CN220787161U - Overturning feeding device and crystal support separation production line - Google Patents

Overturning feeding device and crystal support separation production line Download PDF

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Publication number
CN220787161U
CN220787161U CN202322378235.1U CN202322378235U CN220787161U CN 220787161 U CN220787161 U CN 220787161U CN 202322378235 U CN202322378235 U CN 202322378235U CN 220787161 U CN220787161 U CN 220787161U
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China
Prior art keywords
crystal support
turnover
clamping
flip
support
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CN202322378235.1U
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Inventor
韩金成
闫国朋
万道德
陈大浩
黄金龙
吴广忠
滕宁
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Leshan Gaoce New Energy Technology Co ltd
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Leshan Gaoce New Energy Technology Co ltd
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Abstract

The application discloses upset loading attachment and brilliant support separation production line. The overturning feeding device comprises a feeding mechanism, an overturning mechanism and a first conveying line. The feeding mechanism is used for acquiring and transferring the crystal support. The turnover mechanism is used for receiving and turnover the crystal support transported by the feeding mechanism so that the base plate is positioned above the crystal support plate. The first conveying line is used for receiving the crystal support turned by the turning mechanism and conveying the crystal support. According to the technical scheme, the feeding efficiency of the crystal support can be improved, and then the crystal support separation efficiency is improved.

Description

Overturning feeding device and crystal support separation production line
Technical Field
The application relates to the technical field of silicon wafer processing, in particular to a turnover feeding device and a crystal support separation production line.
Background
In the field of silicon wafer processing, silicon rods are processed into silicon wafers through a slicing machine, the silicon rods are adhered to a backing plate (a resin plate or a plastic plate) of a crystal support through bi-component glue, the crystal support comprises the backing plate and a crystal support plate, the backing plate is adhered to the crystal support plate made of metal through the bi-component glue, degumming treatment is carried out after each silicon rod is processed, the silicon wafers are separated from the backing plate in the process, and the backing plate is directly scrapped because the backing plate is processed in the cutting process, and the crystal support plate is required to be further degummed and separated from the backing plate to be reused.
At present, after the silicon wafer is processed, a crystal support is fed into a crystal support separation production line in an artificial mode to carry out crystal support separation, so that the labor intensity of workers is high, the feeding efficiency is low, and the crystal support separation efficiency is low.
Disclosure of Invention
The application provides a upset loading attachment and brilliant separation production line that holds in palm, it can improve the material loading efficiency that the brilliant held in the palm, and then improves brilliant separation efficiency that holds in the palm.
The application is realized by the following technical scheme:
in a first aspect, the application provides a upset loading attachment, is applied to brilliant support separation production line, and brilliant support includes the backing plate that can take place deformation after the metallic material's brilliant layer board and the temperature variation, and the backing plate bonds on the brilliant layer board. The overturning feeding device comprises a feeding mechanism, an overturning mechanism and a first conveying line. The feeding mechanism is used for acquiring and transferring the crystal support. The turnover mechanism is used for receiving and turning over the crystal support transported by the feeding mechanism so that the base plate is positioned above the crystal support plate. The first conveying line is used for receiving the crystal support turned by the turning mechanism and conveying the crystal support.
In the above-mentioned scheme, upset loading attachment includes feed mechanism, tilting mechanism and first transfer chain. The feeding mechanism acquires the crystal support from the last station, and works through the turnover mechanism to turn over the crystal support, so that the base plate is positioned above the crystal support plate (under the gesture, the heating of the crystal support is facilitated to facilitate the separation of the crystal support), the crystal support in the gesture is transported to the next station by the first conveying line conveniently, the automation of feeding is realized, the labor intensity of crystal support feeding is effectively reduced, the feeding efficiency is improved, and the separation efficiency of the crystal support is further improved.
Illustratively, after the silicon wafer is degummed, the wafer carrier is transported to a station to be loaded in a posture in which the backing plate is below the wafer carrier, and the loading mechanism acquires the wafer carrier from the station to be loaded. The turnover mechanism receives and turns over the crystal support, so that the base plate is positioned above the crystal support plate. The first conveying line receives the turned crystal support and conveys the crystal support to the electromagnetic heating station, and the crystal support plate made of metal is arranged below the crystal support plate, so that electromagnetic heating is facilitated, and the crystal support separation efficiency is improved.
According to some embodiments of the present application, the turnover mechanism includes a turnover receiving portion for receiving the wafer carrier transported by the loading mechanism and a turnover driving portion. The overturning driving part is connected with the overturning supporting part, the overturning driving part is used for driving the overturning supporting part to overturn between a first position and a second position, the overturning supporting part is used for supporting the crystal support transported by the feeding mechanism when the overturning supporting part is positioned at the first position, and the overturning supporting part is used for placing the crystal support on the first conveying line when the overturning supporting part is positioned at the second position.
In the above scheme, the turnover mechanism comprises a turnover bearing part and a turnover driving part. The overturning bearing part can overturn between a first position suitable for bearing the crystal support transported by the feeding mechanism and a second position for placing the crystal support on the first conveying line through the driving of the overturning driving part.
In the process of overturning the overturning supporting part, the crystal support supported by the overturning supporting part also follows overturning, and the crystal support can be placed on the first conveying line in a posture that the base plate is positioned above the crystal support plate, so that automation of overturning the crystal support is realized, the labor intensity is effectively reduced, the feeding efficiency is improved, and further the improvement of separating efficiency of the crystal support is facilitated.
According to some embodiments of the application, the first conveyor line has a void-avoidance slot for receiving at least part of the roll-over receiver. The turnover bearing part is configured in the second position, a part of the turnover bearing part is accommodated in the empty avoidance groove, and the crystal supporting plate is borne by the first conveying line.
According to the scheme, at least part of the overturning supporting part is accommodated in the empty-avoiding groove on the first conveying line, so that the crystal supporting plate is in contact with the conveying interface of the first conveying line, and is separated from the overturning supporting part and conveyed to the next station under the action of the first conveying line.
According to some embodiments of the present application, the flip-flop receptacle includes a first clamp portion and a second clamp portion that are spaced apart in a flip-flop direction of the flip-flop receptacle to accommodate the wafer carrier.
In the scheme, the overturning bearing part has a simple structure and is convenient to manufacture. The first clamping part and the second clamping part which are arranged in the overturning direction of the overturning and receiving part and are mutually spaced are convenient for accommodating and receiving the crystal support on one hand, so that the risk that the crystal support falls off from the overturning and receiving part in the overturning process is reduced; on the other hand, when the overturning bearing part is contained in the avoiding groove, the crystal support can rapidly pass through the gap between the first clamping part and the second clamping part under the action of the first conveying line, so that the crystal support is conveyed to the next station along with the first conveying line.
According to some embodiments of the present application, the wafer carrier is changed from being received by the first clamping portion to being received by the second clamping portion during rotation of the flip receiving portion from the first position to the second position. When the overturning supporting part is at the second position, the clearance groove accommodates at least part of the second clamping part.
In the above scheme, on the one hand, through setting up first clamping part and second clamping part and respectively accepting the brilliant support, reduce the brilliant support and break away from in the risk of upset supporting part, on the other hand, through setting up the at least part of dodging the groove in order to accept second clamping part, can let brilliant support and the transport interface contact of first transfer chain to make the brilliant layer board break away from in second clamping part and carry to next station under the effect of first transfer chain, and then improve the efficiency of material loading, and then improve the efficiency that the brilliant support separated.
According to some embodiments of the present application, in the conveying direction of the first conveying line, the second clamping portion includes a plurality of spaced apart second sub-clamping portions, and the first conveying line is provided with a plurality of spaced apart void-avoidance grooves, and each second sub-clamping portion is accommodated in a corresponding void-avoidance groove when the inverted receiving portion is in the second position. The first conveying line comprises a plurality of rotating rollers for conveying the crystal support, and rotating rollers for receiving the crystal support are arranged between at least two adjacent empty avoidance grooves.
In the scheme, on one hand, the plurality of second sub-clamping parts are arranged at intervals, so that the crystal support can be stably and uniformly stressed and is supported, and the risk that the crystal support is separated from the overturning supporting part is reduced; on the other hand, the second sub-clamping portions spaced apart can correspond to the rotating rollers between the empty avoidance grooves, so that the portion, exposed between the two adjacent second sub-clamping portions, of the crystal support can be acted by the rotating rollers between the empty avoidance grooves, the crystal support is conveyed by the first conveying line, the feeding efficiency is improved, and the crystal support separation efficiency is improved.
According to some embodiments of the present application, the flip-flop receiving portion mechanism further includes a loading conveyor line for receiving a crystal tray transported by the loading mechanism and transporting the crystal tray to the flip-flop receiving portion. The turnover bearing part further comprises a rotating frame, the rotating frame is connected with the turnover driving part, one end of the first clamping part is connected with one end of the second clamping part, the other end of the first clamping part is spaced from the other end of the second clamping part to form a clamping opening, and the turnover bearing part is configured to face the feeding conveying line when in the first position so as to bear the crystal support.
In the above scheme, through setting up the material loading transfer chain, can be with accepting in the brilliant support of feed mechanism to overturning and accepting the portion and carry to make brilliant support can get into the centre gripping mouth that forms by first clamping part and second clamping part, thereby effectively improve brilliant support and shift to the efficiency of upset supporting part by feed mechanism, improved material loading efficiency, and then improved the efficiency that the brilliant support was separated.
According to some embodiments of the present application, a position sensor is disposed in the clamping opening, and the position sensor is used for sensing the position of the crystal support.
In the scheme, the position sensor is arranged in the clamping opening to sense whether the crystal support enters the clamping opening or whether the crystal support enters the clamping opening and goes deep into a proper position, so that whether the crystal support overturns or not can be judged based on signals sent by the position sensor, the overturning feeding device has higher fault tolerance, and the success rate of overturning feeding is improved.
According to some embodiments of the present application, the loading mechanism includes a crystal support fixing portion for fixing the crystal support and a transfer assembly for driving the crystal support fixing portion to move so as to transfer the crystal support to the turnover mechanism.
In the above-mentioned scheme, feed mechanism includes brilliant support fixed part and transfer the subassembly, through transferring the order about of subassembly and can make brilliant support fixed part remove for brilliant support fixed part can be obtained the brilliant support by last station, and with brilliant support transfer to tilting mechanism, and after the brilliant support is accepted by tilting mechanism, can make the brilliant support fixed part remove in order to obtain another brilliant support to last station again, thereby improve the effect of brilliant support material loading effectively, do benefit to the improvement that the brilliant support separation efficiency.
According to some embodiments of the present application, the transfer assembly includes a first transfer portion and a second transfer portion, the first transfer portion being connected to the tray fixing portion and configured to drive the tray fixing portion to move in an up-down direction. The second transfer part is used for driving the first transfer part to move along a first direction, and the first direction is intersected with the up-down direction.
In the above-mentioned scheme, transfer the subassembly and transfer the portion including first transfer portion and second, transfer portion and transfer portion through first transfer portion and second, can make brilliant support the fixed part and remove in two different directions to the brilliant support fixed part will brilliant support and transmit tilting mechanism by last station, reduce the brilliant support fixed part and the brilliant support of last station or tilting mechanism take place the risk of interference, improve the brilliant support material loading efficiency, and then improve the brilliant support separation efficiency.
According to some embodiments of the present application, the first transfer portion includes a mounting member, a first rail, a first slider, and a first driving member. The mounting piece is connected with the second transfer part, the first slider is arranged on the mounting piece, the first guide rail extends along the upper and lower direction and is in sliding connection with the first slider, the first driving piece is arranged on the mounting piece and drives the first guide rail to lift along the first slider, and the end part of the first guide rail is connected with the crystal support fixing part.
In the above-mentioned scheme, the first transfer portion includes mounting member, first guide rail, first slider and first driving member. Through the drive of first driving piece, can make first guide rail lift for first slider to make the brilliant support fixed part that is located first guide rail tip follow upper and lower direction and upwards remove, with the upper and lower ascending position of adjusting brilliant support fixed part, reduce the risk that brilliant support fixed part and brilliant support or tilting mechanism interfere each other, improve the efficiency of material loading, and then improve the efficiency that the brilliant support was separated.
According to some embodiments of the present application, the first driving member is connected to the first rail through a first transmission member; the first transmission piece comprises a first gear and a first rack which are meshed with each other, the first gear is connected with the first driving piece, and the first rack is arranged on the first guide rail and extends along the up-down direction.
In the above scheme, through setting up first gear and the first rack of intermeshing, can make first guide rail steadily follow the upper and lower direction under the drive of first driving piece and remove, improve the stability that the brilliant support was transported, reduce the brilliant support and receive the impact vibration and break away from in the risk of brilliant support fixed part.
According to some embodiments of the application, the second transfer portion includes a second rail, a second slider, and a second driver. The second guide rail extends along the first direction, the mounting piece is in sliding fit with the second guide rail through the second sliding block, and the second driving piece is arranged on the mounting piece and used for driving the mounting piece to slide along the second guide rail.
In the above scheme, the second transfer part comprises a second guide rail, a second sliding block and a second driving piece. Through the drive of second driving piece, can make the mounting slide along the second guide rail to drive first guide rail and be located the brilliant support fixed part of first guide rail tip and remove along first direction, thereby make brilliant support fixed part reciprocating motion between last station and tilting mechanism, realize the transportation that the brilliant held in the palm.
According to some embodiments of the present application, a second transmission member is provided between the second driving member and the second guide rail, the second transmission member including a second gear and a second rack engaged with each other, the second gear being connected with the second driving member, the second rack being provided in the second guide rail and extending in the first direction.
In the above scheme, through setting up second gear and the second rack of intermeshing, can make the installed part remove along first direction steadily under the drive of second driving piece, improve the stability that the brilliant support was transported, reduce the brilliant support and receive the impact vibration and break away from in the risk of brilliant support fixed part.
According to some embodiments of the present application, the wafer holder fixing portion includes an electromagnetic absorbing member for magnetically absorbing a wafer holder of the wafer holder.
In the above-mentioned scheme, brilliant support fixed part includes the electromagnetism and absorbs the accessory, through electromagnetic adsorption's mode, on the one hand, can effectively with the brilliant layer board magnetism that holds in the palm adsorb and be connected, improve the stability that the brilliant support was transported, on the other hand, compared clamping jaw class press from both sides and get the structure, adopt electromagnetic adsorption's mode fixed brilliant support, can reduce the injury to brilliant support surface.
According to some embodiments of the present application, the electromagnetic absorbing member is configured as an electromagnet, and the electromagnet is configured to remain magnetic after power failure.
In the scheme, the electromagnet is still magnetic after power failure, so that the risk of damage to the crystal support caused by falling of the crystal support is reduced when power failure occurs suddenly, and the operation reliability of the overturning feeding device is improved.
According to some embodiments of the present application, the turnover feeding device further comprises a frame, and the feeding mechanism and the turnover mechanism are both arranged on the frame.
In the scheme, through setting up the frame, can integrate feed mechanism and tilting mechanism, improve the space utilization of upset loading attachment.
According to some embodiments of the present application, the rack includes a frame and a grid guard door, the frame has opposite first and second ends, the first and second ends are all open, the first end corresponds to last station setting, the second end corresponds to first transfer chain setting. The grid protection doors are arranged in number, the two grid protection doors are arranged oppositely, and the grid protection doors are connected with the frame and located between the first end and the second end.
In the scheme, the frame can be of a frame type structure, so that the frame has the advantages of being simple in structure and convenient to manufacture, and is beneficial to radiating of each part in the overturning and feeding mechanism, and the risk of fatigue and idle work of mechanical components caused by heat accumulation due to the work of the mechanical components is reduced; on the other hand, through setting up net guard gate, can do benefit to maintainer and get into inside the frame, maintain upset loading attachment.
According to some embodiments of the application, the rack further comprises a base, the base is connected with the frame, the turnover mechanism is arranged on the base, the base is provided with a water receiving tank, and the water receiving tank is used for collecting water dropped by the crystal support.
In the scheme, through setting up the water receiving tank, can collect by the water that brilliant support dripped, reduce by the interference of the water that brilliant support dripped to the device on each station of brilliant support separation production line, improve the operation stability of the device on each station of brilliant support separation production line.
In a second aspect, the present application further provides a crystal support separation production line, where the crystal support separation production line is used for separating a crystal support plate from a backing plate, and the crystal support separation production line includes the overturning loading device of any one of the first aspects.
The foregoing description is only an overview of the technical solutions of the present application, and may be implemented according to the content of the specification in order to make the technical means of the present application more clearly understood, and in order to make the above-mentioned and other objects, features and advantages of the present application more clearly understood, the following detailed description of the present application will be given.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a roll-over loading device according to some embodiments of the present application;
FIG. 2 is a schematic diagram of a susceptor in some embodiments of the present application;
FIG. 3 is a schematic view of a tilting mechanism according to some embodiments of the present application;
FIG. 4 is a schematic view of a roll-over bay and roll-over drive in some embodiments of the present application;
FIG. 5 is a schematic diagram of a feeding mechanism according to some embodiments of the present application;
FIG. 6 is a schematic view of a first transfer portion according to some embodiments of the present application;
FIG. 7 is a schematic view of a first rail in some embodiments of the present application;
FIG. 8 is a schematic view of a second rail in some embodiments of the present application;
fig. 9 is a schematic view of a rack in some embodiments of the present application.
Icon: 100-turning over the feeding device; 800-crystal support; 81-crystal supporting plates; 82-backing plate;
11-a turnover mechanism; 110-turning the receiving portion; 1101-first clamping portion; 1102-a second clamping portion; 11020-a second sub-clamp; 1103-turret; 1104-a grip opening; 111-an inversion driving section; 112-a feeding conveyor line; 1120—chain conveyor line; 113-a position sensor; 1110-an electric motor; 1111-speed reducer; 1112-coupling; 1113-a flipping shaft;
12-a feeding mechanism; 120-a crystal support fixing part; 121-a transfer assembly; 1210-a first transfer section; 12100-mount; 12100 a-a first mounting plate; 12100 b-a second mounting plate; 12100 c-a third mounting plate; 12101-a first rail; 12102-a first slider; 12103-a first driver; 12104-first gear; 12105-a first rack; 1211-a second transfer section; 12110-a second rail; 12112-a second driver; 12114-a second rack;
13-a frame; 130-a frame; 131-grid guard gates; 132-a base; 1320-a water receiving trough;
700-a first conveyor line; 70-an empty-avoiding groove; 71-rotating a roller;
x-a first direction; y-the conveying direction of the first conveying line; z-up and down direction.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the embodiments of the present application, it should be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like indicate orientations or positional relationships based on those shown in the drawings, or those conventionally put in place when the product of the application is used, or those conventionally understood by those skilled in the art, merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the application.
In the description of the embodiments of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.
The crystal support comprises a crystal support plate made of metal and a backing plate which can deform after temperature change, and the backing plate is adhered to the crystal support plate.
After the silicon wafer degumming treatment, the backing plate and the crystal supporting plate of the crystal support are separated through a crystal support separation production line, and the crystal supporting plate is recovered.
In some embodiments, the crystal support separation production line can include a turnover feeding device, an electromagnetic heating device, a backing plate separation device, a glue cleaning device, an ultrasonic cleaning device, a rinsing cooling device and the like. After the silicon wafer degumming treatment, the crystal support can be fed by the overturning and feeding device, and the crystal support fed by the overturning and feeding device can be processed and treated on other stations of the crystal support separation production line, so that the crystal support separation work is finally completed.
According to some embodiments of the present application, a flip loading device is provided. Referring to fig. 1 and fig. 2, fig. 1 is a schematic diagram of a turnover feeding device according to some embodiments of the present application, and fig. 2 is a schematic diagram of a susceptor according to some embodiments of the present application.
The turnover feeding device 100 comprises a feeding mechanism 12, a turnover mechanism 11 and a first conveying line 700. The loading mechanism 12 is used for acquiring and transferring the crystal tray 800. The turnover mechanism 11 is used for receiving and turnover the wafer carrier 800 transported by the loading mechanism 12, so that the backing plate 82 is located above the wafer carrier 81. The first conveying line 700 is used for receiving the crystal support 800 turned by the turning mechanism 11 and conveying the crystal support 800.
The loading mechanism 12 may be used to obtain the crystal support 800 from the previous station and transfer the crystal support 800 to the turnover mechanism 11. In some embodiments, the loading mechanism 12 may include a crystal support fixing portion 120 and a transfer component 121, where the crystal support fixing portion 120 is used to fix the crystal support 800, and the transfer component 121 is used to drive the crystal support fixing portion 120 to move, so as to obtain the crystal support 800 from the last station, and transfer the crystal support 800 onto the turnover mechanism 11. In other embodiments, the loading mechanism 12 may also include a multi-axis robot that may grasp the wafer carrier 800 and transfer the wafer carrier 800 onto the flipping mechanism 11.
In some embodiments, wafer carrier 800 is in a position with backing plate 82 under wafer carrier 81 after the wafer degumming process. When the susceptor 800 is conveyed to the electromagnetic heating device, the susceptor 800 may have a posture in which the pad 82 is located above the susceptor plate 81, so that the susceptor plate 81 made of metal is electromagnetically heated.
The turnover mechanism 11 may be used for receiving the crystal support 800 transported by the feeding mechanism 12 and turnover the crystal support 800, so as to facilitate the separation of the crystal support plate 81 and the backing plate 82 when the crystal support plate 81 is electromagnetically heated in the subsequent process. By "flipping the tray 800" it is understood that by flipping the tray 800, the tray 800 is switched from "the posture of the pad 82 under the tray 81" to "the posture of the pad 82 over the tray 81".
The first transfer line 700 may be used to receive the susceptor 800 turned by the turning mechanism 11, so that the susceptor 800 is transferred to the next process, for example, to an electromagnetic heating device in a posture in which the pad 82 is above the susceptor plate 81.
In some embodiments, the first conveyor line 700 may include a belt conveyor line, a roller conveyor line, or other means capable of conveying the wafer support 800.
In the above-mentioned scheme, the overturning loading device 100 includes the loading mechanism 12, the overturning mechanism 11, and the first conveying line 700. The feeding mechanism 12 acquires the crystal support 800 from the last station, works through the turnover mechanism 11, turns over the crystal support 800, enables the base plate 82 to be located above the crystal support plate 81 (under the gesture, facilitates heating of the crystal support 800 to facilitate separation of the crystal support 800), facilitates conveying the crystal support 800 in the gesture to the next station by the first conveying line 700, achieves automatic feeding, effectively reduces labor intensity of feeding of the crystal support 800, improves feeding efficiency, and further improves separation efficiency of the crystal support 800.
Referring to fig. 3 and 4, fig. 3 is a schematic view of a tilting mechanism 11 according to some embodiments of the present application, and fig. 4 is a schematic view of a tilting receiver 110 and a tilting drive part 111 according to some embodiments of the present application.
The turnover mechanism 11 includes a turnover receiving portion 110 and a turnover driving portion 111, and a turnover fixing portion is used for receiving the crystal tray 800 transported by the feeding mechanism 12. The overturning driving portion 111 is connected with the overturning supporting portion 110, the overturning driving portion 111 is used for driving the overturning supporting portion 110 to overturn between a first position and a second position, when the overturning supporting portion 110 is located at the first position, the overturning supporting portion 110 is used for supporting the crystal support 800 transported by the feeding mechanism 12, and when the overturning supporting portion 110 is located at the second position, the overturning supporting portion 110 is used for placing the crystal support 800 on the first conveying line 700.
The flip-up receiving portion 110 is a flip-up mechanism 11 for receiving the susceptor 800, and the flip-up receiving portion 110 is flipped by the flip-up driving portion 111 to flip-up and switch between the first position and the second position.
The first position is understood to be capable of receiving a wafer carrier 800 transported by the loading mechanism 12 when the roll-over receiver 110 is in the first position. The second position may be understood as that the inversion receiving portion 110 rotates around the inversion axis by the driving of the inversion driving portion 111, so that the posture of the tray 800 received by the inversion receiving portion 110 is inverted, and the inverted tray 800 can be located on the first transfer line 700.
The inversion driving portion 111 is connected to the inversion receiving portion 110, and is configured to provide driving force to inversion of the inversion receiving portion 110. In some embodiments, the flip drive 111 may include a motor that outputs torque to rotate the flip drive 111 along the flip axis to switch between the first and second positions.
In the above-described embodiment, the tilting mechanism 11 includes the tilting receiver 110 and the tilting drive unit 111. The overturning receiving portion 110 can be overturned between a first position suitable for receiving the crystal support 800 transported by the feeding mechanism 12 and a second position for placing the crystal support 800 on the first conveying line 700 by being driven by the overturning driving portion 111.
