CN220730810U - Carrier plate for artificial intelligence development board and artificial intelligence development board - Google Patents
Carrier plate for artificial intelligence development board and artificial intelligence development board Download PDFInfo
- Publication number
- CN220730810U CN220730810U CN202322489652.3U CN202322489652U CN220730810U CN 220730810 U CN220730810 U CN 220730810U CN 202322489652 U CN202322489652 U CN 202322489652U CN 220730810 U CN220730810 U CN 220730810U
- Authority
- CN
- China
- Prior art keywords
- interface
- substrate
- artificial intelligence
- intelligence development
- development board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000013473 artificial intelligence Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000007787 solid Substances 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 230000006870 function Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
The utility model provides a carrier plate for an artificial intelligence development board and the artificial intelligence development board, wherein the carrier plate for the artificial intelligence development board comprises a substrate, wherein a power interface, a Type-C data interface, a solid state disk interface, a Micro USB interface, a Type-C3.0 interface, a WiFi module interface, a USB 3.0 interface, a Debug port, a MIPI CSI camera interface, a Micro SD card slot, a plurality of bus interfaces, an RJ45 network cable interface and a WIFI antenna interface are welded on one side of the substrate; a fan interface, a Jetson OrinnX/NANO Module slot and a BATT interface are welded on the other side of the substrate, and the interfaces are electrically connected with each other through a printed circuit on the substrate; through the good structural and positional layout, the volume of the artificial intelligence development board is reduced.
Description
Technical Field
The utility model relates to the technical field of artificial intelligence, in particular to a carrier plate for an artificial intelligence development plate, and further provides the artificial intelligence development plate.
Background
With the rise of the internet of things, intelligent applications are increasing, and intelligent products are continuously appearing. The intelligent application scene has wide involved range and various coverage types; the intelligent application is mainly characterized by comprising sensor application, communication transmission, data analysis, artificial intelligence and control technology, and has certain perceptibility, memory capacity, learning capacity, self-adaption capacity and decision-making capacity and certain man-machine interaction capacity. Therefore, new technical requirements are put forward for the artificial intelligence development board.
However, at present, the types of interfaces on the existing artificial intelligence development boards in the market are single, the number of the interfaces is small, and the requirements of the clients on the high compatibility of the artificial intelligence development boards cannot be met.
Disclosure of Invention
Aiming at the problems in the prior art, the carrier plate for the artificial intelligence development plate provided by the utility model is used for overcoming the defects in the prior art.
The technical scheme adopted by the utility model is as follows:
the carrier plate for the artificial intelligence development board comprises a substrate, wherein a power interface, a Type-C data interface, a solid state disk interface, a Micro USB interface, a Type-C3.0 interface, a WiFi module interface, a USB 3.0 interface, a Debug port, a MIPI CSI camera interface, a Micro SD card slot, a plurality of bus interfaces, an RJ45 network cable interface and a WIFI antenna interface are welded on one side of the substrate; a fan interface, a Jetson Orin NX/NANO Module card slot and a BATT interface are welded on the other side of the substrate, and the power interface, the Type-C data interface, the solid state disk interface, the Micro USB interface, the Type-C3.0 interface, the WiFi Module interface, the USB 3.0 interface, the Debug port, the MIPI CSI camera interface, the Micro SD card slot, the plurality of bus interfaces, the RJ45 network cable interface, the WIFI antenna interface, the fan interface, the Jetson Orin NX/NANO Module card slot and the BATT interface are mutually electrically connected through a printed circuit on the substrate.
In one embodiment, the power interface, the RJ45 network cable interface and the WIFI antenna interface are sequentially arranged from top to bottom and are arranged at the left edge of the substrate, the Type-C data interface, the Micro USB interface, the Type-C3.0 interface, the USB 3.0 interface and the Debug port are sequentially arranged from left to right and are arranged at the upper edge of the substrate, the two MIPI CSI camera interfaces are sequentially arranged from top to bottom and are arranged at the right edge of the substrate, the Micro SD card slot and the bus interfaces are sequentially arranged from right to left and are arranged at the lower edge of the substrate, and the solid state disk interface and the WIFI module interface are sequentially arranged from left to right and are arranged at the middle position of the substrate.
