CN220651976U - Wafer carrier assembly and de-molding equipment - Google Patents

Abstract

The utility model discloses a wafer carrier combination, which comprises: a housing having a mounting cavity including oppositely disposed first and second open sides; a first discharge drawer for storing wafer cassettes and drawably mounted in the mounting cavity from the first open side; the second discharging drawer is used for bearing wafers, is positioned below the first discharging drawer and is drawably installed in the installation cavity from the first open side; wherein, the second blowing drawer towards the one side of second open side is open structure. The utility model can facilitate centralized storage and transportation of wafers, and can selectively enable a manipulator and/or a worker to pick and place the wafers in the discharging drawer.

Description

Wafer carrier assembly and de-molding equipment

Technical Field

The utility model belongs to the field of semiconductor chip manufacturing, and particularly relates to a wafer carrier combination and a de-gluing device.

Background

In semiconductor processing, it is sometimes necessary to attach a UV film to the wafer surface in order to process the wafer. After the processing is finished, the UV film is required to be subjected to de-colloid treatment, so that the viscosity of the UV film is reduced, and the UV film is convenient to remove.

The conventional de-gumming method uses a de-gumming machine, wherein an irradiation lamp is arranged in the UV de-gumming machine, and the viscosity of a UV film is reduced under the irradiation of the irradiation lamp so that a wafer is peeled off from the UV film. The traditional dispergator is mostly of a semi-automatic structure, and as disclosed in patent CN206650059U, the UV dispergator comprises a box body, a discharging drawer and a UV light source, wherein the box body is provided with a drawing opening, the discharging drawer is arranged in the box body in a way that the drawing opening can be drawn, and the UV light source is positioned below the discharging drawer so as to dispergate and irradiate wafers on the discharging drawer. However, with the structure, the UV dispergator has no area for storing wafers in a concentrated manner, so that the wafers are inconvenient to take and place, and the wafers in the discharging drawer can be taken and placed only from the drawing port, so that the wafers are difficult to be automatically taken and placed from the discharging drawer.

Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art.

Disclosure of Invention

The utility model aims to provide a wafer carrier combination and a de-glue device, which are convenient for centralized storage and transportation of wafers, and can enable a manipulator and/or a worker to take and put the wafers in a material-putting drawer selectively.

The utility model aims at realizing the following technical scheme: a wafer carrier assembly, comprising:

a housing having a mounting cavity including oppositely disposed first and second open sides;

a first discharge drawer for storing wafer cassettes and drawably mounted in the mounting cavity from the first open side; the method comprises the steps of,

the second discharging drawer is used for bearing wafers, is positioned below the first discharging drawer and is drawably installed in the installation cavity from the first open side;

wherein, the second blowing drawer towards the one side of second open side is open structure.

Further, the first discharging drawer includes:

a first base plate;

the first side plates are two in number and are oppositely arranged on the first bottom plate, and the first side plates are in sliding connection with the inner wall of the mounting cavity;

the first panel is arranged on one side, far away from the second open side, of the first bottom plate, is positioned between the two first side plates and is perpendicular to the sliding direction of the first side plates;

the first bottom plate, the first side plate and the first panel are matched to form a first accommodating cavity for accommodating the wafer box, the wafer box is arranged in the first accommodating cavity, the wafer box is provided with a first taking and placing opening, and the first taking and placing opening faces to the second open side.

Further, the first discharging drawer comprises a limiting piece which is arranged opposite to the first panel, and the wafer box is limited between the first side plate, the first panel and the limiting piece.

Further, the wafer box has with the first loading board that first curb plate paralleled, first loading board quantity is two, and sets up relatively, two all be provided with first support piece on the medial surface of first loading board, two first support piece cooperation on the first loading board forms the first bearing structure who supports the wafer, first bearing structure quantity is a plurality of, and along vertical direction interval arrangement, is located bottommost first bearing structure's position height is greater than the height of locating part.

Further, the second discharging drawer includes:

a second base plate;

the second side plates are two in number and are oppositely arranged on the second bottom plate, and the second side plates are in sliding connection with the inner wall of the mounting cavity;

the second panel is arranged on one side, far away from the second open side, of the second bottom plate, is positioned between the two second side plates and is perpendicular to the sliding direction of the second side plates;

the second bottom plate, the second side plate and the second panel are matched to form a second accommodating cavity for accommodating the wafer, and a second taking and placing port for taking and placing the wafer is formed in one side, opposite to the second panel, of the second accommodating cavity.

Further, second supporting pieces are arranged on the inner side surfaces of the two second side plates, and the second supporting pieces on the two second side plates are matched to form a second supporting structure for supporting the wafer.

Further, second supporting pieces are arranged on the inner side surfaces of the two second side plates, and the second supporting pieces on the two second side plates are matched to form a second supporting structure for supporting the wafer; or,

the second discharging drawer comprises a placing structure accommodated in the second accommodating cavity, the placing structure comprises two second bearing plates oppositely arranged on the second bottom plate and cover plates covered at the top ends of the two second bearing plates, the second bearing plates are parallel to the second side plates, second supporting pieces are arranged on the inner side surfaces of the two second bearing plates, and the second supporting pieces on the two second bearing plates are matched to form a second supporting structure for supporting the wafer.

Further, the number of the second supporting structures is two, and the second supporting structures are arranged at intervals along the vertical direction.

Further, the first discharging drawer and the second discharging drawer are provided with handles on the sides far away from the second opening side.

In addition, the utility model also provides a de-gelling device, which comprises:

the wafer carrier assembly described above;

and the UV light source is positioned below the second discharging drawer and is suitable for irradiating the wafers on the second discharging drawer.

Compared with the prior art, the utility model has the following beneficial effects: according to the wafer box storage device, the first discharging drawer for storing the wafer box is arranged on the shell, and the first discharging drawer can be pulled out of the first opening side of the shell manually, so that wafers can be stored in a concentrated mode and the wafer box can be replaced conveniently; the second discharging drawer for storing the wafers is arranged on the shell, the second discharging drawer can be pulled out manually on the first opening side of the shell to take and place the wafers, emergency is convenient to deal with, the second discharging drawer is of an opening structure on the second opening side of the shell, and a manipulator is selectively arranged on the second opening side so as to transfer the wafers between the wafer box and the second discharging drawer, so that automatic production is realized; in addition, the second blowing drawer is located the below of first blowing drawer, can make whole wafer carrier combination compacter, reduces occupation space.

Drawings

FIG. 1 is a schematic view of a wafer carrier assembly according to the present utility model.

Fig. 2 is a schematic view of the wafer carrier assembly of the present utility model with the chassis removed.

Reference numerals illustrate:

100. a housing; 110. a mounting cavity; 111. a first open side; 112. a second open side; 200. a first discharging drawer; 210. a first base plate; 220. a first side plate; 230. a first panel; 240. a handle; 250. a limiting piece; 300. a wafer cassette; 310. a first taking and placing port; 320. a first bearing plate; 330. a first support; 400. a second discharging drawer; 410. a second base plate; 420. a second side plate; 430. a second panel; 440. a second taking and placing port; 450. a second support; 461. a second bearing plate; 462. a cover plate; 500. a wafer; 600. a UV light source.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not limiting. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

The terms "comprising" and "having" and any variations thereof herein are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

Referring to fig. 1 and 2, a wafer carrier assembly according to a preferred embodiment of the utility model includes: the housing 100 has a mounting cavity 110, the mounting cavity 110 including oppositely disposed first and second open sides 111, 112; a first discharging drawer 200 for storing the wafer cassette 300, and is drawably installed in the installation cavity 110 from the first open side 111; and a second discharging drawer 400 for carrying the wafer 500, wherein the second discharging drawer 400 is located below the first discharging drawer 200 and is drawably installed in the installation cavity 110 from the first open side 111; wherein, the side of the second discharging drawer 400 facing the second open side 112 is in an open structure.

According to the utility model, the first discharging drawer 200 for storing the wafer boxes 300 is arranged on the machine shell 100, so that the first discharging drawer 200 can be manually pulled out from the first opening side 111 of the machine shell 100, and the wafer 500 can be conveniently stored in a concentrated manner and the wafer boxes 300 can be conveniently replaced; by arranging the second discharging drawer 400 for storing the wafer 500 on the casing 100, the second discharging drawer 400 can be manually pulled out on the first open side 111 of the casing 100 to take and place the wafer 500, so as to be convenient for coping with emergency, the second discharging drawer 400 has an open structure on the second open side 112 of the casing 100, and the second open side 112 can be selectively provided with a manipulator to transfer the wafer 500 between the wafer box 300 and the second discharging drawer 400, thereby realizing automatic production; in addition, the second discharging drawer 400 is located below the first discharging drawer 200, so that the whole wafer carrier combination can be more compact, and the occupied space is reduced.

Further, the first discharging drawer 200 includes a first bottom plate 210, a first side plate 220, and a first panel 230. The number of the first side plates 220 is two, and the first side plates 220 are oppositely arranged on the first bottom plate 210, and the first side plates 220 are in sliding connection with the inner wall of the mounting cavity 110. A sliding rail may be specifically disposed between the first side plate 220 and the inner wall of the mounting cavity 110 to realize sliding connection between the first side plate and the inner wall of the mounting cavity, which is not described herein. The first panel 230 is disposed on a side of the first bottom plate 210 away from the second open side 112, and the first panel 230 is disposed between the two first side plates 220 and perpendicular to the sliding direction of the first side plates 220. A handle 240 is provided on the first panel 230 to facilitate an operator pulling the first discharge drawer 200 through the handle 240 at the first open side 111.

The first bottom plate 210, the first side plate 220, and the first panel 230 cooperate to form a first receiving cavity (not shown) for receiving the wafer cassette 300, and the wafer cassette 300 is disposed in the first receiving cavity. The wafer cassette 300 has a first access opening 310 for accessing the wafers 500, the first access opening 310 facing the second open side 112. The first discharging drawer 200 includes a limiting member 250 opposite to the first panel 230, the limiting member 250 may have a plate-shaped or block-shaped structure, and the wafer cassette 300 is located between the first side panel 220, the first panel 230 and the limiting member 250, so as to limit the wafer cassette 300 in a direction perpendicular to the first panel 230 and a direction perpendicular to the first side panel 220, thereby improving the reliability of the wafer cassette 300 on the first discharging drawer 200.

In the present embodiment, the wafer cassette 300 has the first carrying plates 320 parallel to the first side plates 220, and the number of the first carrying plates 320 is two and is opposite to each other. The inner sides of the two first carrying plates 320 are respectively provided with a first supporting member 330, and the first supporting members 330 on the two first carrying plates 320 cooperate to form a first supporting structure for supporting the wafer 500. The first support structures are a plurality of in number and are arranged at intervals along the vertical direction. Preferably, the height of the first support structure at the bottommost position is greater than the height of the limiting member 250, so as to avoid the limiting member 250 obstructing the robot to pick and place the wafer 500.

Further, the second discharging drawer 400 includes a second bottom panel 410, a second side panel 420, and a second panel 430. The number of the second side plates 420 is two, and the second side plates 420 are oppositely arranged on the second bottom plate 410, and the second side plates 420 are in sliding connection with the inner wall of the mounting cavity 110. A sliding rail may also be disposed between the second side plate 420 and the inner wall of the mounting cavity 110, so as to achieve sliding connection therebetween. The second panel 430 is disposed on a side of the second bottom plate 410 away from the second open side 112, and the second panel 430 is disposed between the two second side plates 420 and perpendicular to the sliding direction of the second side plates 420. A handle 240 is also provided on the second panel 430 to facilitate an operator pulling the second discharge drawer 400 through the handle 240 at the first open side 111. The second bottom plate 410, the second side plate 420 and the second panel 430 cooperate to form a second accommodating cavity (not shown) accommodating the wafer 500, and a second picking and placing port 440 for picking and placing the wafer 500 is formed on a side of the second accommodating cavity opposite to the second panel 430.

In order to facilitate the handling of the wafer 500 in the second accommodating chamber, in an embodiment, the inner sides of the two second side plates 420 are provided with second supporting members 450, and the second supporting members 450 on the two second side plates 420 cooperate to form a second supporting structure for supporting the wafer 500.

Indeed, in other embodiments, the second discharging drawer 400 includes a placement structure detachably received in the second receiving cavity, and the wafer 500 is carried on the placement structure. The placement structure includes a second carrier plate 461 and a cover plate 462. The second carrier plates 461 are parallel to the second side plates 420, and the number of the second carrier plates 461 is two, and the second carrier plates 461 are oppositely arranged on the second bottom plate 410. The cover plate 462 covers the top ends of the two second carrier plates 461. The inner sides of the two second carrier plates 461 are respectively provided with a second supporting member 450, and the second supporting members 450 on the two second carrier plates 461 cooperate to form a second supporting structure for supporting the wafer 500. By adopting the placement structure, the top of the wafer 500 can be effectively shielded, dust is prevented from polluting the wafer 500, and the wafer 500 is convenient to manually take and place. Preferably, a positioning structure is disposed in the second accommodating cavity to prevent the placement structure from being separated from the second open side 112 after the placement structure is disposed in the second accommodating cavity, and the positioning structure may be a positioning block disposed in the second accommodating cavity near the second open side 112, or the positioning structure may also be a magnetic member or a magnetic conductive member, and the placement structure is magnetically engaged with the positioning structure. Preferably, the cover 462 may be made of a transparent material so as to facilitate direct observation of the interior of the placement structure and enhance the convenience of picking and placing the wafer 500.

Preferably, the number of the second support structures is two and is arranged at intervals along the vertical direction. Because the wafer 500 needs a certain time for the disassembly, the two second supporting structures are arranged in the second discharging drawer 400, the manipulator firstly moves the wafer 500 in the wafer box 300 to one of the second supporting structures for the disassembly operation, then the manipulator continuously moves the wafer 500 to be disassembled in the wafer box 300 to the other second supporting structure, in the process, the wafer 500 firstly entering the second supporting structure is completely disassembled, the manipulator moves the wafer 500 back to the wafer box 300, and the wafer 500 to be disassembled is continuously moved to the empty second supporting structure; the above actions are repeated, so that the waiting time of the manipulator can be effectively saved.

In addition, the present utility model further provides a de-photoresist device, which comprises the wafer carrier assembly and the UV light source 600, wherein the UV light source 600 is located below the second discharging drawer 400 and is suitable for irradiating the wafer 500 on the second discharging drawer 400 to realize the de-photoresist operation of the wafer 500.

Preferably, the de-glue device comprises an openable and closable shielding structure (not shown), the shielding structure has a closed state and an open state, when the de-glue operation is performed, the shielding structure is switched to the closed state, at this time, the shielding structure encloses the UV light source 600 and the second discharging drawer 400 on the first open side 111 and the second open side 112, and forms a cover body accommodating the UV light source 600 and the second discharging drawer 400 in cooperation with the first bottom plate 210 and the second panel 430, so as to prevent UV light from escaping during the de-glue operation; after the photoresist is completely removed, the shielding structure is switched to an open state, and the second open side 112 exposes the second picking and placing opening 440 for normal picking and placing operation.

Preferably, the surface of the shielding structure, the first bottom plate 210 facing the wafer 500 is covered with a reflective film layer (e.g. aluminum, PTFE) to reflect the UV light to the UV film of the wafer 500, so as to enhance the de-colloid effect of the UV film.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or direct or indirect application in other related technical fields are included in the scope of the patent protection of the present application.

Claims (10)

1. A wafer carrier assembly, comprising:

a housing (100) having a mounting cavity (110), the mounting cavity (110) comprising oppositely disposed first (111) and second (112) open sides;

a first discharge drawer (200) for storing wafer cassettes (300) and being drawably mounted from the first open side (111) in the mounting cavity (110); the method comprises the steps of,

a second discharging drawer (400) for carrying wafers (500), wherein the second discharging drawer (400) is positioned below the first discharging drawer (200) and is drawably installed in the installation cavity (110) from the first open side (111);

wherein, a side of the second discharging drawer (400) facing the second open side (112) is an open structure.

2. The wafer carrier assembly of claim 1, wherein the first firing drawer (200) comprises:

a first base plate (210);

the number of the first side plates (220) is two, the first side plates (220) are oppositely arranged on the first bottom plate (210), and the first side plates (220) are in sliding connection with the inner wall of the mounting cavity (110);

the first panel (230) is arranged on one side, far away from the second open side (112), of the first bottom plate (210), and the first panel (230) is positioned between the two first side plates (220) and is perpendicular to the sliding direction of the first side plates (220);

the first bottom plate (210), the first side plate (220) and the first panel (230) are matched to form a first accommodating cavity for accommodating the wafer box (300), the wafer box (300) is arranged in the first accommodating cavity, the wafer box (300) is provided with a first taking and placing opening (310), and the first taking and placing opening (310) faces the second open side (112).

3. The wafer carrier combination of claim 2, wherein the first blanking drawer (200) includes a stop (250) disposed opposite the first panel (230), the wafer cassette (300) being stopped between the first side plate (220), the first panel (230), and the stop (250).

4. The wafer carrier assembly of claim 3, wherein the wafer cassette (300) has a plurality of first carrier plates (320) parallel to the first side plates (220), the first carrier plates (320) are two in number and are disposed oppositely, first supporting members (330) are disposed on inner sides of the two first carrier plates (320), the first supporting members (330) on the two first carrier plates (320) cooperate to form a first supporting structure for supporting the wafer (500), the first supporting structures are plural in number and are disposed at intervals along a vertical direction, and a position height of the first supporting structure at a bottommost position is greater than a height of the limiting member (250).

5. The wafer carrier assembly of claim 1, wherein the second firing drawer (400) comprises:

a second base plate (410);

the second side plates (420) are two in number and are oppositely arranged on the second bottom plate (410), and the second side plates (420) are in sliding connection with the inner wall of the mounting cavity (110);

the second panel (430) is arranged on one side, far away from the second open side (112), of the second bottom plate (410), and the second panel (430) is positioned between the two second side plates (420) and is perpendicular to the sliding direction of the second side plates (420);

the second bottom plate (410), the second side plate (420) and the second panel (430) are matched to form a second accommodating cavity for accommodating the wafer (500), and a second taking and placing opening (440) for taking and placing the wafer (500) is formed in one side of the second accommodating cavity opposite to the second panel (430).

6. The wafer carrier assembly of claim 5, wherein second support members (450) are disposed on inner sides of both of the second side plates (420), and wherein the second support members (450) on both of the second side plates (420) cooperate to form a second support structure for supporting the wafer (500).

7. The wafer carrier assembly of claim 5, wherein second support members (450) are disposed on inner sides of both of the second side plates (420), and the second support members (450) on both of the second side plates (420) cooperate to form a second support structure for supporting the wafer (500); or,

the second discharging drawer (400) comprises a placing structure accommodated in the second accommodating cavity, the placing structure comprises two second bearing plates (461) oppositely arranged on the second bottom plate (410) and cover plates (462) covering the top ends of the two second bearing plates (461), the second bearing plates (461) are parallel to the second side plates (420), second supporting pieces (450) are arranged on the inner side surfaces of the two second bearing plates (461), and the second supporting pieces (450) on the two second bearing plates (461) are matched to form a second supporting structure for supporting the wafer (500).

8. The wafer carrier assembly of claim 6 or claim 7, wherein the second support structures are two in number and are spaced apart along the vertical direction.

9. The wafer carrier combination of claim 1, wherein the first and second firing drawers (200, 400) are each provided with a pull handle (240) on a side thereof remote from the second open side (112).

10. A debonder apparatus, comprising:

the wafer carrier assembly of any one of claims 1 to 9;

-a UV light source (600) located below the second blanking drawer (400) and adapted to irradiate wafers (500) on the second blanking drawer (400).