CN220896766U - Integral type TOF camera module device - Google Patents
Integral type TOF camera module device Download PDFInfo
- Publication number
- CN220896766U CN220896766U CN202322406759.7U CN202322406759U CN220896766U CN 220896766 U CN220896766 U CN 220896766U CN 202322406759 U CN202322406759 U CN 202322406759U CN 220896766 U CN220896766 U CN 220896766U
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- China
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- rfpc
- close
- camera module
- tof camera
- side edge
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- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 16
- 239000010959 steel Substances 0.000 claims abstract description 16
- 210000001503 joint Anatomy 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- -1 graphite alkene Chemical class 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 5
- 229910021389 graphene Inorganic materials 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model provides an integrated TOF camera module device, which relates to the technical field of integrated cameras and comprises an RFPC substrate, wherein a VCSEL chip is fixed at the position, close to one side edge, of the top of the RFPC substrate, a hollowed-out opening is formed in the bottom of the VCSEL chip at the bottom of the RFPC substrate, a steel plate frame is fixed between the inner walls of the hollowed-out opening and close to the top edge, the top of the steel plate frame is mutually attached to the bottom of the VCSEL chip, graphene is filled between the inner part of the hollowed-out opening and the steel plate frame, and a base is arranged at the position, close to the other side edge, of the top of the RFPC substrate.
Description
Technical Field
The utility model relates to the technical field of integrated cameras, in particular to an integrated TOF camera module device.
Background
Cameras can be divided into two main categories, digital cameras and analog cameras. The digital camera can convert the analog video signal generated by the video acquisition device into a digital signal, and further store the digital signal in a computer. The video signal captured by the analog camera must be converted into a digital mode by a specific video capture card, and compressed before being converted into a computer for use.
At present, when the TOF camera is manufactured, the TOF camera and the VCSEL transmitter are manufactured separately, the production process is complex, most of the process flows are carried out twice, and after the TOF camera and the VCSEL transmitter are assembled by using a bracket, the size of the whole module is greatly increased, so that the requirements of light, thin and small terminal equipment cannot be met.
Disclosure of utility model
(One) solving the technical problems
The utility model aims to solve the problems in the prior art and provides an integrated TOF camera module device.
(II) technical scheme
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides an integral type TOF camera module device, includes the RFPC base plate, the top of RFPC base plate is close to one side edge and is fixed with the VCSEL chip, the fretwork mouth has been seted up to the bottom that the bottom of RFPC base plate is located the VCSEL chip, be close to top edge between the inner wall of fretwork mouth and be fixed with the steel sheet frame, the top of steel sheet frame is laminated each other with the bottom of VCSEL chip, it has graphene to fill between the inside of fretwork mouth and the steel sheet frame, the top of RFPC base plate is close to opposite side edge and is provided with the base.
Preferably, a TOF lens groove is formed in the top of the base near one side edge, and a mounting groove is formed in the top of the base near the other side edge.
Preferably, a protective lens is arranged in the mounting groove, and a through hole is formed in the middle of the bottom surface of the mounting groove.
Preferably, a limit groove is formed in the bottom of the base close to the edge of the other side, and the VCSEL chip is clamped in the limit groove.
Preferably, a TOF chip is fixed on the top of the RFPC substrate near the edge of the other side, and a near-infrared narrowband filter is arranged on the top of the TOF chip.
Preferably, the near infrared narrowband filter is attached to the bottom of the base, a bayonet is formed at the position, close to the front side edge, of the bottom of the RFPC substrate, and a connector is fixed at the position, close to the front side edge, of the top of the RFPC substrate.
Preferably, a plurality of butt joint grooves are formed in the top of the RFPC substrate close to the edges of two sides at equal intervals, and spring copper sheets are arranged in the butt joint grooves.
(III) beneficial effects
1. According to the utility model, the base of the TOF camera and the bracket of the VCSEL chip are designed into a whole, the TOF camera and the VCSEL transmitter are not required to be assembled together through the bracket, and the steel plate frame at the bottom of the VCSEL chip adopts hollowed-out design and smears heat dissipation measures such as graphene, so that the heat dissipation performance of the VCSEL chip is better, the size of a finished product is smaller, and the weight is lighter.
2. In the utility model, because the RFPC substrate is shared, other electronic elements such as matched capacitors, resistors and the like of the TOF camera and the VCSEL emitter can be completed through one SMT patch, the TOF chip and the VCSEL chip only need to be subjected to one Die bonding/wire bonding, and two times of machine loading are not needed, because the base of the TOF camera and the bracket of the VCSEL emitter are designed into a whole, the TOF chip and the VCSEL chip share the RFPC substrate only need to be subjected to one bonding, and the base line and the tilt are easier to realize high-precision management and control, and because the two-in-one process flow is simplified into one process flow, the process cost is obviously reduced, and the TOF module is connected with the host through only one connector.
Drawings
Fig. 1 is a schematic side view of a schematic perspective view of an integrated TOF camera module device according to the present utility model;
Fig. 2 is a schematic bottom perspective view of an integrated TOF camera module device according to the present utility model;
fig. 3 is a schematic cross-sectional perspective view of an integrated TOF camera module device according to the present utility model.
In the figure:
1. An RFPC substrate; 2. a TOF chip; 3. a near infrared narrowband filter; 4. a base; 5. a mounting groove; 6. a through hole; 7. protective lenses; 8. a VCSEL chip; 9. a steel plate frame; 10. a connector; 11. a bayonet; 12. a butt joint groove; 13. a spring copper sheet; 14. a hollowed-out opening; 15. a limit groove; 16. TOF lens slot.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
As shown in fig. 1-3, an integrated TOF camera module device comprises an RFPC substrate 1, wherein a VCSEL chip 8 is fixed at the position, close to one side edge, of the top of the RFPC substrate 1, a hollowed-out opening 14 is formed in the bottom, close to the other side edge, of the bottom of the RFPC substrate 1, a steel plate frame 9 is fixed between the inner walls of the hollowed-out opening 14, close to the top edge, the top of the steel plate frame 9 is mutually attached to the bottom of the VCSEL chip 8, graphene is filled between the inner part of the hollowed-out opening 14 and the steel plate frame 9, and a base 4 is arranged at the position, close to the other side edge, of the top of the RFPC substrate 1;
During the use, the support design of base 4 and VCSEL chip 8 of TOF camera has become an organic whole, and TOF camera and VCSEL transmitter need not to be in the same place through the support assembly again, and the heat dissipation measure such as graphite alkene is paintd to the design of fretwork to VCSEL chip 8 bottom steel sheet frame 9 for the heat dispersion to VCSEL chip 8 is better, and the size of finished product is littleer, and the weight is lighter.
Further, a TOF lens groove 16 is formed in the top of the base 4 near one side edge, a mounting groove 5 is formed in the top of the base 4 near the other side edge, and the TOF lens groove 16 is convenient for mounting and fixing an external TOF lens.
In order to protect the VCSEL chip 8, a protective lens 7 is arranged in the mounting groove 5, and a through hole 6 is formed in the middle of the bottom surface of the mounting groove 5;
When the RFID tag reader is used, the limit groove 15 is formed in the position, close to the edge of the other side, of the bottom of the base 4, the VCSEL chip 8 is clamped in the limit groove 15, the TOF chip 2 is fixed to the position, close to the edge of the other side, of the top of the RFPC substrate 1, the near infrared narrowband filter 3 is arranged on the top of the TOF chip 2, the near infrared narrowband filter 3 is mutually attached to the bottom of the base 4, the bayonet 11 is formed in the position, close to the edge of the front, of the bottom of the RFPC substrate 1, the connector 10 is fixed to the position, close to the edge of the front, of the top of the RFPC substrate 1, a plurality of butt joint grooves 12 are formed in the position, close to the edge of the two sides, of the top of the RFPC substrate 1, at equal intervals, and the spring copper sheets 13 are arranged in the butt joint grooves 12.
Because the RFPC substrate 1 is shared, other electronic elements such as matched capacitors, resistors and the like of the TOF camera and the VCSEL transmitter can be completed through one SMT patch, two chips of the TOF chip 2 and the VCSEL chip 8 only need to be subjected to Die bonding/wire bonding once, and two times of machine loading are not needed;
Because the base 4 of the TOF camera and the bracket of the VCSEL emitter are designed into a whole, the TOF chip 2 and the VCSEL chip 8 share the RFPC substrate 1 only by one bonding, and the base line and the tilt are easier to realize high-precision control, the manufacturing cost is obviously reduced because the two-in-one two-time process flow is simplified into one process flow, and the TOF module is connected with the host through only one connector 10.
When the base 4 of the TOF camera and the bracket of the VCSEL chip 8 are designed into a whole during use, the TOF camera and the VCSEL transmitter are not required to be assembled together through the bracket, the steel plate frame 9 at the bottom of the VCSEL chip 8 adopts hollowed-out design and smears graphene and other heat dissipation measures, so that the heat dissipation performance of the VCSEL chip 8 is better, the size of a finished product is smaller, the weight is lighter, the supporting capacitor, the resistor and other electronic elements of the TOF camera and the VCSEL transmitter can be completed through one SMT patch, the TOF chip 2 and the VCSEL chip 8 can be completed through one-time SMT patch, the two chips of the TOF chip 2 and the VCSEL chip 8 are not required to be on the machine twice, the base 4 of the VCSEL camera and the bracket of the VCSEL transmitter are designed into a whole, the TOF chip 2 and the VCSEL chip 8 are required to be subjected to one-time bonding, the RFPC substrate 1, the base line and the Tilt are easier to realize high-precision management, and the control process flow is simplified into one-time after two-time, and the manufacturing cost is obviously reduced through one connector 10 and the host computer.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (7)
1. The utility model provides an integral type TOF camera module device, includes RFPC base plate (1), its characterized in that: the top of RFPC base plate (1) is close to one side edge department and is fixed with VCSEL chip (8), fretwork mouth (14) have been seted up to the bottom that the bottom of RFPC base plate (1) is located VCSEL chip (8), be close to top edge department between the inner wall of fretwork mouth (14) and be fixed with steel sheet frame (9), the top of steel sheet frame (9) is laminated each other with the bottom of VCSEL chip (8), it has graphite alkene to fill between the inside of fretwork mouth (14) and steel sheet frame (9), the top of RFPC base plate (1) is close to opposite side edge department and is provided with base (4).
2. The integrated TOF camera module apparatus of claim 1, wherein: TOF lens grooves (16) are formed in the position, close to one side edge, of the top of the base (4), and mounting grooves (5) are formed in the position, close to the other side edge, of the top of the base (4).
3. The integrated TOF camera module apparatus of claim 2, wherein: the inside of mounting groove (5) is provided with protective lens (7), through-hole (6) have been seted up to the inside bottom surface of mounting groove (5) in the middle part.
4. The integrated TOF camera module apparatus of claim 1, wherein: and a limiting groove (15) is formed in the bottom of the base (4) close to the edge of the other side, and the VCSEL chip (8) is clamped in the limiting groove (15).
5. The integrated TOF camera module apparatus of claim 1, wherein: the top of RFPC base plate (1) is close to opposite side edge department and is fixed with TOF chip (2), the top of TOF chip (2) is provided with near infrared narrowband filter (3).
6. The integrated TOF camera module apparatus of claim 5, wherein: the near infrared narrowband filter (3) is attached to the bottom of the base (4), a bayonet (11) is formed in the position, close to the front side edge, of the bottom of the RFPC substrate (1), and a connector (10) is fixed in the position, close to the front side edge, of the top of the RFPC substrate (1).
7. The integrated TOF camera module apparatus of claim 1, wherein: a plurality of butt joint grooves (12) are formed in the top of the RFPC substrate (1) close to the edges of two sides at equal intervals, and spring copper sheets (13) are arranged in the butt joint grooves (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322406759.7U CN220896766U (en) | 2023-09-06 | 2023-09-06 | Integral type TOF camera module device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322406759.7U CN220896766U (en) | 2023-09-06 | 2023-09-06 | Integral type TOF camera module device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220896766U true CN220896766U (en) | 2024-05-03 |
Family
ID=90868529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322406759.7U Active CN220896766U (en) | 2023-09-06 | 2023-09-06 | Integral type TOF camera module device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220896766U (en) |
-
2023
- 2023-09-06 CN CN202322406759.7U patent/CN220896766U/en active Active
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