CN220738851U - Semiconductor device surface flaw foreign matter detection processing equipment - Google Patents
Semiconductor device surface flaw foreign matter detection processing equipment Download PDFInfo
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- CN220738851U CN220738851U CN202322423334.7U CN202322423334U CN220738851U CN 220738851 U CN220738851 U CN 220738851U CN 202322423334 U CN202322423334 U CN 202322423334U CN 220738851 U CN220738851 U CN 220738851U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 238000001514 detection method Methods 0.000 title abstract description 5
- 239000000428 dust Substances 0.000 claims abstract description 63
- 238000001179 sorption measurement Methods 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 230000007547 defect Effects 0.000 claims abstract description 17
- 230000002950 deficient Effects 0.000 claims abstract description 17
- 239000000969 carrier Substances 0.000 claims abstract description 14
- 238000007598 dipping method Methods 0.000 claims abstract description 5
- 238000004090 dissolution Methods 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 208000033999 Device damage Diseases 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The utility model discloses a semiconductor device surface flaw foreign matter detection processing device, which comprises a platform base, a product placing table, a carrier placing table and a container, wherein the product placing table, the carrier placing table and the container are arranged on the platform base; the automatic carrier pickup module is further arranged above the platform base and used for picking up the dust removing carriers from the carrier placement table, dipping the dust removing carriers in the adsorption solution in the container and enabling the dust removing carriers dipped with the adsorption solution to be in contact with the defect and foreign matters on the surface of the semiconductor device; and after the defective foreign matters are fused or dissolved by the adsorption solution, driving the dust removing carrier to reset and replacing a new dust removing carrier. The application adopts image recognition and adsorption dissolution mode, and the tension of molecules inside the dissolution liquid is utilized to take away the foreign matters after dissolution, so that foreign matters on the surface of an article can be removed, and damage or secondary pollution on the surface of the article can be avoided.
Description
Technical Field
The utility model relates to the technical field of semiconductor detection, in particular to a device for detecting and processing surface flaws and foreign matters of a semiconductor device.
Background
In the process of manufacturing and assembling electronic components and optical elements, surface appearance inspection is generally required for the electronic components and the optical elements. Surface appearance inspection is generally to detect whether or not the surface of an electronic component and the surface of an optical element have surface appearance problems such as flaws, dirt, scratches, cracks, breakage, dust, fingerprints, watermarks, wire bond anomalies, die bond anomalies, and the like. When the surfaces of the electronic components and the surfaces of the optical elements are inspected for dust, it is also necessary to clean the surfaces of the electronic components and the surfaces of the optical elements with dust. The existing dust removing device generally adopts a wet cleaning method or an air blowing cleaning method to clean the surfaces of electronic components and optical components.
When foreign matter adhering to the surface of an object appears, the object is generally treated by the following methods: sticking, cleaning, erasing, blowing and adsorbing, and has the defects: foreign matters with strong adhesive force cannot be removed, damage to the surface of the article exists, and secondary pollution is easy to generate.
Disclosure of Invention
The utility model aims to solve the technical problems that the existing dust removing device damages the surface of a device and is easy to cause secondary pollution.
In order to solve the technical problems, a first aspect of the present utility model provides a device for detecting and processing surface defects and foreign matters of semiconductor devices, which comprises a platform base, a product placement table, a carrier placement table and a container, wherein the product placement table, the carrier placement table and the container are arranged on the platform base, a CCD image recognition module is arranged corresponding to the product placement table, and the CCD image recognition module is used for moving to the product placement table to obtain surface images of each semiconductor device; the automatic carrier pickup module is further arranged above the platform base and used for picking up the dust removing carriers from the carrier placement table, dipping the dust removing carriers in the adsorption solution in the container and enabling the dust removing carriers dipped with the adsorption solution to be in contact with the defect and foreign matters on the surface of the semiconductor device; and after the defective foreign matters are fused or dissolved by the adsorption solution, driving the dust removing carrier to reset and replacing a new dust removing carrier.
