wafers is as a substrate for semiconductor chips used in the fabrication of integrated circuits and other semiconductor devices. The surface of the silicon wafer is subjected to multiple processes such as polishing, cleaning and coating to provide good flatness and quality, the silicon boat is a container for bearing the silicon wafers in the semiconductor manufacturing process, and can contain a plurality of silicon wafers, the existing silicon boat is mainly made of quartz materials, has the defects of poor high-temperature stability, easy deformation and the like, and the problem is solved by arranging the silicon boat with high strength.
The Chinese patent of publication No. CN214797358U discloses a staggered slotting silicon boat, the inner surface of the silicon boat is provided with a plurality of grooves for placing silicon wafers at intervals along the length direction, the surface of the silicon boat is provided with a plurality of through groove groups side by side, each through groove group comprises a plurality of through grooves, and the through grooves of any two through groove groups are staggered with each other. However, the staggered slotting silicon boat has the advantages of low structural strength, less quantity of bearing silicon wafers, low production efficiency, low strength and high temperature resistance and inconvenient use.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides a high-strength silicon wafer boat, which aims to overcome the problems existing in the prior art.
In order to achieve the above purpose, the high-strength silicon wafer boat provided by the utility model comprises a top plate, wherein a bottom plate is arranged on the right side of the top plate, a plurality of mechanical arms are fixedly connected with the left side of the top plate and the right side of the bottom plate, a plurality of silicon wafer groove bars are fixedly connected between the top plate and the bottom plate, and a plurality of silicon wafer placing grooves are formed in the surface of the silicon wafer groove bars.
Preferably, the structural dimensions of the top plate and the bottom plate are the same, and the top plate and the bottom plate are rectangular.
Through above-mentioned technical scheme, set up roof and bottom plate that the structure is the same, simple structure is convenient for make.
Preferably, the four mechanical arms are arranged, the four mechanical arms are fixedly connected with the top plate and the bottom plate in a pairwise manner, and the four mechanical arms are arranged on the same horizontal line.
Through above-mentioned technical scheme, set up four robotic arms, be convenient for snatch removal and transport, it is comparatively convenient to use.
Preferably, two silicon wafer groove bars are symmetrically arranged, and the two silicon wafer groove bars are obliquely arranged and have an inclination angle of 3-4 degrees.
Through the technical scheme, the silicon wafer groove bars are arranged, the silicon wafer groove bars are obliquely arranged, so that the silicon wafers are obliquely arranged between the silicon wafer groove bars, the silicon wafers are obliquely and alternately arranged, and more silicon wafers can be borne.
Preferably, 122 silicon wafer placing grooves are formed in the surface of the silicon wafer groove rod, and the shape of each silicon wafer placing groove is trapezoid.
Through the technical scheme, 122 silicon wafer placing grooves are formed in the single silicon wafer groove rod, 244 silicon wafers can be placed on the highest of the two silicon wafer groove rods, and production efficiency is high.
Preferably, the top plate, the bottom plate, the back plate and the silicon wafer groove bars are all made of silicon crystals, and the top plate, the bottom plate and the silicon wafer groove bars are bonded and connected through high-strength high-temperature-resistant special glue.
Through above-mentioned technical scheme, roof, bottom plate, backplate and silicon chip slot stick all adopt the silicon crystal to make, through using monocrystalline silicon and the components of polycrystalline silicon material components of a whole that can function independently processing, adopt high strength high temperature resistant special glue to splice each part equipment after the processing is accomplished, the preparation is accomplished after the cleanliness factor requirement is reached through chemical cleaning, the high temperature stability of silicon material is better, be difficult for the deformation, compared with the quartz material stability of ordinary, more durable, roof, bottom plate, backplate and silicon chip slot stick adopt high strength high temperature resistant special glue bonding connection, stability and durability are good, high temperature resistant performance is good, can keep stable production efficiency.
Compared with the prior art, the high-strength silicon wafer boat provided by the utility model has the following beneficial effects:
1. This high strength's silicon wafer silicon boat sets up roof and bottom plate that the structure is the same, simple structure, and be convenient for make, set up four robotic arms, be convenient for snatch removal and transport, it is comparatively convenient to use, set up the silicon chip slot stick, the silicon chip slot stick slope sets up, be convenient for place the silicon chip slope between the silicon chip slot stick, the silicon chip slope is crisscross to be placed, can bear more silicon chips, 122 silicon chip standing grooves have been seted up to single silicon chip slot stick, 244 silicon chips can be placed to two silicon chip slot sticks the highest, production efficiency is higher.
2. This high strength silicon wafer silicon boat, roof, bottom plate, backplate and silicon chip slot stick all adopt the silicon crystal to make, through using monocrystalline silicon and the components of polycrystalline silicon material components of a whole that can function independently processing, adopt high strength high temperature resistant special glue to splice each part equipment after the processing is accomplished, accomplish after the chemical cleaning reaches the cleanliness factor requirement, the high temperature stability of silicon material is better, non-deformable, it is better than the quartz material stability of ordinary, it is more durable, roof, bottom plate, backplate and silicon chip slot stick adopt high strength high temperature resistant special glue bonding connection, stability and durability are good, high temperature resistance can be good, can keep stable production efficiency.
Drawings
FIG. 1 is a schematic view of a first perspective view of a silicon wafer boat according to the present utility model;
FIG. 2 is a schematic view of a second perspective view of a silicon wafer boat according to the present utility model;
FIG. 3 is a schematic diagram of the front view structure of a silicon wafer boat according to the present utility model;
fig. 4 is an enlarged schematic view of the structure of fig. 3 at a.
Wherein: 1. a top plate; 2. a bottom plate; 3. a mechanical arm; 4. a silicon wafer groove bar; 5. a silicon wafer placing groove; 6. a back plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Embodiment one:
Referring to fig. 1 and 3, there is shown a constitution example of a high-strength silicon wafer boat given in this example.
As can be seen from the figure, the high-strength silicon wafer boat in this example mainly comprises a top plate 1, a bottom plate 2, a robot arm 3 and a silicon wafer trench bar 4.
Specifically, the silicon wafer silicon boat is provided with a bottom plate 2 on the right side of a top plate 1, a plurality of mechanical arms 3 are fixedly connected on the left side of the top plate 1 and the right side of the bottom plate 2, a plurality of silicon wafer groove bars 4 are fixedly connected between the top plate 1 and the bottom plate 2, and a plurality of silicon wafer placing grooves 5 are formed in the surface of the silicon wafer groove bars 4.
The high-strength silicon wafer boat formed by the method is reasonable in structure, the mechanical arms 3 (such as 4 silicon wafer boat are arranged, the gripping, moving and carrying are convenient, the use is convenient, the silicon wafer groove bars 4 are arranged, the silicon wafer groove bars 4 are obliquely arranged, the silicon wafer is obliquely arranged between the silicon wafer groove bars 4, the silicon wafer is obliquely arranged in a staggered manner, more silicon wafers can be borne, 122 silicon wafer placing grooves 5 are formed in the single silicon wafer groove bar 4, 244 silicon wafers can be placed in the highest of the two silicon wafer groove bars 4, and the production efficiency is high.
In some embodiments of the present example, the top plate 1 and the bottom plate 2 in the silicon wafer boat have the same structural dimensions, and the top plate 1 and the bottom plate 2 are rectangular in shape. The advantage is, sets up roof 1 and bottom plate 2 that the structure is the same, simple structure, the manufacturing of being convenient for.
In some embodiments of the present example, as shown in fig. 1 and 2, four mechanical arms 3 are disposed in the silicon wafer boat, two pairs of four mechanical arms 3 are fixedly connected to the top plate 1 and the bottom plate 2 respectively, and the four mechanical arms 3 are disposed on the same horizontal line. The four mechanical arms 3 are arranged, so that the grabbing, moving and carrying are convenient, and the use is convenient.
In some embodiments of the present example, as shown in fig. 3 and 4, the silicon wafer trench bars 4 in the silicon wafer boat are provided with two silicon wafer trench bars 4 which are symmetrically arranged, and the two silicon wafer trench bars 4 are inclined at an inclination angle of 3-4 °. The silicon wafer groove bars 4 are arranged, the silicon wafer groove bars 4 are obliquely arranged, so that the silicon wafers are obliquely arranged between the silicon wafer groove bars 4, and can be obliquely and alternately arranged, and more silicon wafers can be borne.
Embodiment two:
The example further provides an optimization scheme based on the embodiment scheme.
With further reference to fig. 2 to 4, 122 silicon wafer placing grooves 5 are formed in the surface of the silicon wafer groove rod 4 in the scheme in this example, and the shape of each silicon wafer placing groove 5 is trapezoid. The silicon wafer groove rod has the advantages that 122 silicon wafer placing grooves 5 are formed in a single silicon wafer groove rod 4, 244 silicon wafers can be placed in the highest position of the two silicon wafer groove rods 4, and production efficiency is high.
Further, in this example, the top plate 1, the bottom plate 2, the back plate 6 and the silicon wafer groove bars 4 are all made of silicon crystals, and the top plate 1, the bottom plate 2 and the silicon wafer groove bars 4 are bonded and connected by high-strength high-temperature-resistant special glue. The silicon crystal structure has the advantages that the top plate 1, the bottom plate 2, the back plate 6 and the silicon wafer groove rod 4 are made of silicon crystals, all components are processed through split processing by using monocrystalline silicon and polycrystalline silicon materials, all components are spliced and assembled by high-strength high-temperature-resistant special glue after processing, the components are manufactured after chemical cleaning meets the cleanliness requirement, the high-temperature stability of the silicon materials is good, the silicon crystal structure is not easy to deform, the stability of the silicon crystal structure is better than that of a common quartz material, the silicon crystal structure is more durable, the top plate 1, the bottom plate 2, the back plate 6 and the silicon wafer groove rod 4 are bonded and connected by the high-strength high-temperature-resistant special glue, the stability and the durability are good, the high-temperature resistance performance is good, and the stable production efficiency can be kept.
The working operation of the high strength silicon wafer boat solution given in this example is illustrated below.
This high strength silicon wafer silicon boat is when using, carries out convenient snatch removal and transport based on four robotic arms 3 that set up, and it is comparatively convenient to use, based on the silicon chip slot stick 4 that sets up, and silicon chip slot stick 4 slope setting is convenient for place the silicon chip slope between silicon chip slot stick 4, and the silicon chip slope is crisscross to be placed, can bear more silicon chips, and 122 silicon chip standing grooves 5 have been seted up to single silicon chip slot stick 4, and 244 silicon chips can be placed to two silicon chip slot sticks 4 the highest, and production efficiency is higher.
Moreover, this high strength silicon wafer silicon boat, roof 1, bottom plate 2, backplate 6 and silicon wafer slot stick 4 all adopt silicon crystal to make, through using monocrystalline silicon and the components of polycrystalline silicon material components of a whole that can function independently processing, adopt high strength high temperature resistant special glue to splice each part equipment after the processing is accomplished, accomplish after the chemical cleaning reaches the cleanliness factor requirement, the high temperature stability of silicon material is better, non-deformable, it is better than the quartz material stability of commonly using, more durable, roof 1, bottom plate 2, backplate 6 and silicon wafer slot stick 4 adopt high strength high temperature resistant special glue to bond and connect, stability and durability are good, high temperature resistant can be good, can keep stable production efficiency.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a high strength silicon chip silicon boat, includes roof (1), its characterized in that: the right side of roof (1) is provided with bottom plate (2), a plurality of robotic arms (3) of right side fixed connection of roof (1) left side and bottom plate (2), a plurality of silicon chip slot stick (4) of fixed connection between roof (1) and bottom plate (2), a plurality of silicon chip standing grooves (5) have been seted up on silicon chip slot stick (4) surface, fixed connection backplate (6) between roof (1) and bottom plate (2).
2. The high strength silicon wafer boat of claim 1, wherein: the structure size of the top plate (1) is the same as that of the bottom plate (2), and the top plate (1) and the bottom plate (2) are rectangular.
3. The high strength silicon wafer boat of claim 1, wherein: the mechanical arms (3) are four, the four mechanical arms (3) are fixedly connected with the top plate (1) and the bottom plate (2) in pairs, and the four mechanical arms (3) are arranged on the same horizontal line.
4. The high strength silicon wafer boat of claim 1, wherein: the two silicon wafer groove bars (4) are symmetrically arranged, and the two silicon wafer groove bars (4) are obliquely arranged and have an inclination angle of 3-4 degrees.
5. The high strength silicon wafer boat of claim 1, wherein: 122 silicon wafer placing grooves (5) are formed in the surface of the silicon wafer groove rod (4), and the shape of each silicon wafer placing groove (5) is trapezoid.
6. The high strength silicon wafer boat of claim 1, wherein: the top plate (1), the bottom plate (2), the back plate (6) and the silicon wafer groove rod (4) are all made of silicon crystals, and the top plate (1), the bottom plate (2), the back plate (6) and the silicon wafer groove rod (4) are connected through high-strength high-temperature-resistant special glue in an adhesive mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322532423.5U CN220984486U (en) | 2023-09-18 | 2023-09-18 | High-strength silicon wafer boat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322532423.5U CN220984486U (en) | 2023-09-18 | 2023-09-18 | High-strength silicon wafer boat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220984486U true CN220984486U (en) | 2024-05-17 |
Family
ID=91066193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322532423.5U Active CN220984486U (en) | 2023-09-18 | 2023-09-18 | High-strength silicon wafer boat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220984486U (en) |
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2023
- 2023-09-18 CN CN202322532423.5U patent/CN220984486U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high-strength silicon wafer boat Granted publication date: 20240517 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Shanghai pilot Free Trade Zone Lingang xinpian District sub branch Pledgor: Shanghai shengyongcheng Semiconductor Technology Co.,Ltd. Registration number: Y2024310000660 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |