CN220796693U - Positioning device for open type cassette - Google Patents
Positioning device for open type cassette Download PDFInfo
- Publication number
- CN220796693U CN220796693U CN202322375483.0U CN202322375483U CN220796693U CN 220796693 U CN220796693 U CN 220796693U CN 202322375483 U CN202322375483 U CN 202322375483U CN 220796693 U CN220796693 U CN 220796693U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- support rod
- cassette
- positioning device
- fixing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 60
- 239000010703 silicon Substances 0.000 claims abstract description 60
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 28
- 238000000034 method Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a positioning device for an open cassette, which is characterized by comprising a substrate fixing plate, wherein a silicon wafer contact flat plate is arranged in the central area of the surface of the substrate fixing plate, a left support rod, a right support rod and an upper support rod are respectively arranged in the left side area, the right side area and the top area of the surface, the left support rod, the right support rod and the upper support rod are respectively used for wrapping the rear side of the open cassette when the device is used, and the silicon wafer contact flat plate is used for contacting the silicon wafer when the silicon wafer is pushed forward to leave a clamping groove on the rear side, so that the silicon wafer is placed in the cassette stably. By adopting the positioning device, the problems of dirt and damage to the edge of the silicon wafer can be effectively solved, the problem that the silicon wafer is scratched due to the fact that the mechanical arm touches the back surface of the silicon wafer due to the fact that the silicon wafer is turned over can be also guaranteed, and the production cost is reduced.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer production, and particularly relates to a positioning device for an open cassette.
Background
Open cassette is widely used in processes such as inter-process transportation and cleaning in silicon wafer manufacturing, as shown in fig. 1, which is a typical structural schematic diagram of Open cassette in the prior art, and the cassette will take two states in the circulation process, wherein the back side 7 of the cassette is downward when the cassette is not in use, and the silicon wafer is in a vertical state in the cassette. And the second state is that the bottom 8 of the cassette is downward when the upper machine is used, and the silicon wafer is in a horizontal state in the cassette. In the use process, the state is converted from the first state to the second state, and the silicon wafer possibly is put in the middle of the clamping groove 9 at the rear side of the clamping box, so that the silicon wafer is in an inclined state in the clamping box and is not placed stably, and if the silicon wafer is not corrected in time, the silicon wafer is easy to damage. The correction treatment mode commonly adopted in the prior art is as follows: the operator observes the state of silicon chip in the cassette, pushes away the silicon chip of taking in the draw-in groove of cassette rear side and leave the draw-in groove or tap open cassette and produce vibrations and make the silicon chip landing to the flat region of draw-in groove, but this method easily leads to damaging the wafer edge, dirty, probably appears the silicon chip turn-over (correct front and back silicon chip front and back place the face inconsistent) and lead to the robotic arm who takes the silicon chip to touch the silicon chip back, leads to production silicon chip to scrap or need reprocessing to lead to the cost to rise.
Disclosure of Invention
The utility model aims to provide a positioning device for an open type cassette, which aims to solve the defects in the prior art.
The utility model aims at realizing the following technical scheme:
the utility model provides a positioner for open cassette, includes the base fixed plate, the central region on the surface of base fixed plate is equipped with the silicon chip and contacts the flat board, and left and right side region and the top region on surface are equipped with left bracing piece, right bracing piece and upper bracing piece respectively, left side bracing piece right bracing piece with upper bracing piece is used for wrapping up the rear side of open cassette when the device is used respectively, the silicon chip contacts the flat board and is used for pushing forward the silicon chip and leave the draw-in groove of rear side when the silicon chip contacts the silicon chip, makes the silicon chip place in the cassette steadily.
Preferably, the base fixing plate is provided with a handle.
Preferably, the handle is located on the opposite side of the substrate fixing plate to the side of the silicon wafer contact plate.
Preferably, the silicon wafer contact flat plate, the left support rod, the right support rod and the upper support rod are made of teflon or PEEK materials.
Preferably, the substrate fixing plate is made of plastic material.
Preferably, the handle is made of plastic material.
By adopting the positioning device, the problems of dirt and damage to the edge of the silicon wafer can be effectively solved, the problem that the silicon wafer is scratched due to the fact that the mechanical arm touches the back surface of the silicon wafer due to the fact that the silicon wafer is turned over can be also guaranteed, and the production cost is reduced.
Drawings
FIG. 1 is a schematic diagram of a typical Open cassette architecture of the prior art;
FIG. 2 is a schematic diagram of a front view of a positioning device according to the present utility model;
FIG. 3 is a schematic side view of a positioning device according to the present utility model;
FIG. 4 is a schematic view of a structure of a positioning device of the present application not used for silicon wafers in a cassette;
FIG. 5 is a schematic view of the structure of a silicon wafer in a cassette using the positioning device of the present application;
wherein, 1-handle; 2-silicon wafer contact plate; 3-left support rods; 4-right support bar; 5-upper support rods; a 6-base fixing plate; 7-the rear side of the cassette; 8-bottom of cassette; 9-clamping groove.
Detailed Description
The utility model provides a positioning device for an open cassette, which comprises a substrate fixing plate 6, wherein the central area of the surface of the substrate fixing plate 6 is provided with a silicon wafer contact flat plate 2, the left and right side areas and the top area of the surface are respectively provided with a left supporting rod 3, a right supporting rod 4 and an upper supporting rod 5, and the left supporting rod, the right supporting rod and the upper supporting rod are respectively used for abutting against the rear side of the open cassette when the device is used.
For convenience of hand holding, it is preferable that a handle 1 is provided on the base fixing plate.
When the device is used, as shown in figures 4-5, the left support rod 3, the right support rod 4 and the upper support rod 5 wrap the rear side of the open cassette, so that the device has a positioning function, the silicon wafer contact flat plate 2 can be in contact with all silicon wafers in the cassette, the silicon wafers are pushed forward to leave the clamping groove at the rear side of the cassette, and the silicon wafers are placed in the cassette stably by lightly taking the handle 1 downwards.
By adopting the positioning device, the problems of dirt and damage to the edge of the silicon wafer can be effectively solved, the problem that the silicon wafer is scratched due to the fact that the mechanical arm touches the back surface of the silicon wafer due to the fact that the silicon wafer is turned over can be also guaranteed, and the production cost is reduced.
Further preferably, the handle is located on the opposite side of the substrate holding plate from the side of the silicon wafer contacting the flat plate.
In order to reduce the damage of the silicon chip, the parts which are possibly contacted with the silicon chip in the using process of the device, such as a silicon chip contact flat plate, a left support rod, a right support rod and an upper support rod, are made of teflon or PEEK (polyether ether ketone) materials. The base fixing plate and the handle are made of light plastic materials.
While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model. It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (6)
1. The positioning device for the open cassette is characterized by comprising a substrate fixing plate, wherein a silicon wafer contact flat plate is arranged in the central area of the surface of the substrate fixing plate, a left support rod, a right support rod and an upper support rod are respectively arranged in the left side area, the right side area and the top area of the surface, the left support rod, the right support rod and the upper support rod are respectively used for wrapping the rear side of the open cassette when the device is used, and the silicon wafer contact flat plate is used for contacting the silicon wafer when the silicon wafer is pushed forward to leave a clamping groove on the rear side, so that the silicon wafer is placed in the cassette stably.
2. The positioning device for an open cassette as defined in claim 1,
the base fixing plate is provided with a handle.
3. A positioning device for an open cassette as defined in claim 2,
the handle is positioned on the opposite surface of the substrate fixing plate to the surface of the silicon wafer contact flat plate.
4. The positioning device for an open cassette as defined in claim 1,
the silicon wafer contact flat plate, the left support rod, the right support rod and the upper support rod are made of teflon or PEEK materials.
5. The positioning device for an open cassette as defined in claim 1,
the substrate fixing plate is made of plastic materials.
6. A positioning device for an open cassette as defined in claim 2,
the handle is made of plastic materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322375483.0U CN220796693U (en) | 2023-09-01 | 2023-09-01 | Positioning device for open type cassette |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322375483.0U CN220796693U (en) | 2023-09-01 | 2023-09-01 | Positioning device for open type cassette |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220796693U true CN220796693U (en) | 2024-04-16 |
Family
ID=90653778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322375483.0U Active CN220796693U (en) | 2023-09-01 | 2023-09-01 | Positioning device for open type cassette |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220796693U (en) |
-
2023
- 2023-09-01 CN CN202322375483.0U patent/CN220796693U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |