CN220603831U - Water-cooling heat dissipation projector - Google Patents
Water-cooling heat dissipation projector Download PDFInfo
- Publication number
- CN220603831U CN220603831U CN202321870824.5U CN202321870824U CN220603831U CN 220603831 U CN220603831 U CN 220603831U CN 202321870824 U CN202321870824 U CN 202321870824U CN 220603831 U CN220603831 U CN 220603831U
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- China
- Prior art keywords
- heat dissipation
- water
- module
- cooling
- heat
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 77
- 238000001816 cooling Methods 0.000 title claims abstract description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 52
- 238000005057 refrigeration Methods 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 11
- 239000011324 bead Substances 0.000 abstract description 10
- 238000005187 foaming Methods 0.000 description 8
- 239000000110 cooling liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a water-cooling heat dissipation projector, which comprises a refrigeration module and a heat dissipation module and is characterized in that the refrigeration module and the heat dissipation module are connected through a heat dissipation copper pipe, a heat dissipation copper plate is arranged on the heat dissipation module, a plurality of rows of heat dissipation copper pipes are packaged in the heat dissipation copper plate, and a refrigeration sheet and a heat dissipation fan for heat dissipation are arranged on the refrigeration module. A cooling fin water inlet and a cooling fin water outlet are arranged on the cooling copper pipe inside the cooling fin. A water pump is arranged between the heat radiation module and the semiconductor refrigeration module. The water pump is provided with a water pump water inlet and a water pump water outlet. And the primary built-in cooling fan is used for rapidly cooling and radiating the lamp beads, so that the temperatures of the lamp beads and the processor are not increased to be too high in a short time to influence the use of a user. The external semiconductor radiator is used for high-efficiency refrigeration through the semiconductor refrigeration piece, and the copper pipe is used for water cooling circulation and heat conduction, so that high-efficiency and excellent cooling effects can be brought to the projector.
Description
Technical Field
The utility model relates to the field of projectors, in particular to a water-cooling heat dissipation projector.
Background
Projectors as consumer products, more and more young people have used projectors that are equipped with an android intelligent system to play games. The light source of the projector can generate a large amount of heat, the processor of the intelligent system main board can also generate a large amount of heat, and the service life of the light source and the performance reduction of the intelligent system can be greatly influenced by high temperature and high heat, so that the use is influenced.
The projectors on the market commonly adopt the built-in fans to dissipate heat, but the effect of dissipating heat by the built-in fans alone is not very good.
Disclosure of Invention
Accordingly, the utility model provides a water-cooling heat dissipation projector.
In order to achieve the above object, the present utility model provides the following technical solutions: the cooling device comprises a cooling module and a heat radiation module, and is characterized in that the cooling module and the heat radiation module are connected through a heat radiation copper pipe, a heat radiation copper plate is arranged on the heat radiation module, a plurality of rows of heat radiation copper pipes are packaged in the heat radiation copper plate, and cooling fins and a heat radiation fan for heat radiation are arranged on the cooling module.
Further, the heat dissipation copper pipe on the heat dissipation copper plate is also provided with a heat dissipation module water inlet and a heat dissipation module water outlet.
Further, the inside of the refrigerating plate is encapsulated with a plurality of rows of heat dissipation copper pipes, so that the refrigerating plate and the heat dissipation copper pipes are mutually connected and fixed into a whole.
Further, a cooling fin water inlet and a cooling fin water outlet are arranged on the cooling copper pipe inside the cooling fin.
Further, a water pump is arranged between the heat radiation module and the semiconductor refrigeration module.
Further, a water pump water inlet and a water pump water outlet are arranged on the water pump.
Further, the outer fins are arranged on the refrigerating sheet and are arranged in a zigzag manner.
Further, one side of the refrigerating panel of the refrigerating sheet is completely sealed inside a closed hollow box body (4).
Further, a closed hollow outer shell is arranged on one surface of the refrigerating sheet.
Compared with the prior art, the water-cooling heat dissipation projector provided by the utility model has the following advantages:
1. the primary built-in cooling fan is used for rapidly cooling and radiating the lamp beads, so that the temperatures of the lamp beads and the processor cannot rise to too high a temperature in a short time to affect the use of a user.
2. The external semiconductor radiator is used for high-efficiency refrigeration through the semiconductor refrigeration piece, and the copper pipe is used for water cooling circulation and heat conduction, so that high-efficiency and excellent cooling effects can be brought to the projector.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an overall structure of a projector with water-cooled heat dissipation according to the present utility model;
FIG. 2 is a schematic diagram of an internal heat dissipation module of a water-cooled heat dissipation projector according to the present utility model;
fig. 3 is a schematic diagram of a water-cooled projector module with water-cooled heat dissipation according to the present utility model.
Wherein, each reference sign in the figure:
| name of the name | Reference numerals | Name of the name | Reference numerals | Name of the name | Reference numerals |
| Projector with a light source for projecting light | 1 | Refrigerating sheet water inlet | 25 | Box body | 4 |
| Refrigerating module | 2 | Water outlet of refrigerating sheet | 26 | Outer casing | 5 |
| Refrigerating sheet | 21 | Heat radiation module | 3 | Water pump 6 | 6 |
| Radiating copper pipe | 22 | Heat dissipation copper plate | 30 | ||
| Outer fin | 23 | Heat radiation module water inlet | 31 | ||
| Heat radiation fan | 24 | Water outlet of heat radiation module | 32 |
Detailed Description
For a better understanding of the technical solution of the present utility model, the embodiments provided by the present utility model are described in detail below with reference to the accompanying drawings.
The foregoing describes a water-cooled projector according to the embodiments of the present utility model in detail, and those skilled in the art should not understand the present utility model to limit the scope of the embodiments of the present utility model.
In the description of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "middle," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1-3, the present utility model provides a water-cooled heat dissipation projector 1, which includes a heat dissipation copper plate 30, wherein a plurality of rows of heat dissipation copper pipes are encapsulated in the heat dissipation copper plate 30, and the heat dissipation copper pipes are fixedly arranged in the heat dissipation copper plate 30, so that the heat dissipation copper pipes and the heat dissipation copper plate 30 are fixed as a whole. The heat dissipation copper pipe on the heat dissipation copper plate 30 is also provided with a heat dissipation module water inlet 31 and a heat dissipation module water outlet 32, so that the refrigerating fluid flows through the heat dissipation copper pipe in the heat dissipation copper plate 30, and heat of the heat dissipation copper plate 30 is taken away.
A semiconductor refrigeration module 20 is arranged at one part of the projector 1 shell, and the semiconductor refrigeration module 20 consists of a refrigeration piece 21, a copper pipe 22, an outer fin, a cooling fan and refrigeration liquid. A plurality of rows of heat dissipation copper pipes are packaged in the refrigerating piece 21, so that the refrigerating piece 21 and the heat dissipation copper pipes are mutually connected and fixed into a whole, and a water inlet 25 of the refrigerating piece 21 and a water outlet of the refrigerating piece 21 are arranged on the heat dissipation copper pipes in the refrigerating piece 21; the water inlet 31 of the heat radiation module is connected with the water outlet of the refrigerating sheet 21 by copper pipes, and the water outlet 32 of the heat radiation module is connected with the water inlet 25 of the refrigerating sheet 21 by copper pipes.
When the projector 1 is used, the semiconductor refrigeration module 20 is also started to refrigerate, the heat dissipation copper plate 30 arranged at the lamp bead end absorbs the heat of the lamp bead, and the semiconductor refrigeration module 20 absorbs the heat of the lamp bead heat dissipation copper plate 30 through the cooling liquid in the copper tube, so that the heat dissipation of the lamp bead is realized. As by means of heat absorption.
In order to further enhance the heat dissipation effect and enhance the flow rate of cooling liquid in a copper pipe and enhance the circulation flow rate of the cooling liquid, a water pump 6 system is arranged between the heat dissipation module 3 and the semiconductor refrigeration module 20, a water pump 6 water inlet and a water pump 6 water outlet are arranged on the water pump 6, the heat dissipation module water inlet is connected with the water pump 6 water outlet through a foaming copper-clad pipe, the water inlet of the water pump 6 is connected with the water outlet of the refrigeration sheet 21 through the foaming copper-clad pipe, the heat dissipation module water outlet 32 is connected with the water inlet 25 of the refrigeration sheet 21 through the foaming copper-clad pipe, the water pump 6 is used for pumping the ice-cooled cooling liquid in the semiconductor refrigeration module 20 to the end of the lamp bead heat dissipation copper plate 30, the circulation flow rate of the cooling liquid in the foaming copper-clad pipe is enhanced, heat and cold exchange is rapid, and thus the heat dissipation effect of the lamp bead is enhanced.
Preferably, the copper pipe adopts a foaming copper-clad pipe, and the foaming copper-clad pipe is formed by wrapping a circle of foaming layer on the surface of the copper pipe.
In order to further enhance the heat dissipation effect, the semiconductor refrigerating sheet 21 is provided with outer fins which are arranged in a zigzag manner, so that the heat dissipation area of the radiator is increased, and the heat dissipation efficiency is improved; the outer fins have smaller spacing, so that the friction force and resistance of air between the fins can be increased, and the heat dissipation efficiency of the radiator is further improved;
the shape of the outer fins may create an effect similar to a small turbulence, thereby enhancing the convective heat transfer effect between the heat sink and the air. The outer fins are provided with the cooling fans, so that the cooling fans can play the following two roles: the heat dissipation efficiency can be improved by the first action: the heat dissipation efficiency of the outer fins depends on the convective heat transfer effect of the surrounding air, but when the air is stationary, the heat dissipation efficiency is significantly reduced. The heat dissipation fan can generate air flow to accelerate air convection, so that heat dissipation efficiency is improved.
The second effect can enhance the refrigerating performance, and the semiconductor refrigerating sheet 21 dissipates a large amount of heat generated by the panel, and if the heat is not dissipated in time, more heat cannot be absorbed. The heat can be timely carried out by the cooling fan, so that the refrigerating performance is maintained to be efficient.
One side of the refrigerating panel of the semiconductor refrigerating sheet 21 is completely sealed in a closed box body 4, and the box body 4 is hollow. This is because the surface of the refrigerating panel of the semiconductor refrigerating plate 21 is arranged inside the projector 1 body, and the extremely cold surface of the refrigerating panel of the semiconductor refrigerating plate 21 may cause condensation phenomenon, which may absorb water in the air, and condense into small water droplets to be adsorbed on the surface of the refrigerating panel of the semiconductor refrigerating plate 21, and the accumulated excessive water droplets may drop to the body or the circuit board, thus possibly causing the whole machine to be damped or the circuit board to be damaged.
In order to further enhance the condensation protection effect, a sealed outer shell 5 is arranged on one surface of the semiconductor refrigerating sheet 21, the inside of the box body 4 is hollow, the foaming copper-clad pipe penetrates through the sealed box body 4 and the outer shell 5, and the penetrating opening is guaranteed to be completely sealed and watertight.
The description of the various embodiments of the present utility model has been presented for purposes of illustration and not of limitation, and many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments, the terminology used in the embodiments being intended to best explain the principles of the embodiments, the practical application, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein and not to be construed as limiting the utility model.
Claims (9)
1. The utility model provides a water-cooling heat dissipation projecting apparatus, includes refrigerating module, heat dissipation module, its characterized in that, is led through the heat dissipation copper pipe between refrigerating module and the heat dissipation module and connects, is provided with heat dissipation copper (30) on the heat dissipation module, and the inside encapsulation of heat dissipation copper (30) has multirow heat dissipation copper pipe, is provided with refrigeration piece (21) and is used for radiating radiator fan on the refrigerating module.
2. The water-cooled heat dissipation projector according to claim 1, wherein the heat dissipation copper tube on the heat dissipation copper plate (30) is further provided with a heat dissipation module water inlet (31) and a heat dissipation module water outlet (32).
3. The water-cooled projector according to claim 1, wherein the cooling fin (21) is internally packaged with a plurality of rows of heat dissipation copper pipes, so that the cooling fin (21) and the heat dissipation copper pipes are connected and fixed with each other as a whole.
4. A water cooled projector according to claim 3, wherein the cooling copper tube inside the cooling fin (21) is provided with a cooling fin (21) water inlet (25) and a cooling fin (21) water outlet.
5. The water-cooled heat sink projector according to claim 1, wherein a water pump (6) is provided between the heat sink module (3) and the semiconductor refrigeration module (20).
6. The water-cooled projector according to claim 5, wherein a water inlet of the water pump (6) and a water outlet of the water pump (6) are provided on the water pump (6).
7. The water-cooled projector according to claim 1, wherein the cooling fin (21) is provided with outer fins, and the outer fins are arranged in a zigzag manner.
8. The water-cooled projector according to claim 1, wherein the cooling panel of the cooling sheet (21) is entirely sealed inside a closed hollow case (4).
9. The water-cooled projector according to claim 8, wherein a closed hollow outer casing (5) is provided on one side of the cooling fin (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321870824.5U CN220603831U (en) | 2023-07-15 | 2023-07-15 | Water-cooling heat dissipation projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321870824.5U CN220603831U (en) | 2023-07-15 | 2023-07-15 | Water-cooling heat dissipation projector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220603831U true CN220603831U (en) | 2024-03-15 |
Family
ID=90174809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321870824.5U Active CN220603831U (en) | 2023-07-15 | 2023-07-15 | Water-cooling heat dissipation projector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220603831U (en) |
-
2023
- 2023-07-15 CN CN202321870824.5U patent/CN220603831U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |