CN220914202U

CN220914202U - Wafer clamping device

Info

Publication number: CN220914202U
Application number: CN202322722897.6U
Authority: CN
Inventors: 刘瑶
Original assignee: Hubei Jiangcheng Chip Pilot Service Co ltd
Current assignee: Hubei Jiangcheng Chip Pilot Service Co ltd
Priority date: 2023-10-10
Filing date: 2023-10-10
Publication date: 2024-05-07
Anticipated expiration: 2033-10-10

Abstract

The application provides a wafer clamping device, comprising: a base; the driving assembly is positioned in the base; the sliding component is positioned in the base and connected with the driving component; the pushing component is fixed at one end of the sliding component; the clamping assembly is connected with the base and used for placing the wafer; the driving assembly drives the sliding assembly to slide along the first direction, the sliding assembly drives the pushing assembly to move along the first direction, and the pushing assembly clamps or releases the wafer under the action of the sliding assembly. The wafer clamping device has the effects of improving the wafer taking and placing efficiency, improving the wafer taking yield and the clamping or releasing precision, and can enter high-temperature, high-risk areas and the like, so that the labor cost is reduced.

Description

Wafer clamping device

Technical Field

The application relates to the field of wafer transmission equipment, in particular to a wafer clamping device.

Background

With the great influence of any scratch or defect on the surface of a wafer on the quality of the chip in the production process of the semiconductor chip, the wafer transmission in the machine of the chip production equipment at present basically depends on high-precision mechanical equipment, however, the wafer cannot be normally transmitted due to the abnormality such as loss, partial damage and the like in the use process of the mechanical equipment, and the safe automatic transmission of the wafer in the machine can be interrupted, so that engineers need to manually transport the wafer to a safe area, the problems of reverse placement, dropping or collision of the front and the back of the wafer are easily caused, and the abnormality of the wafer is caused.

Disclosure of utility model

In view of this, the present application provides a wafer clamping device, which is fast and convenient for taking and placing wafers, and can enter high temperature, high risk and other areas, so as to reduce the abnormal rate of the wafers.

In order to solve the problems, the technical scheme provided by the application is as follows:

The application provides a wafer clamping device, comprising: a base;

The driving assembly is positioned in the base;

The sliding component is positioned in the base and connected with the driving component;

The pushing component is fixed at one end of the sliding component; and

The clamping assembly is connected with the base and used for placing the wafer;

The driving assembly drives the sliding assembly to slide along the first direction, the sliding assembly drives the pushing assembly to move along the first direction, and the pushing assembly clamps or releases the wafer under the action of the sliding assembly.

In an alternative embodiment of the present application, the sliding assembly includes a sliding member and a slideway, at least part of the slideway is fixed in the base and extends along the first direction, and two ends of the sliding member are respectively connected with the two slideways in a sliding manner;

wherein, the pushing component is fixedly connected with one end of the sliding piece.

In an alternative embodiment of the application, the sliding piece comprises a sliding support and a screw rod, two ends of the sliding support are respectively connected with the two slide ways in a sliding way, one end of the screw rod is connected with the driving component, the other end of the screw rod penetrates through part of the sliding support along the first direction, the driving component drives the screw rod to rotate, and the screw rod drives the sliding support to move on the slide ways.

In an alternative embodiment of the present application, the sliding support includes a first sliding rod, a second sliding rod, and a supporting rod, wherein two ends of the first sliding rod and two ends of the second sliding rod are respectively connected with the two sliding ways in a sliding manner, the first sliding rod is relatively parallel to the second sliding rod, and the supporting rod is connected between the first sliding rod and the second sliding rod, wherein one end of the screw rod passes through the first sliding rod along a first direction, and provides a force for moving the sliding piece along the first direction.

In an alternative embodiment of the present application, a first limiting portion and a second limiting portion are provided on the slideway, the first limiting portion is located between the first sliding rod and the second sliding rod, and is used for limiting the sliding distance of the sliding member along the first direction; the second limiting part is positioned at one end of the first sliding rod far away from the second sliding rod and used for limiting the sliding distance of the sliding piece along the opposite direction of the first direction.

In an alternative embodiment of the application, the pushing assembly is resiliently coupled to the slider.

In an alternative embodiment of the application, the pushing assembly comprises an elastic piece, a first push rod and a second push rod, wherein two ends of the first push rod are respectively connected with the two slide ways in a sliding way, two ends of the elastic piece are respectively connected with the first push rod and the second slide rod, the second push rod is vertically connected with the first push rod along a first direction, and the second push rod can clamp or release a wafer under the action of the sliding assembly.

In an alternative embodiment of the application, the clamping assembly comprises a placing part and clamping parts, one end of the placing part is connected with the base, and a plurality of clamping parts are arranged at two ends of the placing part; wherein,

The clamping part is provided with a fixing part in a protruding mode on one side away from the placing part, the wafer is placed on the clamping part and is abutted to the fixing part, and the second push rod is used for clamping or releasing the wafer under the action of the sliding component in cooperation with the fixing part.

In an alternative embodiment of the present application, a wafer clamping apparatus further includes:

the control assembly is arranged at one end of the driving assembly far away from the pushing assembly; the control assembly includes a controller configured to control movement of the drive assembly.

and the plurality of position sensors are arranged in the base and are configured to sense the position of the pushing component when the pushing component clamps or releases the wafer.

The wafer clamping device provided by the application has at least the following beneficial effects: the driving component of the wafer clamping device drives the sliding component to slide along the first direction, the sliding component drives the pushing component to move along the first direction, the pushing component clamps or releases the wafer under the action of the sliding component, the wafer is placed on the clamping component, the effect of improving the wafer taking and placing efficiency is achieved, the wafer taking yield is improved, the clamping component can enter high-temperature, high-risk areas and the like, and the labor cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a wafer clamping apparatus according to an embodiment of the application.

Fig. 2 is a schematic structural diagram of another wafer clamping apparatus according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a wafer clamping apparatus according to another embodiment of the present application.

Fig. 4 is a schematic structural diagram of a pushing assembly according to an embodiment of the application.

Fig. 5 is a schematic diagram of a position sensor according to an embodiment of the application.

Fig. 6 is a schematic structural diagram of a clamping assembly according to an embodiment of the application.

Fig. 7 is a schematic view of a wafer position according to an embodiment of the application.

Reference numerals: 10-a base; 20-a drive assembly; 30-a sliding assembly; 31-a slider; 311-sliding brackets; 3111-a first sliding bar; 3112-a second slide bar; 3113-support bars; 312-screw rod; 32-a slideway; 321-a first limiting part; 322-a second limit part; 40-pushing assembly; 41-an elastic member; 42-a first push rod; 43-a second pushrod; a 50-clamp assembly; 51-a placement section; 52-a clamping part; 53-a fixing part; 60-a control assembly; 61-a controller; 70-position sensor; 80-a handle; 90-wafer.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.

In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.

The present application may repeat reference numerals and/or letters in the various examples, and is for the purpose of simplicity and clarity, and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

The array substrate, the liquid crystal display panel and the display device provided by the application are described in detail below with reference to specific embodiments and drawings.

Referring to fig. 1-3, the present application provides a wafer clamping apparatus, comprising:

A base 10;

a drive assembly 20 located within the base 10;

A sliding assembly 30 positioned in the base 10 and connected with the driving assembly 20;

A pushing assembly 40 fixed at one end of the sliding assembly 30; and

A clamping assembly 50 coupled to the susceptor 10 for placing a wafer 90;

The driving assembly 20 drives the sliding assembly 30 to slide along the first direction X, the sliding assembly 30 drives the pushing assembly 40 to move along the first direction X, and the pushing assembly 40 clamps or releases the wafer 90 under the action of the sliding assembly 30.

Specifically, one end of the driving assembly 20 away from the clamping assembly 50 is fixedly connected with the base 10, the other end is connected with the screw rod 312, a force for rotating the screw rod 312 is provided, one end of the screw rod 312 away from the driving assembly 20 is connected with the sliding bracket 311 of the sliding assembly 30, and the driving assembly 20 drives the screw rod 312 to rotate, so that the sliding bracket 311 connected with the screw rod 312 can slide along the first direction X.

Specifically, the driving assembly 20 may be, for example, a driving motor for providing a force for rotating the screw 312, but is not limited thereto, and is specifically based on practical applications.

Further, the end of the base 10 away from the pushing component 40 may be provided with a handle 80, where the base 10 is fixedly connected to the handle 80 for holding the handle 80 when clamping or releasing the wafer 90, and the shape of the handle 80 may be, for example, a cylindrical shape, a rectangular shape or other polygonal shape, and the shape of the handle 80 is not limited in the present application, which is specific to practical applications. Specifically, the inside of the base 10 is a cavity for accommodating the driving assembly 20 and the sliding assembly 30, wherein a bottom surface of the base 10, which is far away from the end of the handle 80, is connected to an end of the clamping assembly 50, and the clamping assembly 50 is used for placing and fixing the wafer 90 and fixing the wafer in cooperation with the pushing assembly 40.

In another alternative embodiment of the present application, the sliding assembly 30 includes a sliding member 31 and a sliding way 32, at least part of the sliding way 32 is fixed in the base 10 and extends along the first direction X, and two ends of the sliding member 31 are slidably connected with two sliding ways 32 respectively;

wherein, the pushing component 40 is fixedly connected with one end of the sliding piece 31.

Specifically, the slide 32 is, for example, cylindrical, through holes penetrating through two ends of the slide 31 along the first direction X are formed at two ends of the slide 31, and two ends of the slide 31 are sleeved on the slide 32, so that the slide 31 can slide along the first direction X on the slide 32, and the pushing assembly 40 is driven to slide along the first direction X, so that one end of the pushing assembly 40 abuts against the wafer 90, and the wafer 90 is fixed.

Further, the sliding track 32 is, for example, a sliding track, a track disposed along the first direction X is provided inside the sliding track 32, and two ends of the sliding member 31 are disposed in the track, so that the sliding member 31 can slide along the first direction X on the sliding track 32 to drive the pushing assembly 40 to slide along the first direction X, so that one end of the pushing assembly 40 abuts against the wafer 90 to fix the wafer 90.

In an alternative embodiment of the present application, the sliding member 31 includes a sliding bracket 311 and a screw rod 312, two ends of the sliding bracket 311 are slidably connected to the two slideways 32, one end of the screw rod 312 is connected to the driving assembly 20, and the other end of the screw rod 312 passes through a part of the sliding bracket 311 along the first direction X, the driving assembly 20 drives the screw rod 312 to rotate, and the screw rod 312 drives the sliding bracket 311 to move on the slideways 32.

Specifically, the other end of the screw rod 312 may vertically pass through a part of the sliding support 311, for example, where the position where the sliding support 311 is vertically connected to the screw rod 312 may be provided with a reinforcing portion, for example, where the other end of the screw rod 312 passes through the reinforcing portion of the sliding support 311, so as to reduce the failure rate of the screw rod 312 in the rotation process, where an internal thread is provided in the reinforcing portion, and the internal thread is matched with a thread on the screw rod 312, so that the screw rod 312 may drive the sliding support 311 to slide along the first direction X.

In an alternative embodiment of the present application, the sliding bracket 311 includes a first sliding bar 3111, a second sliding bar 3112 and a supporting bar 3113, both ends of the first sliding bar 3111 and both ends of the second sliding bar 3112 are slidably connected to the two sliding tracks 32, respectively, the first sliding bar 3111 is relatively parallel to the second sliding bar 3112, and the supporting bar 3113 is connected between the first sliding bar 3111 and the second sliding bar 3112, wherein one end of the screw 312 passes through the first sliding bar 3111 along the first direction X, providing a force for moving the slider 31 along the first direction X.

Specifically, the first slide bar 3111 and the second slide bar 3112 may be relatively parallel and coupled perpendicular to the slide 32, for example, to provide stability of the wafer clamping device. One end of the screw rod 312 passes through the first sliding rod 3111 in the first direction X and is spaced from the second sliding rod 3112 by a distance that provides a distance that the screw rod 312 moves, which is greater than a distance that the pushing assembly 40 moves when the wafer clamping device clamps the wafer 90, as the present application is not particularly limited in practical applications.

Further, the number of the support bars 3113 may be 2, or may be a plurality, in the present application, the number of the support bars 3113 is not limited, two ends of the support bars 3113 are respectively connected to the first sliding bar 3111 and the second sliding bar 3112, and the support bars 3113 may be relatively parallel or inclined, for example, so that the sliding bracket 311 is a whole that can slide along the first direction X, and stability of the sliding bracket 311 is improved.

Referring to fig. 3 and 5, in an alternative embodiment of the present application, a first limiting portion 321 and a second limiting portion 322 are disposed on the slideway 32, where the first limiting portion 321 is located between the first sliding rod 3111 and the second sliding rod 3112, for limiting the sliding distance of the sliding member 31 along the first direction X; the second limiting portion 322 is located at an end of the first sliding rod 3111 away from the second sliding rod 3112, and is used for limiting a sliding distance of the sliding member 31 in a direction opposite to the first direction X.

It will be appreciated that the first limiting portion 321 and the second limiting portion 322 are used to limit the farthest distance and the closest distance of the sliding member 31 sliding in the first direction X, respectively. When the wafer clamping device is abnormal, the first limiting part 321 is used for limiting the farthest sliding distance of the sliding piece 31 on the slideway 32 along the first direction X, so that part of parts of the wafer clamping device are prevented from being out of control; when the wafer clamping device is abnormal, the second limiting portion 322 is used for limiting the sliding distance of the sliding piece 31 along the opposite direction of the first direction X on the slideway 32 when the wafer 90 is released or reset, so that the part of the wafer clamping device is prevented from being out of control, and the wafer clamping device is protected.

Specifically, the first limiting portion 321 and the second limiting portion 322 are fixed on one of the sliding ways 32, and in another embodiment, the first limiting portion 321 and the second limiting portion 322 may be disposed on both sliding ways 32, which is specific to practical application, and the present application is not limited thereto.

Referring to fig. 3-4, in an alternative embodiment of the present application, the pushing assembly 40 is elastically connected to the sliding member 31.

In an alternative embodiment of the present application, the pushing assembly 40 includes an elastic member 41, a first push rod 42 and a second push rod 43, wherein two ends of the first push rod 42 are slidably connected to the two slides 32, two ends of the elastic member 41 are connected to the first push rod 42 and the second slide rod 3112, and the second push rod 43 is vertically connected to the first push rod 42 along the first direction X, and the second push rod 43 can clamp or release the wafer 90 under the action of the sliding assembly 30.

Specifically, the elastic member 41 may be, for example, a spring, but is not limited thereto. The two ends of the elastic member 41 are respectively connected with the first push rod 42 and the second slide rod 3112, when the slide assembly 30 moves along the first direction X, the slide member 31 pushes the elastic member 41 to compress, after compressing to the limit, the first push rod 42 is pushed to slide on the slide way 32, the second push rod 43 is exposed out of the base 10, the second push rod 43 protrudes out of two ends of the two slide ways 32 along the first direction X, the second push rod 43 abuts against the wafer 90, and the wafer 90 is fixed, thereby achieving the clamping effect.

Further, the second push rod 43 may be, for example, a polyethylene material, but is not limited thereto.

Referring to fig. 6-7, in an alternative embodiment of the present application, the clamping assembly 50 includes a placement portion 51 and clamping portions 52, one end of the placement portion 51 is connected to the base 10, and a plurality of clamping portions 52 are disposed at two ends of the placement portion 51; wherein,

The clamping portion 52 is provided with a fixing portion 53 protruding from a side of the placing portion 51, the wafer 90 is placed on the clamping portion 52 and abuts against the fixing portion 53, and the second push rod 43 cooperates with the fixing portion 53 to clamp or release the wafer 90 under the action of the sliding assembly 30.

Specifically, the placement portion 51 may be, for example, an isosceles trapezoid, and a width of an end of the placement portion 51 away from the driving assembly 20 is smaller than a width of an end of the placement portion 51 near the driving assembly 20, and a length of the placement portion 51 may be, for example, greater than a diameter of one wafer 90, but is not limited thereto. The number of the placement portions 51 may be two, for example, where one ends of the two placement portions 51 near the driving assembly 20 are connected to each other, so that the two placement portions 51 are connected to form a V-shaped structure, and an angle is formed between the connected ends of the two placement portions 51, so that the wafer 90 does not fall when placed on the placement portions 51, for example, an acute angle may be formed, and the specific angle is not limited in the present application.

Specifically, the holding portion 52 may be rectangular, for example, for placing a part of the wafer 90, the fixing portion 53 may be provided protruding on the upper surface of the holding portion 52, the fixing portion 53 may be inclined on the side facing the wafer, the inclined surface of the fixing portion 53 may abut against one surface of the wafer 90, and the inclined surface may abut against the side surface of the wafer 90 and adapt to the shape of the wafer 90. When the number of the placement portions 51 is two, the placement portions 51 are symmetrically disposed away from the fixing portions 53 at one end of the driving assembly 20, the inclined surfaces of the two fixing portions 53 are correspondingly adapted to the radian of the wafer 90, and the fixing portions 53 at the other end of the placement portions 51 are correspondingly disposed with the fixing portions 53 at one end of the placement portions 51 away from the driving assembly 20 to form a shape adapted to the radian of the wafer 90.

The control assembly 60 is arranged at one end of the driving assembly 20 away from the pushing assembly 40; the control assembly 60 includes a controller 61, the controller 61 being configured to control the movement of the drive assembly 20.

Specifically, the control assembly 60 is disposed between the base 10 and the handle 80. The controller 61 has various instructions therein, such as an instruction to start the driving assembly 20, an instruction to shut down the driving assembly 20, but is not limited thereto.

Specifically, the control assembly 60 further includes a plurality of levels for detecting whether the device is level and whether the wafer 90 is level. The control assembly 60 also includes a power cell for powering the wafer clamping device. The control assembly 60 also includes status switches, such as a release wafer 90 switch, a clamp wafer 90 switch. In one embodiment, when the switch for clamping the wafer 90 is activated, the driving assembly 20 drives the sliding assembly 30 to slide along the first direction X, and the sliding assembly 30 drives the pushing assembly 40 to move along the first direction X, so that the pushing assembly 40 clamps the wafer 90 under the action of the sliding assembly 30.

Further, a display screen may be disposed in the control assembly 60, for example, for displaying the status of the wafer clamping device.

Specifically, a start switch is further provided on the handle 80, and when the wafer 90 needs to be clamped, the start switch and the wafer 90 clamping switch are pressed simultaneously; when the wafer 90 needs to be released, the start switch and the release wafer 90 switch are pressed simultaneously.

The plurality of position sensors 70, disposed in the base 10, are configured to sense the position of the pushing assembly 40 when the pushing assembly 40 clamps or releases the wafer 90, and sense whether the pushing assembly 40 reaches a designated position, thereby improving the clamping or releasing accuracy of the wafer 90.

Specifically, the number of the position sensors 70 is not limited in the present application, and may include, for example, a first target position sensor for sensing whether the pushing assembly 40 has moved to a position where the wafer 90 is specified to be clamped, and a second target position sensor for sensing and corresponding to the turning on of the response lamp when the pushing assembly 40 has moved to the specified position; the second target position sensor is used for sensing whether the pushing component 40 moves to the position of the designated release wafer 90, and when the pushing component moves to the designated position, the second target position sensor senses and correspondingly lights the response lamp.

Further, a wafer clamping device may be further provided with an abnormality sensor, when the device is abnormal, when the wafer 90 is clamped or released, after the pushing assembly 40 moves to a position, the position sensor 70 cannot normally detect the position, or the pushing assembly 40 moves to an abnormal position, the abnormality sensor provides a command for stopping movement to the controller 61, the abnormality sensor correspondingly lights up the response lamp, and the device stops moving or is blocked by the first limiting portion or the second limiting portion.

The wafer clamping device provided by the application comprises at least the following working processes or principles: the driving component drives the sliding component to slide along the first direction X, the sliding component drives the pushing component to move along the first direction X, the wafer is placed on the clamping component, the side face of the wafer is fixed by the fixing part so as to avoid dropping, one end of the pushing component abuts against the wafer, and the wafer is fixed together with the fixing part, so that the wafer is clamped. When the wafer needs to be released, the driving component drives the sliding component to slide along the direction opposite to the first direction X, the pushing component releases the wafer to retract, and the wafer is released.

In summary, although the present application has been described in terms of the preferred embodiments, the preferred embodiments are not limited to the above embodiments, and various modifications and changes can be made by one skilled in the art without departing from the spirit and scope of the application, and the scope of the application is defined by the appended claims.

Claims

1. A wafer clamping apparatus, comprising:

A base;

A drive assembly located within the base;

the pushing component is fixed at one end of the sliding component; and

The driving assembly drives the sliding assembly to slide along a first direction, the sliding assembly drives the pushing assembly to move along the first direction, and the pushing assembly clamps or releases the wafer under the action of the sliding assembly.

2. The wafer clamping apparatus of claim 1 wherein the slide assembly comprises a slide and a slide, at least a portion of the slide being secured within the base and extending in the first direction, both ends of the slide being slidably coupled to two of the slides, respectively;

Wherein, the promotion subassembly with the one end fixed connection of slider.

3. The wafer clamping apparatus of claim 2 wherein the slider comprises a sliding support and a screw, wherein two ends of the sliding support are slidably connected to the two slides, one end of the screw is connected to the driving assembly, and the other end of the screw passes through a portion of the sliding support along the first direction, the driving assembly drives the screw to rotate, and the screw drives the sliding support to move on the slides.

4. The wafer clamping apparatus of claim 3 wherein said slide bracket comprises a first slide bar, a second slide bar, and a support bar, both ends of said first slide bar and both ends of said second slide bar being slidably coupled to two of said slides, respectively, said first slide bar being relatively parallel to said second slide bar, said support bar being coupled between said first slide bar and said second slide bar, wherein one end of said lead screw passes through said first slide bar in said first direction providing a force that moves said slide in said first direction.

5. The wafer clamping device as recited in claim 4 wherein the slide is provided with a first stop and a second stop, the first stop being located between the first slide bar and the second slide bar for limiting a distance that the slide slides in the first direction; the second limiting part is positioned at one end of the first sliding rod far away from the second sliding rod and is used for limiting the sliding distance of the sliding piece along the direction opposite to the first direction.

6. A wafer clamping apparatus according to claim 3 wherein said pushing assembly is resiliently coupled to said slide.

7. The wafer clamping apparatus of claim 4 wherein the pushing assembly comprises an elastic member, a first push rod and a second push rod, wherein two ends of the first push rod are slidably connected to the two slide rails, two ends of the elastic member are connected to the first push rod and the second slide rod, the second push rod is vertically connected to the first push rod along the first direction, and the second push rod can clamp or release the wafer under the action of the sliding assembly.

8. The wafer clamping apparatus of claim 7 wherein the clamping assembly comprises a placement portion and a clamping portion, one end of the placement portion being connected to the base, a plurality of the clamping portions being disposed at both ends of the placement portion; wherein,

The clamping part is provided with a fixing part in a protruding mode on one side, far away from the placing part, of the clamping part, the wafer is placed on the clamping part and abuts against the fixing part, and the second push rod is used for clamping or releasing the wafer under the action of the sliding component in cooperation with the fixing part.

9. The wafer clamping apparatus of claim 7 further comprising:

the control assembly is arranged at one end of the driving assembly away from the pushing assembly; the control assembly includes a controller configured to control movement of the drive assembly.

10. The wafer clamping apparatus of claim 9 further comprising:

And a plurality of position sensors, which are arranged in the base and are configured to sense the position of the pushing component when the pushing component clamps or releases the wafer.