CN220569139U - Heat radiation structure of computer system - Google Patents
Heat radiation structure of computer system Download PDFInfo
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- CN220569139U CN220569139U CN202322088884.8U CN202322088884U CN220569139U CN 220569139 U CN220569139 U CN 220569139U CN 202322088884 U CN202322088884 U CN 202322088884U CN 220569139 U CN220569139 U CN 220569139U
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- Prior art keywords
- heat
- plate
- fixedly connected
- pipe
- fixed plate
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- 230000005855 radiation Effects 0.000 title description 4
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000010521 absorption reaction Methods 0.000 claims abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009977 dual effect Effects 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of computers, in particular to a heat dissipation structure of a computer system, which comprises a fixed plate and a contact plate, wherein a fan is embedded and installed on the inner side of the fixed plate, a heat conduction pipe distributed in an arc array is fixedly connected to the upper end of the fixed plate, a heat conduction plate is fixedly connected to one end of the heat conduction pipe close to the center of the fan, a drainage pipe is embedded and installed on the inner side of the heat conduction plate, the drainage pipe is spirally arranged, connecting pipes are fixedly connected to one ends of the heat conduction pipes at the left end and the right end close to the heat conduction plate, through the cooperation of a heat absorption component, the drainage component and the fan, the heat absorption component is designed to cool the heat conduction plate firstly, cool the environment near the fixed plate again, ensure that the fan pumps in heat absorption cold air, the heat absorption component absorbs heat rapidly, and the heat dissipation effect on components in the computer is effectively improved under the dual heat dissipation structure.
Description
Technical Field
The present utility model relates to the field of computer technologies, and in particular, to a heat dissipation structure of a computer system.
Background
In the operation process of the computer, a large amount of equipment is needed to calculate data, when all the equipment is in overload operation, the temperature of the inner side of the case is high, and the existing computer system is integrated to perform auxiliary heat dissipation through the strong heat dissipation intelligent equipment box when in use.
The mode effectively avoids the phenomenon that the temperature of an internal processor or a part of the computer system is too high, so that the internal processor or the part is damaged, and the existing strong heat dissipation intelligent equipment box rapidly circulates the external air speed and the internal air speed through the fan when the heat is dissipated, thereby achieving the effects.
When the computer is used in hot summer, the temperature of the computer is higher, and under seasonal increase, the temperature of the inner side of the case is not different from the temperature of the external environment, and the effective cooling cannot be achieved, so that the problem that the electronic components are damaged when the heat reaches the peak value can also occur.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a heat dissipation structure of a computer system.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: including fixed plate and contact plate, the inboard embedding of fixed plate is installed the fan, the upper end fixedly connected with of fixed plate is the heat pipe that arc array distributes, the one end fixedly connected with heat pipe that the heat pipe is close to fan center, the inboard embedding of heat pipe is installed the drainage tube, and the drainage tube is the heliciform setting, is located both ends about the one end fixedly connected with connecting pipe that the heat pipe is close to the heat pipe, and the connecting pipe runs through the heat pipe, is located the left end the connecting pipe right-hand member is fixed connection with the left end interface of drainage tube, and the left end of the connecting pipe that is located the right-hand member is fixed connection with the right-hand member interface of drainage tube, the lower extreme fixedly connected with heat absorption subassembly of fixed plate, the inboard front end fixedly connected with pump body of fixed plate, the drainage subassembly is installed to the inboard of fixed plate.
As a further description of the above technical solution: the heat absorbing assembly comprises a heat radiating plate, the heat radiating plate is arranged at the lower end of the fixing plate in an equal gap mode, the lower end of the heat radiating plate is fixedly connected with a contact plate, and fixing grooves are formed in four corners of the upper end of the contact plate.
As a further description of the above technical solution: the drainage assembly comprises a spiral pipe, a first mounting groove is formed in the right side of the upper end of the fixing plate, a second mounting groove is formed in the left side of the upper end of the fixing plate, a fixing pipe is fixedly connected to the upper end of the pump body, and the upper end of the fixing pipe is fixedly connected with the left side of the lower end of the spiral pipe.
As a further description of the above technical solution: the right-hand member fixedly connected with bleeder of the pump body, and the bleeder is fixed connection with the right-hand member downside of spiral pipe, coolant liquid is all installed to the inboard of spiral pipe and drainage tube, heat conduction silica gel is installed to the lower extreme of contact plate, and heat conduction silica gel and the computer place that dispels the heat contact installation.
As a further description of the above technical solution: the inner walls of the first mounting groove and the second mounting groove which are formed in the fixing plate are provided with supporting pipes which penetrate through the fixing plate, and the supporting pipes are fixedly connected with the heat conduction pipes at the left end and the right end respectively
As a further description of the above technical solution: the upper end of the heat conducting plate is provided with a heat radiating groove, and the heat conducting plate is positioned at the upper end of the fixing plate.
According to the heat radiation structure of the computer system, the heat absorption component, the drainage component and the fan are matched, the heat conduction plate is cooled firstly through circulation of cooling liquid, the environment near the fixing plate is cooled again, the air pumped into the heat absorption component by the fan is guaranteed to be cold air, the heat absorption component absorbs heat rapidly, the cooling is carried out through the cold air, and the heat radiation effect on components in the computer is effectively improved under the dual heat radiation structure.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the mounting explosion configuration of FIG. 1 according to the present utility model;
FIG. 3 is a schematic view of the structure of FIG. 2A according to the present utility model;
fig. 4 is a schematic view showing the structure of the fixing plate of the present utility model in front cross section.
Legend description:
1. a fixing plate; 2. a blower; 3. a heat conduction pipe; 4. a heat conductive plate; 5. a heat sink; 6. a drainage tube; 7. a connecting pipe;
8. a heat sink assembly; 801. a heat dissipation plate; 802. a contact plate; 803. a mounting groove;
9. a pump body;
10. a drainage assembly; 1001. a spiral tube; 1002. a first mounting groove; 1003. a second mounting groove; 1004. a fixed tube; 1005. and (5) supporting the tube.
Detailed Description
Referring to fig. 1-4, the present utility model provides a heat dissipation structure of a computer system: including fixed plate 1 and contact plate 802, fan 2 is installed to the inboard embedding of fixed plate 1, the upper end fixedly connected with of fixed plate 1 is arc array distribution's heat pipe 3, the one end fixedly connected with heat pipe 4 that heat pipe 3 is close to fan 2 center, drainage tube 6 is installed to the inboard embedding of heat pipe 4, and drainage tube 6 is the heliciform setting, is located both ends about the one end fixedly connected with connecting pipe 7 that heat pipe 3 is close to heat pipe 4, and connecting pipe 7 runs through heat pipe 4, is located the left end connecting pipe 7 right-hand member is fixed connection with the left end interface of drainage tube 6, and the left end of connecting pipe 7 that is located the right-hand member is fixed connection with the right-hand member interface of drainage tube 6, the lower extreme fixedly connected with heat absorption subassembly 8 of fixed plate 1, the inboard front end fixedly connected with pump body 9 of fixed plate 1, drainage subassembly 10 is installed to the inboard of fixed plate 1.
As a further embodiment of the above technical solution: the heat absorbing component 8 comprises a heat dissipating plate 801, the heat dissipating plate 801 is arranged at the lower end of the fixed plate 1 in a constant gap mode, the lower end of the heat dissipating plate 801 is fixedly connected with a contact plate 802, four corners of the upper end of the contact plate 802 are provided with fixing grooves 803, the lower end of the contact plate 802 is provided with heat conducting silica gel, and the heat conducting silica gel is installed in a contact mode with a heat dissipating position of a computer, so that heat absorbing and heat dissipating effects are improved.
As a further embodiment of the above technical solution: the drainage assembly 10 comprises a spiral tube 1001, a first mounting groove 1002 is formed in the right side of the upper end of the fixing plate 1, a second mounting groove 1003 is formed in the left side of the upper end of the fixing plate 1, a fixing tube 1004 is fixedly connected to the upper end of the pump body 9, the upper end of the fixing tube 1004 is fixedly connected to the left side of the lower end of the spiral tube 1001, a branch tube 1005 is fixedly connected to the right end of the pump body 9, the branch tube 1005 is fixedly connected to the lower side of the right end of the spiral tube 1001, and cooling liquid is mounted on the inner sides of the spiral tube 1001 and the drainage tube 6, so that the cooling liquid on the inner sides can be conveniently circulated through the pump body 9.
As a further embodiment of the above technical solution: the inner walls of the first mounting groove 1002 and the second mounting groove 1003 formed in the fixing plate 1 are provided with support pipes 1006, the support pipes 1006 penetrate through the fixing plate 1, the support pipes 1006 are fixedly connected with the heat conducting pipes 3 at the left end and the right end respectively, the upper end of the heat conducting plate 4 is provided with a heat dissipation groove 5, the heat conducting plate 4 is located at the upper end of the fixing plate 1, and cooling liquid in the fixing plate 1 can flow into the heat conducting plate 4 through the heat conducting pipes 3 finally, so that the heat dissipation effect is improved.
Working principle:
in using the present utility model, the device is installed in a location where heat dissipation is required for components used in a computer system, which, when installed,
in the first step, after aligning the reserved groove of the component with the fixing groove 803 in the contact plate 802, the component is fixed at the position where the device dissipates heat by the screw of M2, at this time, the heat conducting silica gel is in close contact with the component,
in the second step, when the temperature of the component is too high, heat is quickly conducted through the heat conducting silica gel and the contact plate 802, at the moment, the heat is quickly received in the heat dissipation plate 801, then the fan 2 in the fixed plate 1 and the pump body 9 on the inner side are started, the fan 2 pumps the wind on the upper end into the heat dissipation plate 801 in the lower end heat absorption assembly 8 to blow away the heat, meanwhile, the external cool wind can be blown into the heat dissipation plate 801 and can be blown into the component, the blown wind flows out from the left side and the right side of the heat dissipation plate 801,
thirdly, the pump body 9 pumps the cooling liquid in the spiral tube 1001, at this time, the cooling liquid passes through the branch tube 1005, the pump body 9 and the fixed tube 1004 and then flows into the spiral tube 1001, and is pushed upwards again through the left support tube 1006 by the spiral tube 1001, the cooling liquid passes through the left support tube 1006, finally flows into the drainage tube 6 in the heat conducting plate 4 through the heat conducting tube 3 and the left connecting tube 7, cools the heat conducting plate 4, further cools the external wind, then the cooling liquid of the drainage tube 6 in the heat conducting plate 4 finally flows back into the spiral tube 1001 through the right connecting tube 7, the heat conducting tube 3 and the right support tube 1006,
fourth, through the circulation of coolant liquid, firstly cool down heat conduction board 4, cool down the environment near fixed plate 1 again, and guarantee that fan 2 draws into the wind in the heat absorption subassembly 8 and is cold wind, improve the radiating effect to components and parts in the computer.
Finally, it should be noted that: the foregoing description of the preferred embodiments of the present utility model is not intended to be limiting, but rather, it will be apparent to those skilled in the art that the foregoing description of the preferred embodiments of the present utility model can be modified or equivalents can be substituted for some of the features thereof, and any modification, equivalent substitution, improvement or the like that is within the spirit and principles of the present utility model should be included in the scope of the present utility model.
Claims (6)
1. A heat dissipation structure of a computer system, comprising a fixing plate (1) and a contact plate (802), characterized in that: the fan (2) is installed in inboard embedding of fixed plate (1), the upper end fixedly connected with of fixed plate (1) is arc array distribution's heat pipe (3), the one end fixedly connected with heat pipe (4) that heat pipe (3) are close to fan (2) center, drainage tube (6) are installed in inboard embedding of heat pipe (4), and drainage tube (6) are the heliciform setting, are located both ends about the one end fixedly connected with connecting pipe (7) that heat pipe (3) are close to heat pipe (4), and connecting pipe (7) run through heat pipe (4), are located the left end connecting pipe (7) right-hand member is fixed connection with the left end interface of drainage tube (6), and the left end that is located the connecting pipe (7) of right-hand member is fixed connection with the right-hand member interface of drainage tube (6), the lower extreme fixedly connected with heat absorption subassembly (8) of fixed plate (1), the inboard front end fixedly connected with pump body (9) of fixed plate (1), drainage subassembly (10) are installed to the inboard of fixed plate (1).
2. A heat dissipation structure for a computer system as defined in claim 1, wherein: the heat absorbing assembly (8) comprises a heat radiating plate (801), the heat radiating plate (801) is arranged at the lower end of the fixed plate (1) in an equal gap mode, the lower end of the heat radiating plate (801) is fixedly connected with a contact plate (802), and fixing grooves (803) are formed in four corners of the upper end of the contact plate (802).
3. A heat dissipation structure for a computer system as defined in claim 1, wherein: the drainage assembly (10) comprises a spiral tube (1001), a first mounting groove (1002) is formed in the right side of the upper end of the fixing plate (1), a second mounting groove (1003) is formed in the left side of the upper end of the fixing plate (1), a fixing tube (1004) is fixedly connected to the upper end of the pump body (9), and the upper end of the fixing tube (1004) is fixedly connected with the left side of the lower end of the spiral tube (1001).
4. A heat dissipation structure for a computer system as defined in claim 1, wherein: the right-hand member fixedly connected with bleeder (1005) of pump body (9), and bleeder (1005) are fixed connection with the right-hand member downside of spiral pipe (1001), coolant liquid is all installed to the inboard of spiral pipe (1001) and drainage tube (6), heat conduction silica gel is installed to the lower extreme of contact plate (802), and heat conduction silica gel and the computer is the heat dissipation position and contact the installation.
5. A heat dissipation structure for a computer system as defined in claim 1, wherein: the inner walls of a first mounting groove (1002) and a second mounting groove (1003) formed in the fixing plate (1) are provided with supporting pipes (1006), the supporting pipes (1006) penetrate through the fixing plate (1), and the supporting pipes (1006) are fixedly connected with the heat conduction pipes (3) at the left end and the right end respectively.
6. A heat dissipation structure for a computer system as defined in claim 1, wherein: the upper end of the heat conducting plate (4) is provided with a heat radiating groove (5), and the heat conducting plate (4) is positioned at the upper end of the fixed plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322088884.8U CN220569139U (en) | 2023-08-04 | 2023-08-04 | Heat radiation structure of computer system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322088884.8U CN220569139U (en) | 2023-08-04 | 2023-08-04 | Heat radiation structure of computer system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220569139U true CN220569139U (en) | 2024-03-08 |
Family
ID=90102577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322088884.8U Active CN220569139U (en) | 2023-08-04 | 2023-08-04 | Heat radiation structure of computer system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220569139U (en) |
-
2023
- 2023-08-04 CN CN202322088884.8U patent/CN220569139U/en active Active
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