CN220731482U - Wafer flat edge alignment device - Google Patents
Wafer flat edge alignment device Download PDFInfo
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- CN220731482U CN220731482U CN202322359069.0U CN202322359069U CN220731482U CN 220731482 U CN220731482 U CN 220731482U CN 202322359069 U CN202322359069 U CN 202322359069U CN 220731482 U CN220731482 U CN 220731482U
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- 235000012431 wafers Nutrition 0.000 claims abstract description 210
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- 239000000463 material Substances 0.000 description 6
- 238000000407 epitaxy Methods 0.000 description 5
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Abstract
The utility model discloses a wafer flat edge alignment device, which comprises a frame, a first shaft and a second shaft, wherein a plurality of sliding grooves are formed in the frame, the sliding grooves are arranged in parallel at intervals along the thickness direction of the sliding grooves and are suitable for accommodating a plurality of wafers, the peripheral outline of the wafer comprises an arc edge and a flat edge, and the arc edge can be abutted in the sliding grooves so that the wafer can rotate along the circumferential direction of the sliding grooves in the sliding grooves; the first shaft and the second shaft extend in the same direction along the thickness direction of the chute, the first shaft and the second shaft are arranged on the lower side of the chute, the first shaft and the second shaft are arranged at intervals, so that a plurality of circular arc edges of the wafer can be simultaneously abutted to the first shaft and the second shaft, and the length dimension of the flat edge is larger than or equal to the distance dimension of the first shaft and the second shaft. The wafer flat edge alignment device provided by the embodiment of the utility model has the advantage of higher alignment efficiency.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer flat edge alignment device.
Background
In the semiconductor epitaxy process, a layer of monocrystalline film is grown on a monocrystalline substrate, a new monocrystalline layer is grown outwards according to the crystal orientation of the substrate, the peripheral outline of a wafer is provided with a flat edge for determining the crystal orientation and informing the dissociation direction, the flat edge can be used as a reference for mechanical positioning of the wafer in subsequent epitaxy equipment, the crystal orientation and the conductivity type are identified, and the flat edges of a plurality of wafers need to be aligned in the epitaxy process to improve the uniformity of the epitaxial layer. The flat edges of the wafers in the related technology are manually aligned, and the alignment efficiency is low.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems in the related art to some extent. Therefore, the embodiment of the utility model provides a wafer flat edge alignment device, which has the advantage of higher alignment efficiency.
The wafer flat edge alignment device comprises a frame, wherein a plurality of sliding grooves are formed in the frame, the sliding grooves are arranged in parallel at intervals along the thickness direction of the frame and are suitable for accommodating a plurality of wafers, the peripheral outline of each wafer comprises an arc edge and a flat edge, and the arc edges can be abutted in the sliding grooves so that the wafers can rotate along the circumferential direction of the sliding grooves in the sliding grooves; the first shaft and the second shaft extend in the same direction along the thickness direction of the sliding groove, the first shaft and the second shaft are arranged on the lower side of the sliding groove, the first shaft and the second shaft are arranged at intervals, so that a plurality of circular arc edges of the wafers can be simultaneously abutted to the first shaft and the second shaft, the first shaft and the second shaft can rotate in the same direction to drive the wafers to rotate in the same direction, the length dimension of the flat edge is larger than or equal to the interval dimension of the first shaft and the second shaft, and when the first shaft and the second shaft are respectively positioned at two ends of the flat edge, the wafers stop rotating to enable the flat edges of the wafers to be aligned.
According to the wafer flat edge alignment device, the circular arc edges of a plurality of wafers are abutted against the first shaft and the second shaft, the wafers are driven to rotate in the same direction through rotation of the first shaft and the second shaft, when the first shaft and the second shaft are in contact with the circular arc edges, the wafers are quickly rotated to the positions where the first shaft and the second shaft are separated from the circular arc edges under the common driving of the first shaft and the second shaft, then the wafers are slowly rotated to the positions where the second shaft is separated from the circular arc edges under the single driving of the second shaft, at the moment, the first shaft is positioned at one end of the wafer flat edge and is spaced from the peripheral outline of the wafer, the second shaft is positioned at the other end of the wafer flat edge and is spaced from the peripheral outline of the wafer, the first shaft and the second shaft are separated from the peripheral outline of the wafer, the wafers stop rotating under the friction effect of the chute bottom and are stopped at the positions where the first shaft and the second shaft are separated from the peripheral outline of the wafer, and compared with the wafer flat edge alignment device of the embodiment of the manual alignment mode in related technology, the wafer flat edge alignment device has the advantages of high alignment efficiency.
In some embodiments, the first shaft and the second shaft rotate in the same direction to drive any point on the outer contour of the wafer to rotate in a direction from the first shaft to the second shaft, the flat edge has a first end and a second end, and during rotation of the wafer, when the second end is disengaged from the second shaft and has a set spacing, the first end is also spaced from the first shaft, and both the first shaft and the second shaft are disengaged from the outer contour of the wafer to enable the wafer to rest under friction with the chute.
In some embodiments, the linear velocity of the first shaft surface is greater than the linear velocity of the second shaft surface.
In some embodiments, the wafer flat edge alignment device comprises a driver, wherein a first belt and a second belt are arranged on the driver, the driver is arranged on the rack, the driver is in transmission connection with the first shaft belt through the first belt, the driver is in transmission connection with the second shaft through the second belt, and the linear speed of the first belt is smaller than the linear speed of the second belt.
In some embodiments, the output end of the driver is provided with a first driving wheel and a second driving wheel, the first belt is sleeved on the first driving wheel and the outer peripheral side of the first shaft, the second belt is sleeved on the second driving wheel and the outer peripheral side of the second shaft, and the diameter of the first driving wheel is larger than that of the second driving wheel.
In some embodiments, a coefficient of friction between the first axial surface and the rounded edge of the wafer is greater than a coefficient of friction between the second axial surface and the rounded edge of the wafer.
In some embodiments, a coefficient of friction between the rounded edge of the wafer and the bottom of the chute is less than a coefficient of friction between the second axial surface and the rounded edge of the wafer.
In some embodiments, the first shaft has a diameter dimension that is greater than a diameter dimension of the second shaft.
In some embodiments, the wafer flat edge alignment device further includes a magazine, the magazine is disposed on the frame, a plurality of slots are disposed in the magazine to accommodate a plurality of wafers, and a plurality of slide slots are disposed in one-to-one correspondence with a plurality of slots, so that the wafers can be fitted in the slide slots and the slots corresponding thereto, and an opening is disposed at a lower end of the magazine for a part of the wafers to extend out and can abut against the first shaft and the second shaft.
In some embodiments, the wafer flat edge alignment device further comprises a plurality of sensors, wherein the plurality of sensors are arranged in one-to-one correspondence with the plurality of sliding grooves, and the sensors are suitable for detecting whether the corresponding sliding grooves are provided with wafers.
Drawings
Fig. 1 is a schematic structural view of a wafer flat-edge alignment apparatus according to an embodiment of the present utility model.
Fig. 2 is a schematic front view of a wafer flat-edge alignment apparatus according to an embodiment of the present utility model.
Fig. 3 is a schematic rear view of a wafer flat-edge alignment apparatus according to an embodiment of the present utility model.
Fig. 4 is a schematic diagram of a driver of a wafer flat edge alignment apparatus according to an embodiment of the present utility model.
Fig. 5 is a schematic view of a wafer flat edge alignment apparatus according to an embodiment of the present utility model.
Reference numerals:
a frame 1; a support block 11; a chute 111; a sensor 12;
a first shaft 2; a first belt 21; a second shaft 3; a second belt 31;
a driver 4; a first capstan 41; a second drive wheel 42;
a magazine 5; a slot 51;
a wafer 6; a circular arc edge 61; a flat edge 62.
Detailed Description
Reference will now be made in detail to embodiments of the present utility model, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
The wafer flat alignment apparatus according to the embodiment of the present utility model is described below with reference to fig. 1, 2, 3, 4 and 5.
The wafer flat edge alignment device of the embodiment of the utility model comprises a frame 1, a first shaft 2 and a second shaft 3.
The frame 1 is provided with a plurality of sliding grooves 111, the sliding grooves 111 are arranged at intervals in parallel along the thickness direction of the frame to be suitable for accommodating a plurality of wafers 6, the peripheral outline of each wafer 6 comprises a circular arc edge 61 and a flat edge 62, and the circular arc edges 61 can be abutted in the sliding grooves 111 so that the wafers 6 can rotate in the sliding grooves 111 along the circumferential direction of the sliding grooves.
Specifically, the upper end of the frame 1 is provided with a supporting block 11, the supporting block 11 is provided with a plurality of sliding grooves 111 extending along the left-right direction, and the plurality of sliding grooves 111 are uniformly arranged at intervals along the front-rear direction, so that the wafer 6 can be assembled on the sliding grooves 111 in a sliding manner, and the peripheral outline of the wafer 6 can rotate along the groove bottom of the sliding grooves 111.
The peripheral outline of the wafer 6 is a circular arc edge 61 with a major arc shape and a flat edge 62 connected between two major arc ends, the flat edge 62 can be used as a reference for mechanical positioning of the wafer 6 in subsequent epitaxy equipment, the wafer 6 is used for identifying the crystal orientation and the conductivity type, and the flat edges 62 of a plurality of wafers 6 need to be aligned in the epitaxy process to improve the uniformity of an epitaxial layer. The arc edge 61 of the wafer 6 can abut against the bottom of the chute 111 and rotate relative to the chute 111.
The first shaft 2 and the second shaft 3 extend along the thickness direction of the chute 111 in the same direction, the first shaft 2 and the second shaft 3 are arranged at the lower side of the chute 111, the first shaft 2 and the second shaft 3 are arranged at intervals, so that the circular arc edges 61 of the wafers 6 can be simultaneously abutted against the first shaft 2 and the second shaft 3, the first shaft 2 and the second shaft 3 can rotate in the same direction to drive the wafers 6 to rotate in the same direction, the length dimension of the flat edge 62 is greater than or equal to the distance dimension between the first shaft 2 and the second shaft 3, and when the first shaft 2 and the second shaft 3 are respectively positioned at two ends of the flat edge 62, the wafers 6 stop rotating to align the flat edges 62 of the wafers 6.
Specifically, the first shaft 2 and the second shaft 3 extend in the front-rear direction, the first shaft 2 and the second shaft 3 are arranged in parallel at intervals in the horizontal left-right direction, and the first shaft 2, the second shaft 3 and the support block 11 are arranged in the circumferential direction of the wafer 6 so that the circular arc edge 61 of the wafer 6 can be simultaneously abutted against the first shaft 2, the second shaft 3 and the groove bottom of the chute 111.
The first shaft 2 and the second shaft 3 rotate in the same direction, the circular arc edge 61 of the wafer 6 contacts with the first shaft 2 and the second shaft 3 at the same time, the wafer 6 rotates in the direction a in fig. 5 under the friction effect, and any point on the wafer 6 passes through the first shaft 2 and then passes through the second shaft 3 in the process of rotating the wafer 6.
When the flat edge 62 moves to the position of the first shaft 2, the first shaft 2 is out of contact with the wafer 6, the wafer 6 is driven to rotate only by the contact of the second shaft 3 with the wafer 6, and when the end part of the flat edge 62 moves to the position of the second shaft 3, the first shaft 2 and the second shaft 3 are out of contact with the wafer 6, and at the moment, the wafer 6 stops rotating and keeps in a static state under the friction effect between the circular arc edge 61 of the wafer 6 and the bottom of the chute 111.
The first axis 2 and the second axis 3 have the same pitch dimension as the length dimension of the flat edge 62, and when the wafer 6 is stationary, the first axis 2 and the second axis 3 are located at both ends of the flat edge 62 and are not in contact with the wafer 6, respectively, so that the wafer 6 is stationary at a position where the flat edge 62 extends in the direction of the center line of the first axis 2 and the second axis 3. Thus, the plurality of wafers 6 are driven by the first shaft 2 and the second shaft 3, and the flat edges 62 of the plurality of wafers 6 are aligned while being stationary at positions where the flat edges 62 of the wafers 6 extend in the direction of the center line of the first shaft 2 and the second shaft 3.
According to the wafer flat edge alignment device provided by the embodiment of the utility model, the circular arc edges 61 of the plurality of wafers 6 are abutted against the first shaft 2 and the second shaft 3, the wafers 6 are driven to rotate in the same direction through the rotation of the first shaft 2 and the second shaft 3, when the first shaft 2 and the second shaft 3 are contacted with the circular arc edges 61, the wafers 6 are rapidly rotated to the positions where the first shaft 2 is separated from the circular arc edges 61 under the combined driving action of the first shaft 2 and the second shaft 3, then the wafers 6 are independently driven by the second shaft 3 to slowly rotate until the second shaft 3 is separated from the circular arc edges 61, at the moment, the first shaft 2 and the second shaft 3 are separated from the peripheral outline of the wafers 6, the wafers 6 stop rotating and are stationary at the positions where the first shaft 2 and the second shaft 3 are separated from the peripheral outline of the wafers 6 under the friction action of the chute 111, so that the flat edges 62 of the wafers 6 are aligned.
In some embodiments, the first shaft 2 and the second shaft 3 rotate in the same direction to drive any point on the outer contour of the wafer 6 to rotate in a direction from the first shaft 2 to the second shaft 3, the flat edge 62 has a first end and a second end, and during rotation of the wafer 6, when the second end is disengaged from the second shaft 3 and has a set spacing, the first end is also spaced from the first shaft 2, and both the first shaft 2 and the second shaft 3 are disengaged from the outer contour of the wafer 6 to allow the wafer 6 to rest under friction with the chute 111.
Specifically, after the wafer 6 is stationary under the friction action of the wafer 6 and the chute 111, the first shaft 2 and the first end have a set gap, and the second shaft 3 and the second end have a set gap, so that the first shaft 2 and the second shaft 3 are both separated from contact with the peripheral outline of the wafer 6, and under the friction action of the circular arc edge 61 of the wafer 6 and the bottom of the chute 111, the wafer 6 stops rotating and keeps in a stationary state, so that the flat edges of the plurality of wafers 6 stop at positions where the flat edges 62 are just not contacted with the first shaft 2 and the second shaft 3, and the effect of aligning the flat edges of the plurality of wafers 6 is achieved.
In some embodiments, the linear velocity of the surface of the first shaft 2 is greater than the linear velocity of the surface of the second shaft 3.
Specifically, when the circular arc edge 61 of the wafer 6 is simultaneously contacted with the first shaft 2 and the second shaft 3, since the linear velocity of the surface of the first shaft 2 is greater than that of the surface of the second shaft 3, the wafer 6 rotates at a faster speed under the action of the first shaft 2 until the surface of the first shaft 2 is out of contact with the peripheral contour of the wafer 6, and after the surface of the first shaft 2 is out of contact with the peripheral contour of the wafer 6, the wafer 6 rotates at a slower speed under the driving of the second shaft 3 until the second shaft 3 is also out of contact with the peripheral contour of the wafer 6.
Therefore, under the action of the first shaft 2 and the second shaft 3, the wafer 6 rotates at a faster speed in the process of aligning the flat edge 62, so that the flat edge 62 is quickly close to a set stop position, then under the action of the second shaft 3, the flat edge 62 of the wafer 6 is quickly close to the set stop position and finally is still at the set stop position, on one hand, when the flat edge 62 is far from the set stop position, the wafer 6 is quickly rotated to improve the alignment efficiency of the wafer flat edge alignment device according to the embodiment of the utility model, and on the other hand, after the flat edge 62 is close to the stop position, the rotation speed of the wafer 6 is reduced, the rotation inertia of the wafer 6 is reduced, so that the wafer 6 can stop rotating at the set stop position, and the alignment precision of the wafer flat edge alignment device according to the embodiment of the utility model is improved.
In some embodiments, the wafer flat edge alignment device comprises a driver 4, a first belt 21 and a second belt 31 are arranged on the driver 4, the driver 4 is arranged on the frame 1, the driver 4 is in belt transmission connection with the first shaft 2 through the first belt 21, the driver 4 is in belt transmission connection with the second shaft 3 through the second belt 31, and the linear speed of the first belt 21 is smaller than the linear speed of the second belt 31.
Specifically, the driver 4 is disposed on the frame 1, and an output shaft of the driver 4 is in belt transmission connection with the first shaft 2 through the first belt 21 and is also in belt transmission connection with the second shaft 3 through the second belt 31, so that the power sources of the first shaft 2 and the second shaft 3 are the same, and the rotation consistency is good.
In some embodiments, the output end of the driver 4 is provided with a first driving wheel 41 and a second driving wheel 42, the first belt 21 is sleeved on the outer peripheral sides of the first driving wheel 41 and the first shaft 2, the second belt 31 is sleeved on the outer peripheral sides of the second driving wheel 42 and the second shaft 3, and the diameter of the first driving wheel 41 is larger than that of the second driving wheel 42.
Specifically, the first driving wheel 41 and the second driving wheel 42 are both disposed at the output end of the driver 4, and the diameter of the first driving wheel 41 is larger than that of the second driving wheel 42, so that the surface linear velocity of the first belt 21 is smaller than that of the first generation, and the surface linear velocity of the first shaft 2 is smaller than that of the second shaft 3, so that the wafer 6 has a higher rotation speed when the first shaft 2 and the second shaft 3 are driven together, and a lower rotation speed when the second shaft 3 is driven alone.
In some embodiments, the coefficient of friction between the surface of the first shaft 2 and the arcuate edge 61 of the wafer 6 is greater than the coefficient of friction between the surface of the second shaft 3 and the arcuate edge 61 of the wafer 6.
Thus, when the first shaft 2 and the second shaft 3 drive the wafer 6 to rotate together, the friction action of the first shaft 2 on the circular arc edge 61 of the wafer 6 is larger than the friction action of the second shaft 3 on the circular arc edge 61 of the wafer 6, and when the linear velocity of the circular arc edge 61 is larger than the linear velocity of the second shaft 3, the influence of the second shaft 3 on the rotational velocity of the wafer 6 is reduced, so that the wafer 6 can rotate at a linear velocity close to the first shaft 2 under the condition that the first shaft 2 is dominant.
In some embodiments, the coefficient of friction between the arcuate edge 61 of the wafer 6 and the bottom of the slot 111 is less than the coefficient of friction between the surface of the second shaft 3 and the arcuate edge 61 of the wafer 6.
Specifically, it will be understood that the friction coefficient between the surface of the first shaft 2 and the circular arc edge 61 of the wafer 6 is also greater than the friction coefficient between the circular arc edge 61 of the wafer 6 and the groove bottom of the chute 111, when the circular arc edge 61 of the wafer 6 contacts the first shaft 2 and the second shaft 3 simultaneously, the first shaft 2 and the second shaft 3 drive the wafer 6 to rotate under the action of the chute 111, but the driving action of the first shaft 2 and the second shaft 3 on the wafer 6 is greater than the blocking action of the chute 111 on the wafer 6, so that the wafer 6 can still rotate under the driving action of the first shaft 2 and the second shaft 3, and when the second shaft 3 drives the wafer 6 to rotate, the driving action of the second shaft 3 on the wafer 6 is also greater than the blocking action of the chute 111 on the wafer 6, so that the wafer 6 can slowly rotate under the driving action of the second shaft 3 until the flat edge 62 of the wafer 6 rotates to the set stop position.
In some embodiments, the diameter dimension of the first shaft 2 is greater than the diameter dimension of the second shaft 3.
Specifically, the diameters of the first shafts 2 and 3 are the same everywhere, and the diameters of the first shafts 2 and 3 are larger than the diameters of the second shafts 3, when the first shafts 2 and 3 are simultaneously contacted with the circular arc edges 61 of the wafer 6, the contact area of the first shafts 2 and the wafer 6 is larger than the contact area of the second shafts 3 and the wafer 6, and the difference between the friction action of the first shafts 2 on the circular arc edges 61 of the wafer 6 and the friction action of the second shafts 3 on the circular arc edges 61 of the wafer 6 is further increased, so that the influence of the second shafts 3 on the rotation speed of the wafer 6 when the first shafts 2 drive the wafer 6 to rotate can be further reduced, and the wafer 6 has higher rotation speed when rotating with the first shafts 2 and the second shafts 3 to improve the alignment efficiency of the wafer flat edge alignment device in the embodiment of the utility model.
In some embodiments, the wafer flat edge alignment device further includes a magazine 5, where the magazine 5 is disposed on the frame 1, a plurality of slots 51 are disposed in the magazine 5 to accommodate a plurality of wafers 6, and a plurality of sliding grooves 111 are disposed in one-to-one correspondence with the plurality of slots 51, so that the wafers 6 can be fitted in the sliding grooves 111 and the corresponding slots 51, and an opening is disposed at a lower end of the magazine 5 to allow a part of the wafers 6 to extend out and be abutted against the first shaft 2 and the second shaft 3.
Specifically, the magazine 5 is detachably connected to the frame 1, a plurality of slots 51 are provided in the magazine 5, the slots 51 extend in the vertical direction, and the plurality of slots 51 are uniformly spaced in the front-rear direction, and the plurality of slots 51 and the plurality of sliding grooves 111 are in one-to-one correspondence in the front-rear direction, so that any one wafer 6 can be fitted into the slot 51 while being fitted into the sliding groove 111 corresponding to the slot 51.
The circular arc edge 61 of the wafer 6 is abutted against the groove bottoms of the first shaft 2, the second shaft 3 and the slide groove 111, and the circular arc edge 61 is abutted against the groove bottoms of the slots 51, and the wafer 6 is supported by the slots 51 and the slide groove 111 together so that the centers of the plurality of wafers 6 are aligned in the front-rear direction.
Therefore, the plurality of wafers 6 can be simultaneously propped against the first shaft 2 and the second shaft 3 through the material box 5 so as to simultaneously perform the operation of the flat edges 62 on the plurality of wafers 6, and after the flat edges 62 of the plurality of wafers 6 are aligned, the plurality of wafers 6 which are aligned with the flat edges 62 can be simultaneously dismounted from the first shaft 2 and the second shaft 3, so that the loading and unloading efficiency of the wafer flat edge alignment device in the embodiment of the utility model is improved, and the alignment efficiency of the wafer flat edge alignment device in the embodiment of the utility model is further improved.
In some embodiments, the wafer flat edge alignment apparatus further includes a plurality of sensors 12, the plurality of sensors 12 being arranged in one-to-one correspondence with the plurality of slide slots 111, the sensors 12 being adapted to detect whether the corresponding slide slots 111 are equipped with the wafer 6.
Specifically, by detecting whether the wafer 6 is mounted in the corresponding chute 111 through the sensor 12, the number of the wafers 6 in the plurality of chutes 111 can be obtained through the plurality of sensors 12, so that the wafer flat edge alignment device according to the embodiment of the utility model can also obtain the number of the wafers 6 in the material box 5 while aligning the flat edges 62 of the plurality of wafers 6, so that the material taking robot can take out the wafers 6 from the material box 5 and send the wafers 6 into the processing equipment.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
For purposes of this disclosure, the terms "one embodiment," "some embodiments," "example," "a particular example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While the above embodiments have been shown and described, it should be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives, and variations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the utility model.
Claims (10)
1. A wafer flat edge alignment apparatus, comprising:
the wafer processing device comprises a rack, wherein a plurality of sliding grooves are formed in the rack, the sliding grooves are arranged in parallel at intervals along the thickness direction of the rack and are suitable for accommodating a plurality of wafers, the peripheral outline of each wafer comprises an arc edge and a plane edge, and the arc edges can be abutted in the sliding grooves so that the wafers can rotate along the circumferential direction of the wafers in the sliding grooves;
the first shaft and the second shaft extend in the same direction along the thickness direction of the sliding groove, the first shaft and the second shaft are arranged on the lower side of the sliding groove, the first shaft and the second shaft are arranged at intervals, so that a plurality of circular arc edges of the wafers can be simultaneously abutted to the first shaft and the second shaft, the first shaft and the second shaft can rotate in the same direction to drive the wafers to rotate in the same direction, the length dimension of the flat edge is larger than or equal to the interval dimension of the first shaft and the second shaft, and when the first shaft and the second shaft are respectively positioned at two ends of the flat edge, the wafers stop rotating to enable the flat edges of the wafers to be aligned.
2. The wafer flat edge alignment apparatus of claim 1, wherein the first and second shafts are rotated in unison to drive rotation of any point on the wafer's outer contour in a direction from the first shaft toward the second shaft, the flat edge having a first end and a second end, the first end also being spaced from the first shaft by a set distance when the second end is spaced from the second shaft during rotation of the wafer, the first and second shafts both being spaced from the wafer's outer contour to allow the wafer to rest under friction with the chute.
3. The wafer flat alignment apparatus of claim 2, wherein a linear velocity of the first shaft surface is greater than a linear velocity of the second shaft surface.
4. The wafer edge alignment apparatus of claim 3, comprising a drive having a first belt and a second belt, the drive being disposed on the frame and being drivingly connected to the first shaft belt by the first belt, the drive being drivingly connected to the second shaft belt by the second belt, the first belt having a linear velocity less than a linear velocity of the second belt.
5. The wafer flat alignment apparatus according to claim 4, wherein the output end of the driver is provided with a first driving wheel and a second driving wheel, the first belt is sleeved on the outer peripheral sides of the first driving wheel and the first shaft, the second belt is sleeved on the outer peripheral sides of the second driving wheel and the second shaft, and the diameter of the first driving wheel is larger than that of the second driving wheel.
6. The wafer flat-edge alignment apparatus of claim 3, wherein a coefficient of friction between the first axial surface and the arcuate edge of the wafer is greater than a coefficient of friction between the second axial surface and the arcuate edge of the wafer.
7. The wafer flat edge alignment apparatus of claim 6, wherein a coefficient of friction between the arcuate edge of the wafer and a bottom of the chute is less than a coefficient of friction between the second axial surface and the arcuate edge of the wafer.
8. The wafer flat alignment apparatus of claim 3, wherein a diameter dimension of the first shaft is greater than a diameter dimension of the second shaft.
9. The wafer flat alignment apparatus according to any of claims 1 to 8, further comprising a magazine provided in the frame, wherein a plurality of slots are provided in the magazine to accommodate a plurality of the wafers, and a plurality of the slide grooves are arranged in one-to-one correspondence with a plurality of the slots so that the wafers can be fitted in the slide grooves and the slots corresponding thereto, and a lower end of the magazine is provided with an opening for a part of the wafers to protrude and to be abutted against the first shaft and the second shaft.
10. The wafer flat edge alignment apparatus of claim 9, further comprising a plurality of sensors disposed in one-to-one correspondence with a plurality of said runners, said sensors adapted to detect whether a wafer is mounted in its corresponding runner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322359069.0U CN220731482U (en) | 2023-08-30 | 2023-08-30 | Wafer flat edge alignment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322359069.0U CN220731482U (en) | 2023-08-30 | 2023-08-30 | Wafer flat edge alignment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220731482U true CN220731482U (en) | 2024-04-05 |
Family
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| CN202322359069.0U Active CN220731482U (en) | 2023-08-30 | 2023-08-30 | Wafer flat edge alignment device |
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| CN (1) | CN220731482U (en) |
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2023
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