CN218383884U

CN218383884U - Mainboard cooling cover

Info

Publication number: CN218383884U
Application number: CN202222891534.0U
Authority: CN
Inventors: 刘海霞
Original assignee: Yuncheng Vocational And Technical University
Current assignee: Yuncheng Vocational And Technical University
Priority date: 2022-11-01
Filing date: 2022-11-01
Publication date: 2023-01-24
Anticipated expiration: 2032-11-01

Abstract

The utility model provides a mainboard cooling cover, which comprises a mainboard assembly and an auxiliary cooling mechanism, wherein the mainboard assembly comprises a computer mainboard, a mounting seat, a mainboard CPU and a heat dissipation plate; the auxiliary cooling mechanism comprises a water storage disc, a water storage tank, a micro circulating pump and a refrigerating sheet; the utility model discloses a heat exchanger plate utilizes the water absorption mainboard CPU's in the water storage disk heat, then utilize the heat dissipation fan to carry out preliminary heat dissipation for the water in the water storage disk through the heating panel, when the heating panel receives external temperature factor interference and leads to the temperature degree in the water storage disk to rise, absorb the heat of water in the storage water tank through utilizing the refrigeration piece, thereby to the processing of cooling down of water, then carry the inside to the water storage disk through the water after miniature circulating pump will cool down, so that the water after utilizing the cooling down through the heat exchanger plate absorbs mainboard CPU's heat fast, thereby the radiating mode of mainboard cooling jacket has been increased, the heat dissipation cooling efficiency has been improved, the influence of external environment factor to the radiating effect has been reduced.

Description

Mainboard cooling cover

Technical Field

The utility model relates to a cooling jacket specifically is mainboard cooling jacket belongs to computer motherboard technical field.

Background

The main board is generally a rectangular circuit board, on which a main circuit system forming the computer is installed, and generally comprises elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light connector, an expansion slot, a main board and a direct current power supply connector of a plug-in card and the like; the mainboard cooling cover is one of the accessory accessories of the computer mainboard, and is mainly used for radiating the CPU of the computer mainboard, so as to reduce the temperature of the CPU and ensure the operating efficiency of the CPU;

traditional mainboard cooling jacket comprises the cover body, fin and heat dissipation fan usually, absorbs mainboard CPU's heat through utilizing the fin, then uses the heat dissipation fan to dispel the heat for the fin for reach the purpose for CPU cooling, but its radiating mode is too single, and the heat absorption efficiency of fin receives the interference of ambient temperature factor very easily, for this reason, provides a mainboard cooling jacket.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide a motherboard cooling enclosure to solve or alleviate the technical problems in the prior art, and to provide at least a beneficial choice.

The embodiment of the utility model provides a technical scheme is so realized: a mainboard cooling cover comprises a mainboard assembly and an auxiliary cooling mechanism, wherein the mainboard assembly comprises a computer mainboard, a mounting seat, a mainboard CPU and a heat dissipation plate;

the auxiliary cooling mechanism comprises a water storage disc, a water storage tank, a micro circulating pump, a refrigerating sheet, a heat exchange plate and a temperature sensor;

the inside wall sliding connection of mount pad in mainboard CPU's lateral wall, the mount pad with mainboard CPU all install in the upper surface of computer motherboard, the water storage disk install in the upper surface of mount pad, heating panel fixed connection in the inside wall top of water storage disk, the storage water tank install in one side that computer motherboard upper surface is close to the mount pad, the water inlet of miniature circulating pump communicate in the inside wall bottom of storage water tank, the bottom of miniature circulating pump install in the upper surface of computer motherboard, the refrigeration piece is located one side that miniature circulating pump was kept away from to the storage water tank, heat transfer board fixed connection in the inside wall bottom of storage water tank, temperature sensor install in one side that the storage water tank was kept away from to the water storage disk inside wall.

Further preferably, the upper surface of the computer main board is fixedly connected with a supporting plate, and one side of the water storage tank, which is far away from the mounting seat, is fixedly connected with the supporting plate.

Preferably, the water outlet of the micro-circulation pump is communicated with a water supply pipe, and one end of the water supply pipe, which is far away from the micro-circulation pump, is communicated with the inside of the water storage disc.

Preferably, one side of the inner side wall of the water storage disc, which is far away from the water supply pipe, is communicated with a water return pipe, and one end of the water return pipe, which is far away from the water storage disc, is communicated with the upper surface of the water storage tank.

Further preferably, one side of the inner side wall of the water storage tank, which is close to the support plate, is fixedly connected with a cold guide plate, and one side of the inner side wall of the support plate, which is close to the water storage tank, is fixedly connected with a heat guide plate.

Further preferably, the cold end of the refrigeration piece is bonded to one side, away from the water storage tank, of the cold guide plate, and the hot end of the refrigeration piece is bonded to one side, away from the support plate, of the heat conduction plate.

Further preferably, a second heat dissipation fan is installed in the middle of the upper surface of the heat dissipation plate, and a first heat dissipation fan is installed on one side, away from the refrigeration piece, of the heat conduction plate.

Further preferably, the controller is installed to upper surface one side of computer motherboard, the relay is evenly installed to the upper surface opposite side of computer motherboard, temperature sensor's signal output part passes through wire electric connection in the signal input part of controller, the electric output part of controller passes through wire electric connection in the electric input part of relay, the electric output part of relay passes through wire electric connection in the electric input part of second heat dissipation fan, first heat dissipation fan, refrigeration piece and micro-circulation pump.

The embodiment of the utility model provides a owing to adopt above technical scheme, it has following advantage: the utility model discloses a heat exchanger plate utilizes the water absorption mainboard CPU's in the water storage disk heat, then utilize the heat dissipation fan to carry out preliminary heat dissipation for the water in the water storage disk through the heating panel, when the heating panel receives the interference of external temperature factor and leads to the temperature degree in the water storage disk to rise, through utilizing the refrigeration piece to absorb the heat of water in the storage water tank, thereby to the processing of cooling down of water, then carry the inside to the water storage disk through the water after miniature circulating pump will cool down, so that the water after utilizing the cooling down through the heat exchanger plate absorbs mainboard CPU's heat fast, thereby the radiating mode of mainboard cooling jacket has been increased, the heat dissipation cooling efficiency is improved, the influence of external environment factor to the radiating effect has been reduced.

The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and the following detailed description.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments or technical descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a block diagram of the present invention;

FIG. 2 is a schematic view of a half-section structure of the present invention;

FIG. 3 is a schematic side sectional view of the present invention;

fig. 4 is a schematic side view of the present invention.

Reference numerals are as follows: 1. a motherboard assembly; 2. an auxiliary cooling mechanism; 101. a computer motherboard; 102. a mounting seat; 103. a motherboard CPU; 104. a heat dissipation plate; 201. a water storage tray; 202. a water storage tank; 203. a micro circulating pump; 204. a refrigeration plate; 205. a heat exchange plate; 206. a temperature sensor; 41. a water supply pipe; 42. a water return pipe; 43. a support plate; 44. a cold conducting plate; 45. a relay; 46. a heat conducting plate; 47. a first heat dissipation fan; 48. a second heat dissipation fan; 49. and a controller.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1-4, an embodiment of the present invention provides a motherboard cooling cover, which includes a motherboard assembly 1 and an auxiliary cooling mechanism 2, where the motherboard assembly 1 includes a computer motherboard 101, a mounting seat 102, a motherboard CPU103, and a heat dissipation plate 104;

the auxiliary cooling mechanism 2 comprises a water storage disc 201, a water storage tank 202, a micro circulating pump 203, a refrigerating sheet 204, a heat exchange plate 205 and a temperature sensor 206;

the inside wall sliding connection of mount pad 102 is in mainboard CPU 103's lateral wall, mount pad 102 and mainboard CPU103 all install in the upper surface of computer motherboard 101, water storage tray 201 installs in the upper surface of mount pad 102, heating panel 104 fixed connection is in water storage tray 201's inside wall top, storage water tank 202 installs in the one side that computer motherboard 101 upper surface is close to mount pad 102, the water inlet of micro-circulation pump 203 communicates in storage water tank 202's inside wall bottom, the upper surface in computer motherboard 101 is installed to micro-circulation pump 203's bottom, refrigeration piece 204 locates the one side that storage water tank 202 kept away from micro-circulation pump 203, heat transfer plate 205 fixed connection is in storage water tank 202's inside wall bottom, temperature sensor 206 installs in the one side that storage water tank 202 was kept away from to storage water tank 201 inside wall.

In one embodiment, a supporting plate 43 is fixedly connected to the upper surface of the computer motherboard 101, and one side of the water storage tank 202 away from the mounting seat 102 is fixedly connected to the supporting plate 43; a supporting force is provided to one side of the water storage tank 202 through the supporting plate 43.

In one embodiment, the water outlet of the micro-circulation pump 203 is communicated with a water supply pipe 41, one end of the water supply pipe 41 far away from the micro-circulation pump 203 is communicated with the inside of the water storage tray 201, one side of the inner side wall of the water storage tray 201 far away from the water supply pipe 41 is communicated with a water return pipe 42, and one end of the water return pipe 42 far away from the water storage tray 201 is communicated with the upper surface of the water storage tank 202; the water absorbed in the water storage tray 201 is guided back to the inside of the water storage tank 202 through the water return pipe 42 so that the water can circulate in the water storage tray 201 and the water storage tank 202.

In one embodiment, a cold conducting plate 44 is fixedly connected to one side of the inner side wall of the water storage tank 202 close to the supporting plate 43, a heat conducting plate 46 is fixedly connected to one side of the inner side wall of the supporting plate 43 close to the water storage tank 202, the cold end of the refrigerating sheet 204 is bonded to one side of the cold conducting plate 44 far away from the water storage tank 202, and the hot end of the refrigerating sheet 204 is bonded to one side of the heat conducting plate 46 far away from the supporting plate 43; the heat of the water in the water storage tank 202 is absorbed by the cooling plate 204 through the cold conducting plate 44, so as to cool the water, and then the heat at the hot end of the cooling plate 204 is absorbed by the heat conducting plate 46.

In one embodiment, the middle of the upper surface of the heat dissipating plate 104 is provided with the second heat dissipating fan 48, and the side of the heat conducting plate 46 away from the refrigerating sheet 204 is provided with the first heat dissipating fan 47; the second heat dissipation fan 48 promotes the air around the heat dissipation plate 104 to flow rapidly, so as to dissipate heat from the heat dissipation plate 104, thereby improving the heat absorption efficiency of the heat dissipation plate 104 for the water in the water storage tray 201.

In one embodiment, the controller 49 is installed on one side of the upper surface of the computer motherboard 101, the relays 45 are evenly installed on the other side of the upper surface of the computer motherboard 101, the signal output end of the temperature sensor 206 is electrically connected to the signal input end of the controller 49 through a wire, the electrical output end of the controller 49 is electrically connected to the electrical input end of the relays 45 through a wire, and the electrical output end of the relays 45 is electrically connected to the electrical input ends of the second cooling fan 48, the first cooling fan 47, the refrigerating sheet 204 and the micro-circulation pump 203 through a wire; the controller 49 receives data from the temperature sensor 206, and the relay 45 controls the second heat dissipation fan 48, the first heat dissipation fan 47, the cooling fins 204, and the micro-circulation pump 203 to be turned on and off.

In one embodiment, controller 49 is model TB6569FG; the model of the temperature sensor 206 is MCP9700T-E/TT; the model of the refrigeration plate 204 is TEC1-12703AC.

The utility model discloses at the during operation: the heat generated when the mainboard CPU103 works is absorbed by the water in the water storage tray 201 through the heat exchange plate 205, then the heat of the water in the water storage tray 201 is absorbed by the heat dissipation plate 104, then the heat dissipation plate 104 dissipates heat through flowing air, then the temperature data of the water in the water storage tray 201 is detected through the temperature sensor 206, then the data of the temperature sensor 206 is received through the controller 49, when the temperature data detected by the temperature sensor 206 reaches a threshold range, the second heat dissipation fan 48 is started to work through the relay 45 through the controller 49, the working second heat dissipation fan 48 promotes the air around the heat dissipation plate 104 to flow rapidly for dissipating heat of the heat dissipation plate 104, the heat absorption efficiency of the heat dissipation plate 104 to the water in the water storage tray 201 is improved, when the heat absorption efficiency of the heat dissipation plate 104 is reduced due to the interference of external temperature factors, the temperature of the water in the water storage tray 201 is gradually increased, when the temperature data detected by the temperature sensor 206 exceeds the threshold range, the controller 49 starts the first heat dissipation fan 47, the refrigeration sheet 204 and the micro-circulation pump 203 to work by using the relay 45, the working refrigeration sheet 204 absorbs the heat of the water in the water storage tank 202 by using the cold conduction plate 44 to cool the water, then the heat at the hot end of the refrigeration sheet 204 is absorbed by the heat conduction plate 46, then the heat is dissipated for the heat conduction plate 46 by the working first heat dissipation fan 47, thereby ensuring the heat absorption efficiency at the cold end of the refrigeration sheet 204, then the cooled water in the water storage tank 202 is pumped out by the working micro-circulation pump 203, and then the water is discharged into the water storage tray 201 by the water supply pipe 41, so that the cooled water can rapidly absorb the heat of the mainboard CPU103 by using the heat exchange plate 205, thereby increasing the heat dissipation mode of the mainboard cooling cover, improving the heat dissipation and cooling efficiency, and reducing the influence of the external environmental factors on the heat dissipation effect, then, the water after absorbing heat in the water storage disc 201 is guided back to the inside of the water storage tank 202 through the water return pipe 42, so that the water can flow in the water storage disc 201 and the water storage tank 202 in a circulating manner, the water after being cooled is continuously provided for the heat exchange plate 205, the heat absorption efficiency of the heat exchange plate 205 is ensured, and when the temperature data detected by the temperature sensor 206 is lower than the threshold range, the controller 49 sequentially closes the refrigeration sheet 204, the micro-circulation pump 203, the first cooling fan 47 and the second cooling fan 48 through the relay 45, thereby avoiding the refrigeration sheet 204, the micro-circulation pump 203, the first cooling fan 47 and the second cooling fan 48 from being in a working state for a long time.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various changes or substitutions within the technical scope of the present invention, which should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A mainboard cooling jacket, includes mainboard subassembly (1) and auxiliary cooling mechanism (2), its characterized in that: the mainboard assembly (1) comprises a computer mainboard (101), a mounting base (102), a mainboard CPU (103) and a heat dissipation plate (104);

the auxiliary cooling mechanism (2) comprises a water storage disc (201), a water storage tank (202), a micro circulating pump (203), a refrigerating sheet (204), a heat exchange plate (205) and a temperature sensor (206);

the inner side wall of the mounting seat (102) is connected to the outer side wall of the mainboard CPU (103) in a sliding mode, the mounting seat (102) and the mainboard CPU (103) are installed on the upper surface of the computer mainboard (101), the water storage disc (201) is installed on the upper surface of the mounting seat (102), the heat dissipation plate (104) is fixedly connected to the top of the inner side wall of the water storage disc (201), the water storage tank (202) is installed on one side, close to the mounting seat (102), of the upper surface of the computer mainboard (101), the water inlet of the micro-circulation pump (203) is communicated to the bottom of the inner side wall of the water storage tank (202), the bottom of the micro-circulation pump (203) is installed on the upper surface of the computer mainboard (101), the refrigeration sheet (204) is arranged on one side, far away from the micro-circulation pump (203), of the water storage tank (202), the heat exchange plate (205) is fixedly connected to the bottom of the inner side wall of the water storage tank (202), and the temperature sensor (206) is installed on one side, far away from the water storage tank (202), of the inner side wall of the water storage disc (201).

2. The main plate cooling enclosure of claim 1, wherein: the upper surface of computer mainboard (101) is fixedly connected with backup pad (43), one side that storage water tank (202) is kept away from mount pad (102) with backup pad (43) fixed connection.

3. The main plate cooling enclosure of claim 1, wherein: the water outlet of the micro circulating pump (203) is communicated with a water supply pipe (41), and one end of the water supply pipe (41) far away from the micro circulating pump (203) is communicated with the inside of the water storage disc (201).

4. The main plate cooling enclosure of claim 3, wherein: one side of the inner side wall of the water storage disc (201), which is far away from the water supply pipe (41), is communicated with a water return pipe (42), and one end of the water return pipe (42), which is far away from the water storage disc (201), is communicated with the upper surface of the water storage tank (202).

5. The main plate cooling enclosure of claim 2, wherein: one side fixedly connected with of the inside wall of storage water tank (202) near backup pad (43) leads cold plate (44), one side fixedly connected with heat-conducting plate (46) that backup pad (43) inside wall is close to storage water tank (202).

6. The main plate cooling enclosure of claim 5, wherein: the cold end of the refrigeration piece (204) is bonded to one side, away from the water storage tank (202), of the cold guide plate (44), and the hot end of the refrigeration piece (204) is bonded to one side, away from the support plate (43), of the heat conduction plate (46).

7. The main plate cooling enclosure of claim 6, wherein: the upper surface mid-mounting of heating panel (104) has second heat dissipation fan (48), one side that refrigeration piece (204) were kept away from in heat-conducting plate (46) is installed first heat dissipation fan (47).

8. The main plate cooling enclosure of claim 7, wherein: controller (49) is installed to upper surface one side of computer motherboard (101), relay (45) are evenly installed to the upper surface opposite side of computer motherboard (101), the signal output part of temperature sensor (206) passes through the signal input part of wire electric connection in controller (49), the electrical output part of controller (49) passes through the electrical input part of wire electric connection in relay (45), the electrical output part of relay (45) passes through the electrical input part of wire electric connection in second heat dissipation fan (48), first heat dissipation fan (47), refrigeration piece (204) and micro-circulation pump (203).