In one embodiment, the fan interface is located at the upper right corner of the base plate, the BATT interface is located at the lower left corner of the base plate, and the Jetson orinx/NANO Module card slot is located at the lower edge of the base plate and is located at the right side of the BATT interface.
In one embodiment, the bus interface comprises one or more types of buses of SPI/12C/CAN/UART/GPIO.
The utility model also provides an artificial intelligence development board which is characterized by comprising the carrier board for the artificial intelligence development board, a solid state disk, a WiFi Module and a Jetson Orin NX/NANO Module, wherein the solid state disk, the WiFi Module and the Jetson Orin NX/NANO Module are respectively and correspondingly inserted on the solid state disk interface, the WiFi Module interface and the Jetson OrinNX/NANO Module clamping groove and are connected and fixed with the substrate through fixing screws.
In one embodiment, the electronic device further comprises a cooling fan, wherein the cooling fan is located on the outer side of the Jetson Orin NX/NANO Module and is fixedly connected with the substrate through a fixing screw.
In one embodiment, the substrate is rectangular, and through holes are respectively arranged at each corner of the substrate.
Compared with the prior art, the carrier plate for the artificial intelligence development plate has the following advantages:
the substrate for the carrier plate of the artificial intelligent development board provided by the utility model is integrated with the power interface, the Type-C data interface, the solid state disk interface, the Micro USB interface, the Type-C3.0 interface, the WiFi Module interface, the USB 3.0 interface, the Debug port, the MIPI CSI camera interface, the Micro SD card slot, the plurality of bus interfaces, the RJ45 network cable interface, the WIFI antenna interface, the fan interface, the Jetson OrinnX/NANO Module card slot and the BATT interface, through good structure and position layout, the size of the carrier plate for the artificial intelligent development board and the whole artificial intelligent development board is greatly reduced, meanwhile, the compatibility of the whole artificial intelligent development board and the expansibility to various functions are greatly improved due to the existence of the interfaces of various types and the interfaces, and the performance of the whole artificial intelligent development board is greatly improved.
Drawings
FIG. 1 is a schematic diagram of a front view structure of an artificial intelligence development board in the utility model;
fig. 2 is a schematic diagram of a rear view structure of the artificial intelligence development board in the utility model.
Detailed Description
In the description of the present utility model, it should be understood that the terms "center," "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and the like indicate an orientation or positional relationship based on that shown in the drawings, merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "plurality" is two or more unless specifically defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
As shown in fig. 1 and 2, for convenience of description, the "up", "down", "left", "right", "front", "rear" azimuth references in the present utility model are based on the azimuth shown in fig. 1;
the carrier plate for the artificial intelligence development board comprises a substrate 1, wherein a power interface 2, a Type-C data interface 3, a solid state disk interface, a Micro USB interface 5, a Type-C3.0 interface 6, a WiFi module interface 7, a USB 3.0 interface 8, a Debug port 9, a MIPI CSI camera interface 10, a Micro SD card slot 11, a plurality of bus interfaces 12, an RJ45 network cable interface 13 and a WIFI antenna interface 14 are welded on the front surface of the substrate 1; a fan interface 15, a Jetson Orin NX/NANO Module card slot 16 and a BATT interface 17 are welded on the back of the substrate, and a power interface 2, a Type-C data interface 3, a solid state disk interface, a Micro USB interface 5, a Type-C3.0 interface 6, a WiFi Module interface 7, a USB 3.0 interface 8, a Debug port 9, a MIPI CSI camera interface 10, a Micro SD card slot 11, a plurality of bus interfaces 12, an RJ45 network cable interface 13, a WIFI antenna interface 14, the fan interface 15, the Jetson OrinnX/NANO Module card slot 16 and the BATT interface 17 are electrically connected with each other through a printed circuit on the substrate 1 so as to realize the common function.
In this embodiment, the power interface 2, the RJ45 network cable interface 13 and the WIFI antenna interface 14 are sequentially arranged from top to bottom and are arranged at the left edge of the substrate 1, the Type-C data interface 3, the Micro USB interface 5, the Type-C3.0 interface 6, the USB 3.0 interface 8 and the Debug port 9 are sequentially arranged from left to right and are arranged at the upper edge of the substrate 1, the two MIPI CSI camera interfaces 10 are sequentially arranged from top to bottom and are arranged at the right edge of the substrate 1, the Micro SD card slot 11 and the plurality of bus interfaces 12 are sequentially arranged from right to left and are arranged at the lower edge of the substrate 1, and the solid state hard disk interface and the WIFI module interface 7 are sequentially arranged from left to right and are arranged at the middle position of the substrate 1;
the fan interface 15 is located at the upper right corner of the back of the substrate 1, the BATT interface 17 is located at the lower left corner of the back of the substrate 1, the Jetson orinx/NANO Module card slot 16 is located at the lower edge of the back of the substrate 1, and is located at the right side of the BATT interface 17.
The carrier plate for the artificial intelligence development board provided by the utility model has the advantages that through good structure and position layout, the size of the carrier plate for the artificial intelligence development board and the whole artificial intelligence development board is greatly reduced, and meanwhile, the compatibility of the whole artificial intelligence development board and the expansibility of various functions are greatly improved due to the existence of the interfaces with various types and numbers.
Preferably, the bus interface 12 comprises buses of one or more types of SPI/12C/CAN/UART/GPIO, and through setting buses of different types and numbers, connection between all parts in the bus interface CAN be conveniently realized, and signal transmission between different devices CAN be realized.
The utility model also provides an artificial intelligence development board which is characterized by comprising the carrier board for the artificial intelligence development board, and further comprising a solid state disk 18, a WiFi Module 19 and a Jetson Orin NX/NANO Module 20, wherein the solid state disk 18, the WiFi Module 19 and the Jetson OrinNX/NANO Module 20 are respectively and correspondingly inserted on the solid state disk interface, the WiFi Module interface 7 and the Jetson OrinNX/NANO Module clamping groove 16 and are connected and fixed with the substrate 1 through fixing screws.
Preferably, the heat dissipation device further comprises a heat dissipation fan 21, wherein the heat dissipation fan 21 is positioned on the outer side of the Jetson OrinNX/NANO Module 20, is fixed on the base plate 1 through screws, and is fixedly connected with the base plate 1 through fixing screws, so that heat dissipation treatment on the Jetson OrinNX/NANO Module 20 is realized.
In this embodiment, the base plate 1 is rectangular, and each corner of the base plate 1 is provided with a through hole for fixing the base plate 1 and the whole artificial intelligence development board, so that the whole artificial intelligence development board can be fixed on the unmanned aerial vehicle or the robot conveniently by using the through hole and matching with a corresponding fixing screw.
The carrier plate for the artificial intelligence development plate and the artificial intelligence development plate provided by the utility model adopt the official original Jetson Orin Nano/OrinNX module, and the carrier plate is provided with a plurality of expansion interfaces and solid state disks, so that the whole artificial intelligence development plate has only half palm size through good structure and position layout, but the requirements of the personalized interface development and structural design of current consumers, such as unmanned aerial vehicles, intelligent robots and the like, can be met.
Any combination of the technical features of the above embodiments may be used, and for brevity, all of the possible combinations of the technical features of the above embodiments are not described, however, they should be considered as the scope of the description provided in this specification as long as there is no contradiction between the combinations of the technical features.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (7)
1. The carrier plate for the artificial intelligence development board is characterized by comprising a substrate, wherein a power interface, a Type-C data interface, a solid state disk interface, a Micro USB interface, a Type-C3.0 interface, a WiFi module interface, a USB 3.0 interface, a Debug port, a MIPI CSI camera interface, a Micro SD card slot, a plurality of bus interfaces, an RJ45 network cable interface and a WIFI antenna interface are welded on one side of the substrate; a fan interface, a Jetson OrinNX/NANO Module card slot and a BATT interface are welded on the other side of the substrate, and the power interface, the Type-C data interface, the solid state disk interface, the Micro USB interface, the Type-C3.0 interface, the WiFi Module interface, the USB 3.0 interface, the Debug port, the MIPI CSI camera interface, the Micro SD card slot, the plurality of bus interfaces, the RJ45 network cable interface, the WIFI antenna interface, the fan interface, the Jetson Orin NX/NANO Module card slot and the BATT interface are mutually electrically connected through a printed circuit on the substrate.
