CN220932749U - Detection device for flip product cold joint - Google Patents
Detection device for flip product cold joint Download PDFInfo
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- CN220932749U CN220932749U CN202322245390.6U CN202322245390U CN220932749U CN 220932749 U CN220932749 U CN 220932749U CN 202322245390 U CN202322245390 U CN 202322245390U CN 220932749 U CN220932749 U CN 220932749U
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- 238000001514 detection method Methods 0.000 title claims abstract description 25
- 238000013519 translation Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 238000012544 monitoring process Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000012797 qualification Methods 0.000 abstract description 3
- 230000002159 abnormal effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000012858 packaging process Methods 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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Abstract
The invention relates to a detection device for flip-chip product cold joint, which comprises an objective table, a laser emission head and a panel; the objective table is used for placing the chip to be detected; the laser emission head is used for emitting light to directly irradiate the back surface of the chip; the panel is used for receiving light reflected by the back surface of the chip and forming a light spot used as a detection standard. The method utilizes the smooth mirror surface effect of the chip surface, and carries out angle detection on the flip chip surface finished before reflow through light reflection to judge whether the flip chip surface is in cold joint or not, thereby improving the yield of products, carrying out real-time monitoring on the mounting qualification of the products before the completion of welding and shaping on the flip products, simultaneously, timely finding out the root cause of abnormal contact between the chip salient points and the substrate bonding pads, being applicable to the detection of the connection between the chip salient points and the substrate bonding pads of various packaging process products such as flip chips, chip size packaging, ball grid array packaging and the like, providing clear improvement direction for the yield and reliability of the products, and having strong practicability and wide applicability.
Description
Technical Field
The invention relates to a detection device for flip-chip product cold joint, and belongs to the technical field of semiconductor packaging.
Background
In the flip-chip process of semiconductor package, with the decrease of the size and the increasing of the I/O number of the product, the requirement for the reliability of the product is higher and higher, however, the interconnection technology of the bump and the substrate pad of the chip directly affects the quality and the bad quality of the flip-chip product, and also determines the reliability of the product.
For products prior to reflow, there is temporarily no method for effectively monitoring the effective contact of the chip bumps with the substrate pads.
For the reflowed product, the effective welding of the bump and the substrate pad of the chip is detected by the X-ray at present, but the X-ray detection after reflow has the following defects:
1. The flip-chip product is welded, so that the current situation of yield loss cannot be changed;
2. The detection methods and judgment standards of different flip-chip products are not uniform, and training and experience accumulation are required to be enhanced for personnel cognition.
Therefore, it is necessary to provide a detection device for monitoring the mounting qualification of the flip-chip product in real time before the flip-chip product is welded and shaped.
Disclosure of Invention
In order to solve the defects in the prior art, the invention aims to provide a detection device for flip-chip product cold joint.
In order to achieve the above object, the present invention adopts the following technical scheme:
a detection device for flip-chip product cold joint comprises an objective table, a laser emission head and a panel;
the objective table is used for placing the chip to be detected;
the laser emission head is used for emitting light to directly irradiate the back surface of the chip;
The panel is used for receiving light reflected by the back surface of the chip and forming a light spot used as a detection standard.
The objective table is horizontally arranged, and the panel and the laser emission head are respectively arranged at two ends of the objective table.
Further, the objective table is fixedly arranged on the first bracket;
An X-Y axis system is established on the table top of the object stage, the directions of the two ends of the object stage are taken as the X axis direction, and the first bracket is provided with a translation structure for linking the object stage to move along the X axis and the Y axis.
Further, the panel is fixedly arranged on the side surface of the second longitudinal bracket;
an X1-Y1 axis system is established on the surface of the panel, the longitudinal direction is taken as the Y1 axis, and the second bracket is provided with a translation structure for linking the panel along the X1 axis and the Y1 axis.
Further, the laser emission head is fixedly arranged on the side surface of the longitudinal third bracket through a rotating shaft;
an X2-Y2 axis system is established on the side surface of a third bracket, the longitudinal direction is taken as a Y2 axis, and the third bracket is provided with a translation structure of a linkage rotating shaft along the X2 axis and the Y2 axis;
the rotating shaft is parallel to the X2 axis.
Still further, the translation structure comprises a rectangular base frame, a plurality of transverse shafts are fixedly arranged in the base frame, and the longitudinal shafts are erected on the transverse shafts through first sliding blocks at the bottom; the longitudinal shaft is provided with a second sliding block for fixing and waiting to slide.
The table top of the object stage is provided with an object carrying groove.
Along the moving direction of the light spot, the surface of the panel is provided with light scales, and the unit is um.
The invention has the advantages that:
According to the detection device for the flip chip product cold joint, the smooth mirror surface effect of the chip surface is utilized, and the angle detection is carried out on the flip chip surface finished before reflow through light reflection to judge whether cold joint exists or not.
The invention can detect the product with the possibility of cold joint before the reflow of the flip product is finished and the welding is finished, find hidden danger of cold joint, thereby improving the yield of the product, monitoring the mounting qualification of the product before the flip product is finished and the welding shaping is finished, simultaneously, timely finding the root cause causing the abnormal contact of the chip salient point and the substrate bonding pad, being applicable to the detection of the connection of the chip salient point and the substrate bonding pad of various packaging process products such as Flip Chip (FC), chip Size Package (CSP), ball grid array package (BGA) and the like, providing definite improvement direction for improving the yield and the reliability of the product, and having strong practicability and wide applicability.
Drawings
Fig. 1 is a schematic structural diagram of a detection device.
Fig. 2 is a schematic structural view of a translation structure.
The meaning of the symbols in the drawings is as follows: 1. the laser device comprises a chip, 2, a laser emitting head, 3, a panel, 4, an objective table, 5, an object carrying groove, 6, a first support, 7, a second support, 8, a third support, 9, a photoetching degree, 10, a base frame, 11, a transverse axis, 12, a longitudinal axis, 13, a first sliding block, 14 and a second sliding block.
Detailed Description
The invention is described in detail below with reference to the drawings and the specific embodiments.
A detection device for flip-chip product cold joint consists of an objective table, a laser emission head and a panel.
The objective table is placed horizontally, and the top surface is provided with a carrying groove. The bottom of objective table is equipped with horizontal first support.
The second support is longitudinally arranged at one end of the object stage, and the third support is longitudinally arranged at the other end of the object stage. And the panel and the laser emission head are respectively fixed on the opposite side surfaces between the second bracket and the third bracket.
The first bracket, the second bracket and the third bracket are respectively provided with a translation structure. The translation coordinate system X-Y of the first bracket is based on the horizontal plane of the objective table, and the directions of the two ends of the objective table are taken as the X-axis direction; the translation coordinate system X1-Y1 of the second bracket is based on the plate surface of the panel, and takes the longitudinal direction as the Y1 axis; the translation coordinate system X2-Y2 of the third bracket is based on a longitudinal plane parallel to the panel, and takes the longitudinal direction as a Y2 axis.
The translation structure comprises a base frame, a transverse shaft, a longitudinal shaft, a first sliding block and a second sliding block. The base frame is a rectangular frame, a plurality of transverse shafts are fixedly arranged in the base frame, and the longitudinal shafts are arranged on the transverse shafts through first sliding blocks at the bottom; the longitudinal axis is provided with a second sliding block for fixing the sliding.
The second slide block in the first bracket is fixedly connected with the objective table, the second slide block in the second bracket is fixedly connected with the panel, and the second slide block in the third bracket is fixedly connected with the rotating shaft of the laser emitting head.
Along the moving direction of the light spots, the panel surface of the panel is provided with light scales with the unit of um.
In the use process, the water-soluble fiber is prepared,
The standard chip is reversely placed in the object carrying groove, straight light is emitted by the laser emitter, and the light irradiates the back of the chip with the same mirror surface and then is reflected to the panel, so that a light spot is formed. And the translation structures in the first bracket, the second bracket and the third bracket and the rotating shaft of the laser emission head are respectively adjusted, so that the light spot moves to the 0um scale of the photoetching degree and is fixed to be a calibration position.
The chip to be detected is reversely placed in the object carrying groove, straight light is emitted by the laser emitter, and the light irradiates the back of the chip with the same mirror surface and then is reflected to the panel, so that a detection light spot is formed. And checking the reading of the light scale corresponding to the light spot on the panel, taking +/-0.1 um deviating from the 0um scale position as a reference standard, judging that the panel is in the cold joint if the light spot is out of the range, and judging that the panel is not in the cold joint if the light spot is not out of the range.
Detection principle:
The dummy solder refers to a phenomenon that may occur during the die bonding process, that is, the solder ball does not completely form a good solder connection with the pad, resulting in unreliable electrical connection. Before the reflow process, the chip is tilted to generate the cold solder joint phenomenon.
Under the normal operation condition, the chip is in a horizontal state, the laser emitted by the laser emitter is subjected to specular reflection on the back (smooth and flat) of the chip, and reflected light can be projected on a 0 scale mark on the panel; when the chip is slightly inclined, the projection position of the specular reflection light on the panel is offset relative to the 0 scale mark, the inclination state of the chip can be judged through the size of the offset value, and if the offset value is too large and exceeds the limit value, the chip can be judged to be in the inclination state which can cause the cold joint.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be appreciated by persons skilled in the art that the above embodiments are not intended to limit the invention in any way, and that all technical solutions obtained by means of equivalent substitutions or equivalent transformations fall within the scope of the invention.
Claims (8)
1. The detection device for the flip product cold joint is characterized by comprising an objective table, a laser emission head and a panel;
the objective table is used for placing the chip to be detected;
the laser emission head is used for emitting light to directly irradiate the back surface of the chip;
The panel is used for receiving light reflected by the back surface of the chip and forming a light spot used as a detection standard.
2. The apparatus of claim 1, wherein the stage is horizontally disposed, and the panel and the laser emitter are disposed at opposite ends of the stage.
3. The detection device of claim 2, wherein the stage is fixedly disposed on the first support;
An X-Y axis system is established on the table top of the object stage, the directions of the two ends of the object stage are taken as the X axis direction, and the first bracket is provided with a translation structure for linking the object stage to move along the X axis and the Y axis.
4. The detection device according to claim 2, wherein the panel is fixedly arranged on the side surface of the second longitudinal bracket;
an X1-Y1 axis system is established on the surface of the panel, the longitudinal direction is taken as the Y1 axis, and the second bracket is provided with a translation structure for linking the panel along the X1 axis and the Y1 axis.
5. The detection device according to claim 1, wherein the laser emitting head is fixedly arranged on the side surface of the longitudinal third bracket through a rotating shaft;
an X2-Y2 axis system is established on the side surface of a third bracket, the longitudinal direction is taken as a Y2 axis, and the third bracket is provided with a translation structure of a linkage rotating shaft along the X2 axis and the Y2 axis;
the rotating shaft is parallel to the X2 axis.
6. The detecting device according to any one of claims 3, 4 and 5, wherein the translational structure comprises a rectangular base frame, a plurality of transverse shafts are fixedly arranged in the base frame, and the longitudinal shafts are erected on the transverse shafts through first sliding blocks at the bottom; the longitudinal shaft is provided with a second sliding block for fixing and waiting to slide.
7. The apparatus of claim 1, wherein a top surface of the stage is provided with a carrier slot.
8. The detecting device according to claim 1, wherein the panel surface is provided with light scales in um along the moving direction of the light spot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322245390.6U CN220932749U (en) | 2023-08-21 | 2023-08-21 | Detection device for flip product cold joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322245390.6U CN220932749U (en) | 2023-08-21 | 2023-08-21 | Detection device for flip product cold joint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220932749U true CN220932749U (en) | 2024-05-10 |
Family
ID=90932506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322245390.6U Active CN220932749U (en) | 2023-08-21 | 2023-08-21 | Detection device for flip product cold joint |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220932749U (en) |
-
2023
- 2023-08-21 CN CN202322245390.6U patent/CN220932749U/en active Active
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