JP2012190918A - Surface roughness measuring instrument - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface roughness measuring instrument capable of performing continuous automatic surface roughness measurement of a plurality of wafers, thereby improving measurement efficiency.SOLUTION: The surface roughness measuring instrument includes: a rotating drivable stage 10 capable of placing a plurality of wafers 70 thereon; positioning means 50 for positioning and fixing the plurality of wafers in the shape of concentric circles on the stage; surface roughness measuring means 20 for measuring the surface roughness of a wafer by allowing a contact 21 supported linearly movably in vertical and horizontal directions to contact with a surface of the wafer located at a predetermined measuring position and to move linearly in the horizontal direction; and control means 40 for controlling the stage and the surface roughness measuring means so as to perform sequentially a series of operations, in which a measuring target wafer to be a measuring target is moved to the predetermined measuring position by rotating the stage, and the surface roughness of the measuring target wafer is measured by the surface roughness measuring means, with respect to the plurality of wafers.

Description

  The present invention relates to a surface roughness measuring apparatus, and in particular, a contact that is supported so as to be linearly movable in a vertical direction and a horizontal direction is brought into contact with the surface of a wafer at a predetermined measurement position and linearly moved in the horizontal direction. The present invention relates to a surface roughness measuring apparatus having surface roughness measuring means for measuring the surface roughness of a wafer.

  Since a fine circuit is formed on the surface of a semiconductor wafer such as a silicon wafer, depending on the processing step, only a surface roughness of micron order to angstrom order is allowed, and a high level of smoothness is required. Therefore, it is indispensable to appropriately set processing methods and processing conditions in each processing step of the semiconductor process. In each processing step of such a semiconductor process, measurement using a surface roughness meter is known in order to accurately know the surface roughness of the wafer surface (see, for example, Patent Document 1).

  In the processing of wafers, processing using abrasive grains has become the mainstream, and the surface roughness of the processed surface varies in-plane depending on the processing method and processing conditions. Therefore, depending on the processing method, it is necessary to measure the surface roughness in consideration of the in-plane distribution of the processed surface, and it is generally performed to measure the surface roughness at multiple points from a single wafer. Yes.

  FIG. 1 is a diagram for explaining a method for measuring the surface roughness of a wafer using a conventional surface roughness meter, and FIG. 1A is a configuration diagram showing an example of a conventional surface roughness meter. . In FIG. 1A, a stage 110 and a column 124 for mounting a wafer 170 as a measurement object are provided on a support base 130. A vertical arm 123 that moves the contact 121 in the vertical direction is attached to the support column 124, and a horizontal arm 122 that moves the contact 121 in the horizontal direction is attached to the vertical arm 123. The contact 121 has a needle shape and is provided at the tip of the horizontal arm 122. Data measured by the contact 121 is stored in the recording means 126.

  Next, a method for measuring the surface roughness of the wafer using the conventional surface roughness meter shown in FIG. First, the operator places the wafer 170 on the stage 110 and moves the contactor 121 to the measurement position of the wafer 170 to start measurement. Next, the upper and lower arms 123 are lowered to a position where the contact 121 comes into contact with the wafer 170. Next, when the horizontal arm 122 moves to the near side, the contact 121 moves to the near side while pulling the surface of the wafer 170 linearly. At this time, by detecting the pressure change of the contact 121, the position information of the contact 121 and the surface roughness information of the wafer 170 are measured, and the measurement data is recorded in the recording unit 126. Generally, the contact 121 moves a linear distance of 5 mm to 15 mm while measuring the surface roughness of the wafer 170 while making contact with the wafer 170 that is the object to be measured at one measurement point.

  FIG. 1B is a diagram showing wafer measurement points in a method for measuring the surface roughness of a wafer using a conventional surface roughness meter. As shown in FIG. 1B, the surface roughness measurement points 171 to 175 of the wafer 170 are four points in the cross direction and a total of five points including the center in consideration of the in-plane distribution of the surface roughness. There are many cases to do.

