CN220901089U - Automatic detection equipment for semiconductor chip - Google Patents
Automatic detection equipment for semiconductor chip Download PDFInfo
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- CN220901089U CN220901089U CN202322631059.8U CN202322631059U CN220901089U CN 220901089 U CN220901089 U CN 220901089U CN 202322631059 U CN202322631059 U CN 202322631059U CN 220901089 U CN220901089 U CN 220901089U
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- 238000001514 detection method Methods 0.000 title claims abstract description 88
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 9
- 238000012360 testing method Methods 0.000 claims abstract description 9
- 238000007689 inspection Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000004088 simulation Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model belongs to the technical field of semiconductor chip production, and discloses automatic detection equipment for a semiconductor chip. The automatic detection equipment of the semiconductor chip comprises a detection box, wherein the left inner wall and the right inner wall of the detection box are fixedly provided with electric sliding rails, sliding blocks are connected in the electric sliding rails, a placement block is fixedly connected on the sliding blocks, a detection plate is arranged between the two placement blocks, the left side and the right side of the detection plate are fixedly connected with limiting blocks, and limiting grooves are formed in the upper surfaces of the placement blocks. This automatic check out test set of semiconductor chip, through the design of unloading mechanism, can carry out the separate collection with the chip that goes wrong, be convenient for follow-up categorised collection and unified encapsulation can carry out a plurality of chips simultaneous detection simultaneously, can carry out board level detection and simulation environment detection to the chip, collect performance detection and reliability detection as an organic wholely, saved a large amount of costs and check out test time, solved the problem that proposes among the background art.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip production, in particular to automatic detection equipment for a semiconductor chip.
Background
The semiconductor chip, which is a common electronic device for short, plays a vital role in modern electronic technology, is a tiny circuit made of semiconductor materials such as silicon, germanium and the like, is integrated on a small chip, calculates, stores, processes signals, communicates and the like, is widely applied to various electronic devices such as computers, mobile phones, automobiles, household appliances and the like, has small volume, low power consumption and stable work, and can efficiently complete various tasks in different working environments.
Because the chips have countless possible steps of introducing defects in the production and manufacturing process, even if the chips are in the same batch of wafers and packaged finished products, the chips are good or bad, so that screening is needed, the semiconductor chips only can be marked when being detected, the problematic chips are difficult to be singly collected and separated, the subsequent classified collection brings a certain influence, and meanwhile, the performance detection and the reliability detection of the chips are generally carried out step by adopting instruments and meters and detection boxes, so that a great amount of cost and time are consumed, and the automatic detection equipment for the semiconductor chips is designed.
Disclosure of utility model
The utility model aims to provide an automatic detection device for a semiconductor chip, which can synchronously perform performance detection and reliability detection, and can independently separate and collect chips with problems, so that the problems in the background technology are solved.
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the automatic detection equipment for the semiconductor chip comprises a detection box, wherein electric sliding rails are fixedly arranged on the left and right inner walls of the detection box, a sliding block is connected in the electric sliding rails in a sliding manner, a placement block is fixedly connected to the sliding block, a detection plate is arranged between the two placement blocks, limiting blocks are fixedly connected to the left and right sides of the detection plate, limiting grooves are formed in the upper surfaces of the placement blocks, the limiting blocks are inserted into the limiting grooves, and a discharging mechanism is further arranged in the detection box;
The unloading mechanism includes:
Square holes are formed in the detection plate;
the placing frame is fixedly connected in the square hole;
the bottom plate is arranged on the lower surface of the placement frame;
The strip-shaped groove is formed in the lower surface of the placement frame;
The electric telescopic rod is fixedly arranged in the strip-shaped groove, and the output end of the electric telescopic rod is movably connected with the bottom plate through the movable piece;
and a limiting component is further arranged in the placement frame.
Through the technical scheme, the chips with problems can be separated and collected independently, so that the operation time and the detection time are saved.
Preferably, the diameter of the bottom plate is larger than that of the placement frame, and the PCB board used for detection and the semiconductor chip to be detected are placed in the placement frame.
Through the technical scheme, the PCB and the chip are used for simulating the working environment of the chip, the interface of the chip is led out, the function of the chip is detected, or whether the chip can normally operate Worker's work is checked in various severe environments.
Preferably, the limiting assembly includes: rectangular channel, gasbag and air pump, rectangular channel has been seted up to the inner wall of placing the frame, rectangular channel internal fixation has the gasbag, the front of placing the frame still fixed mounting has the air pump, the end of giving vent to anger of air pump extends to rectangular channel in and with the fixed intercommunication of gasbag.
Through the technical scheme, the detection chip and the detection PCB can be limited, and the phenomenon of displacement during plugging detection is prevented, so that the plugging accuracy of the interface is affected.
Preferably, an extension spring is fixedly connected between the inner walls of the air bags, and the diameter of the air bags is smaller than that of the rectangular grooves.
Through the technical scheme, the air bag is initially positioned in the rectangular groove, the placement of the PCB and the chip is not affected, and after the air bag is inflated and then deflated and reduced for resetting, the air bag can be reset into the rectangular groove, so that the picking process of the PCB and the chip is not affected.
Preferably, the number of the placing frames is a plurality of the placing frames and the placing frames are uniformly distributed on the detection plate, and the detection box is a high-low temperature alternating damp-heat test box.
Through the technical scheme, the detection box can simulate more severe temperature, humidity and pressure to carry out reliability detection.
Preferably, the rear side of the placement frame is also provided with a plug hole, and a socket is fixedly arranged on the inner rear wall of the detection box corresponding to the plug hole.
Through the technical scheme, the chip performance detection device is connected with the interface on the PCB through the socket so as to detect the performance of the chip, and meanwhile, the socket can simulate the instant voltage which is increased by a human body or an industrial body to the chip, so that the reliability of the chip is detected.
By adopting the technical scheme, the utility model has the beneficial effects that:
1. This automatic check out test set of semiconductor chip, through the design of unloading mechanism, can carry out the separate collection with the chip that goes wrong, be convenient for follow-up categorised collection and unified encapsulation can carry out a plurality of chips simultaneous detection simultaneously, can carry out board level detection and simulation environment detection to the chip, collect performance detection and reliability detection as an organic wholely, saved a large amount of costs and check out test time, solved the problem that proposes among the background art.
2. This automatic check out test set of semiconductor chip, through the design of spacing subassembly, can carry out spacingly to the chip that detects and detection PCB board, prevent that it from appearing the phenomenon of displacement when grafting detection, and then influence the accuracy of interface grafting, possess good protectiveness simultaneously, can not cause the influence to chip and detection PCB board.
Drawings
FIG. 1 is a perspective view of the present utility model;
FIG. 2 is a front view of the present utility model;
FIG. 3 is a top cross-sectional view of the present utility model;
FIG. 4 is a side cross-sectional view of a placement frame of the present utility model;
FIG. 5 is a rear view of the placement frame of the present utility model;
FIG. 6 is a cross-sectional view of an airbag of the present utility model.
In the figure: 1 detection box, 2 electronic slide rail, 3 sliders, 4 place the piece, 5 pick-up plate, 6 spacing groove, 7 stopper, 8 unloading mechanism, 81 square hole, 82 place frame, 83 bottom plate, 84 bar grooves, 85 electronic telescopic link, 9 spacing subassembly, 91 rectangular channel, 92 gasbag, 93 air pump, 10 extension spring, 11 spliced eye, 12 sockets.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-6, the present utility model provides a technical solution: the automatic detection equipment for the semiconductor chip comprises a detection box 1, wherein an electric sliding rail 2 is fixedly installed on the left inner wall and the right inner wall of the detection box 1, a sliding block 3 is connected in a sliding manner in the electric sliding rail 2, a placement block 4 is fixedly connected to the sliding block 3, a detection plate 5 is arranged between the two placement blocks 4, limiting blocks 7 are fixedly connected to the left side and the right side of the detection plate 5, limiting grooves 6 are formed in the upper surface of the placement block 4, the limiting blocks 7 are spliced in the limiting grooves 6, and a blanking mechanism 8 is further arranged in the detection box 1;
the blanking mechanism 8 comprises:
A square hole 81, wherein the square hole 81 is arranged on the detection plate 5;
the placement frame 82 is fixedly connected in the square hole 81;
a bottom plate 83, the bottom plate 83 being provided on a lower surface of the placement frame 82;
a bar-shaped groove 84, wherein the bar-shaped groove 84 is arranged on the lower surface of the placement frame 82;
The electric telescopic rod 85 is fixedly arranged in the strip-shaped groove 84, and the output end of the electric telescopic rod 85 is movably connected with the bottom plate 83 through a movable piece;
A limiting component 9 is further arranged in the placement frame 82.
Through the technical scheme, the chips with problems can be separated and collected independently, so that the operation time and the detection time are saved.
Preferably, the diameter of the bottom plate 83 is larger than that of the placement frame 82, and a PCB board for inspection and a semiconductor chip to be inspected are placed in the placement frame 82.
Through the technical scheme, the PCB and the chip are used for simulating the working environment of the chip, the interface of the chip is led out, the function of the chip is detected, or whether the chip can normally operate Worker's work is checked in various severe environments.
Preferably, the limiting assembly 9 comprises: rectangular groove 91, gasbag 92 and air pump 93, rectangular groove 91 has been seted up to the inner wall of placing frame 82, fixedly connected with gasbag 92 in the rectangular groove 91, the front of placing frame 82 still fixed mounting has air pump 93, the end of giving vent to anger of air pump 93 extends to in the rectangular groove 91 and with gasbag 92 fixed intercommunication.
Through the technical scheme, the detection chip and the detection PCB can be limited, and the phenomenon of displacement during plugging detection is prevented, so that the plugging accuracy of the interface is affected.
Preferably, a tension spring 10 is fixedly connected between the inner walls of the air bags 92, and the diameter of the air bags 92 is smaller than that of the rectangular grooves 91.
Through the technical scheme, the air bag 92 is initially positioned in the rectangular groove 91, so that the placement of the detection PCB and the chip is not affected, and after the air bag 92 is inflated and then deflated and reduced for resetting, the air bag can be reset into the rectangular groove 91, and therefore the taking process of the PCB and the chip is not affected.
Preferably, the number of the placing frames 82 is a plurality and the placing frames are uniformly distributed on the detection plate 5, and the detection box 1 is a high-low temperature alternating damp-heat test box.
Through the technical scheme, the detection box 1 can simulate more severe temperature, humidity and pressure to carry out reliability detection.
Preferably, the rear side of the placement frame 82 is further provided with a plugging hole 11, and the socket 12 is fixedly installed on the inner rear wall of the detection box 1 corresponding to the plugging hole 11.
Through the technical scheme, the chip performance is detected by connecting the socket 12 with the interface on the PCB, and meanwhile, the reliability of the chip is detected by simulating the instantaneous voltage which is increased by a human body or an industrial body to the chip through the socket 12.
When the automatic detection equipment for the semiconductor chip works, firstly, a PCB and a chip are placed in the placement frame 82, at the moment, the bottom plate 83 is contacted with the placement frame 82 to play a supporting role, then the air pump 93 is started to inflate the air bag 92, the air bag 92 is enlarged to limit the PCB and the chip in the placement frame 82, then the limiting block 7 of the detection plate 5 is placed in the limiting groove 6 of the placement block 4 to limit, the electric sliding rail 2 is started to drive the detection plate 5 and the placement frame 82 to move, an interface on the PCB is connected with the jack 12 to perform performance detection on the chip, then the detection box 1 and the jack 12 are used for comprehensively detecting the chip, if a problem chip is generated, the electric sliding rail 2 drives the detection plate 5 and the chip to reset after the detection is finished, at the moment, the electric sliding rail 85 with the problem chip in the placement frame 82 is extended, a certain gap is formed between the bottom plate 83 and the placement frame 82, at the moment, the problem chip is continuously extended to generate an inclined angle to the bottom of the detection box 1, the problem chip is collected to the bottom of the detection box 1, and the chip on the detection plate 5 is a qualified chip after the detection plate 5 is taken out, and the detection is uniformly slipped, and the detection process can be completed.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an automatic check out test set of semiconductor chip, includes detection case, its characterized in that: the left and right inner walls of the detection box are fixedly provided with electric sliding rails, sliding blocks are connected in the electric sliding rails in a sliding manner, a placement block is fixedly connected to the sliding blocks, a detection plate is arranged between the two placement blocks, the left and right sides of the detection plate are fixedly connected with limiting blocks, the upper surfaces of the placement blocks are provided with limiting grooves, the limiting blocks are inserted into the limiting grooves, and a blanking mechanism is further arranged in the detection box;
The unloading mechanism includes:
Square holes are formed in the detection plate;
the placing frame is fixedly connected in the square hole;
the bottom plate is arranged on the lower surface of the placement frame;
The strip-shaped groove is formed in the lower surface of the placement frame;
The electric telescopic rod is fixedly arranged in the strip-shaped groove, and the output end of the electric telescopic rod is movably connected with the bottom plate through the movable piece;
and a limiting component is further arranged in the placement frame.
2. An automated inspection apparatus for semiconductor chips as defined in claim 1, wherein: the diameter of the bottom plate is larger than that of the placement frame, and the PCB used for detection and the semiconductor chip to be detected are placed in the placement frame.
3. An automated inspection apparatus for semiconductor chips as defined in claim 2, wherein: the spacing subassembly includes: rectangular channel, gasbag and air pump, rectangular channel has been seted up to the inner wall of placing the frame, rectangular channel internal fixation has the gasbag, the front of placing the frame still fixed mounting has the air pump, the end of giving vent to anger of air pump extends to rectangular channel in and with the fixed intercommunication of gasbag.
4. An automated inspection apparatus for semiconductor chips as defined in claim 3, wherein: an extension spring is fixedly connected between the inner walls of the air bags, and the diameter of each air bag is smaller than that of the rectangular groove.
5. An automated inspection apparatus for semiconductor chips as defined in claim 4, wherein: the number of the placing frames is a plurality of the placing frames and the placing frames are uniformly distributed on the detection plate, and the detection box is a high-low temperature alternating damp-heat test box.
6. An automated inspection apparatus for semiconductor chips as defined in claim 5, wherein: the rear side of placing the frame has still offered the spliced eye, the interior back wall of detection case corresponds the position fixed mounting of spliced eye has the socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322631059.8U CN220901089U (en) | 2023-09-26 | 2023-09-26 | Automatic detection equipment for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322631059.8U CN220901089U (en) | 2023-09-26 | 2023-09-26 | Automatic detection equipment for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220901089U true CN220901089U (en) | 2024-05-07 |
Family
ID=90911313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322631059.8U Active CN220901089U (en) | 2023-09-26 | 2023-09-26 | Automatic detection equipment for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220901089U (en) |
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2023
- 2023-09-26 CN CN202322631059.8U patent/CN220901089U/en active Active
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