CN220665512U - Thermal field component and monocrystalline silicon rod drawing device - Google Patents

Thermal field component and monocrystalline silicon rod drawing device Download PDF

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Publication number
CN220665512U
CN220665512U CN202321739753.5U CN202321739753U CN220665512U CN 220665512 U CN220665512 U CN 220665512U CN 202321739753 U CN202321739753 U CN 202321739753U CN 220665512 U CN220665512 U CN 220665512U
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field component
thermal field
annular
magnetic
crucible
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CN202321739753.5U
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刘阳
李侨
赵领航
任伟康
卫博阳
董升
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Longi Green Energy Technology Co Ltd
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Longi Green Energy Technology Co Ltd
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Abstract

The embodiment of the application provides a thermal field component and a single crystal silicon rod drawing device. The thermal field component comprises: the annular body is internally provided with an annular cavity; the shell is arranged at one side, close to the crucible, in the annular cavity, and an annular accommodating cavity is arranged in the shell; the annular magnetic piece is connected in the shell; the water inlet pipe is communicated with the accommodating cavity and is used for introducing a cooling medium into the accommodating cavity; and the water outlet pipe is communicated with the accommodating cavity and is used for guiding out the cooling medium in the accommodating cavity. When the thermal field component disclosed by the embodiment of the application is applied to a single crystal silicon rod drawing device, the drawing speed and the pulling quality of the single crystal silicon rod can be both considered.

Description

Thermal field component and monocrystalline silicon rod drawing device
Technical Field
The application belongs to the technical field of photovoltaic processing, and particularly relates to a thermal field component and a monocrystalline silicon rod drawing device.
Background
In recent years, photovoltaic power generation is increasingly being regarded as one of green energy and main energy for sustainable development of human beings, and is being greatly developed by people in various countries around the world. Monocrystalline silicon wafers have a wide market demand as a base material for photovoltaic power generation. The monocrystalline silicon wafer is usually obtained by slicing a monocrystalline silicon rod, and the monocrystalline silicon rod can be formed by growing and drawing silicon liquid.
Currently, a heat exchanger and a thermal field component sleeved outside the heat exchanger are usually arranged in a single crystal silicon rod drawing device. The heat field component can concentrate the heat of a high-temperature region of the heat field in the heat exchanger, so that the heat exchanger can rapidly bring the heat released during crystallization of the monocrystalline silicon rod out of the furnace, the longitudinal temperature gradient of the crystal rod is improved, the crystal growth rate is improved, and the drawing speed of the monocrystalline silicon rod is improved.
However, the heat exchanger can also reduce the temperature at the solid-liquid interface while taking away heat, so that the temperature difference inside the silicon liquid is increased, and the convection of the melt inside the silicon liquid is increased. In practical application, the oxygen-containing compound is easily brought to a solid-liquid interface by melt convection in the silicon liquid and enters into the monocrystalline silicon rod, so that the quality of the monocrystalline silicon rod is reduced. That is, in the conventional single crystal silicon rod, it is difficult to achieve both the pulling rate and the quality of the single crystal silicon rod when pulling the single crystal silicon rod.
Disclosure of Invention
The application aims to provide a thermal field component and a single crystal silicon rod drawing device, at least solving the problem that the existing single crystal silicon rod drawing device is difficult to consider drawing speed and quality of a single crystal silicon rod.
In order to solve the technical problems, the application is realized as follows:
in a first aspect, the present application discloses a thermal field component for single crystal silicon rod drawing device, single crystal silicon rod drawing device include the furnace body and set up in crucible in the furnace body, thermal field component is located the crucible top, thermal field component is the heat shield, thermal field component includes:
the annular body is internally provided with an annular cavity;
the shell is arranged at one side, close to the crucible, in the annular cavity, and an annular accommodating cavity is arranged in the shell;
the annular magnetic piece is connected in the shell;
the water inlet pipe is communicated with the accommodating cavity and is used for introducing a cooling medium into the accommodating cavity;
and the water outlet pipe is communicated with the accommodating cavity and is used for guiding out the cooling medium in the accommodating cavity.
Optionally, a gap exists between the outer wall of the magnetic piece and the inner wall of the accommodating cavity, and the cooling medium is filled in the gap.
Optionally, a plurality of supporting blocks are arranged at intervals at the bottom of the accommodating cavity, and the supporting blocks are connected to the bottom of the magnetic piece so that the magnetic piece and the accommodating cavity form the gap;
and/or, be provided with a plurality of interval distribution's first boss on holding the inside wall in chamber, first boss orientation magnetic part extends, magnetic part in with a plurality of first boss corresponding positions are provided with a plurality of second bosses, one the second boss with one first boss cooperates, so that magnetic part with hold the chamber and form the clearance.
Optionally, the annular body includes first tubular structure and second tubular structure, the second tubular structure cover is established outside the first tubular structure, and with the first tubular structure encloses and closes and form the annular cavity.
Optionally, the thermal field component further comprises a flexible thermal insulation member, and the flexible thermal insulation member is filled in the annular cavity.
Optionally, the thermal field component further comprises a support member, wherein the support member is arranged at the bottom of the annular cavity and is connected with the shell, and the support member is used for supporting the shell.
Optionally, a boss is arranged at the bottom of the shell, and a threaded hole is formed in the boss;
the thermal field component further comprises a fastener, and the fastener penetrates through the supporting piece and is in threaded connection with the threaded hole.
Optionally, the magnetic member is a ferromagnetic member; wherein,
the ferromagnetic piece is of an annular integrated structure;
or the ferromagnetic piece is of a split structure and comprises a plurality of magnetic blocks which are sequentially distributed along the circumferential direction of the annular body to form an annular structure.
Optionally, the magnetic element is an electromagnetic coil; wherein,
the axial direction of the electromagnetic coil is perpendicular to the axial direction of the annular body, and the electromagnetic coil is used for forming a transverse magnetic field;
or, the axial direction of the electromagnetic coil is parallel to the axial direction of the annular body, and the electromagnetic coil is used for forming a vertical magnetic field.
Optionally, in the case that the axial direction of the electromagnetic coil is perpendicular to the axial direction of the annular body, the number of the electromagnetic coils is plural, and the plurality of the electromagnetic coils are distributed at intervals along the circumferential direction;
the number of the electromagnetic coils is one or more in the case that the axial direction of the electromagnetic coils is parallel to the axial direction of the annular body, and the electromagnetic coils are distributed at intervals along the circumferential direction of the annular body.
Optionally, the magnetic element is an electromagnetic coil; wherein,
the electromagnetic coil is arranged at a preset included angle with the axial direction of the annular body, and the preset included angle is an included angle outside the right angle.
In a second aspect, the present application also discloses a single crystal silicon rod pulling apparatus, comprising:
a furnace body;
the crucible is arranged in the furnace body and is used for accommodating silicon liquid so as to grow monocrystalline silicon rods from the silicon liquid;
the heat exchanger is arranged in the furnace body and is positioned above the crucible;
and the thermal field component is arranged in the furnace body and sleeved outside the heat exchanger, and comprises a magnetic piece which is connected to one side of the thermal field component, which is close to the crucible.
In an embodiment of the present application, the thermal field component may include an annular body, where an annular cavity is disposed in the annular body; the shell is arranged at one side, close to the crucible, in the annular cavity, and an annular accommodating cavity is arranged in the shell; and the annular magnetic piece is connected in the shell. In the drawing process of the monocrystalline silicon rod, the cooling medium circulates in the accommodating cavity, so that the magnetic piece can be cooled, heat released during crystallization of the monocrystalline silicon rod can be rapidly taken away, and the drawing speed of the monocrystalline silicon rod is improved. Meanwhile, the magnetic piece can form a magnetic field in the silicon liquid of the crucible, the magnetic field can be used for inhibiting heat convection in the silicon liquid, washing of the silicon liquid on the crucible wall is reduced, impurity content in the silicon liquid is reduced, and accordingly crystal pulling quality of a monocrystalline silicon rod is improved. That is, in the case where the thermal field member described in the embodiment of the present application is applied to a single crystal silicon rod pulling apparatus, both the pulling speed and the pulling quality of the single crystal silicon rod can be considered.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic view of a thermal field component applied to a single crystal silicon rod pulling apparatus according to an embodiment of the present application;
FIG. 2 is a schematic illustration of cusp magnetic fields formed in a silicon liquid by magnetic elements in a thermal field component according to an embodiment of the present application;
FIG. 3 is a schematic illustration of a layout of electromagnetic coils in a thermal field component according to an embodiment of the present application;
FIG. 4 is a schematic diagram of the magnetic field generated by the solenoid shown in FIG. 3;
FIG. 5 is a second schematic illustration of the layout of the electromagnetic coils in a thermal field component according to an embodiment of the present application;
FIG. 6 is a schematic diagram of the magnetic field generated by the solenoid shown in FIG. 5;
reference numerals: 10-annular body, 101-first tubular structure, 1011-first straight wall, 1012-first bottom wall, 1021-second straight wall, 1022-second bottom wall, 102-second tubular structure, 11-casing, 111-boss, 12-magnetic piece, 121-magnetic induction line, 122-supporting block, 13-inlet tube, 14-outlet tube, 15-supporting piece, 20-heat exchanger, 30-crucible, 40-monocrystalline silicon rod, 50-silicon liquid, A-current incident direction, B-current emergent direction.
Detailed Description
Reference will now be made in detail to embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The features of the terms "first", "second", and the like in the description and in the claims of this application may be used for descriptive or implicit inclusion of one or more such features. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Embodiments of the present application provide a thermal field component that may be used in a single crystal silicon rod pulling apparatus. The single crystal silicon rod drawing device may include a furnace body and a crucible disposed in the furnace body, the crucible may be used to contain a silicon liquid, and the thermal field member may be located above the crucible. Specifically, the thermal field component can be sleeved outside the monocrystalline silicon rod, and can play a role in isolating heat and provide a good thermal field environment. In practical application, a heat exchanger can be arranged between the thermal field component and the monocrystalline silicon rod, and can absorb heat radiated by the monocrystalline silicon rod during crystallization and transmit the absorbed heat to the outside of the furnace body, so that the longitudinal temperature gradient of the monocrystalline silicon rod is improved and the crystal growth speed of the monocrystalline silicon rod is improved. The thermal field component may include, but is not limited to, at least one of a thermal shield and a thermal insulation cylinder, and in this embodiment of the present application, the thermal field component is only used as an example of the thermal shield, and other types of thermal field components may be executed with reference to the implementation.
Referring to fig. 1, a schematic structural view of a thermal field unit applied to a single crystal silicon rod pulling apparatus according to an embodiment of the present application is shown. Specifically, the single crystal silicon rod drawing device may include a furnace body and a crucible 30 disposed in the furnace body, and the thermal field part is located above the crucible 30.
As shown in fig. 1, the thermal field component may specifically include: the annular body 10, the annular body 10 is internally provided with an annular cavity; a housing 11, wherein the housing 11 is arranged at one side of the annular cavity close to the crucible 30, and an annular accommodating cavity is arranged in the housing 11; a ring-shaped magnetic member 12, the magnetic member 12 being connected inside the housing 11; a water inlet pipe 13, wherein the water inlet pipe 13 is communicated with the accommodating cavity, and the water inlet pipe 13 can be used for leading cooling medium into the accommodating cavity; and a water outlet pipe 14, wherein the water outlet pipe 14 is communicated with the accommodating cavity, and the water outlet pipe 14 can be used for guiding out the cooling medium in the accommodating cavity.
In this embodiment, the thermal field component may include an annular body 10, and an annular cavity is disposed in the annular body 10; a housing 11, wherein the housing 11 is arranged at one side of the annular cavity close to the crucible 30, and an annular accommodating cavity is arranged in the housing 11; an annular magnetic member 12, the magnetic member 12 being connected to the inside of the housing 11. During the drawing process of the single crystal silicon rod, the cooling medium circulates in the accommodating cavity, so that not only the magnetic piece 12 can be cooled, but also the heat released during crystallization of the single crystal silicon rod 40 can be quickly taken away, and the drawing speed of the single crystal silicon rod 40 is improved. Meanwhile, the magnetic member 12 can form a magnetic field in the silicon liquid 50 of the crucible 30, and the magnetic field can be used for inhibiting heat convection in the silicon liquid 50, reducing scouring of the silicon liquid 50 to the wall of the crucible 30 and reducing impurity content in the silicon liquid 50, so that the crystal pulling quality of the monocrystalline silicon rod 40 is improved. That is, in the case where the thermal field member described in the embodiment of the present application is applied to a single crystal silicon rod pulling apparatus, both the pulling speed and the pulling quality of the single crystal silicon rod 40 can be considered.
Specifically, the annular body 10 may be made of a carbon-carbon composite material, wood, or the like having a certain strength and having a heat-insulating function as a structural body of the thermal field member. In some optional embodiments of the present application, the single crystal silicon rod pulling apparatus may further include a heat exchanger 20, the heat exchanger 20 is disposed in the furnace body and above the crucible 30, and the thermal field component may be sleeved outside the heat exchanger 20 and form a preset gap with the heat exchanger 20. The heat exchanger 20 can continuously feed the circulating cooling medium, and when the monocrystalline silicon rod 40 passes through the crystal pulling channel in the heat exchanger 20, heat exchange can be carried out with the cooling medium in the heat exchanger 20, so that the crystallization latent heat of the monocrystalline silicon rod 40 can be rapidly carried away, and the drawing speed of the monocrystalline silicon rod 40 can be improved.
In this embodiment, a housing 11 may be disposed on a side of the annular body 10 of the thermal field component, which is close to the crucible 30, and an annular magnetic member 12 may be disposed in the housing 11. In practice, at least a portion of magnetic element 12 may extend into crucible 30 such that magnetic element 12 may be positioned adjacent to silicon liquid 50 within crucible 30 and form a cusp magnetic field within silicon liquid 50. In particular applications, cusp magnetic fields within the silicon liquid 50 may be used to inhibit longitudinal thermal convection, lateral thermal convection, and other directional thermal convection of the silicon liquid 50. Thus, the impurity content in the silicon liquid 50 can be reduced, and the quality of the single crystal silicon rod 40 can be improved.
Referring to fig. 2, a schematic diagram of a cusp magnetic field formed by a magnetic member in a silicon liquid in a heat exchanger according to an embodiment of the present application is shown. As shown in fig. 2, the magnetic induction lines 121 of the cusp magnetic field in the silicon liquid 50 of the crucible 30 are arc-shaped magnetic induction lines 121. Thus, the partial magnetic induction lines 121 can cut the longitudinal heat convection in the silicon liquid 50, generate lorentz force, and suppress the longitudinal heat convection in the silicon liquid 50. Meanwhile, another part of the magnetic induction lines 121 can cut the transverse heat convection in the silicon liquid 50, generate lorentz force and inhibit the transverse heat convection in the silicon liquid 50. Moreover, the magnetic induction lines 121 can also cut heat convection in other directions than the longitudinal and transverse directions to generate lorentz forces. The other direction may be, for example, a direction having an inclination angle of 45 °, 60 ° or the like with respect to the lateral direction. By suppressing the heat convection in the silicon liquid 50 in a plurality of directions in this way, the scouring of the crucible 30 wall by the silicon liquid 50 can be reduced, and the impurity content in the silicon liquid 50 can be reduced.
As shown in fig. 1, the annular body 10 may include a first cylindrical structure 101 and a second cylindrical structure 102, where the second cylindrical structure 102 is sleeved outside the first cylindrical structure 101 and encloses the first cylindrical structure 101 to form the annular cavity, and the housing 11 is disposed inside the annular cavity enclosed by the first cylindrical structure 101 and the second cylindrical structure 102.
As shown in fig. 1, the first cylindrical structure 101 may include a first straight wall 1011 and a first bottom wall 1012 connected to the first straight wall 1011, and the first bottom wall 1012 is disposed obliquely with respect to the first straight wall 1011. The second cylindrical structure 102 may include a second straight wall 1021 and a second bottom wall 1022, the second bottom wall 1022 being perpendicular to the second straight wall 1021, and an arc-shaped transition wall may be provided between the second bottom wall 1022 and the first straight wall 1011. Wherein the first bottom wall 1012 is connected to the second bottom wall 1022, the housing 11 may be connected to the second bottom wall 1022.
It should be noted that, in fig. 1, only the case where the first bottom wall 1012 is obliquely disposed and the second bottom wall 1022 is horizontally disposed is illustrated, but in practical application, the first bottom wall 1012 may also be vertically disposed, the second bottom wall 1022 may also be obliquely disposed, and the manner of disposing the first bottom wall 1012 and the second bottom wall 1022 is not specifically limited in this embodiment.
In some optional embodiments of the application, the thermal field component may further include a flexible thermal insulation member, where the flexible thermal insulation member is filled in the annular cavity, and the flexible thermal insulation member may perform a thermal insulation effect. In practical applications, the flexible heat-insulating member may be filled in the annular cavity of the annular body 10 at a position outside the housing 11, so as to achieve a better heat-insulating effect.
By way of example, the flexible thermal insulation member may include, but is not limited to, any one of a thermal insulation felt and a thermal insulation foam, and the specific content of the flexible thermal insulation member in the embodiments of the present application may not be limited.
In some alternative embodiments of the present application, the thermal field component may further include a support member 15, where the support member 15 is disposed at the bottom of the annular cavity and is connected to the housing 11, and the support member 15 may be used to support the housing 11 to reliably connect the housing 11 in the annular cavity.
Specifically, the supporting member 15 may be adhered or clamped to the second bottom wall 1022, and the bottom of the housing 11 may be connected to the supporting member 15 by adhesion, clamping or fastening. Thus, the shell 11 can be hung on the furnace body through the water inlet pipe 13 and the water outlet pipe 14, and the bottom can be supported through the supporting piece 15, so that the installation stability of the shell 11 and the magnetic piece 12 in the shell 11 is greatly improved.
Optionally, a boss 111 is provided at the bottom of the housing 11, and a threaded hole is provided on the boss 111; the thermal field component may also include fasteners that pass through the support 15 and are threadably connected to the threaded holes. The threaded connection is simple in structure and reliable in connection, so that the threaded connection of the shell 11 and the support 15 is realized by the fasteners, and accordingly the threaded connection has the advantages of simple structure and reliable connection.
By way of example, the fastener may include, but is not limited to, at least one of a screw, a bolt, and a stud, and embodiments of the present application may not be limited in their details.
In this embodiment, the housing 11 may be provided with a receiving cavity therein, and the magnetic member 12 is located in the receiving cavity. Housing 11 may be used to support magnetic element 12 and to provide protection for magnetic element 12. By introducing a circulating cooling medium into the receiving space of the housing 11, the magnetic part 12 can be cooled by the cooling medium. In this way, the magnetic element 12 is prevented from being demagnetized or damaged due to the high temperature of the silicon liquid 50, so that the magnetic element 12 can work at a proper temperature, and the service life of the magnetic element 12 is prolonged.
In some alternative embodiments of the present application, a gap exists between the outer wall of magnetic element 12 and the inner wall of the receiving chamber, and the cooling medium fills the gap. The cooling medium may fill the gap to remove heat from magnetic element 12, so that magnetic element 12 may operate at a suitable temperature, thereby increasing the useful life of magnetic element 12.
Optionally, a plurality of supporting blocks 122 are disposed at the bottom of the accommodating cavity at intervals, and the supporting blocks 122 are connected to the bottom of the magnetic element 12, so that the magnetic element 12 and the accommodating cavity form the gap, and a cooling medium is filled in the bottom of the magnetic element 12, so that cooling of the bottom of the magnetic element 12 is achieved.
Specifically, the supporting block 122 may be a metal block, and the metal block may be welded to the bottom of the accommodating cavity. The plurality of metal blocks may be spaced at any location as desired for reliable support of magnetic element 12.
And/or, be provided with a plurality of first bosss of interval distribution on holding the inside wall of chamber, first boss extends towards magnetic part 12, and magnetic part 12 is in the position that corresponds with a plurality of first bosss is provided with a plurality of second bosss, a second boss with a first boss cooperation, so that magnetic part 12 with hold the chamber and form the clearance, be convenient for cooling medium fills in the side of magnetic part 12, realizes the cooling to magnetic part 12 side.
Specifically, the first bosses need to be distributed at intervals, that is, a channel through which the cooling medium can circulate needs to be formed between the first bosses, so that the cooling medium can flow along the outer side of the magnetic element 12, and cooling of the magnetic element 12 is achieved. In practical applications, to enhance the cooling effect of the cooling medium on magnetic element 12, more than 90% of the area of the outer surface of magnetic element 12 needs to be in contact with the cooling medium, i.e. the area occupied by the second boss on the outer surface of magnetic element 12 cannot exceed 10%.
In some alternative embodiments of the present application, magnetic member 12 is a ferromagnetic member that may include, but is not limited to, any of a samarium cobalt magnet, a neodymium iron boron magnet, and an iron oxide magnet. Because of the simple structure and low cost of the ferromagnetic member, in the case where the magnetic member 12 is a ferromagnetic member, the structure of the magnetic member 12 can be made correspondingly simpler and less costly.
Alternatively, the ferromagnetic piece may be an annular integrally formed structure, that is, the ferromagnetic piece may be an integral structure, and the structure is simple and the assembly process is relatively simple. Or, the ferromagnetic member is of a split structure, and includes a plurality of magnetic blocks sequentially distributed along the circumferential direction of the annular body 10 to form an annular structure. In practical applications, the shapes and positions of the magnetic blocks and the intervals between two adjacent magnetic blocks can be set according to practical situations, so that the layout flexibility of the magnetic piece 12 can be greatly improved.
In particular, the ferromagnetic member may comprise a first magnetic pole and a second magnetic pole, the first and second magnetic poles being of opposite polarity. In practical application, the first magnetic pole may be disposed at the top of the ferromagnetic member, and the second magnetic pole may be disposed at the bottom of the ferromagnetic member, or the first magnetic pole may be disposed at the outer side of the ferromagnetic member, and the second magnetic pole may be disposed at the inner side of the ferromagnetic member. The specific positions of the first magnetic pole and the second magnetic pole may not be limited in the embodiments of the present application.
For example, the first magnetic pole may be one of an N pole and an S pole, and the second magnetic pole may be the other of the N pole and the S pole.
In some alternative embodiments of the present application, magnetic element 12 may also be a solenoid coil that, when energized, may generate a magnetic field that inhibits convection of the melt within silicon liquid 50.
Referring to fig. 3, a schematic diagram of a layout of an electromagnetic coil in a thermal field component according to an embodiment of the present application is shown, and referring to fig. 4, a schematic diagram of a magnetic field generated by the electromagnetic coil shown in fig. 3 is shown. As shown in fig. 3, the axial direction of the electromagnetic coil may be perpendicular to the axial direction of the annular body 10, that is, the axial direction of the annular body 10 is a vertical direction, the axial direction of the electromagnetic coil is a transverse direction (that is, the radial direction of the annular body 10), the current incident direction a of the electromagnetic coil may be located above, and the current exiting direction B may be located below. The electromagnetic coil may be used to form a transverse magnetic field as shown in fig. 4.
As shown in fig. 4, the magnetic induction line 121 of the transverse magnetic field in the silicon liquid 50 of the crucible 30 is an arc-shaped magnetic induction line 121. Thus, the partial magnetic induction lines 121 can cut the longitudinal heat convection in the silicon liquid 50, generate lorentz force, and suppress the longitudinal heat convection in the silicon liquid 50. Meanwhile, another part of the magnetic induction lines 121 can cut the transverse heat convection in the silicon liquid 50, generate lorentz force and inhibit the transverse heat convection in the silicon liquid 50. Moreover, the magnetic induction lines 121 can also cut heat convection in other directions than the longitudinal and transverse directions to generate lorentz forces. Thus, heat convection in a plurality of directions in the silicon liquid 50 can be suppressed, the scouring of the wall of the crucible 30 by the silicon liquid 50 can be reduced, and the impurity content in the silicon liquid 50 can be reduced.
Referring to fig. 5, a second schematic layout of the electromagnetic coil in a thermal field component according to an embodiment of the present application is shown, and referring to fig. 6, a schematic diagram of the magnetic field generated by the electromagnetic coil shown in fig. 5 is shown. As shown in fig. 5, the axial direction of the electromagnetic coil is parallel to the axial direction of the annular body 10, that is, the axial direction of the annular body 10 is a vertical direction, the axial direction of the electromagnetic coil is also a vertical direction, the current incident direction a of the electromagnetic coil may be located at the outer side, and the current exiting direction B may be located at the inner side. The electromagnetic coil may be used to form a vertical magnetic field as shown in fig. 6.
As shown in fig. 6, the magnetic induction lines 121 of the vertical magnetic field in the silicon liquid 50 of the crucible 30 are arc-shaped magnetic induction lines 121. Thus, the partial magnetic induction lines 121 can cut the longitudinal heat convection in the silicon liquid 50, generate lorentz force, and suppress the longitudinal heat convection in the silicon liquid 50. Meanwhile, another part of the magnetic induction lines 121 can cut the transverse heat convection in the silicon liquid 50, generate lorentz force and inhibit the transverse heat convection in the silicon liquid 50. Moreover, the magnetic induction lines 121 can also cut heat convection in other directions than the longitudinal and transverse directions to generate lorentz forces. Thus, heat convection in a plurality of directions in the silicon liquid 50 can be suppressed, and the scouring of the silicon liquid 50 to the wall of the crucible 30 can be reduced, thereby reducing the impurity content in the silicon liquid 50.
In practical applications, in the case where the magnetic member 12 is an electromagnetic coil, those skilled in the art may arrange the electromagnetic coil in the manner shown in fig. 3, or may arrange the electromagnetic coil in the manner shown in fig. 5, which is not limited in the embodiment of the present application. However, by comparing the magnetic field diagrams shown in fig. 4 and 6, it can be obtained that the magnetic field shown in fig. 4 is more advantageous to realize heat convection of the silicon liquid 50 from a plurality of directions under the same conditions, and therefore, the layout manner shown in fig. 3 can be preferred.
Alternatively, in the case where the axial direction of the electromagnetic coil is perpendicular to the axial direction of the annular body 10, the number of the electromagnetic coils may be plural, and the plural electromagnetic coils may be distributed at intervals along the circumferential direction of the annular body 10 to form the annular magnetic member 12. In practice, the magnetic fields generated by the plurality of electromagnetic coils may overlap to inhibit thermal convection within the silicon liquid 50 from more directions, further reducing the impact of the silicon liquid 50 on the walls of the crucible 30.
Alternatively, in the case where the axial direction of the electromagnetic coil is parallel to the axial direction of the annular body 10, the number of the electromagnetic coils is one or more. In the case that the electromagnetic coil is one, the electromagnetic coil may be annularly distributed and sleeved outside the crystal pulling channel of the heat exchanger 20. In the case where there are a plurality of electromagnetic coils, a plurality of the electromagnetic current conditions are distributed at intervals in the circumferential direction to form the annular magnetic member 12. In practice, the magnetic fields generated by the plurality of electromagnetic coils may overlap to inhibit thermal convection within the silicon liquid 50 from more directions, further reducing the impact of the silicon liquid 50 on the walls of the crucible 30.
In other alternative embodiments of the present application, the magnetic member 12 is an electromagnetic coil, and the axial direction of the electromagnetic coil is set at a preset angle with the axial direction of the annular body 10, and the preset angle is an angle other than a right angle, so that the electromagnetic coil can generate an intermediate magnetic field between the transverse magnetic field shown in fig. 4 and the vertical magnetic field shown in fig. 6.
In a specific application, the magnetic induction line 121 of the intermediate magnetic field in the silicon liquid 50 of the crucible 30 is an arc-shaped magnetic induction line 121. Thus, the partial magnetic induction lines 121 can cut the longitudinal heat convection in the silicon liquid 50, generate lorentz force, and suppress the longitudinal heat convection in the silicon liquid 50. Meanwhile, another part of the magnetic induction lines 121 can cut the transverse heat convection in the silicon liquid 50, generate lorentz force and inhibit the transverse heat convection in the silicon liquid 50. Moreover, the magnetic induction lines 121 can also cut heat convection in other directions than the longitudinal and transverse directions to generate lorentz forces. Thus, heat convection in a plurality of directions in the silicon liquid 50 can be suppressed, and the scouring of the silicon liquid 50 to the wall of the crucible 30 can be reduced, thereby reducing the impurity content in the silicon liquid 50.
It should be noted that, in practical application, the value of the preset included angle may be set according to practical situations, for example, the preset included angle may be 30 degrees, 50 degrees, 85 degrees, or 140 degrees, etc., and the specific value of the preset included angle may not be limited in this embodiment of the present application.
In summary, the thermal field component according to the embodiments of the present application may specifically include:
in an embodiment of the present application, the thermal field component may include an annular body, where an annular cavity is disposed in the annular body; the shell is arranged at one side, close to the crucible, in the annular cavity, and an annular accommodating cavity is arranged in the shell; and the annular magnetic piece is connected in the shell. In the drawing process of the monocrystalline silicon rod, the cooling medium circulates in the accommodating cavity, so that the magnetic piece can be cooled, heat released during crystallization of the monocrystalline silicon rod can be rapidly taken away, and the drawing speed of the monocrystalline silicon rod is improved. Meanwhile, the magnetic piece can form a magnetic field in the silicon liquid of the crucible, the magnetic field can be used for inhibiting heat convection in the silicon liquid, washing of the silicon liquid on the crucible wall is reduced, impurity content in the silicon liquid is reduced, and accordingly crystal pulling quality of a monocrystalline silicon rod is improved. That is, in the case where the thermal field member described in the embodiment of the present application is applied to a single crystal silicon rod pulling apparatus, both the pulling speed and the pulling quality of the single crystal silicon rod can be considered.
The embodiment of the application also provides a schematic structural diagram of the single crystal silicon rod drawing device shown in fig. 1, and as shown in fig. 1, the single crystal silicon rod drawing device comprises: a furnace body; the crucible is arranged in the furnace body and is used for accommodating silicon liquid so as to grow monocrystalline silicon rods from the silicon liquid; the heat exchanger is arranged in the furnace body and is positioned above the crucible; the biological thermal field component according to any one of the above embodiments, wherein the thermal field component is disposed in the furnace body and sleeved outside the heat exchanger, and the thermal field component includes a magnetic member connected to a side of the thermal field component, which is close to the crucible.
In an embodiment of the present application, the thermal field component may include an annular body, where an annular cavity is disposed in the annular body; the shell is arranged at one side, close to the crucible, in the annular cavity, and an annular accommodating cavity is arranged in the shell; and the annular magnetic piece is connected in the shell. In the drawing process of the monocrystalline silicon rod, the cooling medium circulates in the accommodating cavity, so that the magnetic piece can be cooled, heat released during crystallization of the monocrystalline silicon rod can be rapidly taken away, and the drawing speed of the monocrystalline silicon rod is improved. Meanwhile, the magnetic piece can form a magnetic field in the silicon liquid of the crucible, the magnetic field can be used for inhibiting heat convection in the silicon liquid, washing of the silicon liquid on the crucible wall is reduced, impurity content in the silicon liquid is reduced, and accordingly crystal pulling quality of a monocrystalline silicon rod is improved. That is, the single crystal silicon rod pulling apparatus according to the embodiment of the present application can achieve both the pulling speed and the pulling quality of the single crystal silicon rod.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (12)

1. A thermal field component for single crystal silicon rod drawing device, single crystal silicon rod drawing device include the furnace body and set up in crucible in the furnace body, thermal field component is located the crucible top, thermal field component is the heat screen, its characterized in that, thermal field component includes:
the annular body is internally provided with an annular cavity;
the shell is arranged at one side, close to the crucible, in the annular cavity, and an annular accommodating cavity is arranged in the shell;
the annular magnetic piece is connected in the shell;
the water inlet pipe is communicated with the accommodating cavity and is used for introducing a cooling medium into the accommodating cavity;
and the water outlet pipe is communicated with the accommodating cavity and is used for guiding out the cooling medium in the accommodating cavity.
2. The thermal field component of claim 1, wherein a gap exists between an outer wall of the magnetic member and an inner wall of the receiving cavity, the gap being filled with the cooling medium.
3. The thermal field component of claim 2, wherein a plurality of spaced apart support blocks are provided at the bottom of the receiving cavity, the support blocks being connected to the bottom of the magnetic member such that the magnetic member and the receiving cavity form the gap;
and/or, be provided with a plurality of interval distribution's first boss on holding the inside wall in chamber, first boss orientation magnetic part extends, magnetic part in with a plurality of first boss corresponding positions are provided with a plurality of second bosses, one the second boss with one first boss cooperates, so that magnetic part with hold the chamber and form the clearance.
4. The thermal field component of claim 1, wherein the annular body comprises a first tubular structure and a second tubular structure, the second tubular structure is sleeved outside the first tubular structure and encloses with the first tubular structure to form the annular cavity.
5. The thermal field component of claim 1, further comprising a flexible insulation filled within the annular cavity.
6. The thermal field component of claim 1, further comprising a support disposed at a bottom of the annular cavity and connected to the housing, the support configured to support the housing.
7. The thermal field component of claim 6, wherein a boss is provided at a bottom of the housing, the boss having a threaded hole provided thereon;
the thermal field component further comprises a fastener, and the fastener penetrates through the supporting piece and is in threaded connection with the threaded hole.
8. The thermal field component of claim 1, wherein the magnetic member is a ferromagnetic member; wherein,
the ferromagnetic piece is of an annular integrated structure;
or the ferromagnetic piece is of a split structure and comprises a plurality of magnetic blocks which are sequentially distributed along the circumferential direction of the annular body to form an annular structure.
9. The thermal field component of claim 1, wherein the magnetic member is an electromagnetic coil; wherein,
the axial direction of the electromagnetic coil is perpendicular to the axial direction of the annular body, and the electromagnetic coil is used for forming a transverse magnetic field;
or, the axial direction of the electromagnetic coil is parallel to the axial direction of the annular body, and the electromagnetic coil is used for forming a vertical magnetic field.
10. The thermal field component of claim 9, wherein in the case where the axial direction of the electromagnetic coil is perpendicular to the axial direction of the annular body, the number of electromagnetic coils is plural, and the plurality of electromagnetic coils are circumferentially spaced apart;
the number of the electromagnetic coils is one or more in the case that the axial direction of the electromagnetic coils is parallel to the axial direction of the annular body, and the electromagnetic coils are distributed at intervals along the circumferential direction of the annular body.
11. The thermal field component of claim 1, wherein the magnetic member is an electromagnetic coil; wherein,
the electromagnetic coil is arranged at a preset included angle with the axial direction of the annular body, and the preset included angle is an included angle outside the right angle.
12. A single crystal silicon rod pulling apparatus, characterized in that the single crystal silicon rod pulling apparatus comprises:
a furnace body;
the crucible is arranged in the furnace body and is used for accommodating silicon liquid so as to grow monocrystalline silicon rods from the silicon liquid;
the heat exchanger is arranged in the furnace body and is positioned above the crucible;
and the thermal field component of any one of claims 1 to 11, which is arranged in the furnace body and sleeved outside the heat exchanger, and comprises a magnetic piece connected to one side of the thermal field component close to the crucible.
CN202321739753.5U 2023-07-04 2023-07-04 Thermal field component and monocrystalline silicon rod drawing device Active CN220665512U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321739753.5U CN220665512U (en) 2023-07-04 2023-07-04 Thermal field component and monocrystalline silicon rod drawing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321739753.5U CN220665512U (en) 2023-07-04 2023-07-04 Thermal field component and monocrystalline silicon rod drawing device

Publications (1)

Publication Number Publication Date
CN220665512U true CN220665512U (en) 2024-03-26

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