2. The carrier board for an artificial intelligence development board according to claim 1, wherein the power interface, the RJ45 network cable interface and the WIFI antenna interface are sequentially arranged from top to bottom and are arranged at the left edge of the substrate, the Type-C data interface, the Micro USB interface, the Type-C3.0 interface, the USB 3.0 interface and the Debug port are sequentially arranged from left to right and are arranged at the upper edge of the substrate, the two MIPI CSI camera interfaces are sequentially arranged from top to bottom and are arranged at the right edge of the substrate, the Micro SD card slot and the bus interfaces are sequentially arranged from right to left and are arranged at the lower edge of the substrate, and the solid state disk interface and the WIFI module interface are sequentially arranged from left to right and are arranged at the middle position of the substrate.
3. The carrier for artificial intelligence development boards of claim 2 wherein the fan interface is located in the upper right hand corner of the base plate, the BATT interface is located in the lower left hand corner of the base plate, the Jetson Orin NX/NANO Module card slot is located in the lower edge of the base plate and to the right of the BATT interface.
4. The carrier board for an artificial intelligence development board of claim 2, wherein the bus interface comprises one or more types of buses of SPI/12C/CAN/UART/GPIO.
5. The artificial intelligent development board is characterized by comprising the carrier board for the artificial intelligent development board according to any one of claims 1-4, and further comprising a solid state disk, a WiFi Module and a Jetson Orin NX/NANO Module, wherein the solid state disk, the WiFi Module and the Jetson OrinNX/NANO Module are respectively and correspondingly inserted on the solid state disk interface, the WiFi Module interface and the Jetson Orin NX/NANO Module clamping groove and are fixedly connected with the substrate through fixing screws.
6. The artificial intelligence development board according to claim 5, further comprising a heat dissipation fan, wherein the heat dissipation fan is located at the outer side of the Jetson Orin NX/NANO Module and is connected and fixed to the substrate by a fixing screw.
7. The artificial intelligence development board according to claim 5, wherein the base plate is rectangular, and each corner of the base plate is provided with a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322489652.3U CN220730810U (en) | 2023-09-13 | 2023-09-13 | Carrier plate for artificial intelligence development board and artificial intelligence development board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322489652.3U CN220730810U (en) | 2023-09-13 | 2023-09-13 | Carrier plate for artificial intelligence development board and artificial intelligence development board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220730810U true CN220730810U (en) | 2024-04-05 |
Family
ID=90493587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322489652.3U Active CN220730810U (en) | 2023-09-13 | 2023-09-13 | Carrier plate for artificial intelligence development board and artificial intelligence development board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220730810U (en) |
-
2023
- 2023-09-13 CN CN202322489652.3U patent/CN220730810U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20230200028A1 (en) | Computing apparatus and vehicle | |
| MX2012014355A (en) | Miniturization techniques, systems, and apparatus relating to power supplies, memory, interconnections, and leds. | |
| US10139955B2 (en) | Display unit for vehicle and display control unit | |
| US20140024261A1 (en) | Four in one electrical connector socket | |
| CN101414205B (en) | Double-layer computer host | |
| CN220730810U (en) | Carrier plate for artificial intelligence development board and artificial intelligence development board | |
| CN210986748U (en) | Multimedia host and vehicle | |
| CN202956703U (en) | Main board module and vehicle-mounted information terminal provided with main board module | |
| WO2023236494A1 (en) | Electronic device | |
| CN206251437U (en) | Master control borad and navigation equipment | |
| CN218413721U (en) | Unmanned aerial vehicle remote controller and unmanned aerial vehicle subassembly | |
| CN220693248U (en) | Camera module | |
| CN104902154B (en) | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device | |
| CN211827100U (en) | Intelligent interaction module and case with same | |
| CN105357932A (en) | Terminal equipment and radiating structure thereof | |
| CN210352001U (en) | Picture transmission transmitting/receiving apparatus and picture transmission system | |
| EP1703780B1 (en) | Printed wiring board with an FPC connector | |
| CN211239923U (en) | Camera device and unmanned equipment | |
| CN220974044U (en) | Vehicle-mounted looking-around device | |
| CN112729866A (en) | Automatic driving test box | |
| KR200411375Y1 (en) | Variable type usb memory stick | |
| CN216849193U (en) | LED display module and LED display device with same | |
| CN218768236U (en) | Consolidate on-vehicle demonstration accuse terminal | |
| CN215068014U (en) | PCB substrate, computer mainboard and computer | |
| CN216795554U (en) | Heat dissipation casing, controlling means and unmanned aerial vehicle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |