CN212906168U - Computer heat abstractor - Google Patents

Computer heat abstractor Download PDF

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Publication number
CN212906168U
CN212906168U CN202022418235.6U CN202022418235U CN212906168U CN 212906168 U CN212906168 U CN 212906168U CN 202022418235 U CN202022418235 U CN 202022418235U CN 212906168 U CN212906168 U CN 212906168U
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China
Prior art keywords
heat dissipation
case
computer
plate
air
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CN202022418235.6U
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Chinese (zh)
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张素芳
李琳
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张素芳
李琳
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Priority to CN202022418235.6U priority Critical patent/CN212906168U/en
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Abstract

The utility model belongs to the field of computers, in particular to a computer heat dissipation device, which comprises a base, wherein a heat dissipation platform is arranged above the base, a supporting plate is arranged at the top of the heat dissipation platform, and side plates are symmetrically arranged on the left side wall and the right side wall of the heat dissipation platform; two radiators are installed at the bottom end of the interior of the radiating table, a fan capable of rotating to supply air is arranged in each radiator, a separation net with a ring net structure is installed at the top of each radiator, and a ventilating plate is installed on each side plate; the computer heat dissipation device comprises a heat dissipation table and a ventilation plate, wherein a heat dissipation device in the heat dissipation table sends out heat dissipation air through rotation of a fan, the heat dissipation air is transmitted to the inside of a case to perform auxiliary heat dissipation, the heat dissipation air is discharged outside through a through groove formed in the ventilation plate of a side plate after use, and the heat dissipation air forms a passage in the case, so that heat in the case is taken away in the circulation process of the heat dissipation air, the case is at a safe operation temperature, and stable operation of elements in the case is kept.

Description

Computer heat abstractor
Technical Field
The utility model relates to a computer field, concretely relates to computer heat abstractor.
Background
Integrated circuits are heavily used in computer components. It is known that the heat that causes the high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. Most heat sinks absorb heat by contacting the surfaces of heat-generating components, and then transfer the heat to a remote location by various methods, such as air in a chassis, and then the chassis transfers the hot air to the outside of the chassis, thereby dissipating heat from the computer.
The prior art has the following problems:
1. when a computer performs high-efficiency operation, internal elements emit high temperature, a radiator arranged in a case is difficult to meet the radiating requirement, and a host is overheated and stops working, so that operation data are lost and the defects exist;
2. the integration level in the computer case is high, and the installation space of the radiator is insufficient, so that the radiator additionally installed in the case cannot be realized due to the space limitation.
In order to solve the above problems, the present application provides a heat dissipation device for a computer.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
For solving the technical problem who exists among the background art, the utility model provides a computer heat abstractor has the outside supplementary heat dissipation of computer machine case and the stable characteristics of computer machine case support.
(II) technical scheme
In order to solve the technical problem, the utility model provides a computer heat dissipation device, which comprises a base, wherein a heat dissipation table is arranged above the base, a supporting plate is arranged at the top of the heat dissipation table, and side plates are symmetrically arranged on the left side wall and the right side wall of the heat dissipation table;
the heat dissipation platform is characterized in that two radiators are installed at the bottom end of the interior of the heat dissipation platform, a fan capable of rotating to supply air is arranged in each radiator, a separation net with a ring net structure is installed at the top of each radiator, a ventilation plate is installed on each side plate, and hollow through grooves are formed in the ventilation plate in an array mode.
Preferably, the separation net installed at the top of the radiator penetrates through the upper surface of the supporting plate, and the positions of the two radiators correspond to the position of the bottom opening of the case.
Preferably, the through groove formed in the ventilating plate corresponds to the position of the opening of the outer wall of the case.
Preferably, the upper surface of the supporting plate is provided with a rubber pad, and the rubber pad is attached to the bottom of the case.
Preferably, the clamping area between the supporting plate and the two side plates is of a U-shaped structure, and a case is clamped and installed in the U-shaped structure.
Preferably, the side plates are symmetrically provided with protruded heat dissipation fin wings which are metal members.
The above technical scheme of the utility model has following profitable technological effect:
1. the computer heat dissipation device comprises a heat dissipation table and a ventilation plate, wherein a heat dissipation device in the heat dissipation table sends out heat dissipation air through rotation of a fan, the heat dissipation air is transmitted to the inside of a case to perform auxiliary heat dissipation, the heat dissipation air is discharged outside through a through groove formed in the ventilation plate of a side plate after use, and the heat dissipation air forms a passage in the case, so that heat in the case is taken away in the circulation process of the heat dissipation air, the case is at a safe operation temperature, and stable operation of elements in the case is kept.
2. The supporting plate and the two side plates of the computer heat radiating device are combined into a whole to form a U-shaped structure, and the case is directly placed in the combined whole of the U-shaped structure, so that the case is stably installed on the computer heat radiating device.
Drawings
Fig. 1 is a schematic front view of the present invention;
fig. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic side view of the present invention;
FIG. 4 is a schematic view of the front view of the computer heat dissipation device of the present invention;
fig. 5 the utility model discloses a computer heat abstractor uses and looks sideways at the schematic diagram.
Reference numerals:
1. a base; 2. a heat dissipation table; 3. a support plate; 4. a side plate; 5. a heat sink; 6. a fan; 7. a separation net; 8. a rubber pad; 9. heat dissipation fins; 10. a ventilation board; 11. a through groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-3, the utility model provides a computer heat dissipation device, which comprises a base 1, a heat dissipation platform 2 is installed above the base 1, a supporting plate 3 is installed on the top of the heat dissipation platform 2, and side plates 4 are symmetrically installed on the left and right side walls of the heat dissipation platform 2;
two radiators 5 are installed at the inside bottom end of the radiating platform 2, a fan 6 capable of rotating to supply air is arranged in each radiator 5, a separation net 7 with a ring net structure is installed at the top of each radiator 5, a ventilating plate 10 is installed on each side plate 4, and hollow through grooves 11 are formed in the ventilating plate 10 in an array mode.
It should be noted that:
1. a separation net 7 arranged at the top of the radiators 5 penetrates through the upper surface of the supporting plate 3, and the positions of the two radiators 5 correspond to the opening positions at the bottom of the case; the separation net 7 is a hollow structure attached to the opening of the chassis base, and air sent out by the fan 6 in the radiator 5 in a rotating mode is transmitted to the interior of the chassis through the separation net 7 with the hollow structure and the opening of the chassis base, so that high-temperature elements in the chassis are swept and radiated.
2. A through groove 11 formed in the ventilation plate 10 corresponds to the position of an opening on the outer wall of the case; the side plate 4 clamps the side wall of the case, the contact position of the through groove 11 formed in the ventilating plate 10 of the side plate 4 and the outer wall of the case is of an open pore structure, and the heat dissipation wind in the case is transmitted to the outside through the through groove 11 which is through, so that the heat dissipation wind is discharged outside.
In this embodiment, a computer heat dissipation device is made into a support structure, a case is placed in a clamping area between a supporting plate 3 and two side plates 4, wherein the bottom of the case is in contact with a heat dissipation platform 2, the side wall of the case is in contact with the side plates 4, two heat radiators 5 in the heat dissipation platform 2 are rotated by a fan 6 to send out air for heat dissipation, the air for heat dissipation is transmitted to the inside of the case for auxiliary heat dissipation, after the heat dissipation is used, the air for heat dissipation is discharged outside through a through groove 11 formed in a ventilation plate 10 of the side plates 4, the air for heat dissipation forms a passage in the inside of the case, heat in the case is taken away in the circulation process of the air for heat dissipation, the case is at a safe operation.
In an optional embodiment, the side plates 4 are symmetrically provided with protruding heat dissipation fins 9, and the heat dissipation fins 9 are metal members; the radiating fin 9 supported by the metal member has heat conduction performance, when the temperature in the chassis rises, the temperature is conducted to the radiating fin 9 on the side plate 4, and heat is conducted to the outside through the special-shaped structure protruded from the radiating fin 9, so that the heat in the chassis is assisted to be radiated to the outside.
As shown in fig. 1, the clamping area between the supporting plate 3 and the two side plates 4 is a U-shaped structure, and a chassis is clamped and installed in the U-shaped structure.
In this embodiment, the supporting plate 3 and the two side plates 4 are integrally combined into a U-shaped structure, the case is directly placed in the combined body of the U-shaped structure, the bottom and the side walls of the case are limited, and the case is stably mounted on the computer heat dissipation device.
In an alternative embodiment, the upper surface of the supporting plate 3 is provided with a rubber pad 8, and the rubber pad 8 is attached to the bottom of the case; the bottom of the case is placed on the supporting plate 3 and is in direct contact with the rubber pad 8, the rubber pad 8 is made of rubber and has elastic deformation performance, and when the case runs, vibration can be buffered through slight deformation of the rubber pad 8, and running noise of the case is reduced.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims (6)

1. The computer heat dissipation device is characterized by comprising a base (1), wherein a heat dissipation table (2) is arranged above the base (1), a supporting plate (3) is arranged at the top of the heat dissipation table (2), and side plates (4) are symmetrically arranged on the left side wall and the right side wall of the heat dissipation table (2);
two radiators (5) are installed to the inside bottom of heat dissipation platform (2), but radiator (5) built-in fan (6) of rotatable air supply, just the top of radiator (5) is installed separation net (7) that have the ring network structure, install ventilating board (10) on curb plate (4), logical groove (11) of fretwork are seted up to the array on ventilating board (10).
2. The computer heat sink according to claim 1, wherein the separation net (7) mounted on top of the heat sinks (5) penetrates the upper surface of the supporting plate (3), and the positions of the two heat sinks (5) correspond to the bottom opening position of the case.
3. The computer heat sink according to claim 1, wherein the through slot (11) formed in the ventilation plate (10) corresponds to the position of the opening in the outer wall of the chassis.
4. The computer heat dissipation device of claim 1, wherein a rubber pad (8) is mounted on the upper surface of the supporting plate (3), and the rubber pad (8) is attached to the bottom of the case.
5. The computer heat dissipation device according to claim 1, wherein the clamping area between the supporting plate (3) and the two side plates (4) is a U-shaped structure, and a chassis is clamped and mounted in the U-shaped structure.
6. The computer heat dissipation device according to claim 1, wherein the side plates (4) are symmetrically provided with protruding heat dissipation fins (9), and the heat dissipation fins (9) are metal members.
CN202022418235.6U 2020-10-27 2020-10-27 Computer heat abstractor Active CN212906168U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022418235.6U CN212906168U (en) 2020-10-27 2020-10-27 Computer heat abstractor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022418235.6U CN212906168U (en) 2020-10-27 2020-10-27 Computer heat abstractor

Publications (1)

Publication Number Publication Date
CN212906168U true CN212906168U (en) 2021-04-06

Family

ID=75261136

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022418235.6U Active CN212906168U (en) 2020-10-27 2020-10-27 Computer heat abstractor

Country Status (1)

Country Link
CN (1) CN212906168U (en)

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