CN220821504U - Wafer tray for semiconductor equipment - Google Patents
Wafer tray for semiconductor equipment Download PDFInfo
- Publication number
- CN220821504U CN220821504U CN202322600954.3U CN202322600954U CN220821504U CN 220821504 U CN220821504 U CN 220821504U CN 202322600954 U CN202322600954 U CN 202322600954U CN 220821504 U CN220821504 U CN 220821504U
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- CN
- China
- Prior art keywords
- adjusting
- main body
- tray main
- tray
- slide block
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 235000012431 wafers Nutrition 0.000 claims abstract description 62
- 238000009423 ventilation Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004836 Glue Stick Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The utility model discloses a wafer tray for semiconductor equipment, which comprises a round tray main body for bearing wafers, wherein a bearing surface of the tray main body is provided with a plurality of adjusting sliding blocks which are distributed along the circumferential direction and are arranged along the radial direction of the tray main body in an adjusting way, and all the adjusting sliding blocks are distributed around the outer circular edge of the wafers borne by the tray main body; each adjusting slide block is at least provided with an adjusting track for guiding the radial adjusting direction of the adjusting slide block, and the adjusting track is a strip-shaped hole or a strip-shaped groove formed in the tray main body; the lower side of the adjusting slide block is fixedly connected with an inserting block, and the inserting block can be adjustably inserted into the adjusting track. According to the utility model, the radial adjustment of the adjusting slide block is adopted to realize the embedding of wafers with various diameter sizes, so that the wafers with various diameter sizes are compatible.
Description
Technical Field
The utility model relates to the technical field of semiconductor equipment, in particular to a wafer tray for semiconductor equipment.
Background
In semiconductor device manufacturers or semiconductor research laboratories, wafer experiments of various sizes are often involved, but most semiconductor devices cannot be compatible with wafers of various diameter sizes, for example, small-sized wafers of 4 inches, 6 inches, 8 inches, etc., are often not used on 12 inches devices. However, semiconductor devices are subject to various conditions for compatibility with wafers of various sizes, such as: EFEM, robot, chuck, and the like. Most of the semiconductor devices are very expensive, and if a plurality of devices are purchased to adapt to wafers with different sizes, serious resource waste is caused.
Disclosure of utility model
The utility model aims to provide a wafer tray for semiconductor equipment, which can be compatible with wafers with various diameter sizes.
The purpose of the utility model is realized in the following way: the wafer tray for the semiconductor equipment comprises a round tray main body for bearing wafers, wherein a bearing surface of the tray main body is provided with a plurality of adjusting sliding blocks which are distributed along the circumferential direction and are arranged along the radial direction of the tray main body in an adjusting way, and all the adjusting sliding blocks are distributed around the outer circular edge of the wafers borne by the tray main body;
Each adjusting slide block is at least provided with an adjusting track for guiding the radial adjusting direction of the adjusting slide block, and the adjusting track is a strip-shaped hole or a strip-shaped groove formed in the tray main body;
The lower side of the adjusting slide block is fixedly connected with an inserting block, and the inserting block is adjustably inserted into the adjusting track.
The utility model has the beneficial effects that:
Through radial adjustment of the adjusting slide block, the embedding of wafers with various diameter sizes is realized, so that the wafers with various diameter sizes are compatible, and the wafers with smaller sizes can be put into the tray, so that the wafers with smaller sizes can be used on large-size wafer equipment without barriers.
Drawings
Fig. 1 is a plan view of the overall arrangement of the present utility model.
Fig. 2 is a sectional view A-A in fig. 1.
Fig. 3 is a bottom view of fig. 1.
Fig. 4 is a perspective view of the present utility model.
Detailed Description
The utility model will be further described with reference to figures 1-4 and the specific examples.
As shown in fig. 1 and 4, a wafer tray for semiconductor devices includes a circular tray main body 1 for carrying wafers, the carrying surface of the tray main body 1 is provided with four adjusting sliders 2 distributed along the circumferential direction and arranged along the radial direction of the tray main body 1, all the adjusting sliders 2 are distributed around the outer circumferential edge of the wafers carried by the tray main body 1 and are attached to the outer circumferential edge of the wafers, and limit is formed on the wafers, and the adjusting sliders 2 can be adjusted along the radial direction of the tray main body 1, so that the wafer tray can be compatible with wafers with various diameter sizes.
The adjusting scheme of the adjusting slide 2 is as follows: as shown in fig. 1 and 2, each adjusting slider 2 is at least provided with an adjusting rail 11 for guiding the radial adjusting direction of the adjusting slider 2, the adjusting rail 11 is a bar-shaped hole or a bar-shaped groove formed on the tray main body 1, the adjusting rail 11 is parallel to the radial adjusting direction of the adjusting slider 2, the lower side of the adjusting slider 2 is fixedly connected with an inserting block 3, the inserting block 3 adjustably inserts the adjusting rail 11, that is, the inserting block 3 drives the adjusting slider 2 along the length direction of the adjusting rail 11 to adjust.
As one of the preferred solutions, the side of the adjusting slide 2 facing the center of the tray main body 1 is designed as an arc side adapted to the outer round side of the wafer, and the arc side is abutted against the outer round side of the wafer so as to limit the wafer better.
As a preferable structural scheme of the adjusting slide block 2, the whole adjusting slide block 2 is of a sheet structure extending in an arc shape and is abutted against the bearing surface of the tray main body 1.
Since the surfaces of the tray body 1 and the wafer are very smooth, in order to facilitate the removal of the wafer from the carrying surface of the tray body 1, the tray body 1 is provided with a plurality of through ventilation holes 13.
In order to optimize the structural configuration of the adjustment rail 11 and the plug-in block 3, this embodiment proposes a preferred solution, specifically: the section of the adjusting rail 11 is trapezoid, and the upper bottom of the trapezoid section of the adjusting rail 11 is aligned with the bearing surface of the tray main body 1; the cross section of the insertion block 3 is trapezoid and is matched with the trapezoid cross section of the adjusting rail 11, so that the radial adjusting process of the adjusting slide block 2 is more stable, reliable and accurate.
As one of the preferable mounting and dismounting schemes of the adjusting slider 2, one end of the adjusting rail 11 facing the center of the tray main body 1 is provided with a take-out hole 12, and the width of the take-out hole 12 is larger than that of the adjusting rail 11.
When the adjusting slide block 2 is disassembled, the adjusting slide block 2 is shifted towards the circle center direction of the tray main body 1, so that the inserting block 3 slides into the taking-out hole 12, a separable movable gap is reserved between the inserting block 3 and the taking-out hole 12, and the inserting block 3 can be smoothly separated from the taking-out hole 12, so that the whole adjusting slide block 2 is taken down;
When the adjusting slide block 2 is installed, two inserting and matching blocks 3 of the adjusting slide block 2 enter the two taking-out holes 12, the adjusting slide block 2 is attached to the bearing surface of the tray main body 1, then the adjusting slide block 2 is shifted in the outward round direction, the inserting and matching blocks 3 are driven to enter the adjusting track 11, and therefore the adjusting slide block 2 is conveniently installed on the bearing surface of the tray main body 1, and the position of the adjusting slide block 2 is adjusted during use.
In order to optimize the adjusting effect, each adjusting slide 2 is provided with two mutually parallel adjusting rails 11, the adjusting rails 11 being parallel to the radial adjusting direction of the adjusting slide 2; when the position of the adjusting slide block 2 is adjusted, the inserting block 3 slides in the adjusting track 11, and the adjusting operation of the adjusting slide block 2 can be more stable and reliable by arranging two mutually parallel adjusting tracks 11.
In order to lock the position of the adjusting slide blocks 2 on the bearing surface of the tray main body 1, as shown in fig. 1 and 3, each adjusting slide block 2 is in threaded connection with a locking screw 4 for locking the position of the adjusting slide block, and in order to achieve a better locking effect, the locking screw 4 is positioned at an intermediate position between the two adjusting rails 11, and in the locked state, the threaded part of the locking screw 4 abuts against the bearing surface of the tray main body 1.
When the wafer tray is used, the following steps are performed:
1. According to the size of the existing equipment, manufacturing a tray main body 1 with a corresponding size, and embedding small-size wafers into the tray main body 1 before testing;
2. Adjusting the adjusting slide block 2 according to the size of the wafer to be embedded, so that the adjusting slide block 2 moves radially, adjusts to a proper position capable of fixing the wafer, and screws the locking screw 4;
3. Performing on-machine testing of the wafer;
4. after the wafer is tested on-press, a glue stick can be inserted into the vent hole 13 to push against the wafer to help take out the wafer.
According to the wafer tray of the embodiment, through radial adjustment of the adjusting slide block 2, embedding of wafers with various diameter sizes is achieved, and wafers with smaller sizes (such as 4, 6 and 8-inch wafers) can be placed in the tray, so that the wafers with smaller sizes can be used in large-size wafer equipment without barriers.
The size of the tray main body 1 may not be particularly limited, and the size of the tray main body 1 may be consistent with the size of a 12-inch wafer, and for convenience of positioning, a notch is formed in the outer circumferential edge of the tray main body 1. The material of the tray main body 1 is consistent with that of the wafer, and in order to ensure the rigidity and toughness of the tray main body 1, the thickness of the tray main body 1 is set to be 5-7 mm.
To facilitate the removal of the embedded wafer, three ventilation holes 13 with a diameter of 2 mm are formed in the tray body 1, and the size of the ventilation holes 13 may be selected in various ways, but is not limited thereto.
The foregoing is a preferred embodiment of the present utility model, and various changes and modifications, such as specific dimensions of the relevant structure, may be made therein by those of ordinary skill in the art without departing from the general inventive concept, and such changes and modifications are intended to be included within the scope of the present utility model as defined by the appended claims.
Claims (8)
1. The wafer tray for the semiconductor equipment comprises a round tray main body (1) for bearing wafers, and is characterized in that a bearing surface of the tray main body (1) is provided with a plurality of adjusting sliding blocks (2) which are distributed along the circumferential direction and are arranged along the radial direction of the tray main body (1), and all the adjusting sliding blocks (2) are distributed around the outer circular edge of the wafers borne by the tray main body (1);
Each adjusting slide block (2) is at least provided with an adjusting track (11) for guiding the radial adjusting direction of the adjusting slide block (2), and the adjusting track (11) is a bar-shaped hole or a bar-shaped groove arranged on the tray main body (1);
The lower side of the adjusting slide block (2) is fixedly connected with an inserting block (3), and the inserting block (3) is adjustably inserted into an adjusting track (11).
2. A wafer tray for semiconductor devices according to claim 1, wherein: the section of the adjusting rail (11) is trapezoid, and the upper bottom of the trapezoid section of the adjusting rail (11) is aligned with the bearing surface of the tray main body (1); the cross section of the inserting block (3) is trapezoid and is matched with the trapezoid cross section of the adjusting rail (11).
3. A wafer tray for semiconductor devices according to claim 2, wherein: each adjusting slide (2) is provided with two mutually parallel adjusting rails (11).
4. A wafer tray for semiconductor devices according to claim 2, wherein: one end of the adjusting rail (11) facing the center of the tray main body (1) is provided with a taking-out hole (12), and the width of the taking-out hole (12) is larger than that of the adjusting rail (11); when the adjusting slide block (2) is disassembled/assembled, the inserting block (3) is positioned in the taking-out hole (12) and a movable gap is reserved between the inserting block and the taking-out hole (12).
5. A wafer tray for semiconductor devices according to claim 3, wherein: each adjusting slide block (2) is in threaded connection with a locking screw (4) for locking the position of the adjusting slide block, the locking screw (4) is positioned between the two adjusting rails (11), and the threaded part of the locking screw (4) abuts against the bearing surface of the tray main body (1) in a locking state.
6. A wafer tray for semiconductor devices according to claim 1, wherein: one side of the adjusting slide block (2) facing the center of the tray main body (1) is provided with an arc edge matched with the outer round edge of the wafer.
7. A wafer tray for semiconductor devices according to claim 6, wherein: the whole adjusting slide block (2) is of a sheet-shaped structure extending in an arc shape and is abutted against the bearing surface of the tray main body (1).
8. A wafer tray for semiconductor devices according to any one of claims 1-7, wherein: the tray main body (1) is provided with a plurality of through vent holes (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322600954.3U CN220821504U (en) | 2023-09-25 | 2023-09-25 | Wafer tray for semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322600954.3U CN220821504U (en) | 2023-09-25 | 2023-09-25 | Wafer tray for semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220821504U true CN220821504U (en) | 2024-04-19 |
Family
ID=90712022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322600954.3U Active CN220821504U (en) | 2023-09-25 | 2023-09-25 | Wafer tray for semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220821504U (en) |
-
2023
- 2023-09-25 CN CN202322600954.3U patent/CN220821504U/en active Active
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| GR01 | Patent grant |