CN219696440U - Single wafer wet cleaning clamping mechanism - Google Patents
Single wafer wet cleaning clamping mechanism Download PDFInfo
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- CN219696440U CN219696440U CN202321021074.4U CN202321021074U CN219696440U CN 219696440 U CN219696440 U CN 219696440U CN 202321021074 U CN202321021074 U CN 202321021074U CN 219696440 U CN219696440 U CN 219696440U
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- 238000004140 cleaning Methods 0.000 title claims abstract description 37
- 230000007246 mechanism Effects 0.000 title claims abstract description 19
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000007704 transition Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 103
- 230000000694 effects Effects 0.000 description 17
- 230000009471 action Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a single wafer wet cleaning clamping mechanism, which relates to the technical field of wafer cleaning and comprises a rotating part shell and a circular support which is arranged in the rotating part shell and fixedly connected with the rotating part shell, wherein a plurality of supporting thimbles which play a role in supporting a wafer are fixed on the upper surface of the circular support, the plurality of supporting thimbles are arranged in an array mode by taking the central line of the circular support as the axis, and a plurality of clamping pieces which play a role in clamping the wafer so as to reduce the flying-out of the wafer are also arranged on the circular support.
Description
Technical Field
The utility model relates to the technical field of wafer cleaning, in particular to a wet cleaning clamping mechanism for a single wafer.
Background
The wafer, i.e. the silicon wafer required for manufacturing the silicon semiconductor circuit, is made of silicon, and in the wafer processing and manufacturing industry, the position of the wafer clamping device is important, and generally comprises vacuum adsorption, electrostatic adsorption, thimble clamping and the like.
The wafer needs to be cleaned by wet method in the manufacturing process, when in cleaning, a single wafer needs to be clamped, and the wafer is driven to rotate for cleaning, however, the existing clamping mechanism has the problems that the structure is simple, the wafer can be fixed in the horizontal direction, the wafer possibly flies out in the rotating process of the wafer, meanwhile, the contact area of the clamping mechanism and the wafer is large, the flow of cleaning liquid medicine is influenced, and the cleaning effect can be influenced to a certain extent.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides a wet cleaning and clamping mechanism for a single wafer, which comprises a rotating part shell and a circular support arranged in the rotating part shell and fixedly connected with the rotating part shell, wherein a plurality of supporting thimbles which play a supporting role on the wafer are fixed on the upper surface of the circular support, the supporting thimbles are arrayed by taking the central line of the circular support as an axle center, and a plurality of clamping pieces which play a clamping role on the wafer to reduce the flying-out of the wafer are also arranged on the circular support.
In order to achieve the above purpose, the supporting function is achieved on the wafer through the function of the supporting ejector pins, meanwhile, the contact area between the supporting ejector pins and the wafer is small, the cleaning effect of the wafer is not affected, the wafer is clamped in the horizontal direction and the vertical direction through the function of the clamping piece, the possibility that the wafer flies out of the device when rotating is reduced while the cleaning effect is not affected, and the cleaning effect of the wafer is improved.
Further, the clamping piece is including setting up the clamping thimble at the wafer periphery, set up on the clamping thimble with the wafer periphery wall conflict in order to reduce the inner groovy that the wafer flies out the possibility, clamping thimble lower surface is fixed with the spliced pole, the spliced pole outer wall is fixed with the push rod towards one side of circular support, the one end that the spliced pole was kept away from to the push rod is fixed with hexagonal ball screw, each the push rod all slides with circular support through the guide and is connected, be equipped with the moving part that control push rod moved in order to drive spliced pole and clamping thimble removal in order to press from both sides tight wafer on the circular support in the horizontal direction.
Through above-mentioned technical scheme, when installing the wafer, the wafer is placed on a plurality of bearing thimble, play the supporting role to the wafer through the effect of a plurality of bearing thimble, afterwards drive the orientation removal of push rod towards the wafer through the effect of moving part, the removal of push rod can drive the spliced pole that is fixed with the push rod and remove, the removal of spliced pole can drive the tight thimble of clamp with the spliced pole is fixed and remove, until clamp the indent on the thimble and the circumference outer wall conflict of wafer, a plurality of clamp thimble clamp wafer this moment, the possibility that the wafer flies out the device in the cleaning process has been reduced, the effect through the guide part plays the guide effect to the removal of push rod simultaneously, so that push rod and circular support slide and be connected.
Further, the guide piece is including fixing the protruding type piece at circular support lower surface, the guide way that supplies the push rod to remove has been seted up to protruding type piece inside intermediate position, the central line direction of guide way is perpendicular with the central line direction of circular support, the push rod slides through the guide way with protruding type piece and is connected, be fixed with the minor axis on the push rod, circular support lower surface is fixed with a plurality of first locating pieces that are located the minor axis side, minor axis and first locating piece pass through first extension spring fixed connection.
Through above-mentioned technical scheme, through the effect of first extension spring, hexagonal ball screw on the push rod is contradicted with protruding piece all the time, the effect through the driving piece drives the annular wheel and rotates, the rotation of annular wheel can drive the protruding piece rotation with annular wheel fixed connection, the rotation of protruding piece can drive hexagonal ball screw's removal, hexagonal ball screw's removal can drive with hexagonal ball screw fixed push rod removal, and then drive and push rod fixed clamp thimble removes, when protruding piece A point rotates along with the annular wheel and is close to hexagonal ball screw gradually, first extension spring is stretched, clamp thimble is kept away from the wafer gradually this moment, when protruding piece B point is close to hexagonal ball screw gradually along with annular wheel rotation, first extension spring kick-backs, clamp thimble is close to the wafer gradually this moment.
Further, the driving piece comprises a driven gear fixed on the circumferential inner wall of the annular wheel, the center line of the driven gear is coaxial with the center line of the annular wheel, a driving gear meshed with the driven gear is arranged beside the annular wheel, and a rotary cylinder for driving the driving gear to rotate is fixed on the rotary part shell.
Through above-mentioned technical scheme, through the effect control driving gear rotation of gyration cylinder, the rotation of driving gear can drive the driven gear rotation with the driving gear meshing, and driven gear's rotation can drive the annular wheel rotation fixed with driven gear, and the rotation of annular wheel can drive the rotation of protruding piece, and then the removal of control push rod.
Further, a plurality of mounting lugs are uniformly arranged on the circumferential outer wall of the annular wheel, a plurality of second positioning blocks matched with the mounting lugs are fixed on the lower surface of the circular support, and the second positioning blocks are fixed with the mounting lugs through second tension springs.
Through the technical scheme, along with the movement of the protruding block, when the point A of the protruding block is gradually close to the hexagonal ball screw, the second tension spring is gradually stretched at the moment, when the top B of the protruding block is gradually close to the hexagonal ball screw, the second tension spring rebounds at the moment, and the action of the second tension spring of the push rod plays a limiting role on the rotation of the protruding block.
Further, a wedge block is fixed on the push rod, the wedge block extends out of the push rod, a plurality of A limiting blocks and B limiting blocks which are respectively positioned beside the wedge block are fixed on the lower surface of the circular support, the A limiting blocks are positioned between the B limiting blocks and the wedge block, and a limiting shaft positioned between the wedge block and the convex block is arranged on the push rod.
Through the technical scheme, the movement of the push rod can drive the movement of the limit shaft fixedly connected with the push rod and the wedge block, when the limit shaft moves towards the direction away from the wafer to be in conflict with the B limit block, the push rod cannot move towards the direction away from the wafer again, when the wedge block moves along with the push rod towards the direction of the wafer and moves to be in conflict with the A limit block, the push rod cannot move towards the direction close to the wafer again, and the movement range of the push rod is limited through the functions of the wedge block, the A limit block, the B limit block and the limit shaft.
In summary, the single wafer wet cleaning clamping mechanism has the following beneficial effects:
(1) This monolithic wafer wet cleaning clamping mechanism plays the supporting role to the wafer through the effect of a plurality of bearing thimble, and bearing thimble and wafer area of contact are little simultaneously, do not influence the cleaning performance of wafer, all carry out the centre gripping to the wafer in horizontal direction and vertical direction through the effect of clamping piece, and the atress is even, reduces the possibility that the wafer flies out the device when rotatory when not influencing the cleaning performance, has improved the cleaning performance of wafer.
(2) This monolithic wafer wet cleaning clamping mechanism, when protruding piece A point rotates along with the ring wheel and is close to hexagonal ball bolt gradually, first extension spring is stretched, and the wafer is kept away from gradually to the clamp thimble this moment, and when protruding piece B point rotated along with the ring wheel gradually is close to hexagonal ball bolt, first extension spring resilience, and clamp thimble is close to the wafer this moment gradually to the device is applicable to multiple unidimensional wafer, has improved the utilization ratio of the device.
(3) This monolithic wafer wet cleaning clamping mechanism, the removal of push rod can drive the removal of spacing axle and wedge with push rod fixed connection, spacing axle moves to when contradicting with the B stopper towards the direction of keeping away from the wafer, the push rod can't continue to move towards the direction of keeping away from the wafer this moment, when the wedge moves and moves to when contradicting with A stopper along with the direction of push rod towards the wafer, the push rod can't continue to move towards the direction near the wafer this moment, through the effect of wedge, A stopper, B stopper and spacing axle, restrict the range of movement of push rod.
Drawings
The utility model is further described and illustrated below with reference to the accompanying drawings.
FIG. 1 is a schematic overall construction of a preferred embodiment of the present utility model;
FIG. 2 is a schematic view of a structure embodying the present utility model for supporting a thimble;
FIG. 3 is a schematic view of the bottom construction of the present utility model;
FIG. 4 is a schematic view of a configuration of a hexagonal ball screw embodying the present utility model;
fig. 5 is a schematic view of the structure of the present utility model for embodying the inner groove.
Reference numerals: 1. a circular bracket; 2. a wafer body; 3. supporting the thimble; 4. a clamping member; 401. clamping the thimble; 402. an inner groove; 403. a connecting column; 404. a push rod; 405. a hexagonal ball screw; 5. a guide member; 501. a convex block; 502. a guide groove; 6. an annular wheel; 7. a protruding block; 8. a short shaft; 9. a first positioning block; 10. a first tension spring; 11. a driven gear; 12. a drive gear; 13. a mounting ear; 14. a second positioning block; 15. a second tension spring; 16. wedge blocks; 17. a limiting block; 18. a limiting block B; 19. and a limiting shaft.
Detailed Description
The technical solution of the present utility model will be more clearly and completely explained by the description of the preferred embodiments of the present utility model with reference to the accompanying drawings.
As shown in fig. 1-5, the wet cleaning and clamping mechanism for a single wafer according to the preferred embodiment of the utility model comprises a rotating part shell and a circular support 1 which is arranged in the rotating part shell and fixedly connected with the rotating part shell, wherein a plurality of supporting ejector pins 3 which play a role in supporting the wafer 2 are fixed on the upper surface of the circular support 1, the plurality of supporting ejector pins 3 are arranged in an array mode by taking the central line of the circular support 1 as an axis, the supporting ejector pins 3 play a role in supporting the wafer 2, and meanwhile, the contact area between the supporting ejector pins 3 and the wafer 2 is small, so that the cleaning effect of the wafer 2 is not affected.
As shown in fig. 1, the rotating part housing and the circular support 1 rotate during the cleaning process of the wafer 2, and the rotation of the rotating part housing and the circular support 1 drives the wafer 2 to rotate, so as to reduce the possibility of the wafer 2 flying out of the device during the cleaning process, a plurality of clamping pieces 4 for clamping the wafer are further provided on the circular support 1 to reduce the flying out of the wafer 2.
As shown in fig. 2, the clamping member 4 includes a clamping thimble 401 disposed at the periphery of the wafer 2, and an inner groove 402 that is in contact with the peripheral wall of the wafer 2 to reduce the possibility of the wafer 2 flying out is formed in the clamping thimble 401, and the plurality of clamping thimbles 401 are uniformly distributed and are arranged in an array manner with the center line of the circular support 1 as an axis, and both the horizontal direction and the vertical direction of the wafer 2 are clamped by the action of the inner groove 402, so that the possibility of the wafer 2 flying out from the device is reduced.
As shown in fig. 2 and 5, in order to be suitable for wafers 2 with different sizes, and also in order to facilitate the installation and removal of the wafers 2, a push rod 404 is fixed on one side of the outer wall of the connecting column 403 facing the circular support 1, a hexagonal ball screw 405 is fixed on one end of the push rod 404 away from the connecting column 403, each push rod 404 is slidably connected with the circular support 1 through a guide 5, and a moving member for controlling the push rod 404 to move in the horizontal direction to drive the connecting column 403 and the clamping thimble 401 to move so as to clamp the wafers 2 is arranged on the circular support 1.
As shown in fig. 1 and 5, when the wafer 2 is installed, the wafer 2 is placed on the supporting pins 3, the supporting function is performed on the wafer 2 through the functions of the supporting pins 3, then the push rod 404 is driven to move towards the direction of the wafer 2 through the function of the moving part, the movement of the push rod 404 drives the connecting column 403 fixed with the push rod 404 to move, the movement of the connecting column 403 drives the clamping pins 401 fixed with the connecting column 403 to move until the inner grooves 402 on the clamping pins 401 are in contact with the circumferential outer wall of the wafer 2, and at the moment, the plurality of clamping pins 401 clamp the wafer 2, so that the possibility that the wafer 2 flies out of the device in the cleaning process is reduced, and meanwhile, the movement of the push rod 404 is guided through the function of the guide part 5, so that the push rod 404 is connected with the circular support 1 in a sliding manner.
As shown in fig. 3 and fig. 4, the guide member 5 includes a convex block 501 fixed on the lower surface of the circular support 1, a guide groove 502 for the push rod 404 to move is provided in the middle position inside the convex block 501, the center line direction of the guide groove 502 is perpendicular to the center line direction of the circular support 1, the push rod 404 and the convex block 501 slide and connect through the guide groove 502, and the cooperation of the convex block 501 and the guide groove 502 plays a role in guiding and supporting the movement of the push rod 404, so that the push rod 404 is also convenient to slide and connect with the circular support 1, the possibility that the push rod 404 is separated from the circular support 1 is reduced, and the wafer 2 is further clamped conveniently.
As shown in fig. 3 and 4, the moving member comprises an annular wheel 6 rotatably connected to the central position of the lower surface of the circular support 1, a plurality of protruding blocks 7 which are abutted against the hexagonal ball bolts 405 are arranged on the circumferential outer wall of the annular wheel 6, the plurality of protruding blocks 7 are arrayed by taking the central line of the annular wheel 6 as an axle center, the diameter length of the point of the protruding block 7A is larger than that of the point of the protruding block 7B, the point of the protruding block 7 is in smooth inclined transition with the outer wall of the annular wheel 6, a driving member for controlling the annular wheel 6 to rotate is arranged on the upper circular support 1, a short shaft 8 is fixed on a push rod 404, a plurality of first positioning blocks 9 positioned beside the short shaft 8 are fixed on the lower surface of the circular support 1, and the short shaft 8 and the first positioning blocks 9 are fixedly connected through first tension springs 10.
As shown in fig. 3 and fig. 4, under the action of the first tension spring 10, the hexagonal ball screw 405 on the push rod 404 is always abutted against the bump 7, the annular wheel 6 is driven to rotate under the action of the driving member, the bump 7 fixedly connected with the annular wheel 6 is driven to rotate by the rotation of the annular wheel 6, the hexagonal ball screw 405 is driven to move by the rotation of the bump 7, the push rod 404 fixedly connected with the hexagonal ball screw 405 is driven to move by the movement of the hexagonal ball screw 405, and then the clamping thimble 401 fixedly connected with the push rod 404 is driven to move, when the bump 7A rotates along with the annular wheel 6 and gradually approaches the hexagonal ball screw 405, the first tension spring 10 is stretched, the clamping thimble 401 is gradually far away from the wafer 2, and when the bump 7B rotates along with the annular wheel 6 and gradually approaches the hexagonal ball screw 405, the first tension spring 10 rebounds, and the clamping thimble 401 is gradually close to the wafer 2.
As shown in fig. 3, the driving member includes a driven gear 11 fixed on the inner wall of the circumference of the ring gear 6, the center line of the driven gear 11 is coaxial with the center line of the ring gear 6, a driving gear 12 meshed with the driven gear 11 is arranged at the side of the ring gear 6, a revolving cylinder for driving the driving gear 12 to rotate is fixed on the rotating part shell, the driving gear 12 is controlled to rotate through the action of the revolving cylinder, the rotation of the driving gear 12 drives the driven gear 11 meshed with the driving gear 12 to rotate, the rotation of the driven gear 11 drives the ring gear 6 fixed with the driven gear 11 to rotate, and the rotation of the ring gear 6 drives the rotation of the protruding block 7 to further control the movement of the push rod 404.
As shown in fig. 3 and 4, in order to limit the rotation range of the protruding block 7 and the annular wheel 6, a plurality of mounting lugs 13 are uniformly arranged on the circumferential outer wall of the annular wheel 6, a plurality of second positioning blocks 14 matched with the mounting lugs 13 are fixed on the lower surface of the circular support 1, the second positioning blocks 14 and the mounting lugs 13 are fixed through second tension springs 15, along with the movement of the protruding block 7, when the point a of the protruding block 7 is gradually close to the hexagonal ball screw 405, the second tension springs 15 are gradually stretched, when the top B of the protruding block 7 is gradually close to the hexagonal ball screw 405, the second tension springs 15 rebound, the action of the push rod 404 plays a limiting role on the rotation of the protruding block 7, and the point a of the protruding block 7 rotates to be in contact with the hexagonal ball screw 405 and does not continue rotating any more, but reversely rotates.
As shown in fig. 3 and fig. 4, a wedge block 16 is fixed on the push rod 404, the wedge block 16 extends out of the push rod 404, a plurality of a limiting blocks 17 and B limiting blocks 18 are fixed on the lower surface of the circular support 1, the a limiting blocks 17 are respectively located beside the wedge block 16, the a limiting shaft 19 located between the wedge block 16 and the convex block 501 is arranged on the push rod 404, the movement of the push rod 404 drives the limiting shaft 19 fixedly connected with the push rod 404 and the movement of the wedge block 16, the limiting shaft 19 moves towards the direction far away from the wafer 2 to abut against the B limiting blocks 18, at this time, the push rod 404 cannot move towards the direction far away from the wafer 2 again, and at this time, the push rod 404 cannot move towards the direction close to the wafer 2 again when the wedge block 16 moves towards the a limiting block 17, and the movement range of the push rod 404 is limited by the functions of the wedge block 16, the a limiting block 17, the B limiting block 18 and the limiting shaft 19.
When the wafer 2 is required to be mounted, the rotary cylinder is opened, the driving gear 12 is driven to rotate through the action of the rotary cylinder, the driven gear 11 meshed with the driving gear 12 is driven to rotate through the rotation of the driving gear 12, the annular wheel 6 fixed with the driven gear 11 is driven to rotate through the rotation of the driven gear 11, the boss 7 fixed with the annular wheel 6 is driven to rotate through the rotation of the annular wheel 6, the point A of the boss 7 is gradually close to the adjacent hexagonal ball screw 405 along with the rotation of the annular wheel 6, at the moment, the movement of the hexagonal ball screw 405 drives the push rod 404 fixed with the hexagonal ball screw 405 to move, the push rod 404 moves towards the direction away from the wafer 2, the movement of the push rod 404 plays a guiding and supporting role through the cooperation of the boss 501 and the guide groove 502 until the limiting shaft 19 on the push rod 404 is abutted against the B limiting block 18, at the moment, the movement of the push rod 404 drives the short shaft 8 to move, and the first tension spring 10 is stretched;
at the moment, the wafer 2 is placed on the plurality of supporting ejector pins 3 through the mechanical arm, the supporting ejector pins 3 play a supporting role on the wafer 2, the contact area between the supporting ejector pins 3 and the wafer 2 is small, and the cleaning effect of the wafer 2 is not affected;
then the driving gear 12 is driven to rotate reversely by controlling the rotary cylinder, the driving gear 12 rotates reversely to drive the annular wheel 6 to rotate reversely until the point B of the protruding block 7 is gradually close to the adjacent hexagonal ball bolt 405, at the moment, the first tension spring 10 rebounds to drive the push rod 404 to move towards the direction of the wafer 2, the movement of the push rod 404 drives the connecting column 403 fixed with the push rod 404, the movement of the connecting column 403 drives the clamping thimble 401 fixed with the connecting column 403 to move until the inner groove 402 on the clamping thimble 401 is abutted against the circumferential outer wall of the wafer 2, at the moment, the plurality of clamping thimbles 401 clamp the wafer 2, the possibility that the wafer 2 flies out of the device in the cleaning process is reduced, the wafer 2 is clamped in both the horizontal direction and the vertical direction by the action of the clamping thimble 401, the possibility that the wafer 2 flies out of the device while rotating is reduced, and the cleaning effect of the wafer 2 is improved.
The above detailed description is merely illustrative of the preferred embodiments of the present utility model and is not intended to limit the scope of the present utility model. Various modifications, substitutions and improvements of the technical scheme of the present utility model will be apparent to those skilled in the art from the description and drawings provided herein without departing from the spirit and scope of the utility model. The scope of the utility model is defined by the claims.
Claims (7)
1. The utility model provides a monolithic wafer wet cleaning clamping mechanism, its characterized in that, including rotating part shell and set up in the rotating part shell and with rotating part shell fixed connection's circular support (1), circular support (1) upper surface is fixed with a plurality of bearing thimble (3) that play the supporting role to wafer body (2), a plurality of bearing thimble (3) use the central line of circular support (1) as the axle center array to arrange, still be equipped with a plurality of clamping pieces (4) that play the clamping role to reduce wafer body (2) departure to the wafer on circular support (1).
2. The wet cleaning and clamping mechanism for a single wafer according to claim 1, wherein the clamping piece (4) comprises a clamping thimble (401) arranged on the periphery of the wafer body (2), an inner groove (402) which is in contact with the peripheral wall of the wafer body (2) to reduce the possibility of the wafer body (2) flying out is formed in the clamping thimble (401), a connecting column (403) is fixed on the lower surface of the clamping thimble (401), a push rod (404) is fixed on one side, facing the circular support (1), of the outer wall of the connecting column (403), a hexagonal ball bolt (405) is fixed on one end, far away from the connecting column (403), of each push rod (404), the push rod (404) is slidably connected with the circular support (1) through a guide piece (5), and a moving piece for controlling the push rod (404) to move in the horizontal direction to drive the connecting column (403) and the clamping thimble (401) to move so as to clamp the wafer body (2).
3. The wet cleaning and clamping mechanism for single wafer according to claim 2, wherein the guide piece (5) comprises a convex block (501) fixed on the lower surface of the circular support (1), a guide groove (502) for a push rod (404) to move is formed in the middle position inside the convex block (501), the central line direction of the guide groove (502) is perpendicular to the central line direction of the circular support (1), and the push rod (404) is slidably connected with the convex block (501) through the guide groove (502).
4. The wet cleaning and clamping mechanism for the single wafer according to claim 2, wherein the moving part comprises an annular wheel (6) rotatably connected to the center position of the lower surface of the circular support (1), a plurality of protruding blocks (7) which are in contact with the hexagonal ball bolts (405) are arranged on the circumferential outer wall of the annular wheel (6), the protruding blocks (7) are arrayed by taking the central line of the annular wheel (6) as an axis, the diameter length of an A point of each protruding block (7) is larger than the diameter length of a B point, the B point of each protruding block (7) is in smooth inclined transition with the outer wall of the annular wheel (6), and a driving part for controlling the rotation of the annular wheel (6) is arranged on the circular support (1);
the novel telescopic device is characterized in that a short shaft (8) is fixed on the push rod (404), a plurality of first positioning blocks (9) positioned beside the short shaft (8) are fixed on the lower surface of the circular support (1), and the short shaft (8) and the first positioning blocks (9) are fixedly connected through a first tension spring (10).
5. The wet cleaning and clamping mechanism for single wafer as claimed in claim 4, wherein the driving member comprises a driven gear (11) fixed on the circumferential inner wall of the annular wheel (6), the center line of the driven gear (11) is coaxial with the center line of the annular wheel (6), a driving gear (12) meshed with the driven gear (11) is arranged beside the annular wheel (6), and a rotary cylinder for driving the driving gear (12) to rotate is fixed on the rotary part shell.
6. The wet cleaning and clamping mechanism for single wafer according to claim 5, wherein a plurality of mounting lugs (13) are uniformly arranged on the circumferential outer wall of the annular wheel (6), a plurality of second positioning blocks (14) matched with the mounting lugs (13) are fixed on the lower surface of the circular support (1), and the second positioning blocks (14) and the mounting lugs (13) are fixed through second tension springs (15).
7. A single wafer wet cleaning and clamping mechanism according to claim 3, wherein a wedge block (16) is fixed on the push rod (404), the wedge block (16) extends out of the push rod (404), a plurality of a limiting blocks (17) and B limiting blocks (18) which are respectively positioned beside the wedge block (16) are fixed on the lower surface of the circular support (1), the a limiting blocks (17) are positioned between the B limiting blocks (18) and the wedge block (16), and a limiting shaft (19) positioned between the wedge block (16) and the convex block (501) is arranged on the push rod (404).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321021074.4U CN219696440U (en) | 2023-04-28 | 2023-04-28 | Single wafer wet cleaning clamping mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321021074.4U CN219696440U (en) | 2023-04-28 | 2023-04-28 | Single wafer wet cleaning clamping mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219696440U true CN219696440U (en) | 2023-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321021074.4U Active CN219696440U (en) | 2023-04-28 | 2023-04-28 | Single wafer wet cleaning clamping mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219696440U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117276181A (en) * | 2023-11-16 | 2023-12-22 | 创微微电子(常州)有限公司 | Chuck device |
| CN117690833A (en) * | 2024-02-04 | 2024-03-12 | 苏州智程半导体科技股份有限公司 | Wafer photoresist stripping equipment |
-
2023
- 2023-04-28 CN CN202321021074.4U patent/CN219696440U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117276181A (en) * | 2023-11-16 | 2023-12-22 | 创微微电子(常州)有限公司 | Chuck device |
| CN117276181B (en) * | 2023-11-16 | 2024-02-23 | 创微微电子(常州)有限公司 | Chuck device |
| CN117690833A (en) * | 2024-02-04 | 2024-03-12 | 苏州智程半导体科技股份有限公司 | Wafer photoresist stripping equipment |
| CN117690833B (en) * | 2024-02-04 | 2024-04-16 | 苏州智程半导体科技股份有限公司 | Wafer photoresist stripping equipment |
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