CN220709957U - Radiator and solid state disk - Google Patents

Abstract

The application provides a radiator and solid state disk, this radiator includes: a first housing; the first heat pipe is positioned on the inner surface of the first shell; a second housing forming an accommodating chamber for mounting a device to be heat-dissipated with the first housing; and a second heat pipe located on the inner surface of the second housing; the first shell and the second shell respectively cover a first surface and a second surface which are opposite to each other of the device to be cooled, the first heat pipe is in contact with a first heating device on the first surface, and the second heat pipe is in contact with a second heating device on the second surface.

Description

Radiator and solid state disk

Technical Field

The application relates to the field of semiconductor technology. Specifically, the application relates to a radiator and a solid state disk.

Background

The solid state disk (Solid State Drives, SSD for short) is a novel storage device for storing data by using a solid state electronic storage chip, has the advantages of high data reading and writing speed, good shock resistance and drop resistance, low noise, light weight and the like, and has been widely applied to various fields. However, at present, the solid state disk still has some defects in performance, and needs to be further improved.

Disclosure of Invention

An aspect of the present application provides a heat sink, including: a first housing; the first heat pipe is positioned on the inner surface of the first shell; a second housing forming an accommodating chamber for mounting a device to be heat-dissipated with the first housing; and a second heat pipe located on the inner surface of the second housing; the first shell and the second shell respectively cover a first surface and a second surface which are opposite to each other of the device to be cooled, the first heat pipe is in contact with a first heating device on the first surface, and the second heat pipe is in contact with a second heating device on the second surface.

In one embodiment of the present application, a first groove is formed on the inner surface of the first housing, and the first heat pipe is located in the first groove; and/or a second groove is formed in the inner surface of the second shell, and the second heat pipe is positioned in the second groove.

In one embodiment of the present application, the first heat pipe extends from a region of the first surface having the first heat generating device to a region of the first surface remote from the first heat generating device; and/or the second heat pipe extends from a region of the second surface having the second heat generating device to a region of the second surface remote from the second heat generating device.

In one embodiment of the present application, the shape of the cross section of the first heat pipe and/or the second heat pipe includes one of a circle, an ellipse, a square, and a rectangle.

In one embodiment of the present application, the thickness of the first heat pipe and/or the second heat pipe is 0.4-0.8 mm, and the thickness of the first shell after being connected with the second shell is 7-15 mm.

In one embodiment of the present application, the heat conductivity of the first heat pipe and/or the second heat pipe is 1000 to 1500W/mK.

In one embodiment of the present application, the first heat pipe and/or the second heat pipe is a pulsating heat pipe.

In one embodiment of the present application, the first housing is a metal housing, the tube body of the first heat pipe is a metal tube, and the first heat pipe is welded to the first housing; and/or the second shell is a metal shell, the pipe body of the second heat pipe is a metal pipe, and the second heat pipe is welded to the second shell.

In one embodiment of the present application, a metal plating layer for improving welding performance is further included between the first housing and the first heat pipe; and/or a metal plating layer for improving welding performance is also included between the second shell and the second heat pipe.

In one embodiment of the present application, the metal housing comprises an aluminum alloy housing, the metal tube comprises a copper alloy tube, and the metal plating layer comprises a nickel plating layer.

In one embodiment of the present application, heat dissipation fins are provided on the outer surface of the first housing and/or the second housing.

In one embodiment of the present application, the first heat generating device includes a main control chip and a memory chip, and the second heat generating device includes a memory chip.

In one embodiment of the present application, the memory chip includes a NAND flash memory chip.

Another aspect of the present application provides a solid state disk, including: a solid state disk body; and the radiator according to the first aspect, the solid state disk body is mounted in the accommodating cavity of the radiator.

In one embodiment of the present application, the solid state disk includes one of an enterprise-level solid state disk and a consumer-level solid state disk.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading the detailed description of non-limiting embodiments, made with reference to the following drawings. In the drawings of which there are shown,

FIG. 1 is a schematic cross-sectional view of a related art solid state disk;

FIG. 2 is a schematic cross-sectional view of a heat spreader assembled with a device to be heat dissipated according to one embodiment of the present application;

FIG. 3 is a partially exploded perspective view of a heat sink assembled with a device to be heat-dissipated according to another embodiment of the present application;

FIG. 4 is a perspective view of the first heat pipe of the heat sink of FIG. 3 assembled with the first housing;

fig. 5 is a schematic diagram of the first heat pipe of the heat spreader of fig. 3 adapted to a first heat generating device of a device to be heat-dissipated.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed description are merely illustrative of exemplary embodiments of the application and are not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification.

Note that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but other embodiments may not necessarily include the particular feature, structure, or characteristic. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the relevant art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

Generally, the term may be understood, at least in part, from the use of context. For example, a term such as "a" or "the" may also be understood to convey a singular usage or a plural usage depending, at least in part, on the context.

It should be readily understood that the meanings of "on", "over" and "over" in this disclosure should be interpreted in the broadest sense so that "on" means not only "directly on something but also includes" on something "with an intermediate feature or layer therebetween, and" over "or" over "means not only" over "or" over "something, but also may include" over "or" over "something with no intermediate feature or layer therebetween (i.e., directly on something).

Further, spatially relative terms such as "under," "below," "lower," "above," "upper," and the like may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.

In the drawings, for ease of illustration, the drawings are merely examples and are not drawn to scale, and thus the thickness, size, and shape of the illustrated components may not be in agreement with actual components. The terms "about," "approximately," and the like, as used herein, are used as terms of a table approximation, and not as terms of a table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by one of ordinary skill in the art.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the present application, use of "may" means "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

Unless otherwise defined, all terms (including engineering and technical terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

In addition, embodiments and features of embodiments in the present application may be combined with each other without conflict. In addition, unless explicitly defined or contradicted by context, the particular steps included in the methods described herein are not necessarily limited to the order described, but may be performed in any order or in parallel. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

The solid state disk is a novel storage device for storing data by using a solid state electronic storage chip, and can be generally classified into an enterprise-level solid state disk and a consumer-level solid state disk (consumer Solid State Drives, abbreviated as csds). At present, the heat dissipation of both enterprise-level solid state disks and consumer-level solid state disks is mainly achieved by adopting a passive heat dissipation mode.

Fig. 1 shows a schematic cross-sectional view of a solid state disk 1000 in the related art, where, as shown in fig. 1, the solid state disk 1000 includes a solid state disk body 200 and a heat sink 100. The solid state disk body 200 has a first surface 210 and a second surface 220 opposite to each other, the devices 211, 212 and 213 are located on the first surface 210, and the devices 221, 222 and 223 are located on the second surface 220. The heat sink 100 includes a first housing 110 and a second housing 120, where the first housing 110 and the second housing 120 form a receiving cavity 130, the solid state disk body 200 is mounted in the receiving cavity 130, and the first housing 110 covers the first surface 210, and the second housing 120 covers the second surface 220. Wherein the device 213 on the first surface 210 is a heat generating device, and the device 222 on the second surface 220 is a heat generating device. Accordingly, the device 213 is further filled with the heat conductive material 111, the device 222 is further filled with the heat conductive material 121, the device 213 is in contact with the inner surface of the first housing 110 through the heat conductive material 111, and the device 222 is in contact with the inner surface of the second housing 120 through the heat conductive material 121. Meanwhile, the first housing 110 also has heat dissipation fins 112 on its outer surface. The heat generated by the device 213 is transferred to the first housing 110 through the heat conductive material 111, then transferred to the air of the external environment through the first housing 110 and the second housing 120, and the heat generated by the device 222 is transferred to the second housing 120 through the heat conductive material 121, then transferred to the air of the external environment through the first housing 110 and the second housing 120, thereby realizing the heat dissipation of the solid state disk body 200 through the heat sink 100.

Typically, the first and second cases 110 and 120 are aluminum alloy materials having a thermal conductivity of 100 to 300W/m.K, and the thermal conductive materials 111 and 121 are thermal conductive pads or thermal conductive gels having a thermal conductivity of typically not more than 20W/m.K. Accordingly, the heat conductive materials 111 and 121 may relatively obstruct heat transfer on the heat transfer path, affecting heat transfer efficiency, and thus heat dissipation efficiency. With the use of the higher performance devices 213 and 222, the performance of the solid state disk 1000 is continuously improved, the power consumption is continuously increased, and the heat conducting materials 111 and 121 can cause the temperature aggregation of the devices 213 and 222 to be increased, so that the reliability and stability of the solid state disk 1000 are affected. Therefore, the heat dissipation manner through the housings 110 and 120 and the heat conductive materials 111 and 121 cannot meet the requirement of the solid state disk 1000 for higher heat dissipation efficiency. In particular, for enterprise-level solid state disks, since the method is mainly applied to servers, the installation space is limited, and higher requirements on reliability and stability are provided, it is required to provide higher heat dissipation efficiency without increasing the volume.

Some embodiments of the present application provide a heat sink 300, 500 to address the above-described issues.

Fig. 2 shows a schematic cross-sectional view of a heat spreader 300 assembled with a device 400 to be heat dissipated according to one embodiment of the present application. As shown in fig. 2, the heat sink 300 of the embodiment of the present application includes first and second cases 310 and 320 and first and second heat pipes 311 and 321. The first heat pipe 311 is located on an inner surface of the first housing 310, the second heat pipe 321 is located on an inner surface of the second housing 320, the second housing 320 and the first housing 310 form a receiving cavity 330 for mounting the device 400 to be cooled, and the first housing 310 and the second housing 320 respectively cover a first surface 410 and a second surface 420 opposite to the device 400 to be cooled. Wherein devices 411, 412, and 413 are located on first surface 410, devices 421, 422, and 423 are located on second surface 420, device 413 is a first heat generating device, and device 422 is a second heat generating device. The first heat pipe 311 is in contact with a first heat generating device 413 on a first surface 410 of the device 400 to be heat-dissipated, and the second heat pipe 321 is in contact with a second heat generating device 422 on a second surface 420 of the device 400 to be heat-dissipated. The heat generated by the first heat generating device 413 is firstly transferred to the first housing 310 through the first heat pipe 311, then transferred to the air of the external environment through the first housing 310 and the second housing 320, and the heat generated by the second heat generating device 422 is firstly transferred to the second housing 320 through the second heat pipe 321, and then transferred to the air of the external environment through the first housing 310 and the second housing 320, thereby realizing the heat dissipation of the device 400 to be dissipated through the heat sink 300.

According to the radiator 300 provided by the embodiment of the application, the first heat pipe 311 and the second heat pipe 321 are respectively arranged on the inner surfaces of the first shell 310 and the second shell 320, the first heat pipe 311 and the second heat pipe 321 are respectively in contact with the heat generating devices 413 and 422 on the two surfaces 410 and 420 of the device 400 to be radiated, the heat pipes 311 and 321 are used for having higher heat conductivity coefficients, for example, the heat conductivity coefficients are 1000-1500W/m.K, and the heat generated by the heat generating devices 413 and 422 on the two surfaces 410 and 420 of the device 400 to be radiated is respectively transferred, so that the heat generated by the heat generating devices 413 and 422 can be quickly transferred to the shells 310 and 320 and taken away by air in the external environment, the heat transfer efficiency is high, the heat radiation efficiency can be improved, the volume of the shells 310 and 320 can not be increased, the temperature aggregation of the heat generating devices 413 and 422 can be effectively reduced, the temperature of the heat generating devices 413 and 422 can be reduced, and the reliability and stability of the device 400 to be ensured.

It should be understood that the heat sink 300 of the embodiment of the present application is not limited to the shape and number of the first heat pipes 311 and the second heat pipes 321, as long as the shape and number of the first heat pipes 311 can satisfy contact with all heat generating devices on the first surface 410 of the device 400 to be heat-dissipated, i.e., the first heat generating devices 413, and the shape and number of the second heat pipes 321 can satisfy contact with all heat generating devices on the second surface 420 of the device 400 to be heat-dissipated, i.e., the second heat generating devices 422.

It should be understood that the heat sink 300 of the embodiment of the present application is not limited to the shape and number of the first and second cases 310 and 320, as long as the shape and number of the first case 310 can satisfy the need of mounting and radiating heat covering the first surface 410 of the device 400 to be radiated and the first heat pipe 311, and the shape and number of the second case 320 can satisfy the need of mounting and radiating heat covering the second surface 420 of the device 400 to be radiated and the second heat pipe 321.

In some embodiments of the present application, as shown in fig. 2, a first groove 313 is formed on an inner surface of the first housing 310, the first heat pipe 311 is located in the first groove 313, a portion of the first heat pipe 311 located in the first groove 313 is embedded in the first housing 310, and another portion of the first heat pipe 311 protrudes from the inner surface of the first housing 310 and contacts the first heat generating device 413. The second housing 320 has a second groove 323 on an inner surface thereof, the second heat pipe 321 is disposed in the second groove 323, a portion of the second heat pipe 321 disposed in the second groove 323 is embedded in the second housing 320, and another portion of the second heat pipe 321 protrudes from the inner surface of the second housing 320 and contacts the second heat generating device 422. By providing the grooves 313, 323 on the inner surfaces of the housings 310, 320, the heat pipes 311, 321 are located in the grooves 313, 323, so that the space occupied by the heat pipes 311, 321 can be reduced, the thickness of the whole radiator 300 can be further reduced, and the control of the whole volume of the radiator 300 and the device 400 to be cooled after assembly is facilitated.

Alternatively, the shape of the first groove 313 on the inner surface of the first housing 310 may be identical to the shape of the first heat pipe 311, and likewise, the shape of the second groove 323 on the inner surface of the second housing 320 may be identical to the shape of the second heat pipe 321. By adapting the shape of the first recess 313 to the shape of the first heat pipe 311, the shape of the second recess 323 is adapted to the shape of the second heat pipe 321, facilitating the positioning of the heat pipes 311, 321 at the inner surface of the housing 310, 320.

It should be noted that, the heat sink 300 according to the embodiment of the present application is not limited to the implementation in which the grooves 313, 323 are provided on the inner surfaces of the two housings 310, 320 in fig. 2, and in some other embodiments of the present application, the grooves may be provided on the inner surface of only one housing. For example, the first groove 313 may be provided only on the inner surface of the first housing 310, and the second groove 323 may not be provided on the inner surface of the second housing 320, in which case the second heat pipe 321 will protrude integrally from the inner surface of the second housing 320; alternatively, the second grooves 323 may be formed only on the inner surface of the second housing 320, and the first grooves 313 may not be formed on the inner surface of the first housing 310, and the first heat pipes 311 may protrude from the inner surface of the first housing 310.

Fig. 3 is a partially exploded perspective view illustrating an assembly of a heat sink 500 and a device 400 to be heat-dissipated according to another embodiment of the present application, fig. 4 is a perspective view illustrating an assembly of a first heat pipe 511 of the heat sink 500 and a first housing 510 in fig. 3, and fig. 5 is a schematic view illustrating an adaptation of the first heat pipe 511 of the heat sink 500 and a first heat-generating device of the device 400 to be heat-dissipated in fig. 3. As shown in fig. 3, 4 and 5, the heat sink 500 of the embodiment of the present application includes first and second cases 510 and 520 and first and second heat pipes 511 and 521. The first heat pipe 511 is located on an inner surface of the first housing 510, the second heat pipe 521 is located on an inner surface of the second housing 520, the second housing 520 is detachably connected with the first housing 510 to form a receiving cavity for mounting the device 400 to be cooled, and the first housing 510 and the second housing 520 respectively cover the first surface 410 and the second surface 420 opposite to the device 400 to be cooled. Wherein devices 414, 415, 416, 417 and 418 are all first heat generating devices located on first surface 410. The first heat pipe 511 is in contact with the first heat generating devices 414, 415, 416, 417, 418 on the first surface 410 of the device 400 to be heat-dissipated, and extends from a region of the first surface 410 having the first heat generating devices 414, 415, 416, 417, 418 to a region of the first surface 410 remote from the first heat generating devices 414, 415, 416, 417, 418. Wherein the evaporation portion 511a of the first heat pipe 511 may be brought into contact with the first heat generating devices 414, 415, 416, 417, 418, while the condensation portion 511b of the first heat pipe 511 may be extended to a region distant from the first heat generating devices 414, 415, 416, 417, 418. The second heat pipe 521 is in contact with a second heat generating device (not shown) on the second surface 420 of the device 400 to be heat-dissipated, and extends from a region of the second surface 420 having the second heat generating device (not shown) to a region of the second surface 420 remote from the second heat generating device (not shown). Similarly, the evaporation portion 521a of the second heat pipe 521 may be brought into contact with a second heat generating device (not shown), and the condensation portion 521b of the second heat pipe 521 may be extended to a region distant from the second heat generating device (not shown). By extending the heat pipes 511, 521 from the region having the heat generating device to the region away from the heat generating device, heat generated by the heat generating device can be quickly taken away from the heat generating device, so that the temperature accumulation of the heat generating device can be further reduced, and the temperature of the heat generating device can be reduced.

It should be noted that, the heat sink 500 of the embodiment of the present application is not limited to the implementation in which the two heat pipes 511 and 512 each have a region with a heat generating device extending to a region far from the heat generating device in fig. 3 to 5, and in some other embodiments of the present application, only one heat pipe may extend from a region with a heat generating device to a region far from the heat generating device. For example, only the first heat pipe 511 may be extended from the region of the first surface 410 having the heat generating device to the region of the first surface 410 remote from the heat generating device; alternatively, only the second heat pipe 521 may extend from the region of the second surface 420 having the heat generating device to the region of the second surface 420 remote from the heat generating device.

In other embodiments of the present application, the cross-sectional shape of the first heat pipe 511 may include one of a circle, an ellipse, a square, and a rectangle, and the cross-sectional shape of the second heat pipe 521 may also include one of a circle, an ellipse, a square, and a rectangle. The cross-sectional shapes of the first heat pipe 511 and the second heat pipe 521 may be the same, for example, the cross-sectional shapes of the first heat pipe 511 and the second heat pipe 521 are all circular; alternatively, the cross-sectional shapes of the first heat pipe 511 and the second heat pipe 521 may be different, for example, the cross-sectional shape of the first heat pipe 511 is a circle, and the cross-sectional shape of the second heat pipe 521 is a square; embodiments of the present application are not limited in this regard. In an example of the present application, as shown in fig. 3, the cross sections 511c and 521c of the first heat pipe 511 and the second heat pipe 521 are both elliptical, and at this time, the first heat pipe 511 and the second heat pipe 521 are both flat pipes, and the flat pipes are adopted as the heat pipes 511 and 521, so that the space occupied by the heat pipes 511 and 521 can be further reduced, and further the thickness of the whole radiator 500 can be reduced, for example, the thickness of the first housing 510 and the second housing 520 after being connected can be controlled to be 7-15 mm, which is beneficial for further controlling the whole volume of the radiator 500 and the device 400 to be cooled after being assembled.

In still other embodiments of the present application, at least one of the first heat pipe 511 and the second heat pipe 521 may be an ultra-thin heat pipe with a thickness of 0.4-0.8 mm, so as to further reduce the space occupied by the heat pipe, without affecting the spatial layout of the device 400 to be heat-dissipated. For example, the first heat pipe 511 and the second heat pipe 521 may each be an ultra-thin heat pipe; further, only the first heat pipe 511 is an ultra-thin heat pipe, and the second heat pipe 521 is not an ultra-thin heat pipe, or only the second heat pipe 521 is an ultra-thin heat pipe, and the first heat pipe 511 is not an ultra-thin heat pipe.

It should be noted that the types of the first heat pipe 511 and the second heat pipe 521 are not limited in the embodiments of the present application, for example, the first heat pipe 511 and the second heat pipe 521 may be conventional heat pipes, or may be pulsating heat pipes. In one example of the present application, both the first heat pipe 511 and the second heat pipe 521 are pulsating heat pipes. In another example of the present application, the first heat pipe 511 is a pulsating heat pipe and the second heat pipe 521 is a conventional heat pipe. In yet another example of the present application, the first heat pipe 511 is a conventional heat pipe and the second heat pipe 521 is a pulsating heat pipe.

In still other embodiments of the present application, the first housing 510 is a metal housing, the tube body of the first heat pipe 511 is a metal tube, the first heat pipe 511 is welded to the first housing 510, the second housing 520 is a metal housing, the tube body of the second heat pipe 521 is a metal tube, and the second heat pipe 521 is welded to the second housing 520. It should be noted that, the heat sink 500 according to the embodiment of the present application is not limited to the implementation in which the first housing 510 and the second housing 520 are both metal housings, and the tube bodies of the first heat pipe 511 and the second heat pipe 521 are both metal tubes, and in some other embodiments of the present application, only one housing may be a metal housing, and the tube bodies of the corresponding heat pipes may be metal tubes. For example, only the first housing 510 may be a metal housing, and the tube body of the first heat pipe 511 may be a metal tube; alternatively, only the second housing 520 may be a metal housing, and the tube body of the second heat pipe 521 may be a metal pipe.

Optionally, when the first housing 510 is a metal housing and the tube body of the first heat pipe 511 is a metal tube, a metal plating layer for improving welding performance may be further included between the first housing 510 and the first heat pipe 511. When the second housing 520 is a metal housing and the pipe body of the second heat pipe 521 is a metal pipe, a metal plating layer for improving welding performance may be further included between the second housing 520 and the second heat pipe 521. In an example of this application, the metal casing includes the aluminum alloy casing, and the metal pipe includes the copper alloy pipe, and the copper alloy pipe can't directly weld in the aluminum alloy casing, can electroplate one deck nickel as the metal coating that improves welding performance at the aluminum alloy casing surface earlier, i.e. nickel plating, based on nickel plating again with copper alloy pipe welding in the aluminum alloy casing can satisfy both welded requirements.

In further embodiments of the present application, as shown in fig. 2 and 3, the heat dissipation fins 312, 512 are further disposed on the outer surface of the first housing 310, 510, so as to increase the heat dissipation area of the first housing 310, 510 and accelerate the heat dissipation of the heat sink 300, 500. Optionally, as shown in fig. 3, a heat dissipating fin 522 may also be disposed on the outer surface of the second housing 520, so as to increase the heat dissipating area of the second housing 520, and further accelerate the heat dissipation of the heat sink 500. It should be noted that, the heat sink according to the embodiment of the present application may have only the heat dissipating fins on the outer surface of the second housing, and may not have the heat dissipating fins on the outer surface of the first housing.

In further embodiments of the present application, as shown in fig. 3 and 5, the device to be heat-dissipated 400 may include a printed circuit board (Printed Circuit Board Assembly, abbreviated as PCBA), the first and second heat-generating devices may include a high-power-consumption device and a temperature-sensitive device, etc., for example, the high-power-consumption device may include a main control chip (Controller), and the temperature-sensitive device may include a memory chip. In one example of the present application, the device to be heat-dissipated 400 may be a solid state disk body, the first heat-generating device includes a main control chip and a memory chip, the second heat-generating device may include a memory chip, and the memory chip may include a NAND flash memory chip, for example. It should be noted that, in embodiments of the present application, the types of the first heat generating device and the second heat generating device are not limited, and in some other embodiments of the present application, the first heat generating device and the second heat generating device may further include a buffer chip and a power management chip.

Therefore, some embodiments of the present application further provide a solid state disk 2000. As shown in fig. 2 and 3, the solid state disk 2000 in the embodiment of the present application includes a solid state disk body and the heat sinks 300 and 500 in the above embodiment, where the solid state disk body is installed as the device 400 to be heat-dissipated in the accommodating cavity 330 of the heat sinks 300 and 500. According to the solid state disk 2000 provided by the embodiment of the application, the radiator 300 and 500 provided in the embodiment is used for radiating, so that the radiating efficiency can be improved under the condition that the volume of the solid state disk is not increased, the temperature aggregation of heating devices is effectively reduced, the temperature of the heating devices is reduced, the use requirement of higher-performance devices is met, the reliability and stability of the solid state disk are effectively ensured, the triggering of the temperature regulation (Thermal Throttling, TT) function of the solid state disk can be reduced, and the requirement of long-time high-performance work of the solid state disk is met.

In some embodiments of the present application, solid state disk 2000 of embodiments of the present application may include one of an enterprise-level solid state disk and a consumer-level solid state disk.

The objects, technical solutions and advantageous effects of the present application are further described in detail in the above detailed description. It should be understood that the foregoing is only a specific embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application are intended to be included within the scope of the present application.

Claims (15)

1. A heat sink, comprising:

a first housing;

the first heat pipe is positioned on the inner surface of the first shell;

a second housing forming an accommodating chamber for mounting a device to be heat-dissipated with the first housing; and

the second heat pipe is positioned on the inner surface of the second shell;

the first shell and the second shell respectively cover a first surface and a second surface which are opposite to each other of the device to be cooled, the first heat pipe is in contact with a first heating device on the first surface, and the second heat pipe is in contact with a second heating device on the second surface.

2. The heat sink of claim 1, wherein a first recess is provided in an inner surface of the first housing, the first heat pipe being located in the first recess; and/or

A second groove is formed in the inner surface of the second shell, and the second heat pipe is located in the second groove.

3. The heat sink of claim 2, wherein the first heat pipe extends from a region of the first surface having the first heat generating device to a region of the first surface remote from the first heat generating device; and/or

The second heat pipe extends from a region of the second surface having the second heat generating device to a region of the second surface remote from the second heat generating device.

4. A heat sink according to claim 3, wherein the cross-sectional shape of the first heat pipe and/or the second heat pipe comprises one of circular, elliptical and rectangular.

5. The heat sink of claim 4, wherein the thickness of the first heat pipe and/or the second heat pipe is 0.4-0.8 mm, and the thickness of the first housing after being connected to the second housing is 7-15 mm.

6. The heat sink according to any one of claims 1 to 5, characterized in that the heat conductivity of the first heat pipe and/or the second heat pipe is 1000-1500W/m-K.

7. The heat sink of claim 6, wherein the first heat pipe and/or the second heat pipe is a pulsating heat pipe.

8. The heat sink of claim 6, wherein the first housing is a metal housing, the body of the first heat pipe is a metal pipe, and the first heat pipe is welded to the first housing; and/or

The second shell is a metal shell, the pipe body of the second heat pipe is a metal pipe, and the second heat pipe is welded to the second shell.

9. The heat sink of claim 8 further comprising a metal plating between the first housing and the first heat pipe to improve solderability; and/or

A metal plating layer for improving welding performance is also included between the second shell and the second heat pipe.

10. The heat sink of claim 9 wherein the metal housing comprises an aluminum alloy housing, the metal tube comprises a copper alloy tube, and the metal plating comprises a nickel plating.

11. The heat sink of claim 10, wherein the first housing and/or the second housing has heat sink fins on an outer surface thereof.

12. The heat sink of claim 11, wherein the first heat generating device comprises a master chip and a memory chip, and the second heat generating device comprises a memory chip.

13. The heat sink of claim 12, wherein the memory chip comprises a NAND flash memory chip.

14. A solid state disk, comprising:

a solid state disk body; and

the heatsink of any one of claims 1 to 13, the solid state disk body being mounted to the receiving cavity of the heatsink.

15. The solid state disk of claim 14, wherein the solid state disk comprises one of an enterprise-level solid state disk and a consumer-level solid state disk.