CN220651995U - Wafer spin-drying device - Google Patents
Wafer spin-drying device Download PDFInfo
- Publication number
- CN220651995U CN220651995U CN202322309741.5U CN202322309741U CN220651995U CN 220651995 U CN220651995 U CN 220651995U CN 202322309741 U CN202322309741 U CN 202322309741U CN 220651995 U CN220651995 U CN 220651995U
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- Prior art keywords
- wafer
- movable clamping
- clamping mechanism
- spin
- carrying platform
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Links
- 238000001035 drying Methods 0.000 title claims abstract description 38
- 230000007246 mechanism Effects 0.000 claims abstract description 93
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 235000012431 wafers Nutrition 0.000 claims description 163
- 230000000903 blocking effect Effects 0.000 claims description 9
- 235000006506 Brasenia schreberi Nutrition 0.000 claims description 4
- 244000267222 Brasenia schreberi Species 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 description 12
- 230000009471 action Effects 0.000 description 2
- 238000010981 drying operation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model belongs to the technical field of wafer spin-drying clamping, and discloses a wafer spin-drying device, wherein a wafer carrying platform of the wafer spin-drying device is used for placing a wafer and can rotate to throw out liquid water on the wafer, a plurality of movable clamping mechanisms can move relative to the wafer carrying platform to have clamping positions and non-clamping positions, and when the plurality of movable clamping mechanisms are positioned at the clamping positions, the plurality of movable clamping mechanisms are abutted with the wafer and can clamp the wafer placed on the wafer carrying platform, so that the wafer is prevented from being thrown out when the wafer carrying platform rotates; when the movable clamping mechanism is positioned at the non-clamping position, the movable clamping mechanism is separated from the wafer, the wafer can be installed or removed at the moment, the water retaining cover is arranged on the wafer carrying table and can move relative to the wafer carrying table so as to drive the movable clamping mechanism to move towards the non-clamping position, a user can drive the movable clamping mechanism to move to the non-clamping position in a mode of adjusting the position of the water retaining cover, and then the wafer can be disassembled and assembled.
Description
Technical Field
The utility model relates to the technical field of wafer spin-drying clamping, in particular to a wafer spin-drying device.
Background
The effective thickness on the wafer circuit is small, about 5-10 μm, while the thickness of the wafer itself is large, typically 700-800 μm, and after the circuit layer is fabricated, the wafer needs to be thinned on its back and cleaned. After the wafer is cleaned, liquid or impurities are usually remained on the surface of the wafer, so that the wafer needs to be spin-dried. When the wafer spin-drying operation is performed, a vacuum chuck is generally used to adsorb a wafer on a wafer carrier, and the wafer is driven to rotate by rotating the wafer carrier, so that liquid water on the surface of the wafer is flung out under the action of centrifugal force. However, there is a problem in that, on one hand, vacuum adsorption is required to keep the adsorption surface clean to ensure flatness, otherwise, there is a risk of wafer falling off when rotating at high speed; on the other hand, the vacuum chuck needs to ensure stable and sufficient air supply, which results in a complicated structure of the vacuum adsorption scheme.
Disclosure of Invention
The utility model provides a wafer spin-drying device, which is used for solving the problems that in the prior art, the vacuum adsorption is required to keep an adsorption surface clean, and a vacuum chuck is required to ensure stable and sufficient air supply, so that the structure of a vacuum adsorption scheme is complex.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
wafer spin-drying device includes:
the wafer carrier is used for placing a wafer, and can rotate along the center line of the wafer carrier so as to drive the wafer to rotate and throw out liquid water on the wafer;
the movable clamping mechanisms are arranged, the movable clamping mechanisms can move relative to the wafer carrier and have clamping positions and non-clamping positions, when the movable clamping mechanisms are positioned at the clamping positions, the movable clamping mechanisms are abutted with the wafers and can clamp the wafers placed on the wafer carrier, and when the movable clamping mechanisms are positioned at the non-clamping positions, the movable clamping mechanisms are separated from the wafers;
the water retaining cover is arranged on the wafer carrying platform and can move relative to the wafer carrying platform so as to drive the movable clamping mechanism to move towards the non-clamping position.
As the preferred scheme of wafer spin-drying device, movable fixture pass through the rotation axis rotate set up in the wafer carrier to have clamping part and butt portion, clamping part can with the wafer butt, the manger plate cover can with butt portion butt to drive movable fixture moves towards non-clamping position, the butt portion is located the rotation axis is kept away from one side of wafer.
As the preferable scheme of the wafer spin-drying device, the water blocking cover can vertically move downwards relative to the wafer carrying platform so as to drive the movable clamping mechanism to move, and the height of the clamping part is higher than that of the rotating shaft.
As a preferable mode of the wafer spin-drying device, the abutting portion comprises an abutting portion body and a bolt which is in threaded connection with the abutting portion body, and the head of the bolt can be abutted with the water blocking cover.
As a preferable mode of the wafer spin-drying device, the wafer spin-drying device further comprises an elastic piece, wherein the elastic piece is connected between the wafer carrying platform and the movable clamping mechanism and is used for providing elastic force for enabling the movable clamping mechanism to move towards the clamping position.
As the preferable scheme of the wafer spin-drying device, the movable clamping mechanism is provided with an elastic piece mounting hole, and part of the elastic piece is arranged in the elastic piece mounting hole.
As the preferable scheme of wafer spin-drying device, be provided with the guide post in the elastic component mounting hole, be located the part in the elastic component mounting hole the elastic component cover is located the guide post.
As the preferable scheme of the wafer spin-drying device, the wafer carrying platform is round, a plurality of movable clamping mechanisms are arranged at intervals along the circumferential direction of the wafer carrying platform, and the distances between any two adjacent movable clamping mechanisms are the same.
As the preferable scheme of wafer spin-drying device, the peripheral wall of wafer carrier has seted up the holding tank, the partly setting of movable fixture is in the holding tank.
As the preferred scheme of wafer spin-drying device, still include fixed fixture fixedly set up in the wafer carrier, the activity fixture can with fixed fixture cooperation is in order to press from both sides tightly the wafer.
The beneficial effects of the utility model are as follows:
the utility model provides a wafer spin-drying device which comprises a wafer carrying platform, a movable clamping mechanism and a water retaining cover, wherein the wafer carrying platform is used for placing a wafer and can rotate along the center line of the wafer carrying platform so as to drive the wafer to rotate and throw out liquid water on the wafer. The movable clamping mechanisms are provided with a plurality of movable clamping mechanisms, the movable clamping mechanisms can move relative to the wafer carrier and have clamping positions and non-clamping positions, and when the movable clamping mechanisms are positioned at the clamping positions, the movable clamping mechanisms are abutted with the wafer and can clamp the wafer placed on the wafer carrier, so that when the wafer carrier rotates, the wafer is prevented from being thrown out; when the movable clamping mechanism is positioned at the non-clamping position, the movable clamping mechanism is separated from the wafer, and the wafer can be installed or removed at the moment. The water retaining cover is arranged on the wafer carrying platform, the water retaining cover can move relative to the wafer carrying platform to drive the movable clamping mechanism to move towards the non-clamping position, so that the water retaining cover is linked with the movable clamping mechanism, after a wafer needs to be installed or the wafer is dried, a user can drive the movable clamping mechanism to move to the non-clamping position in a mode of adjusting the position of the water retaining cover, then the wafer can be disassembled and assembled, and the wafer clamping device is convenient to operate and simple in structure.
Drawings
FIG. 1 is a schematic view of a wafer spin-drying apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic view of the movable clamping mechanism in the clamping position according to the embodiment of the present utility model;
fig. 3 is a schematic view of the movable clamping mechanism in the unclamped position according to an embodiment of the present utility model.
In the figure:
1. a wafer carrier; 11. a rotation shaft; 12. a receiving groove;
2. a movable clamping mechanism; 21. a clamping part; 22. an abutting portion; 221. an abutting portion body; 222. a bolt; 23. an elastic member mounting hole; 231. a guide post;
3. a water retaining cover;
4. an elastic member.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
When the wafer spin-drying operation is performed, a vacuum chuck is generally used to adsorb a wafer on a wafer carrier, and the wafer is driven to rotate by rotating the wafer carrier, so that liquid water on the surface of the wafer is flung out under the action of centrifugal force. However, there is a problem in that, on one hand, vacuum adsorption is required to keep the adsorption surface clean to ensure flatness, otherwise, there is a risk of wafer falling off when rotating at high speed; on the other hand, the vacuum chuck needs to ensure stable and sufficient air supply, which results in a complicated structure of the vacuum adsorption scheme.
To above-mentioned problem, this embodiment provides wafer spin-drying device to in solving prior art, vacuum adsorption needs to make the adsorption surface keep clean and vacuum chuck needs to guarantee that the air feed is stable and sufficient, leads to vacuum adsorption scheme structure complicated problem, can be used to wafer spin-drying centre gripping technical field.
Referring to fig. 1-3, the wafer spin-drying device includes a wafer carrier 1, a movable clamping mechanism 2, and a water blocking cover 3, wherein the wafer carrier 1 is used for placing a wafer, and the wafer carrier 1 can rotate along its own center line to drive the wafer to rotate and spin out liquid water on the wafer. The movable clamping mechanisms 2 are provided with a plurality of, the movable clamping mechanisms 2 can move relative to the wafer carrier 1 to have clamping positions and non-clamping positions, and when the movable clamping mechanisms 2 are positioned at the clamping positions, the movable clamping mechanisms 2 are abutted with the wafer and can clamp the wafer placed on the wafer carrier 1, so that when the wafer carrier 1 rotates, the wafer is prevented from being thrown out; when the movable clamping mechanism 2 is in the non-clamping position, the movable clamping mechanism 2 is separated from the wafer, at which time the wafer may be mounted or removed.
With continued reference to fig. 1-3, the water retaining cover 3 is disposed on the wafer carrier 1, where the water retaining cover 3 can block liquid water thrown out by the wafer, and the water retaining cover 3 can move relative to the wafer carrier 1 to drive the movable clamping mechanism 2 to move towards the non-clamping position, so that the water retaining cover 3 and the movable clamping mechanism 2 are linked, after the wafer needs to be mounted or the wafer has finished spin-drying, a user can drive the movable clamping mechanism 2 to move to the non-clamping position by adjusting the position of the water retaining cover 3, and then the wafer can be disassembled and assembled, so that the operation is convenient and the structure is simple.
With continued reference to fig. 1-3, the movable clamping mechanism 2 is rotatably disposed on the wafer stage 1 through the rotation shaft 11, and has a clamping portion 21 and an abutting portion 22, the clamping portion 21 can abut against the wafer, and the water retaining cover 3 can abut against the abutting portion 22 to drive the movable clamping mechanism 2 to move toward the non-clamping position, and the abutting portion 22 is located on a side of the rotation shaft 11 away from the wafer. In general, in order to make the structural layout of the wafer spin-drying apparatus more reasonable, the water blocking cover 3 is generally disposed on the outer side of the wafer stage 1, and the abutting portion 22 is disposed on the side of the rotating shaft 11 away from the wafer, so that the water blocking cover 3 and the abutting portion 22 are conveniently matched.
With continued reference to fig. 1-3, the water blocking cover 3 can move vertically downward relative to the wafer carrier 1 to drive the movable clamping mechanism 2 to move, and the height of the clamping portion 21 is higher than that of the rotating shaft 11.
In other embodiments, the water blocking cover 3 can also move vertically upwards relative to the wafer carrier 1 to drive the movable clamping mechanism 2 to move, the height of the clamping portion 21 is lower than the height of the rotating shaft 11, and when the water blocking cover 3 moves to drive the movable clamping mechanism 2 to move, the clamping portion 21 rotates downwards, so that a user can place a wafer on the wafer carrier 1 from below the clamping portion 21.
With continued reference to fig. 1-3, the abutment 22 includes an abutment body 221 and a bolt 222 screwed to the abutment body 221, the head of the bolt 222 being capable of abutting against the water deflector 3. So configured, on the one hand, the position of the bolt 222 with respect to the abutment body 221 can be adjusted by screwing the bolt 222, so that the angle of rotation of the movable clamp mechanism 2 is different when the water deflector 3 moves along the same path; on the other hand, since the water shield 3 needs to contact with the abutment portion 22 to drive the movable clamping mechanism 2 to move, the abutment portion 22 is easily worn after long-time use, and the bolt 222 detachably connected to the abutment portion body 221 is engaged with the water shield 3, if the head of the bolt 222 is worn, only the bolt 222 may be replaced.
With continued reference to fig. 1-3, the wafer spin-drying apparatus further includes an elastic member 4, where the elastic member 4 is connected between the wafer carrier 1 and the movable clamping mechanism 2 and is configured to provide an elastic force for moving the movable clamping mechanism 2 toward the clamping position, so that the movable clamping mechanism 2 is driven by the elastic force of the movable clamping mechanism 2 to move toward the clamping position and is configured to clamp the wafer. In this embodiment, the elastic member 4 is a compression spring and is disposed below the rotation shaft 11. In other embodiments, the elastic member 4 may be a tension spring and disposed above the rotation shaft 11, and in addition, the elastic member 4 may be a torsion spring or the like.
With continued reference to fig. 1-3, the movable clamping mechanism 2 has an elastic member mounting hole 23, and a part of the elastic member 4 is disposed in the elastic member mounting hole 23, so that during the movement of the movable clamping mechanism 2, the part of the elastic member 4 located in the elastic member mounting hole 23 is prevented from being collided, and at the same time, a dust-proof effect can be achieved.
With continued reference to fig. 1-3, the elastic member mounting hole 23 is provided with a guide post 231, and a portion of the elastic member 4 located in the elastic member mounting hole 23 is sleeved on the guide post 231, so as to avoid bending of the portion of the elastic member 4 located in the elastic member mounting hole 23.
With continued reference to fig. 1-3, the wafer carrier 1 is circular, and the plurality of movable clamping mechanisms 2 are arranged at intervals along the circumferential direction of the wafer carrier 1, and the distances between any two adjacent movable clamping mechanisms 2 are the same, so that the movable clamping mechanisms 2 can stably clamp the wafer. In this embodiment, three movable clamping mechanisms 2 are provided, and the included angles between the three movable clamping mechanisms 2 and the connecting line of the circle center of the wafer carrier 1 are all 120 °.
With continued reference to fig. 1-3, the peripheral wall of the wafer carrier 1 is provided with a receiving groove 12, and a portion of the movable clamping mechanism 2 is disposed in the receiving groove 12, so as to protect the movable clamping mechanism 2 and save space. Alternatively, the abutment 22 protrudes out of the receiving groove 12 to facilitate the connection between the abutment 22 and the water shield 3.
With continued reference to fig. 1-3, the wafer spin-drying apparatus further includes a fixed clamping mechanism fixedly disposed on the wafer carrier 1, and the movable clamping mechanism 2 is capable of cooperating with the fixed clamping mechanism to clamp a wafer, so that a part of the clamping mechanisms are fixed clamping mechanisms fixedly disposed on the wafer carrier 1, another part of the clamping mechanisms are movable clamping mechanisms 2 movably disposed on the wafer carrier 1, and a user can operate the wafer to contact with the fixed clamping mechanisms during installation, then place the wafer on the wafer carrier 1, and operate the movable clamping mechanisms 2 to enable the movable clamping mechanisms 2 to abut against the wafer to complete clamping.
It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.
Claims (10)
1. Wafer spin-drying device, its characterized in that includes:
the wafer carrying platform (1) is used for placing a wafer, and the wafer carrying platform (1) can rotate along the central line of the wafer carrying platform to drive the wafer to rotate and throw out liquid water on the wafer;
a plurality of movable clamping mechanisms (2), wherein the movable clamping mechanisms (2) can move relative to the wafer carrying platform (1) to have clamping positions and non-clamping positions, when the movable clamping mechanisms (2) are positioned at the clamping positions, the movable clamping mechanisms (2) are abutted with the wafers and can clamp the wafers placed on the wafer carrying platform (1), and when the movable clamping mechanisms (2) are positioned at the non-clamping positions, the movable clamping mechanisms (2) are separated from the wafers;
the water retaining cover (3) is arranged on the wafer carrying platform (1), and the water retaining cover (3) can move relative to the wafer carrying platform (1) so as to drive the movable clamping mechanism (2) to move towards the non-clamping position.
2. The wafer spin-drying device according to claim 1, wherein the movable clamping mechanism (2) is rotatably arranged on the wafer carrying table (1) through a rotating shaft (11), and is provided with a clamping part (21) and an abutting part (22), the clamping part (21) can be abutted with the wafer, the water retaining cover (3) can be abutted with the abutting part (22) so as to drive the movable clamping mechanism (2) to move towards a non-clamping position, and the abutting part (22) is positioned on one side, away from the wafer, of the rotating shaft (11).
3. The wafer spin-drying device according to claim 2, wherein the water blocking cover (3) can vertically move downwards relative to the wafer carrying platform (1) so as to drive the movable clamping mechanism (2) to move, and the height of the clamping part (21) is higher than the height of the rotating shaft (11).
4. The wafer spin-drying apparatus according to claim 2, wherein the abutment portion (22) includes an abutment portion body (221) and a bolt (222) screwed to the abutment portion body (221), and a head of the bolt (222) is capable of abutting the water shield (3).
5. The wafer spin-drying apparatus according to claim 1, further comprising an elastic member (4), the elastic member (4) being connected between the wafer carrier (1) and the movable clamping mechanism (2) and being configured to provide an elastic force for moving the movable clamping mechanism (2) towards a clamping position.
6. The wafer spin-drying apparatus according to claim 5, wherein the movable clamping mechanism (2) has an elastic member mounting hole (23), and a part of the elastic member (4) is disposed in the elastic member mounting hole (23).
7. The wafer spin-drying device according to claim 6, wherein a guide post (231) is disposed in the elastic member mounting hole (23), and a portion of the elastic member (4) disposed in the elastic member mounting hole (23) is sleeved on the guide post (231).
8. The wafer spin-drying apparatus according to any one of claims 1 to 7, wherein the wafer stage (1) is circular, a plurality of the movable clamping mechanisms (2) are arranged at intervals along the circumferential direction of the wafer stage (1), and the distances between any two adjacent movable clamping mechanisms (2) are the same.
9. The wafer spin-drying apparatus according to any one of claims 1 to 7, wherein a receiving groove (12) is formed in an outer peripheral wall of the wafer stage (1), and a part of the movable clamping mechanism (2) is disposed in the receiving groove (12).
10. The wafer spin-drying apparatus according to any one of claims 1-7, further comprising a fixed clamping mechanism fixedly provided to the wafer carrier (1), the movable clamping mechanism (2) being capable of cooperating with the fixed clamping mechanism to clamp the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322309741.5U CN220651995U (en) | 2023-08-28 | 2023-08-28 | Wafer spin-drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322309741.5U CN220651995U (en) | 2023-08-28 | 2023-08-28 | Wafer spin-drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220651995U true CN220651995U (en) | 2024-03-22 |
Family
ID=90287218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322309741.5U Active CN220651995U (en) | 2023-08-28 | 2023-08-28 | Wafer spin-drying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220651995U (en) |
-
2023
- 2023-08-28 CN CN202322309741.5U patent/CN220651995U/en active Active
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