In the process of overturning the overturning and supporting part 110, the crystal support 800 supported by the overturning and supporting part 110 also follows overturning, the crystal support 800 can be placed on the first conveying line 700 in a posture that the base plate 82 is positioned above the crystal support plate 81, and automation of overturning the crystal support 800 is achieved, so that the labor intensity is effectively reduced, the feeding efficiency is improved, and further the improvement of the separation efficiency of the crystal support 800 is facilitated.
According to some embodiments of the present application, referring to fig. 1, a first conveyor line 700 has a void-avoidance slot 70, the void-avoidance slot 70 for receiving at least a portion of the roll-over receiver 110. The turn receiving portion 110 is configured such that, in the second position, a portion of the turn receiving portion 110 is received in the empty-avoiding groove 70, and the wafer pallet 81 is received by the first conveyor line 700.
The void-avoiding groove 70 may be understood as a hollow void-avoiding groove 70 formed on the first conveying line 700, and when the turnover receiving portion 110 is switched from the first position to the second position, at least a portion of the turnover receiving portion 110 may be received in the void-avoiding groove 70, so that the crystal support 800 received by the turnover receiving portion 110 may contact the first conveying line 700, and a friction force is generated between the first conveying line 700 and the crystal support 800, so that the crystal support 800 moves along with the first conveying line 700.
In some embodiments, the first transfer line 700 may be a roller transfer line, and the void-avoidance groove 70 may be formed by increasing a gap between adjacent two rollers. In other embodiments, the first conveying line 700 may be a belt conveying line, the void-avoidance groove 70 may be formed by forming a plurality of through holes in the belt, the movement frequency of the belt corresponds to the turnover frequency of the turnover mechanism 11, and when the turnover receiving portion 110 is switched from the first position to the second position, the through holes in the belt are located at corresponding positions so as to be capable of receiving at least part of the turnover receiving portion 110.
In the above-mentioned scheme, by providing the empty-avoiding groove 70 on the first conveying line 700 to accommodate at least part of the turnover receiving portion 110, the wafer pallet 81 can be brought into contact with the conveying interface of the first conveying line 700, so that the wafer pallet 81 is separated from the turnover receiving portion 110 and conveyed to the next station under the action of the first conveying line 700.
According to some embodiments of the present application, referring to fig. 4, the inversion socket 110 includes a first grip portion 1101 and a second grip portion 1102, the first grip portion 1101 and the second grip portion 1102 being spaced apart in an inversion direction of the inversion socket 110 to accommodate the wafer tray 800.
The first clamping part 1101 and the second clamping part 1102 are arranged at intervals in the turning direction of the turning receiving part 110, and a space for accommodating the crystal tray 800 is formed between the first clamping part 1101 and the second clamping part 1102.
In some embodiments, first clamping portion 1101 and second clamping portion 1102 may be rotated along the inversion axis of inversion receptacle 110 such that crystal tray 800 between first clamping portion 1101 and second clamping portion 1102 is "switched" from a posture in which "backing plate 82 is below crystal tray 81 to a posture in which backing plate 82 is above crystal tray 81.
In some embodiments, when the tray 800 is between the first clamping portion 1101 and the second clamping portion 1102, the tray 800 may contact only one of the first clamping portion 1101 and the second clamping portion 1102. In other words, during the flip of the tray 800, when the tray 800 contacts one of the first clamping portion 1101 and the second clamping portion 1102, the tray 800 is spaced apart from the other.
In some embodiments, when the flip-up receiving portion 110 is received in the void 70, the crystal support 800 is supported by the first conveying line 700, and the crystal support 800 may not contact the first clamping portion 1101 or the drop clamping portion, so as to facilitate the movement of the crystal support 800 along with the first conveying line 700.
In some embodiments, the surfaces of the first clamping portion 1101 and the second clamping portion 1102 facing each other may be flat surfaces to stably support the wafer carrier 800. In some embodiments, the surfaces of the first clamping portion 1101 and the second clamping portion 1102 facing each other may be provided with an anti-slip layer to increase friction with the crystal support 800 and reduce the risk of the crystal support 800 separating from the flip-flop receiving portion 110, and the anti-slip layer may be a concave-convex layer disposed on the surface of the first clamping portion 1101 or the flip-flop clamping portion, or may be a rubber layer disposed on the surface of the first clamping portion 1101 or the flip-flop clamping portion.
In the above scheme, the overturning bearing part 110 has a simple structure and is convenient to manufacture. The first clamping part 1101 and the second clamping part 1102 which are arranged in the overturning direction of the overturning supporting part 110 and are spaced from each other are convenient for accommodating and supporting the crystal support 800 on one hand, so that the risk that the crystal support 800 falls off from the overturning supporting part 110 in the overturning process is reduced; on the other hand, when the overturning supporting part 110 is accommodated in the avoiding groove, the crystal support 800 can quickly pass through the gap between the first clamping part 1101 and the second clamping part 1102 under the action of the first conveying line 700, so that the crystal support can be conveyed to the next station along with the first conveying line 700.
In other embodiments, the flip-top receiving portion 110 may further include a manipulator or other clamp capable of performing a clamping action, where the clamp is capable of grabbing or dropping the tray 800, for example, when the clamp is in a first position, the tray 800 is clamped by the previous station, and when the clamp is in a second position, the clamping force on the tray 800 is cancelled.
According to some embodiments of the present application, during rotation of the flip-flop tray 110 from the first position to the second position, the tray 800 is being held by the first clamp 1101 to be changed to be held by the second clamp 1102. When the roll-over receiver 110 is in the second position, the clearance groove 70 receives at least a portion of the second clip portion 1102.
In some embodiments, the first clamping portion 1101 may be below the tray 800 to support the tray 800 when the flip-flop tray 110 is in the first position and is receiving the tray 800. With the inversion of the inversion receiving portion 110, the component against the gravity of the tray 800 is changed from the first clamping portion 1101 to the second clamping portion 1102, and when the inversion receiving portion 110 is switched to the second position, the second clamping portion 1102 may be located below the tray 800 to support the tray 800.
By "at least a portion of the void 70 accommodates the second grip 1102" it is understood that a portion or all of the second grip 1102 may be accommodated in the void 70 when the roll-over receiver 110 is in the second position.
In some embodiments, when the roll-over receiver 110 is in the second position, some or all of the first clamping portion 1101 may be received within the void-avoidance groove 70.
In the above-mentioned scheme, on the one hand, through setting up first clamping part 1101 and second clamping part 1102 and accepting brilliant support 800 respectively, reduce the brilliant support 800 and break away from in upset and accept the risk of portion 110, on the other hand, through setting up the at least part of dodging the groove in order to accept second clamping part 1102, can let brilliant support 800 and the transport interface contact of first transfer chain 700, so that brilliant layer board 81 breaks away from in second clamping part 1102 and carries to next station under the effect of first transfer chain 700, and then improve the efficiency of material loading, and then improve the efficiency that brilliant support 800 separated.
According to some embodiments of the present application, referring to fig. 4 in combination with fig. 1, the second clamping portion 1102 comprises a plurality of spaced apart second sub-clamping portions 11020 in the conveying direction y of the first conveying line, the first conveying line 700 is provided with a plurality of spaced apart void-avoidance grooves 70, and each second sub-clamping portion 11020 is received within a corresponding void-avoidance groove 70 when the inverted socket 110 is in the second position. The first conveying line 700 includes a plurality of rotating rollers 71 for conveying the crystal support 800, and the rotating rollers 71 for receiving the crystal support 800 are disposed between at least two adjacent empty avoidance grooves 70.
In some embodiments, the second grip 1102 includes a plurality of second sub-grips 11020, e.g., including two, three, or more second sub-grips 11020.
The second sub-clamping portion 11020 may have a bar shape, and a plurality of the second sub-clamping portions 11020 having a bar shape are disposed at intervals along the conveying direction y of the first conveying line. The gap between two adjacent second sub-clamping portions 11020 can be exposed to portions of the wafer carrier 800. The conveying direction y of the first conveyor line may be parallel to the inversion axis of the inversion receiving portion 110.
The first conveyor line 700 is provided with a plurality of empty avoiding grooves 70. The number of the space-avoiding grooves 70 corresponds to the number of the second sub-clamping portions 11020, for example, the number of the space-avoiding grooves 70 corresponds to the number of the second sub-clamping portions 11020 so that each of the second sub-clamping portions 11020 can be accommodated by the corresponding space-avoiding groove 70.
The first transfer line 700 may be a roller transfer line, that is, the first transfer line 700 includes a plurality of rotating rollers 71 for transferring the susceptor 800, and the rotation of the rotating rollers 71 provides a rolling friction force to the susceptor 800, thereby realizing the transportation of the susceptor 800.
The "at least partially adjacent two of the space-avoiding grooves 70 are provided with the rotating roller 71 for receiving the tray 800" means that the portion of the tray 800 exposed by the gap between the adjacent two of the second sub-clamping portions 11020 can be subjected to the action of the rotating roller 71, thereby realizing the transportation of the tray 800.
In some embodiments, the portion of the susceptor 800 acted upon by the rotating roller 71 includes a portion located between two adjacent second sub-clamping portions 11020; including a portion of the wafer carrier 800 that extends beyond the second clamping portion 1102 along the conveying direction y of the first conveying line; or include a portion between two adjacent second sub-clamping portions 11020 and a portion of the wafer carrier 800 that extends beyond the second clamping portion 1102 along the conveying direction y of the first conveying line.
In some embodiments, the first clamp 1101 may also include a plurality of spaced apart first sub-clamps in the conveying direction y of the first conveyor line. Alternatively, in other embodiments, the first clamping portion 1101 is a unitary structure and the first clamping portion 1101 is a plate-like structure.
In the above-mentioned solution, on the one hand, by providing the plurality of second sub-clamping portions 11020 spaced apart, the wafer carrier 800 can be stably and uniformly received by force, so as to reduce the risk that the wafer carrier 800 is separated from the flip-chip receiving portion 110; on the other hand, the plurality of spaced apart second sub-clamping portions 11020 can correspond to the rotating rollers 71 between the empty avoidance grooves 70, so that the portion of the crystal support 800 exposed between two adjacent second sub-clamping portions 11020 can be acted on by the rotating rollers 71 between the empty avoidance grooves 70, thereby facilitating the first conveying line 700 to convey the crystal support 800, improving the feeding efficiency, and further improving the separating efficiency of the crystal support 800.
In some embodiments, the second clamping portion 1102 may not include a plurality of spaced apart second sub-clamping portions 11020, for example, the second clamping portion 1102 is a unitary structure, and when the second clamping portion 1102 is received in the void-avoidance groove 70, the portion of the wafer tray 800 that exceeds the second clamping portion 1102 is acted upon by the rotating roller 71 along the conveying direction y of the first conveying line so that the wafer tray 800 is separated from the second clamping portion 1102 and moves with the first conveying line 700.
According to some embodiments of the present application, referring to fig. 3, the turnover mechanism 11 further includes a feeding conveyor line 112, where the feeding conveyor line 112 is configured to receive the crystal tray 800 transported by the feeding mechanism 12, and transport the crystal tray 800 to the turnover receiving portion 110. The flip receiving portion 110 further includes a rotating frame 1103, the rotating frame 1103 is connected to the flip driving portion 111, one end of the first clamping portion 1101 and one end of the second clamping portion 1102 are connected to the rotating frame 1103, the other end of the first clamping portion 1101 and the other end of the second clamping portion 1102 are spaced apart to form a clamping opening 1104, and the flip receiving portion 110 is configured such that, when in the first position, the clamping opening 1104 faces the feeding conveyor line 112 to receive the wafer carrier 800.
Referring to fig. 3, the roll-over receiving portion 110 includes a rotating frame 1103, a first clamping portion 1101, and a second clamping portion 1102, the rotating frame 1103 is connected to a roll-over driving portion 111, and the roll-over driving portion 111 drives the rotating frame 1103 to roll over. In some embodiments, the overturn driving part 111 may include a motor 1110, a speed reducer 1111, a coupling 1112, and an overturn shaft 1113, an output shaft of the motor 1110 is connected to the speed reducer 1111, and the speed reducer 1111 is connected to the overturn shaft 1113 through the coupling 1112, such that the overturn shaft 1113 rotates around an axis of the overturn shaft 1113, and the rotating frame 1103 is provided on a circumferential surface of the overturn shaft 1113 to overturn with the rotation of the overturn shaft.
The turret 1103 connects the first clamping portion 1101 and the second clamping portion 1102, and an end of the first clamping portion 1101 remote from the turret 1103 and an end of the second clamping portion 1102 remote from the turret 1103 are spaced apart to form a clamping mouth 1104. When the flip-flop receiving portion 110 is in the first position, the clamping port 1104 faces the feed conveyor line 112, and the wafer carrier 800 enters the clamping port 1104 under the conveyance of the feed conveyor line 112.
The loading conveyor line 112 is a member for receiving the tray 800 transferred by the loading mechanism 12 and transporting the tray 800 to the turn receiving portion 110. In some embodiments, the loading mechanism 12 may place the wafer carrier 800 on the loading conveyor line 112. In some embodiments, the loading conveyor line 112 is located on one side of the flipping mechanism 11 and the first conveyor line 700 is located on the other side of the flipping mechanism 11, such that the wafer carrier 800 moves from side to side under flipping of the flipping mechanism 11.
In some embodiments, the conveying direction of the loading conveyor line 112 may be perpendicular to the conveying direction y of the first conveyor line.
In some embodiments, the loading conveyor line 112 may include two chain conveyor lines 1120, with the two chain conveyor lines 1120 being spaced apart along the transport direction of the first conveyor line 700. Two chain conveyor lines respectively act on both ends of the wafer carrier 800.
When the turnover receiving portion 110 is at the first position, the turnover receiving portion 110 is located between the two chain conveying lines 1120, and the middle portion of the wafer support 800 moves towards the clamping port 1104 along with the conveying of the two chain conveying lines 1120, and finally enters the clamping port 1104 to be located between the first clamping portion 1101 and the second clamping portion 1102.
In the above scheme, through setting up material loading transfer chain 112, can carry to overturning the portion 110 is accepted to the brilliant support 800 that holds in the palm in feed mechanism 12 to make brilliant support 800 can get into the centre gripping mouth 1104 that is formed by first clamping part 1101 and second clamping part 1102, thereby effectively improve the brilliant support 800 and shift the efficiency to overturning the supporting part by feed mechanism 12, improved material loading efficiency, and then improved the efficiency that brilliant support 800 separated.
According to some embodiments of the present application, referring to fig. 4, a position sensor 113 is disposed in the clamping port 1104, and the position sensor 113 is used to sense the position of the susceptor 800.
The position sensor 113 is a sensor device for sensing the susceptor 800, for example, the position sensor 113 may be a photoelectric sensor.
The position sensor 113 may be disposed deep in the grip port 1104, for example, one end of the position sensor 113 may be disposed in the rotating frame 1103. Along with the conveying of the feeding conveying line 112, the crystal support 800 enters between the first clamping part 1101 and the second clamping part 1102 through the clamping opening 1104, and when the crystal support 800 triggers the position sensor 113 or the position sensor 113 senses the crystal support 800, it can indicate that the crystal support 800 is at a proper position, and can allow the overturning driving part to drive the overturning receiving part 110 to overturn.
In some embodiments, the overturning loading device 100 may be configured with a control module, where the control module may receive a signal sent by the position sensor 113, so as to determine whether to drive the overturning driving portion to work.
In the above scheme, the position sensor 113 is arranged in the clamping opening 1104 to sense whether the crystal support 800 enters the clamping opening 1104 or whether the crystal support 800 enters the clamping opening 1104 and goes deep into a proper position, so that whether the turnover is judged based on the signal sent by the position sensor 113, thereby the turnover feeding device 100 has higher fault tolerance and the success rate of turnover feeding is improved.
Referring to fig. 5, fig. 5 is a schematic diagram of the feeding mechanism 12 according to some embodiments of the present application.
The loading mechanism 12 includes a crystal support fixing portion 120 and a transfer assembly 121, the crystal support fixing portion 120 is used for fixing the crystal support 800, and the transfer assembly 121 is used for driving the crystal support fixing portion 120 to move so as to transfer the crystal support 800 to the turnover mechanism 11.
The tray fixing portion 120 is a member for acquiring and fixing the tray 800. In some embodiments, the wafer support fixing portion 120 may be an electromagnetic adsorption member, and is connected to the wafer support plate 81 by a magnetic adsorption manner. In other embodiments, the wafer holder fixing portion 120 may be a clamp with a clamping function.
The transfer assembly 121 is a component for moving the crystal support fixing portion 120, and the crystal support fixing portion 120 can be switched between different positions by the operation of the transfer assembly 121, so as to achieve the purpose of transferring the crystal support 800. For example, the crystal support fixing portion 120 can move between the upper station and the feeding conveyor line 112 under the driving of the transferring assembly 121, and the crystal support fixing portion 120 can slowly put down the crystal support 800 under the driving of the transferring assembly 121, so that the crystal support 800 is placed on the feeding conveyor portion.
In the above-mentioned scheme, feed mechanism 12 includes brilliant support fixed part 120 and transfer subassembly 121, through transferring subassembly 121 drive can make brilliant support fixed part 120 remove for brilliant support fixed part 120 can obtain brilliant support 800 by last station, and transfer brilliant support 800 to tilting mechanism 11, and after brilliant support 800 is accepted by tilting mechanism 11, can make brilliant support fixed part 120 upwards one station again and remove in order to obtain another brilliant support 800, thereby improve the effect of brilliant support 800 material loading effectively, do benefit to the improvement of brilliant support 800 separation efficiency.
According to some embodiments of the present application, the transfer assembly 121 includes a first transfer portion 1210 and a second transfer portion 1211, the first transfer portion 1210 being connected to the tray fixing portion 120 and configured to drive the tray fixing portion 120 to move in the up-down direction z. The second transfer portion 1211 is configured to drive the first transfer portion 1210 to move along a first direction x, which intersects the up-down direction z.
The first transfer portion 1210 is a member for moving the tray fixing portion 120 in the up-down direction z, that is, a member for lifting and lowering the tray fixing portion 120. In some embodiments, the first transfer portion 1210 is driven to enable the tray fixing portion 120 to lower the tray 800, for example, to lower the tray 800 from above the feeding conveyor line 112 to a position contacting the feeding conveyor line 112.
The second transfer part 1211 is a member for driving the first moving part to move in the first direction x so that the tray fixing part 120 moves in the first direction x. The first direction x is the direction in which the last station and the turning mechanism 11 are disposed opposite to each other. In some embodiments, the first direction x may be perpendicular to the conveying direction y of the first conveyor line.
In some embodiments, the tray 800 can be moved above the loading conveyor line 112 by the conveyance of the second transfer portion 1211, and then the tray 800 can be placed on the loading conveyor line 112 by the conveyance of the first transfer portion 1210.
In the above-mentioned scheme, the transfer assembly 121 includes the first transfer portion 1210 and the second transfer portion 1211, and through the first transfer portion 1210 and the second transfer portion 1211, the crystal support fixing portion 120 can be moved in two different directions, so that the crystal support fixing portion 120 transfers the crystal support 800 from the previous station to the turnover mechanism 11, the risk of interference between the crystal support fixing portion 120 and the crystal support 800 of the previous station or the turnover mechanism 11 is reduced, the feeding efficiency of the crystal support 800 is improved, and the separating efficiency of the crystal support 800 is further improved.
Referring to fig. 5 and 6, fig. 6 is a schematic view of a first transfer portion 1210 according to some embodiments of the present application.
The first transfer portion 1210 includes a mounting member 12100, a first rail 12101, a first slider 12102, and a first driving member 12103. The mounting member 12100 is connected to the second transfer portion 1211, the first slider 12102 is disposed on the mounting member 12100, the first rail 12101 extends in the up-down direction z and is slidably connected to the first slider 12102, the first driving member 12103 is disposed on the mounting member 12100 and drives the first rail 12101 to rise and fall along the first slider 12102, and an end portion of the first rail 12101 is connected to the crystal support fixing portion 120.
The mounting member 12100 is a member that mounts the first driving member 12103 and the first slider 12102. In some embodiments, the mount 12100 may include a first mounting plate 12100a, a second mounting plate 12100b, and a third mounting plate 12100c, the first mounting plate 12100a being formed with a through hole for the first rail 12101 to pass through. The second and third mounting plates 12100b and 12100c are vertically disposed on the first mounting plate 12100a and disposed around the through hole, and the second and third mounting plates 12100b and 12100c are disposed adjacently. The first slider 12102 is disposed on the second mounting plate 12100b and is in sliding fit with the first rail 12101, and the first driving member 12103 is disposed on the third mounting plate 12100c for driving the first rail 12101 to lift.
Referring to fig. 6, the number of first sliders 12102 is a plurality, for example, two, three or more. The plurality of first sliders 12102 are disposed at intervals along the up-down direction z, and are each slidably engaged with the first rail 12101.
In some embodiments, the number of second mounting plates is two, the two second mounting plates are disposed opposite to each other, and each second mounting plate is provided with a first slider 12102.
In the above-described embodiment, the first transfer portion 1210 includes the mounting member 12100, the first rail 12101, the first slider 12102, and the first driving member 12103. By driving the first driving member 12103, the first guide rail 12101 can be lifted relative to the first slider 12102, so that the crystal support fixing portion 120 located at the end of the first guide rail 12101 moves in the up-down direction z, so as to adjust the position of the crystal support fixing portion 120 in the up-down direction z, reduce the risk of mutual interference between the crystal support fixing portion 120 and the crystal support 800 or the turnover mechanism 11, improve the feeding efficiency, and further improve the separation efficiency of the crystal support 800.
Referring to fig. 6 and 7, fig. 7 is a schematic view of a first rail 12101 according to some embodiments of the present application.
The first drive 12103 is coupled to the first rail 12101 via a first transmission. The first transmission member includes a first gear 12104 and a first rack 12105 engaged with each other, the first gear 12104 being connected to the first driving member 12103, the first rack 12105 being provided to the first rail 12101 and extending in the up-down direction z.
Referring to fig. 6, the first driving member 12103 includes a motor, and a first gear 12104 is provided on an output shaft of the motor. Referring to fig. 7, a first rack 12105 is provided on the first rail 12101, and the first rack 12105 extends in the up-down direction z. When the motor is operated, the first guide rail 12101 can be moved up and down by the cooperation of the first slider 12102 through the first gear 12104 and the first rack 12105 which are engaged with each other, so as to realize the lifting of the crystal support fixing portion 120.
In the above-mentioned scheme, by providing the first gear 12104 and the first rack 12105 which are engaged with each other, the first guide rail 12101 can be stably moved in the up-down direction z under the driving of the first driving member 12103, so that the stability of transferring the crystal support 800 is improved, and the risk that the crystal support 800 is separated from the crystal support fixing portion 120 due to impact vibration is reduced.
In some embodiments, the first transfer portion 1210 may further include a linear motor, an electric cylinder, an air cylinder, or other mechanism capable of outputting linear motion, for example. For example, the first transfer part 1210 includes a linear motor driven by the second transfer part 1211 to move in the first direction x, and an output end of the linear motor is provided with the susceptor fixing part 120.
According to some embodiments of the present application, please refer to fig. 5 and 8. Fig. 8 is a schematic diagram of a second rail 12110 in some embodiments of the present application. The second transfer unit 1211 includes a second guide rail 12110, a second slider, and a second driver 12112. The second rail 12110 extends along the first direction x, the mounting member 12100 is slidably engaged with the second rail 12110 through a second slider, and the second driving member 12112 is disposed on the mounting member 12100, for driving the mounting member 12100 to slide along the second rail 12110.
Referring to fig. 8, the number of the second guide rails 12110 is two, and the two second guide rails 12110 are disposed opposite to each other at a distance to commonly support the first mounting plate of the mounting member 12100. The surface of the first mounting plate of the mounting member 12100 facing the second rail 12110 is provided with at least two second slide blocks to slidably engage with the two second rails 12110. The second rail 12110 extends along the first direction x, so that the mounting member 12100 can slide along the first rail 12101 along the first direction x.
The second driving member 12112 is disposed on the mounting member 12100, for example, the second driving member 12112 is disposed on the first mounting plate of the mounting member 12100, and an output end of the second driving member 12112 passes through the first mounting plate of the mounting member 12100 to be in driving connection with the second rail 12110, so that the mounting member 12100 drives the first rail 12101 to slide along the first direction x under the driving of the second driving member 12112. Wherein in some embodiments the output end of the second driver 12112 may be in driving connection with one of the second rails 12110.
In the above-described embodiment, the second transfer portion 1211 includes the second rail 12110, the second slider, and the second driver 12112. By driving the second driving member 12112, the mounting member 12100 can slide along the second guide rail 12110, so as to drive the first guide rail 12101 and the crystal support fixing portion 120 located at the end of the first guide rail 12101 to move along the first direction x, so that the crystal support fixing portion 120 reciprocates between the last station and the turnover mechanism 11, and the transportation of the crystal support 800 is realized.
According to some embodiments of the present application, a second transmission member is disposed between the second driving member 12112 and the second rail 12110, the second transmission member including a second gear and a second rack 12114 engaged with each other, the second gear being connected to the second driving member 12112, the second rack 12114 being disposed on the second rail 12110 and extending in the first direction x.
Referring to fig. 6, the second driving member 12112 includes a motor, and a second gear may be provided on an output shaft of the motor. Referring to fig. 8, one of the second rails 12110 is provided with a second rack 12114, and the second rack 12114 extends in the first direction x. The second rack 12114 may be provided at a surface of the second rail 12110 facing the other second rail 12110. When the motor is operated, the mounting member 12100 can be moved along the second guide rail 12110 by the second gear and the second rack 12114 engaged with each other, enabling movement of the tray fixing portion 120 in the first direction x.
In the above-mentioned scheme, by providing the second gear and the second rack 12114 meshed with each other, the mounting member 12100 can be stably moved along the first direction x under the driving of the second driving member 12112, so as to improve the stability of transferring the crystal support 800 and reduce the risk that the crystal support 800 is separated from the crystal support fixing portion 120 due to impact vibration.
According to some embodiments of the present application, the tray fixing portion 120 includes an electromagnetic suction member for magnetically sucking the tray 81 of the tray 800.
Electromagnetic absorbing means a component capable of generating magnetic force or eliminating magnetic force under the action of electric current. For example, when the electromagnetic absorbing member is operated by different currents, a magnetic force can be generated to fix the tray 800, or the magnetic force can be eliminated to release the tray 800.
In the above-mentioned scheme, brilliant support fixed part 120 includes the electromagnetism and absorbs the accessory, through electromagnetic adsorption's mode, on the one hand, can effectively hold in the palm the brilliant layer board 81 magnetism of 800 to adsorb and be connected, improves the stability that the brilliant support 800 transported, on the other hand, compared with clamping jaw class clamp and get the structure, adopts electromagnetic adsorption's mode fixed brilliant support 800, can reduce the injury to brilliant support 800 surface.
According to some embodiments of the present application, the electromagnetic absorbing member is configured as an electromagnet, and the electromagnet is configured to remain magnetic after power failure.
In some embodiments, the electromagnetic absorbing member may be a power-off holding magnet to be able to absorb the wafer pallet 81 also without being powered on (e.g., powered off or power off).
In the above scheme, through setting up the electro-magnet to still have magnetism after the outage, can reduce brilliant support 800 and drop and lead to the impaired risk of brilliant support 800 when the sudden power failure, improve the operational reliability of upset loading attachment 100.
According to some embodiments of the present application, the overturning loading device 100 further includes a frame 13, and the loading mechanism 12 and the overturning mechanism 11 are both disposed on the frame 13.
The frame 13 is a part for supporting the turnover feeding device 100. In some embodiments, the frame 13 mounts the fixed loading mechanism 12 and the turnover mechanism 11 and the frame 13 can be bolted to the ground to allow stability of the overall device.
In the above scheme, through setting up frame 13, can integrate feed mechanism 12 and tilting mechanism 11, improve the space utilization of upset loading attachment 100.
Referring to fig. 9, fig. 9 is a schematic view of a frame 13 according to some embodiments of the present application. The frame 13 includes a frame 130 and a grid protective door 131, where the frame 130 has a first end and a second end opposite to each other, the first end and the second end are both open, the first end is set corresponding to the last station, and the second end is set corresponding to the first conveying line 700. The number of the grid guard doors 131 is two, the two grid guard doors 131 are oppositely arranged, and the grid guard doors 131 are connected with the frame 130 and are located between the first end and the second end.
In some embodiments, the frame 130 may be welded from square tubing. In the first direction x, the frame 130 has opposite first and second ends, the first end may be disposed corresponding to the last station and the second end may be disposed corresponding to the first conveyor line 700. For example, the feeding mechanism 12 obtains the crystal support 800 from the first end, and transfers the crystal support 800 to the turning mechanism 11 along the first direction x, and the turning mechanism 11 turns toward the second end, so that the crystal support 800 turns onto the first conveying line 700.
The number of the grid guard doors 131 is two, and the two grid guard doors 131 are oppositely arranged to close two side surfaces of the frame 130, so that the frame 13 is in a semi-closed structure.
In the above scheme, the frame 13 can be of a frame 130 type structure, so that the frame has the advantages of simple structure and convenient manufacture, and is beneficial to radiating of each part in the turnover feeding mechanism 12, so that the risk of fatigue and idle work of mechanical components caused by heat accumulation due to the operation of the mechanical components is reduced; on the other hand, by providing the grid guard door 131, maintenance personnel can easily enter the frame 130 to maintain the turnover feeding device 100.
According to some embodiments of the present application, the rack 13 further includes a base 132, the base 132 is connected with the frame 130, the turnover mechanism 11 is disposed on the base 132, and the base 132 is provided with a water receiving tank for collecting water dropped from the crystal tray 800.
The base 132 is a component that receives the tilting mechanism 11, and the base 132 is connected to the frame 130 so that the tilting mechanism 11 is stably located within the frame 130. In some embodiments, the base 132 may be welded to the frame 130 by a square tube, by welding, screwing or clamping.
In the up-down direction z, the turnover mechanism 11 may be mounted on the upper surface of the base 132, and the lower surface of the base 132 may be provided with a water receiving tank 1320, the water receiving tank 1320 being used to collect water dropped from the wafer tray 800. The connection of the water receiving tank 1320 to the base 132 includes, but is not limited to, welding, clamping, adhesive, or bolting.
In the above scheme, through setting up the water receiving tank, can collect by the water that crystal support 800 dripped, reduce the interference of the water that drops by crystal support 800 to the device on each station of crystal support 800 separation production line, improve the running stability of the device on each station of crystal support 800 separation production line.
According to some embodiments of the present application, there is further provided a tray 800 separating line, the tray 800 separating line is used for separating the tray 81 from the pad 82, and the tray 800 separating line includes the overturning loading device 100 of any one of the first aspect.
According to some embodiments of the present application, a flip loading device 100 is provided. Please refer to fig. 1-9. The overturning loading device 100 comprises a loading mechanism 12, an overturning mechanism 11, a first conveying line 700 and a frame 13.
The frame 13 includes a frame 130 and a mesh protection door 131, and the frame 130 is formed by welding square tubes. The mesh protection door 131 is disposed at both sides of the frame 130. Along a first direction x, the frame 130 has opposite first and second ends. The first transfer line 700 is disposed corresponding to the second end, and a transfer direction y of the first transfer line is perpendicular to the first direction x. The feeding mechanism 12 and the turnover mechanism 11 are mounted on the frame 130.
The feeding mechanism 12 is mounted on the top end of the frame 130, the feeding mechanism 12 comprises a crystal support fixing portion 120 and a transfer assembly 121, the transfer assembly 121 comprises a first transfer portion 1210 and a second transfer portion 1211, a second guide rail 12110 in the second transfer portion 1211 is arranged on the top end of the frame 130, and a part of a first guide rail 12101 of the first transfer portion 1210 is located in the frame 130. The tray fixing portion 120 includes an electromagnetic adsorption member disposed at an end of the first rail 12101. The electromagnetic adsorption member is movable in the up-down direction z by the first transfer portion 1210, and movable in the first direction x by the second transfer portion 1211.
The tilting mechanism 11 is disposed in the frame 130 via a bottom plate. The turnover mechanism 11 includes a feeding conveyor line 112, a turnover receiving portion 110, and a turnover driving portion 111, and along a first direction x, the turnover receiving portion 110 is located between the feeding conveyor line 112 and the first conveyor line 700. The feeding conveyor line 112 is used for receiving the crystal support 800 released by the electromagnetic adsorption piece, and transporting the crystal support 800 to the overturning receiving portion 110 along the first direction x.
