CN220855167U - T/R assembly and phased array antenna - Google Patents
T/R assembly and phased array antenna Download PDFInfo
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- CN220855167U CN220855167U CN202322307378.3U CN202322307378U CN220855167U CN 220855167 U CN220855167 U CN 220855167U CN 202322307378 U CN202322307378 U CN 202322307378U CN 220855167 U CN220855167 U CN 220855167U
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- heat conducting
- shell
- phased array
- array antenna
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 35
- 238000009434 installation Methods 0.000 claims abstract description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model belongs to the technical field of radio frequency and discloses a T/R assembly and a phased array antenna. The T/R assembly includes: the shell is internally provided with an installation cavity; the chip is fixed in the mounting cavity; the heat conducting piece is arranged on the outer side of the shell and is attached to the outer side wall of the shell, and the cross section area of the heat conducting piece is larger than that of the shell; the heat dissipation cold plate is arranged on one side, far away from the shell, of the heat conducting piece, and the cross section area of the heat dissipation cold plate is larger than that of the heat conducting piece. Therefore, in the using process of the T/R component, generated heat can be quickly transferred through the heat-dissipation cold plate, so that the heat-dissipation effect is effectively improved, and the upper limit of the emission duty ratio of the T/R component is ensured to be higher. In the use process of the phased array antenna, the T/R component can rapidly complete heat dissipation, so that the overall upper performance limit of the phased array antenna is improved, various performances of the phased array antenna can be improved, and the phased array antenna can be applied in more fields and fields.
Description
Technical Field
The utility model relates to the technical field of radio frequency, in particular to a T/R assembly and a phased array antenna.
Background
The phased array antenna is an antenna which changes the shape of a pattern by controlling the feed phase of a radiating element in the array antenna, and is characterized by fast wave speed scanning and fast phase change speed. The core structure of the phased array antenna is a T/R component, which is responsible for transmitting and receiving signals and also controls the amplitude and phase of the signals. In recent years, advances in T/R assemblies have driven improvements in phased array system performance. At the same time, the new requirements that phased arrays are emerging also present a greater challenge for T/R assemblies.
In the prior art, a one-dimensional phased array is comprehensively converted into a two-dimensional phased array, and the scanning angle requirement is improved (from +/-30 degrees to +/-45 degrees or even +/-60 degrees), so that the integration level of the array surface is greatly increased, and a high-integration BGA or QFN packaged chip type T/R component is generally adopted at present. The heat dissipation surface of the T/R component is positioned at the bottom of a package (BGA/QFN surface), a multifunctional plate is arranged on the heat dissipation surface, natural heat dissipation is realized through heat conduction of the multifunctional plate, or a cold plate is arranged at the top of the R/T component, and contact heat dissipation is realized through the cold plate.
However, the effect of contact heat dissipation is directly related to the effective contact area between the cold plate and the T/R assembly, and if the contact area is small, the heat dissipation effect is significantly reduced. The natural heat dissipation depends on the heat conduction property of the T/R component, and the heat conduction property of the T/R component is general, so that the heat dissipation effect is obviously reduced. Therefore, the radiating effect of the structure is poor, the upper limit of the transmitting duty ratio of the T/R assembly is low, and the overall performance of the phased array antenna is limited.
Disclosure of utility model
The utility model aims to provide a T/R assembly and a phased array antenna, which solve the problem that the upper limit of the emission duty ratio of the T/R assembly is lower due to poor heat dissipation effect of the T/R assembly in the prior art, so that the overall performance of the phased array antenna is limited.
To achieve the purpose, the utility model adopts the following technical scheme:
In a first aspect, the present utility model provides a T/R assembly comprising:
the shell is internally provided with an installation cavity;
The chip is fixed in the mounting cavity;
The heat conducting piece is arranged on the outer side of the shell and is attached to the outer side wall of the shell, and the cross section area of the heat conducting piece is larger than that of the shell; and
The heat dissipation cold plate is arranged on one side, far away from the shell, of the heat conducting piece, and the cross section area of the heat dissipation cold plate is larger than that of the heat conducting piece.
Optionally, the heat conducting member is a heat conducting pad or a heat conducting grease.
Optionally, a plurality of heat conducting holes distributed at intervals are formed in one side, close to the heat conducting piece, of the shell, one end of each heat conducting hole corresponds to the chip, and the other end of each heat conducting hole corresponds to the heat conducting piece.
Optionally, a heat conducting part is embedded in the shell, and the heat conducting part is located between the chip and the heat conducting piece.
Optionally, the heat conducting part is made of a metal material with the same expansion coefficient as the shell.
Optionally, the housing is made of a ceramic material.
Optionally, the T/R assembly further comprises:
and the cover plate is arranged in the mounting cavity and is used for being welded with the multifunctional plate.
Optionally, a mounting groove for accommodating the cover plate is formed in one side, away from the heat conducting piece, of the shell.
In a second aspect, the present utility model also provides a phased array antenna comprising:
A multi-functional board; and
The T/R assembly of any one of the first aspects, disposed on the multi-function board.
Optionally, the multifunctional board is integrated with an antenna element and a built-in power division network; or (b)
The multifunctional board is connected with the antenna through a connector.
The utility model has the beneficial effects that:
According to the first aspect, the heat conducting piece is arranged outside the shell, the cross section area of the heat conducting piece is larger than that of the shell, the heat conducting piece can be fully contacted with the shell, heat generated by the chip can be quickly transferred into the heat conducting piece through the shell and then transferred into the heat radiating cold plate through the heat conducting piece, and sufficient effective contact between the heat radiating cold plate and the heat conducting piece can be ensured, so that heat in the heat conducting piece can be quickly transferred into the heat radiating cold plate, and the whole heat radiation of the T/R assembly can be quickly completed. Therefore, in the using process of the T/R component, generated heat can be quickly transferred through the heat-dissipation cold plate, so that the heat-dissipation effect is effectively improved, and the upper limit of the emission duty ratio of the T/R component is ensured to be higher.
In the second aspect, the T/R assembly can rapidly complete heat dissipation in the use process of the phased array antenna, so that the overall performance upper limit of the phased array antenna is improved, various performances of the phased array antenna can be improved, and the phased array antenna can be applied in more fields and fields.
Drawings
FIG. 1 is a cross-sectional view of a T/R assembly of the present utility model employing a BGA package;
Fig. 2 is a cross-sectional view of the present utility model when the T/R package employs QFN solder pad packages.
In the figure:
1. A housing; 11. a mounting cavity; 12. a heat conduction hole; 13. a mounting groove; 2. a chip; 3. a heat conductive member; 4. a heat-dissipating cold plate; 5. a cover plate; 6. a multi-functional board; 7. radio frequency interconnect structure.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
The utility model provides a T/R assembly and a phased array antenna.
Referring to fig. 1 and 2, the T/R assembly includes a case 1, a chip 2, a heat conductive member 3, and a heat dissipating cold plate 4. The shell 1 is internally provided with a mounting cavity 11; the chip 2 is fixed in the mounting cavity 11; the heat conducting piece 3 is arranged on the outer side of the shell 1 and is attached to the outer side wall of the shell 1, and the cross section area of the heat conducting piece 3 is larger than that of the shell 1; the heat dissipation cold plate 4 is arranged on one side of the heat conduction piece 3 far away from the shell 1, and the cross-sectional area of the heat dissipation cold plate 4 is larger than that of the heat conduction piece 3.
Specifically, the casing 1 is in a cubic plate structure, the middle of the lower side of the casing is provided with a groove as the mounting cavity 11, the chip 2 is fixed on the top wall of the mounting cavity 11 in a conductive adhesive bonding or eutectic welding mode, the chip 2 can be a GaAs chip (gallium arsenide chip), a Si chip (silicon chip), a GaN chip (gallium nitride chip) or a three-dimensional stacked chip combination, and the specific type of the chip 2 can be selected according to requirements, so that the utility model is not limited. The heat conducting piece 3 is arranged on the upper side of the shell 1, the heat conducting piece 3 and the shell 1 form surface contact, the length and the width of the heat conducting piece 3 are both larger than those of the shell 1, the heat conducting piece 3 is made of materials with higher heat conductivity coefficients such as heat conducting gaskets or heat conducting grease, and other materials with heat conductivity coefficients meeting the requirements can be adopted for manufacturing. The heat dissipation cold plate 4 is attached to a side of the heat conducting member 3 away from the housing 1, and the heat dissipation cold plate 4 can dissipate heat by any means or combination of means such as natural radiation, air cooling or liquid cooling, and the specific heat dissipation manner of the heat dissipation cold plate 4 can refer to the prior art, which is not described herein.
Through set up heat-conducting piece 3 outside casing 1, and the cross-sectional area of heat-conducting piece 3 is greater than casing 1 for heat-conducting piece 3 can fully contact with casing 1, then the heat that chip 2 produced just can be through in casing 1 transmits to heat-conducting piece 3 fast, in again by heat-conducting piece 3 transmits to heat dissipation cold plate 4, and also can ensure abundant effective contact between heat dissipation cold plate 4 and the heat-conducting piece 3, then the heat in the heat-conducting piece 3 can be transmitted to heat dissipation cold plate 4 fast, thereby accomplish the holistic heat dissipation to the T/R subassembly fast. Therefore, in the using process of the T/R component, generated heat can be quickly transferred through the heat-dissipation cold plate 4, so that the heat-dissipation effect is effectively improved, and the upper limit of the emission duty ratio of the T/R component is ensured to be higher. In this embodiment, the transmit duty cycle of the T/R assembly can be up to 30% or more.
Optionally, a plurality of heat conducting holes 12 are formed on one side, close to the heat conducting piece 3, of the shell 1, wherein the heat conducting holes 12 are distributed at intervals, one end of each heat conducting hole 12 corresponds to the chip 2, and the other end of each heat conducting hole corresponds to the heat conducting piece 3. Specifically, the heat conducting hole 12 may be formed through the upper side of the housing 1, and is formed along the vertical direction, the upper end of the heat conducting hole 12 is aligned with the heat conducting member 3, and the lower end is communicated with the mounting cavity 11. The heat conduction holes 12 can be arranged in a plurality, and the plurality of heat conduction holes 12 are distributed at intervals to form an array of heat conduction holes 12.
Through setting up heat conduction hole 12 for the heat that chip 2 produced can be through the direct transfer to heat conduction spare 3 of air, and the setting of a plurality of heat conduction holes 12 can effectively improve thermal transfer efficiency, is favorable to the heat of chip 2 to transfer to in the heat conduction spare 3 fast.
Alternatively, the housing 1 is made of a ceramic material. Specifically, the ceramic material may be a high-temperature co-fired ceramic, a low-temperature co-fired ceramic, or other materials suitable for packaging the chip 2.
Optionally, the T/R assembly further comprises a cover plate 5. The cover plate 5 is arranged in the mounting cavity 11 and is intended to be welded with the multifunctional plate 6. Specifically, the mounting groove 13 that holds the apron 5 has been seted up to one side that heat-conducting piece 3 was kept away from to casing 1, and mounting groove 13 sets up in the diapire intermediate position of casing 1, and its communication area is greater than installation cavity 11 to the department at the opening of installation cavity 11 forms the step, and apron 5 just utilizes glue to bond in the step, and the thickness of apron 5 can equal the degree of depth of mounting groove 13, so that the downside of apron 5 can not bulge the downside of casing 1, then the holistic downside of T/R subassembly keeps level, can not appear interfering with multi-functional board 6. The material of the cover plate 5 can be ceramic or other materials meeting the requirements.
The phased array antenna comprises a multifunctional board 6 and a T/R assembly as described above. The T/R assembly is provided to the multifunction board 6.
Specifically, the T/R component may have only a transmitting function, may have only a receiving function, or may have both transmitting and receiving functions. The T/R components may be connected by BGA (Ball GRID ARRAY Ball grid array) balls or QFN (Quad Flat No-leads Quad Flat non-leaded package) pads. When the BGA ball is used for packaging, the BGA ball is a high-lead ball, so that the welding height of the T/R component is consistent and controllable, and the chip 2 in the T/R component and the radio frequency interconnection structure 7 of the multifunctional board 6 are formed by adopting a bond alloy wire-microstrip-strip line-quasi-coaxial-BGA ball. When QFN bonding pads are used for connection, the rf interconnect structure 7 of the chip 2 and the multifunctional board 6 in the T/R assembly is formed using bond wires-microstrip-striplines-quasi-coaxial-QFN bonding pads.
In the use process of the phased array antenna, the T/R component can rapidly complete heat dissipation, so that the overall upper performance limit of the phased array antenna is improved, various performances of the phased array antenna can be improved, and the phased array antenna can be applied in more fields and fields. Wherein, the maximum transmission duty cycle of phased array antenna can be promoted to more than 30%, and single channel transmit power can improve 2W, 5W even higher.
Optionally, the multifunctional board 6 integrates an antenna element and a built-in power distribution network. Specifically, the multifunctional board 6 adopts an integrated design, and the back surface of the multifunctional board integrates the antenna element and the built-in power division network, and simultaneously provides power for the T/R component for receiving and transmitting time sequence and beam control. In other embodiments, the multifunctional board 6 is connected to the antenna through a Connector, where the multifunctional board 6 is not designed to be integrated, but is connected to the antenna element through a Connector, and the Connector includes but is not limited to SMP (Spring-Loaded Push-Pin Connector), SMPM (Super Miniature Multi-Pin Connector) or button-hair elastic Connector, and the type of the specific Connector may be selected according to the practical application scenario, which is not limited in the present utility model.
Example two
The difference between this embodiment and the first embodiment is that the heat conduction structure built in the upper side of the housing 1 is different.
Optionally, a heat conducting part is embedded in the shell 1, and the heat conducting part is located between the chip 2 and the heat conducting piece 3. The heat conducting part is made of a metal material with the same expansion coefficient as the shell 1.
Specifically, a heat conducting part is embedded in the upper side of the shell 1, and the heat conducting part can be made of metal materials such as molybdenum and copper, so as to replace the heat conducting hole 12 of one embodiment, thereby improving the heat conducting performance of the shell 1, and also enabling the heat of the chip 2 to be quickly transferred to the heat conducting piece 3, and meanwhile, after the heat conducting part is heated, the expansion degree of the heat conducting part is consistent with that of the shell 1, so that the possibility of damage of the shell 1 in the heat dissipation process is reduced.
It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.
Claims (10)
- A t/R assembly, comprising:a housing (1), wherein an installation cavity (11) is formed in the housing (1);The chip (2) is fixed in the mounting cavity (11);The heat conduction piece (3) is arranged outside the shell (1) and is attached to the outer side wall of the shell (1), and the cross section area of the heat conduction piece (3) is larger than that of the shell (1); andThe heat dissipation cold plate (4) is arranged on one side, far away from the shell (1), of the heat conducting piece (3), and the cross section area of the heat dissipation cold plate (4) is larger than that of the heat conducting piece (3).
- 2. The T/R assembly according to claim 1, characterized in that the heat conducting member (3) is a heat conducting pad or a heat conducting grease.
- 3. The T/R assembly according to claim 1, wherein a plurality of heat conducting holes (12) are formed in a side of the housing (1) close to the heat conducting member (3) at intervals, one end of each heat conducting hole (12) corresponds to the chip (2), and the other end corresponds to the heat conducting member (3).
- 4. The T/R assembly according to claim 1, characterized in that the housing (1) is embedded with a heat conducting part, which is located between the chip (2) and the heat conducting member (3).
- 5. The T/R assembly according to claim 4, characterized in that the heat conducting part is made of a metallic material having the same expansion coefficient as the housing (1).
- 6. T/R assembly according to any of claims 1 to 5, characterized in that the housing (1) is made of ceramic material.
- 7. The T/R assembly of any one of claims 1 to 5, further comprising:And the cover plate (5) is arranged in the mounting cavity (11) and is used for being welded with the multifunctional plate (6).
- 8. The T/R assembly according to claim 7, characterized in that the side of the housing (1) remote from the heat-conducting member (3) is provided with a mounting groove (13) accommodating the cover plate (5).
- 9. A phased array antenna, comprising:A multifunctional plate (6); andThe T/R assembly according to any one of claims 1 to 8, being provided to the multi-function board (6).
- 10. Phased array antenna according to claim 9, characterized in that the multifunctional board (6) integrates antenna elements and a built-in power distribution network; or (b)The multifunctional board (6) is connected with the antenna through a connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322307378.3U CN220855167U (en) | 2023-08-28 | 2023-08-28 | T/R assembly and phased array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322307378.3U CN220855167U (en) | 2023-08-28 | 2023-08-28 | T/R assembly and phased array antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220855167U true CN220855167U (en) | 2024-04-26 |
Family
ID=90739346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322307378.3U Active CN220855167U (en) | 2023-08-28 | 2023-08-28 | T/R assembly and phased array antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220855167U (en) |
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2023
- 2023-08-28 CN CN202322307378.3U patent/CN220855167U/en active Active
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