Japanese Utility Model Publication 4-35761

  However, in the measurement of the surface roughness using the conventional surface roughness meter shown in FIG. 1, the wafer 170 is placed at the center of the stage 110, and a total of five surface roughnesses including four points in the cross direction and the center are added. In the case of measuring the thickness, after the measurement on the straight line in one direction is first completed, the operator needs to manually rotate the stage 110 by 90 ° and measure the roughness of the other straight line again. there were. For this reason, during the measurement of the surface roughness, the operator must always stand near the apparatus for rotating the rotary stage 10 by 90 ° and for exchanging the wafer 10, resulting in a problem that work efficiency deteriorates. there were.

  On the other hand, the method of handling the wafer 170 with a robot requires taking out and placing the wafer 170, and further requires a precise rotation of the stage, which makes it very expensive and large-scale. was there. In particular, in recent years, not only silicon wafers but also wafers such as sapphire substrates have been used, and it is necessary to measure the surface roughness of such wafers, but such substrates are produced in small lots. There are many. Therefore, the introduction of the robot is not preferable from the viewpoint of cost effectiveness, and there is a problem that it is not a practical solution.

  Therefore, the present invention provides a surface roughness measuring device that can be continuously configured and can automatically measure the surface roughness of a plurality of wafers, and can improve the measurement efficiency. The purpose is to do.

In order to achieve the above object, a surface roughness measuring apparatus according to an embodiment of the present invention includes a rotationally driveable stage on which a plurality of wafers can be placed,
Positioning means for concentrically positioning and fixing the plurality of wafers on the stage;
The surface roughness of the wafer is measured by bringing a contactor supported so as to be linearly movable in the vertical and horizontal directions into contact with the surface of the wafer at a predetermined measurement position and linearly moving in the horizontal direction. Surface roughness measuring means;
Of the plurality of wafers positioned and fixed concentrically by the positioning means, the measurement target wafer to be measured is moved to the predetermined measurement position by rotating the stage, and the surface roughness measurement means performs the measurement. And a control means for controlling the stage and the surface roughness measuring means so that a series of operations for measuring the surface roughness of the target wafer are sequentially performed on the plurality of wafers. To do.

  Thereby, the surface roughness of a plurality of wafers can be automatically and continuously measured, the measurement efficiency can be remarkably improved, and the burden on the operator can be reduced by automation.

In addition, when there are a plurality of surface roughness measurement points on the measurement target wafer, and the plurality of surface roughness points include an arrangement relationship that is not on a moving straight line on which the contact moves horizontally,
The control means moves the surface roughness point that is not on the moving straight line onto the moving straight line of the contact by rotating the stage, and measures the surface roughness point that has moved on the moving straight line. You may be comprised so that control may be performed.

  Thereby, even if the measurement points on the surface of the measurement target wafer are not on the same straight line, the surface roughness can be automatically and continuously measured by the rotation control of the stage.

The positions of the plurality of surface roughness points are stored in advance in the storage means as rotation angle information of the stage and horizontal position information of the contact,
The control means is configured to perform control to continuously measure the surface roughness at the plurality of surface roughness points based on the rotation angle information and the horizontal position information stored in the storage means. Also good.

  Thereby, when there are a plurality of measurement points on the surface of the same wafer, the measurement point is stored in advance as rotation angle information, and the horizontal position is stored as horizontal position information. Can be measured continuously and automatically.

Further, the contact is supported by a horizontal arm that moves linearly in the horizontal direction,
The horizontal position information may be stored as stroke information of the horizontal arm.

  Further, the positioning means is a positioning sheet in which a wafer positioning hole having a shape and a size capable of surrounding the periphery of the wafer along the outer periphery of the wafer is formed at a position where the plurality of wafers are placed. May be.

  As a result, when a plurality of wafers are placed on the stage, even if an operator places the wafer on the stage by hand, the wafer is positioned at a predetermined position on the stage without causing variations in the placed position. Can be fixed.

Also, two or more protrusions are provided on the stage,
The wafer positioning sheet may have a sheet positioning hole that fits into the protrusion.

  Thereby, it is possible to prevent a shift between the stage and the wafer positioning sheet and between the wafer positioning sheet and the wafer.

  The wafer positioning sheet may be a resin sheet having a thickness of 0.1 to 2 mm.

Further, the surface roughness measuring means includes an upper and lower arm that moves the contactor up and down,
An arm raising sensor for detecting the raising of the upper and lower arms,
The control means is configured to detect the end of surface roughness measurement at the surface roughness measurement point by detecting the rise of the upper and lower arms by the arm elevation sensor, and perform the next control operation after detecting the end of the surface roughness measurement. May be.

  According to the present invention, the surface roughness of a plurality of wafers can be continuously and automatically measured.

It is explanatory drawing of the measuring method of the surface roughness of the wafer by the conventional surface roughness meter. FIG. 1A is a configuration diagram showing a conventional surface roughness meter. FIG. 1B is a diagram showing wafer measurement points in a wafer surface roughness measurement method using a conventional surface roughness meter. It is the figure which showed an example of the surface roughness measuring apparatus which concerns on embodiment of this invention. FIG. 2A is a diagram illustrating an overall configuration of an example of a surface roughness apparatus according to the present embodiment. FIG. 2B is a diagram showing an example of measurement points when measuring five measurement points. It is the figure which showed the wafer positioning sheet as an example of the wafer positioning means of the surface roughness apparatus which concerns on embodiment of this invention. FIG. 3A is a configuration diagram illustrating an example of a wafer positioning sheet. FIG. 3B is a view showing a method for placing the wafer positioning sheet on the stage. It is the figure which showed an example of the positional relationship of the measurement point of the wafer 70 used as a measuring object.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  FIG. 2 is a diagram illustrating an example of a surface roughness measuring apparatus according to an embodiment of the present invention. FIG. 2A is a diagram illustrating an overall configuration of an example of a surface roughness apparatus according to the present embodiment. 2A, the surface roughness apparatus according to this embodiment includes a stage 10, a servo motor 13, an origin sensor 14, a surface roughness measuring means 20, a support base 30, a controller 40, An information input device 42 and a wafer positioning sheet 50 are provided. The surface roughness measuring means 20 includes a contact 21, a horizontal arm 22, an upper and lower arm 23, a support 24, an arm raising sensor 25, and a recording means 26. In addition, the controller 40 includes a storage unit 41 inside. In FIG. 2A, a plurality of wafers 70 are shown as related components.

  The support base 30 is a base for supporting the stage 10 and the surface roughness measuring means 20, and the stage 10 and the support 24 of the surface roughness measuring means 20 are provided on the support base 30. A vertical arm 23 for moving the contact 21 in the vertical direction is attached to the support 24, and a horizontal arm 22 for moving the contact 21 in the horizontal direction is attached to the vertical arm 23. The contact 21 has a needle shape and is provided at the tip of the horizontal arm 22. Data measured by the contact 21 is stored in the recording means 26.

  The surface roughness measuring means 20 is a means for measuring the surface roughness of the wafer 70 to be measured at a predetermined measurement position on the stage 10. The surface roughness is measured by the surface roughness measuring means 20 with the contact 21 being lowered by the upper and lower arms 23 and in contact with the surface of the wafer 70 so that the horizontal arm 22 is pulled forward and the horizontal arm 22 is pulled to the front. It is moved and the surface roughness of the wafer 70 is measured. Since both the upper and lower arms 22 and the horizontal arm 23 move linearly, the surface roughness of the wafer 70 is measured when the contactor 21 moves linearly on the surface of the wafer 70. The predetermined measurement position for measuring the surface roughness of the wafer 70 may be a position on a moving straight line where the horizontal arm 22 can move, but from the viewpoint of reducing the moving distance of the contact 21, It is preferable to be on the near side. In general, the moving distance of the contact 21 is measured by measuring a surface roughness by moving a straight line of 5 mm to 15 mm while making contact with the wafer 70 as an object to be measured at one measurement point.

  The stage 10 is means for placing a wafer 70 that is an object to be measured. The stage 10 is provided with a servo motor 13 for rotating the stage 10 to a desired angle in accordance with a control signal from the controller 40. Therefore, the stage 10 can be rotationally driven, and the drive can be controlled by the controller 40. Note that the origin of the stage 10 is configured to be specified by the origin sensor 14. The origin sensor 14 is detection means for detecting the origin position of the stage 10, and when the stage 10 comes to the origin position, a pair of origin sensors 14 provided on the support base 30 side and the stage 10 side is provided. It may be provided in an arrangement so as to face each other. For example, if it is configured to emit light from one side and receive light from the other side, the origin position of the stage 10 can be detected and the origin can be positioned.

  In addition, the stage 10 has a configuration in which a plurality of wafers 70 can be placed on a circumference near the outer periphery of the surface of the stage 10. Specifically, positioning means 50 for accurately determining the mounting position of the wafer 70 is provided, and the wafer 70 can be positioned and fixed. The wafer positioning means 50 has a similar shape slightly larger than the wafer 70 in order to position and fix the wafer 70, and means for forming a recess surrounding the periphery of the wafer 70 along the outer periphery of the wafer 70. It is. Details of the positioning means 50 will be described later.

  The controller 40 is a control unit that controls the rotational driving of the stage 10 and the surface roughness measurement by the surface roughness measuring unit 20. In the surface roughness measuring apparatus according to the present embodiment, when the surface roughness measurement of one wafer 70 at a predetermined measurement position is completed, the upper and lower arms 23 are raised, the stage 10 is rotated, and the next wafer 70 is rotated. Is moved to a predetermined measurement position, and the vertical arm 23 is lowered to perform a continuous measurement operation for measuring the surface roughness of the wafer 70 as the next measurement target. Therefore, the controller 40 needs to detect the rise of the upper and lower arms 23 and perform drive control by synchronizing the operations of the servo motor 13 and the surface roughness measuring means 20. Therefore, the controller 40 is electrically connected to the servo motor 13 and the arm raising sensor 25, and is connected to the contact 21, the upper and lower arms 23, and the horizontal arm 22. The arm raising sensor 25 is a detecting unit that detects the raising of the upper and lower arms 23. Since the upper and lower arms 23 are raised and lowered for each measurement, the arm raising sensor 25 serves as an operation interlock for measuring completion timing. Further, the controller 40 stores the rotation angle information of the stage 10 input to the information input device 42 by the storage means 41, and issues an angle command to the servo motor 13 based on the stored rotation angle acquisition information. Can actually be rotated. Such continuous operation enables continuous measurement automatically. Note that the storage unit 41 is not necessarily provided inside the controller 40, and may be provided on the information input device 42 side so that the controller 40 reads the stored information and performs drive control. .

  FIG. 2B is a diagram showing an example of measurement points when five measurement points are measured by the surface roughness measuring means 20. In FIG. 2B, the measurement points 71 to 75 are located on two different straight lines orthogonal to each other as described in FIG. 1B, but the direction in which the contact 21 moves is orthogonal. Not related. That is, the measurement points 72, 73, and 74 are on one straight line, but the measurement point 71 is inclined to the right side of the measurement points 72, 73, and 74, and the measurement point 75 is the measurement points 72, 73. , 74 are inclined to the left side. In the surface roughness measuring apparatus according to the present embodiment, even when there are a plurality of measurement points on one wafer 70, the stage 10 is not rotated by 90 degrees, but the measurement points 71 and the measurement points 72 to 74 are measured. Then, drive control is performed in which the measurement points 75 are slightly moved so as to come on the movement straight line of the contact 21. Therefore, the measurement points 71 and 75 at both ends are not in a relationship in which the movement directions of the measurement points 72 to 74 and the contactor 21 are orthogonal to each other, and are slightly different in angle. Details of this point will be described later.

  FIG. 3 is a view showing a wafer positioning sheet 51 as an example of the wafer positioning means 50 of the surface roughness apparatus according to the embodiment of the present invention. FIG. 3A is a configuration diagram showing an example of the wafer positioning sheet 51. As shown in FIG. 3A, the wafer positioning means 50 described in FIG. 2 can be configured as a sheet-like wafer positioning sheet 51, for example. The wafer positioning sheet 51 has a wafer positioning hole 52 and a sheet positioning hole 53. The wafer positioning hole 52 is a hole for positioning and fixing the wafer 70 and is placed on the stage 10 to form a recess having a depth corresponding to the thickness of the wafer positioning sheet 51 on the surface of the stage 10. be able to. When the sheet positioning hole 53 is provided with a projection such as a pin on the surface of the stage 10, the wafer positioning sheet 51 is fixedly installed on the stage 10 by fitting the sheet positioning hole 53 into the projection. This is a hole provided for this purpose.

  When the wafer positioning sheet 51 shown in FIG. 3 is used, various types of wafer positioning holes 52 formed in the wafer positioning sheet 51 are used in accordance with the size and number of wafers 70 to be measured. It becomes possible to measure the surface roughness of the wafer.

  FIG. 3B is a view showing a method of installing the wafer positioning sheet 51 on the stage 10. In FIG. 3B, positioning pins 12 are provided on the surface 11 of the stage 10. The pin 12 is fixed to the surface 11 of the stage 10. Further, as described above, the wafer positioning sheet 51 has the sheet positioning hole 53 which is a hole having substantially the same diameter as the pins 12 so that the position does not shift even when rotated. Further, the thickness of the wafer positioning sheet 51 is, for example, 0.1 to 2 mm, and is such a thickness that the wafer 70 is caught. Further, the wafer positioning sheet 51 is provided with wafer positioning holes 52 having substantially the same size as the wafer 70, and the wafer 70 can be fixed on the rotary stage 10 by placing the wafer 70 thereon.

  The wafer positioning sheet 51 may be made of various materials as long as it has a thickness and hardness capable of positioning and fixing the wafer 70. For example, the wafer positioning sheet 51 may be made of a resin sheet. For example, a polypropylene resin wafer positioning sheet 51 having a thickness of about 1 mm may be used.

  As described above, the positioning means 50 provides the positioning pins 12 on the surface 11 of the stage 10, and also provides the wafer positioning holes 52 and the sheet positioning holes 53 in the disc-shaped sheet, and these are mounted on the rotary stage 10. It may be configured. By inserting the pins 12 through the sheet positioning holes 53, the wafer positioning sheet 51 can be installed and fixed on the surface 11 of the stage 10.

  In FIG. 3, the example in which the protruding pins 12 and the sheet positioning holes 53 are two has been described. However, in order to reliably prevent the positional deviation of the wafer positioning sheet, three or more pins 12 or the like are used. Protrusions and sheet positioning holes 53 may be provided.

  Next, the positional relationship between the measurement points of the wafer 70 measured by the surface roughness apparatus of the present invention will be described in detail with reference to FIG. FIG. 4 is a diagram showing an example of the positional relationship between the measurement points of the wafer 70 to be measured. FIG. 4 shows an example of measurement positions when measuring the surface roughness of six wafers 70 continuously and setting five measurement points per wafer. The constituent elements described so far are denoted by the same reference numerals as those described above, and the description thereof is omitted.

  In the example of FIG. 4, five measurement points 71 to 75 are set on the surface of one measurement target wafer 70, and the measurement order is from the measurement point 71 to the measurement point 75. The measurement direction is set to a direction from the measurement point 72 toward the measurement point 74. As shown in FIG. 4, the measurement points 72 to 74 are on the horizontal movement straight line of the contactor 21 that is the measurement direction, so that the measurement points 72 to 74 can be measured without rotating the stage 10. There is a relationship. The measurement points 71, 73, and 75 are on a straight line perpendicular to the measurement direction, although the moving direction of the contact 21 is different. Therefore, the measurement stroke, which is the amount of movement in the linear direction by the horizontal arm 22, is set as the movement amount 76 from the measurement point 71 to the measurement point 72, and is also set as the movement amount 76 from the measurement point 72 to the measurement point 73. Can be remembered. Further, when six stages 10 are installed, the movement angle α per sheet is 60 °, and the movement angle β between the measurement point 71 and the measurement point 72 is approximately 22 °. These angles and movement amounts are stored in the controller 40 in advance.

  It is assumed that the stage 10 is rotated counterclockwise by an angle β from the state shown in FIG. Then, when the stage 10 is rotated clockwise by the angle β and the contact 21 is moved inward by an amount of movement 76, the measurement point 72 can be measured next. In the relationship between the measurement points 72 to 74, the rotation angle information is unnecessary or zero, and the position information in the radial direction of the stage 10 may be stored. That is, the next measurement point 73 can be measured by moving the contactor 21 to the outside of the movement amount 76, and similarly, the measurement point 74 is measured if the contactor 21 is further moved to the outside of the movement amount 76 minutes. be able to. Next, the measurement point 75 can be measured by rotating the stage 10 clockwise by the angle β and moving the contact 21 inwardly by the movement amount 76 from the measurement point 74. In the case of this measurement pattern, if the measurement point 71 is first installed on the movement straight line in the measurement direction and the measurement starts from the center position of the wafer 70 in the radial direction (the horizontal movement direction of the horizontal arm 22), The measurement point 71 is measured, the stage 10 is rotated at an angle β in the clockwise direction, the horizontal arm 22 is moved with the movement amount 76 inward, the measurement point 72 is measured, the horizontal arm 22 is moved with the movement amount 76 outward, and the measurement point 73 is measured. The horizontal arm 22 moves with the movement amount 76 on the outside, the measurement point 74 is measured, the stage 10 rotates at an angle β in the clockwise direction, the horizontal arm 22 moves inward with the movement amount 76, and the measurement point 75 is measured. All the measurement points 71 to 75 can be measured in the sequence.

  Further, if the stage 10 is rotated clockwise or counterclockwise at an angle α thereafter, another adjacent wafer 70 is moved to a predetermined measurement position, and the wafer 70 moved to the measurement position is moved to the surface. Surface roughness can be measured as the next measurement target of the roughness measuring means 20. In this case, when the measurement of one wafer 70 is completed, it is only necessary to enter a sequence for rotating the stage 10 at the rotation angle α. Therefore, the next wafer is measured in the same way as the measurement of the individual measurement points 71 to 75. A surface roughness of 70 can be measured.

  As described above, if the movement amount or position information in the measurement direction and the rotation angle information of the stage 10 are set in advance and a sequence is set in accordance with the measurement method, the surface roughness of the plurality of wafers 70 is automatically and continuously set. Can be measured.

  The movement amount information or the position information can be stored as stroke information of the horizontal arm 22, and the movement amount information or the position information can be stored in a format suitable for actual driving of the actuator.

  Next, a method for measuring the surface roughness of the wafer 70 using the surface roughness measuring apparatus according to the present embodiment will be described with reference to FIGS. Here, as shown in FIG. 4, six wafers 70 are used as an example, and five measurement points 71 to 75 per sheet. However, the measurement with the surface roughness measuring apparatus of the present invention is performed by measuring the number of wafers. The measurement point is not limited.

  As shown in FIG. 3, first, the wafer positioning sheet 51 is placed on the stage 10 so that the pins 12 protruding above the stage 10 and the pin positioning holes 53 provided in the wafer positioning sheet 51 are fitted. Put it on. Next, six wafers 70 are set on the surface of the stage 10 so as to fit in the wafer positioning holes 52 of the wafer positioning sheet 51.

  Next, the measurement order, rotation angle, measurement stroke 36, measurement order, and measurement length per point of the six wafers 10, five measurement points 71 to 75 are stored in the controller 40 shown in FIG. Set. The setting to the controller 40 may be performed using the information input device 42, and each setting information may be stored in the storage unit 41 inside the controller 40. In addition, when measurement is performed under the same conditions after the second time, it is not necessary to set again.

  When the surface roughness measuring apparatus shown in FIG. 2 starts automatic operation, the stage 10 moves to the origin position with the angle of the center position of the first wafer 70 as the origin position, and then the first position in FIG. Rotate by the rotation angle β of the measurement point 71 and stop. The horizontal arm 22 moves to a stroke position 77 from the center of the measurement point 72 (see FIG. 4), and the upper and lower arms 23 are lowered until the contact 21 and the wafer 70 come into contact with each other, and the measurement operation is performed. When the measurement is completed, the upper and lower arms 23 are temporarily raised, and the arm raising sensor 25 detects the rise of the upper and lower arms 23 and moves to the next measurement point while being raised.

  When the upper and lower arms 23 are raised and the arm raising sensor 25 is turned on, the controller 40 detects the end of measurement, rotates the stage 10, and rotates by the rotation angle β of the next measurement point 72. Meanwhile, the horizontal arm 22 moves to the upper side of the next measurement point 72 and starts measurement after the upper and lower arms 23 are lowered.

  When the measurement of the first wafer 70 is completed by repeating the operations as described above, the stage 10 rotates 60 ° and moves to the position of the second rotation angle α (see FIG. 4). Similarly, after the surface roughness is measured continuously for the second to sixth sheets, when all measurements are completed, an end display is displayed and the process stops.

  As described above, by first setting the number information and the position information and installing one servo motor 11, the surface roughness of the wafer 70 can be automatically measured continuously and unattended. .

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present invention. Can be added.

  The present invention can be used in a surface roughness measuring apparatus that measures the surface roughness of a wafer.

DESCRIPTION OF SYMBOLS 10 Stage 11 Surface 12 Pin 13 Servo motor 14 Origin sensor 20 Surface roughness measuring means 21 Contact 22 Horizontal arm 23 Vertical arm 24 Support | pillar 25 Arm rise sensor 26 Recording means 30 Support stand 40 Controller 41 Memory | storage means 42 Information input device 50 Positioning means 51 Wafer positioning sheet 52 Wafer positioning hole 53 Sheet positioning hole 70 Wafer 71 to 75 Measurement point 76 Movement amount

Claims (8)

A stage that can be driven to rotate, on which a plurality of wafers can be mounted;
Positioning means for concentrically positioning and fixing the plurality of wafers on the stage;
The surface roughness of the wafer is measured by bringing a contactor supported so as to be linearly movable in the vertical and horizontal directions into contact with the surface of the wafer at a predetermined measurement position and linearly moving in the horizontal direction. Surface roughness measuring means;
Of the plurality of wafers positioned and fixed concentrically by the positioning means, the measurement target wafer to be measured is moved to the predetermined measurement position by rotating the stage, and the surface roughness measurement means performs the measurement. And a control means for controlling the stage and the surface roughness measuring means so that a series of operations for measuring the surface roughness of the target wafer are sequentially performed on the plurality of wafers. Surface roughness measuring device. When there are a plurality of surface roughness measurement points on the measurement target wafer, and the plurality of surface roughness points include an arrangement relationship that is not on a moving straight line on which the contact is horizontally moved,
The control means moves the surface roughness point that is not on the moving straight line onto the moving straight line of the contact by rotating the stage, and measures the surface roughness point that has moved on the moving straight line. The surface roughness measuring apparatus according to claim 1, wherein control is performed. The positions of the plurality of surface roughness points are stored in advance in storage means as rotation angle information of the stage and horizontal position information of the contact,
The control means performs control to continuously measure the surface roughness at the plurality of surface roughness points based on the rotation angle information and the horizontal position information stored in the storage means. The surface roughness measuring apparatus according to claim 2. The contact is supported by a horizontal arm that moves linearly in the horizontal direction,
The surface roughness measuring apparatus according to claim 3, wherein the horizontal position information is stored as stroke information of the horizontal arm.   The positioning means is a wafer positioning sheet in which a wafer positioning hole having a shape and a size capable of surrounding the periphery of the wafer along the outer periphery of the wafer is formed at a position where the plurality of wafers are placed. The surface roughness measuring device according to any one of claims 1 to 4. Two or more protrusions are provided on the stage,
The surface roughness measuring apparatus according to claim 5, wherein the wafer positioning sheet has a sheet positioning hole that fits into the protrusion.   The surface roughness measuring apparatus according to claim 5 or 6, wherein the wafer positioning sheet is a resin sheet having a thickness of 0.1 to 2 mm. The surface roughness measuring means includes an upper and lower arm that moves the contact up and down,
An arm raising sensor for detecting the raising of the upper and lower arms,
The control means detects the end of surface roughness measurement of the surface roughness measurement point by detecting the rise of the upper and lower arms by the arm elevation sensor, and performs the next control operation after detecting the end of the surface roughness measurement. The surface roughness measuring device according to claim 2.

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