The flip driving part 111 is used for driving the flip bearing part 110 to flip between the first position and the second position. When the flip-flop receiving portion 110 is in the first position, the clamping port 1104 of the flip-flop receiving portion 110 faces the loading conveyor line 112, so that the wafer carrier 800 enters the clamping port 1104 under transportation of the loading conveyor line 112. When the roll-over receiver 110 is in the second position, the roll-over receiver 110 places the tray 800 on the first conveyor line 700 such that the tray 800 is transported with the first conveyor line 700. The first conveyor line 700 has a void 70, the void 70 for receiving at least a portion of the roll-over receiver 110. The turn receiving portion 110 is configured such that, in the second position, a portion of the turn receiving portion 110 is received in the empty-avoiding groove 70, and the wafer pallet 81 is received by the first conveyor line 700.
Through the upset loading attachment 100 that provides above, can automatic material loading and upset brilliant support 800, provide the material loading efficiency that brilliant support 800, and then improve the separation efficiency that brilliant support 800.
Illustratively, after the wafer is degummed, the wafer carrier 800 is transported to the station to be loaded (i.e., the last station of the flip-top loading apparatus 100) with the backing plate 82 under the wafer carrier 81, and the loading mechanism 12 retrieves the wafer carrier 800 from the station to be loaded. The turnover mechanism 11 receives the crystal support 800, rotates the crystal support by 180 degrees, and then places the crystal support on the first conveying line 700, and conveys the crystal support to the electromagnetic heating station along with the first conveying line 700.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (20)

1. The utility model provides a upset loading attachment, is applied to brilliant support separation production line, brilliant support includes the brilliant layer board of metal material and the backing plate that can take place deformation after the temperature variation, the backing plate bond in on the brilliant layer board, a serial communication port includes:
The feeding mechanism is used for acquiring and transferring the crystal support;
the turnover mechanism is used for receiving and turnover the crystal support transported by the feeding mechanism so that the base plate is positioned above the crystal support plate;
the first conveying line is used for receiving the crystal support turned by the turning mechanism and conveying the crystal support.
2. The flip-top loading device of claim 1, wherein,
the turnover mechanism comprises a turnover bearing part and a turnover driving part, and the turnover bearing part is used for bearing the crystal support transported by the feeding mechanism;
the overturning driving part is connected with the overturning supporting part, the overturning driving part is used for driving the overturning supporting part to overturn between a first position and a second position, the overturning supporting part is used for supporting the crystal support transported by the feeding mechanism when the overturning supporting part is positioned at the first position, and the overturning supporting part is used for placing the crystal support on the first conveying line when the overturning supporting part is positioned at the second position.
3. The flip-top loading device of claim 2, wherein,
the first conveying line is provided with an empty avoidance groove, and the empty avoidance groove is used for accommodating at least part of the overturning bearing part;
The turnover receiving portion is configured such that, in the second position, a portion of the turnover receiving portion is received in the void-avoidance groove, and the wafer pallet is received by the first conveyor line.
4. The turnover feeding device of claim 3, wherein the turnover feeding device comprises a turnover frame,
the flip-flop receiving portion includes a first clamping portion and a second clamping portion that are spaced apart in a flip-flop direction of the flip-flop receiving portion to accommodate the wafer carrier.
5. The flip-top loading device of claim 4, wherein,
in the process that the overturning supporting part rotates from the first position to the second position, the crystal support is supported by the first clamping part to be supported by the second clamping part;
when the turnover receiving part is at the second position, the clearance groove accommodates at least part of the second clamping part.
6. The flip-top loading device of claim 5, wherein,
the second clamping part comprises a plurality of second sub-clamping parts which are spaced apart in the conveying direction of the first conveying line, a plurality of spaced apart empty avoidance grooves are formed in the first conveying line, and each second sub-clamping part is accommodated in the corresponding empty avoidance groove when the overturning supporting part is positioned at the second position;
The first conveying line comprises a plurality of rotating rollers used for conveying the crystal support, and the rotating rollers used for bearing the crystal support are arranged between at least two adjacent empty avoidance grooves.
7. The flip-top loading device of claim 4, wherein,
the turnover mechanism further comprises a feeding conveying line, wherein the feeding conveying line is used for receiving the crystal support transported by the feeding mechanism and transporting the crystal support to the turnover receiving part;
the turnover bearing part further comprises a rotating frame, the rotating frame is connected with the turnover driving part, one end of the first clamping part is connected with one end of the second clamping part, the other end of the first clamping part is spaced from the other end of the second clamping part to form a clamping opening, and the turnover bearing part is configured in the first position, and the clamping opening faces the feeding conveying line to bear the crystal support.
8. The flip-top loading device of claim 7, wherein,
the clamping opening is internally provided with a position sensor, and the position sensor is used for sensing the position of the crystal support.
9. The flip-top loading device of claim 1, wherein,
The feeding mechanism comprises a crystal support fixing part and a transfer assembly, wherein the crystal support fixing part is used for fixing the crystal support, and the transfer assembly is used for driving the crystal support fixing part to move so as to transfer the crystal support to the turnover mechanism.
10. The flip-top loading device of claim 9, wherein,
the transfer assembly comprises a first transfer part and a second transfer part, wherein the first transfer part is connected with the crystal support fixing part and is used for driving the crystal support fixing part to move in the up-down direction;
the second transfer part is used for driving the first transfer part to move along a first direction, and the first direction is intersected with the up-down direction.
11. The flip-top loading device of claim 10, wherein,
the first transfer part comprises a mounting part, a first guide rail, a first sliding block and a first driving part, wherein the mounting part is connected with the second transfer part, the first sliding block is arranged on the mounting part, the first guide rail extends along the vertical direction and is in sliding connection with the first sliding block, the first driving part is arranged on the mounting part and drives the first guide rail to lift along the first sliding block, and the end part of the first guide rail is connected with the crystal support fixing part.
12. The turnover feeding device of claim 11, wherein the first driving member is connected with the first guide rail through a first transmission member;
the first transmission piece comprises a first gear and a first rack which are meshed with each other, the first gear is connected with the first driving piece, and the first rack is arranged on the first guide rail and extends along the up-down direction.
13. The flip-top loading device of claim 11, wherein,
the second transfer part comprises a second guide rail, a second sliding block and a second driving piece;
the second guide rail extends along the first direction, the mounting piece is in sliding fit with the second guide rail through the second sliding block, and the second driving piece is arranged on the mounting piece and used for driving the mounting piece to slide along the second guide rail.
14. The flip-top loading device of claim 13, wherein,
the second driving piece with be provided with the second driving piece between the second guide rail, the second driving piece includes second gear and the second rack of intermeshing, the second gear with the second driving piece is connected, the second rack set up in the second guide rail and follow the first direction extends.
15. The flip-top loading device of claim 9, wherein,
the crystal support fixing part comprises an electromagnetic absorption part, and the electromagnetic absorption part is used for magnetically absorbing a crystal supporting plate of the crystal support.
16. The flip-top loading device of claim 15, wherein,
the electromagnetic attraction member is configured as an electromagnet, and the electromagnet is configured to remain magnetic after power failure.
17. The roll-over loading device of any one of claims 1-16, wherein,
the overturning feeding device further comprises a frame, and the feeding mechanism and the overturning mechanism are both arranged on the frame.
18. The flip-top loading device of claim 17, wherein,
the frame comprises a frame and a grid protective door, the frame is provided with a first end and a second end which are opposite, the first end and the second end are both open, the first end is arranged corresponding to the last station, and the second end is arranged corresponding to the first conveying line;
the number of the grid protection doors is two, the two grid protection doors are oppositely arranged, and the grid protection doors are connected with the frame and located between the first end and the second end.
19. The flip-top loading device of claim 18, wherein,
the frame still includes the base, the base with frame coupling, tilting mechanism set up in the base, the base is provided with the water receiving tank, the water receiving tank is used for collecting by brilliant support drip.
20. A crystal support separation line for separating the crystal support plate from the backing plate, characterized by comprising the overturning and feeding device according to any one of claims 1 to 19.
CN202322378235.1U 2023-08-31 2023-08-31 Overturning feeding device and crystal support separation production line Active CN220787161U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322378235.1U CN220787161U (en) 2023-08-31 2023-08-31 Overturning feeding device and crystal support separation production line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322378235.1U CN220787161U (en) 2023-08-31 2023-08-31 Overturning feeding device and crystal support separation production line

Publications (1)

Publication Number Publication Date
CN220787161U true CN220787161U (en) 2024-04-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322378235.1U Active CN220787161U (en) 2023-08-31 2023-08-31 Overturning feeding device and crystal support separation production line

Country Status (1)

Country Link
CN (1) CN220787161U (en)

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