Further, the device for detecting and processing the surface defect and foreign matter of the semiconductor device comprises a first Y-direction linear module, and the product placing table is arranged on the first Y-direction linear module, so that the product placing table moves back and forth along the Y-direction on the platform base.
Further, the semiconductor device surface defect foreign matter detection processing equipment comprises a second Y-direction linear module, wherein the carrier placement table is arranged on the second Y-direction linear module, so that the carrier placement table moves back and forth along the Y-direction on the platform base, and the first Y-direction linear module and the second Y-direction linear module are arranged on the platform base side by side.
Further, a first support frame is arranged on one side, perpendicular to the first Y-direction linear module and the second Y-direction linear module, of the platform base, a first X-direction linear module is arranged on the first support frame, the CCD image recognition module is arranged on the first X-direction linear module through a first Z-direction linear module, and the first X-direction linear module, the first Z-direction linear module and the first Y-direction linear module act together to enable the CCD image recognition module to collect surface images of each semiconductor device on the product placing table.
Further, a second support frame is arranged on the other side, opposite to the first support frame, of the platform base, a second X-direction linear module is arranged on the second support frame, the carrier automatic pickup module is arranged on the second X-direction linear module through a second Z-direction linear module, and the second X-direction linear module, the second Z-direction linear module and the second Y-direction linear module jointly act to enable the carrier automatic pickup module to pick up dust removal carriers from the carrier placement table, dip in adsorption solution in a container and enable the dust removal carriers dipped in the adsorption solution to contact with defective foreign matters on the surface of the semiconductor device; and after the defective foreign matters are fused or dissolved by the adsorption solution, driving the dust removing carrier to reset and replacing a new dust removing carrier.
Further, a liquid level sensor is further arranged on one side of the automatic carrier pickup module, and the liquid level sensor is used for identifying the liquid level distance of the adsorbed liquid in the container.
Further, the device for detecting and processing the surface flaws and foreign matters of the semiconductor device further comprises an industrial personal computer, wherein the industrial personal computer is electrically connected with the first Y-direction linear module, the second Y-direction linear module, the first X-direction linear module, the first Z-direction linear module, the CCD image recognition module, the second X-direction linear module, the second Z-direction linear module, the carrier automatic pickup module and the liquid level sensor.
Specifically, a plurality of semiconductor devices are uniformly arranged in the product placement table, and the industrial control host records the initial position of each semiconductor device on the platform base.
Specifically, a plurality of dust removal carriers are uniformly arranged in the carrier placement table, and the industrial control host records the initial positions of each dust removal carrier and the center of the container on the platform base.
The technical scheme of the utility model has the beneficial effects that:
according to the device for detecting and processing the defective foreign matters on the surface of the semiconductor device, disclosed by the embodiment of the utility model, the defective foreign matters on the surface of the semiconductor device are rapidly identified through the CCD image identification module, then the carrier automatic pickup module is utilized to pick up the dust removing carrier, the dust removing carrier is immersed into a container filled with special chemical liquid (hereinafter referred to as adsorption solution), the adsorption solution is dipped into the container, the dust removing carrier is separated from the adsorption solution in the container, the adsorption solution on the surface of the dust removing carrier forms a water drop shape under the action of gravity and self tension, and meanwhile, the water drop shape adsorption solution is tightly adhered to the dust removing carrier. The dust removal carrier contacts the water droplet-shaped adsorption solution with the defective foreign matters which need to be removed on the surface of the article, after the foreign matters are dissolved in the adsorption solution, the dust removal carrier leaves the surface of the article with the water droplet-shaped adsorption solution, and at the moment, the foreign matters are dissolved in the liquid to be taken away together.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic three-dimensional diagram of a device for detecting and treating surface defects and foreign matters of a semiconductor device according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a three-dimensional structure of a device for detecting and treating surface defects and foreign matters of a semiconductor device according to an embodiment of the present utility model;
FIG. 3 is a schematic top view of a device for detecting and treating surface defects and foreign matters of a semiconductor device according to an embodiment of the present utility model;
FIG. 4 is a schematic diagram showing a left-hand structure of a device for detecting and treating surface defects and foreign matters of a semiconductor device according to an embodiment of the present utility model;
FIG. 5 is a schematic diagram showing a right-hand view of a device for detecting and treating surface defects and foreign matters of a semiconductor device according to an embodiment of the present utility model;
fig. 6 is a schematic view of the structure of a dust removing carrier according to an embodiment of the present utility model.
The device comprises a 1-platform base, a 2-first Y-direction linear module, a 3-second Y-direction linear module, a 4-product placing table, a 5-carrier placing table, a 6-dust removing carrier, 61-metal pipe needles, 62-viscose parts, 7-containers, 8-first support frames, 9-first X-direction linear modules, 10-first Z-direction linear modules, 11-CCD image recognition modules, 12-second support frames, 13-second X-direction linear modules, 14-second Z-direction linear modules, 15-carrier automatic pickup modules, 16-liquid level sensors and 17-semiconductor devices.
Detailed Description
The following describes the embodiments of the present utility model further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present utility model, but is not intended to limit the present utility model. In addition, the technical features of the embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
Example 1
As shown in fig. 1-5, an embodiment of the present utility model provides a device for detecting and processing defective foreign matter on a surface of a semiconductor device, which includes a platform base 1, a product placement table 4 disposed on the platform base 1, a carrier placement table 5, and a container 7, wherein a CCD image recognition module 11 is disposed corresponding to the product placement table 4, and the CCD image recognition module 11 is configured to move onto the product placement table 4 to obtain a surface image of each semiconductor device 17; a carrier automatic pickup module 15 is further arranged above the platform base 1 and is used for picking up the dust removing carrier 6 from the carrier placing table 5, dipping the dust removing carrier 6 in the adsorption solution in the container 7 and contacting the dust removing carrier 6 dipped with the adsorption solution with the defect and foreign matters on the surface of the semiconductor device 17; and after the defective foreign matters are fused or dissolved by the adsorption solution, driving the dust removing carrier 6 to reset and replacing a new dust removing carrier 6. Specifically, the adsorption solution in the container 7 may be a gel-like substance, may have solubility, and may be a cleaning medium as described in CN114761471a, or a composition for forming a coating film for removing foreign matters as described in CN 116034453A, and the adsorption solution may be selected from the above-mentioned conventional products, including, but not limited to.
As shown in fig. 1 and 2, the apparatus for detecting and processing defective foreign matter on the surface of a semiconductor device includes a first Y-direction linear module 2, and the product placement table 4 is disposed on the first Y-direction linear module 2, so that the product placement table 4 moves back and forth along the Y-direction on the platform base 1.
As shown in fig. 1 and 2, the device for detecting and processing the surface defect and foreign matter of the semiconductor device includes a second Y-direction linear module 3, and the carrier placement table 5 is disposed on the second Y-direction linear module 3, so that the carrier placement table 5 moves back and forth along the Y-direction on the platform base 1, and the first Y-direction linear module 4 and the second Y-direction linear module 3 are disposed on the platform base 1 side by side.
As shown in fig. 1 and 2, a first support frame 8 is disposed on a side of the platform base 1 perpendicular to the first Y-direction linear module 2 and the second Y-direction linear module 3, a first X-direction linear module 9 is disposed on the first support frame 8, the CCD image recognition module 11 is disposed on the first X-direction linear module 9 through a first Z-direction linear module 10, and the first X-direction linear module 9, the first Z-direction linear module 10 and the first Y-direction linear module 2 cooperate to enable the CCD image recognition module 11 to collect surface images of each semiconductor device 17 on the product placement table 4.
As shown in fig. 1 and 2, a second support frame 12 is disposed on the other side opposite to the first support frame 8 on the platform base 1, a second X-direction linear module 13 is disposed on the second support frame 12, the automatic carrier pickup module 15 is disposed on the second X-direction linear module 13 through a second Z-direction linear module 14, and the second X-direction linear module 13, the second Z-direction linear module 14 and the second Y-direction linear module 3 cooperate to make the automatic carrier pickup module 15 pick up the dust removing carrier 6 from the carrier placement table 5, dip in the adsorption solution in the container, and contact the dust removing carrier 6 dipped with the adsorption solution with the defective foreign matter on the surface of the semiconductor device 17; and after the defective foreign matters are fused or dissolved by the adsorption solution, driving the dust removing carrier 6 to reset and replacing a new dust removing carrier 6.
Specifically, the automatic carrier pickup module 15 may adopt a structure of clamping, magnetic attraction, negative pressure adsorption, or the like, and grasp the dust removing carrier 6 from the carrier placement table 5 and may replace the dust removing carrier 6 onto the carrier placement table 5 after use.
As shown in fig. 1 and 2, a liquid level sensor 16 is further disposed on one side of the automatic carrier pickup module 15, and the liquid level sensor 16 is used for identifying the liquid level distance of the adsorbed liquid in the container.
Optionally, the device for detecting and processing the surface defects and foreign matters of the semiconductor device further comprises an industrial personal computer, and the industrial personal computer is electrically connected with the first Y-direction linear module 2, the second Y-direction linear module 3, the first X-direction linear module 9, the first Z-direction linear module 10, the CCD image recognition module 11, the second X-direction linear module 13, the second Z-direction linear module 14, the carrier automatic pickup module 15 and the liquid level sensor 16.
Specifically, a plurality of semiconductor devices 17 are uniformly arranged in the product placement table 4, and the industrial control host records the initial position of each semiconductor device 17 on the platform base 1.
Specifically, a plurality of dust removal carriers 6 are uniformly arranged in the carrier placement table 5, and the industrial control host records the initial position of the center of each dust removal carrier 6 and the center of the container 7 on the platform base 1.
As shown in fig. 6, the dust removing carrier 6 includes a metal tubular needle 61, a drop-shaped adhesive part 622 is formed at the end due to gravity after dipping the adsorption solution, on the basis of the known physical and chemical performance parameters of the adsorption solution, when the dust removing carrier is disassembled into a container so that the metal tubular needle 621 is immersed in the adsorption solution, the adsorption solution enters the metal tubular needle 61, the immersion depth is assumed to be H, the inner diameter boundary area of the metal tubular needle 61 is assumed to be s, the amount of the adsorption solution dipped in each immersion is assumed to be v=hs, and the height h=k1.v of the drop-shaped adhesive part 62 is formed; the outer diameter L of the adhesive part 62 is l=k2.v, and k1, k2 can be obtained by a controlled variable method test method; so that the height H and the outer diameter L of the water droplet-shaped adhesive part 62 can be adjusted by the immersion depth H.
According to the device for detecting and processing the defective foreign matters on the surface of the semiconductor device, disclosed by the embodiment of the utility model, the defective foreign matters on the surface of the semiconductor device are rapidly identified through the CCD image identification module, then the carrier automatic pickup module is utilized to pick up the dust removing carrier, the dust removing carrier is immersed into a container filled with special chemical liquid (hereinafter referred to as adsorption solution), the adsorption solution is dipped into the container, the dust removing carrier is separated from the adsorption solution in the container, the adsorption solution on the surface of the dust removing carrier forms a water drop shape under the action of gravity and self tension, and meanwhile, the water drop shape adsorption solution is tightly adhered to the dust removing carrier. The dust removal carrier contacts the water droplet-shaped adsorption solution with the defective foreign matters which need to be removed on the surface of the article, after the foreign matters are dissolved in the adsorption solution, the dust removal carrier leaves the surface of the article with the water droplet-shaped adsorption solution, and at the moment, the foreign matters are dissolved in the liquid to be taken away together.
The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings, but the present utility model is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the utility model, and yet fall within the scope of the utility model.
Claims (9)
1. The device for detecting and processing the surface defect and foreign matters of the semiconductor device is characterized by comprising a platform base, a product placing table, a carrier placing table and a container, wherein the product placing table, the carrier placing table and the container are arranged on the platform base; the automatic carrier pickup module is further arranged above the platform base and used for picking up the dust removing carriers from the carrier placement table, dipping the dust removing carriers in the adsorption solution in the container and enabling the dust removing carriers dipped with the adsorption solution to be in contact with the defect and foreign matters on the surface of the semiconductor device; and after the defective foreign matters are fused or dissolved by the adsorption solution, driving the dust removing carrier to reset and replacing a new dust removing carrier.
2. The apparatus according to claim 1, wherein the apparatus comprises a first Y-direction linear module, and the product placement stage is disposed on the first Y-direction linear module such that the product placement stage moves back and forth along the Y-direction on the stage base.
3. The apparatus according to claim 1, wherein the apparatus comprises a second Y-direction linear module, the carrier placement stage is disposed on the second Y-direction linear module such that the carrier placement stage moves back and forth along the Y-direction on the stage base, and the first Y-direction linear module and the second Y-direction linear module are disposed side by side on the stage base.
4. The apparatus according to claim 3, wherein a first support frame is provided on the platform base at a side perpendicular to the first and second Y-direction linear modules, a first X-direction linear module is provided on the first support frame, the CCD image recognition module is provided on the first X-direction linear module by a first Z-direction linear module, and the first X-direction linear module, the first Z-direction linear module, and the first Y-direction linear module cooperate with the first Y-direction linear module to enable the CCD image recognition module to capture a surface image of each semiconductor device on the product placement table.
5. The apparatus according to claim 4, wherein a second support frame is provided on the other side of the platform base opposite to the first support frame, a second X-direction linear module is provided on the second support frame, the carrier automatic pickup module is provided on the second X-direction linear module by a second Z-direction linear module, and the second X-direction linear module, the second Z-direction linear module and the second Y-direction linear module cooperate to pick up the dust removing carrier from the carrier placement table, dip in the adsorption solution in the container, and contact the dust removing carrier dipped in the adsorption solution with the defect foreign matter on the surface of the semiconductor device; and after the defective foreign matters are fused or dissolved by the adsorption solution, driving the dust removing carrier to reset and replacing a new dust removing carrier.
6. The apparatus according to claim 1, wherein a liquid level sensor for identifying a liquid level distance of the adsorbed liquid in the container is further provided on one side of the carrier automatic pickup module.
7. The apparatus according to claim 5, further comprising an industrial control host electrically connected to the first Y-direction linear module, the second Y-direction linear module, the first X-direction linear module, the first Z-direction linear module, the CCD image recognition module, the second X-direction linear module, the second Z-direction linear module, the carrier auto-pick-up module, and the liquid level sensor.
8. The apparatus according to claim 7, wherein a plurality of semiconductor devices are arranged in the product placement table in a uniform arrangement, and the industrial control host records an initial position of each of the semiconductor devices on the stage base.
9. The apparatus according to claim 7, wherein a plurality of dust removing carriers are uniformly arranged in the carrier placement table, and the industrial control host records an initial position of each dust removing carrier and a center of the container on the platform base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322423334.7U CN220738851U (en) | 2023-09-07 | 2023-09-07 | Semiconductor device surface flaw foreign matter detection processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322423334.7U CN220738851U (en) | 2023-09-07 | 2023-09-07 | Semiconductor device surface flaw foreign matter detection processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220738851U true CN220738851U (en) | 2024-04-09 |
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ID=90566232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322423334.7U Active CN220738851U (en) | 2023-09-07 | 2023-09-07 | Semiconductor device surface flaw foreign matter detection processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220738851U (en) |
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2023
- 2023-09-07 CN CN202322423334.7U patent/CN220738851U/en active Active
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