CN220554240U - Electric control board module, radio frequency thawing device and refrigerator - Google Patents

Abstract

The application discloses automatically controlled board module, radio frequency thawing apparatus and refrigerator, automatically controlled board module includes radiating piece, automatically controlled board, shielding lid and encapsulating box, and the automatically controlled board is connected with the radiating piece, derives the heat of automatically controlled board through the radiating piece; the shielding cover is covered on the first circuit unit of the electric control board and used for shielding and protecting electronic elements positioned on the first circuit unit; the glue filling box is used for carrying out glue filling and sealing on an electronic element located in the second circuit unit, the glue filling box is provided with a containing area and a through hole, the radiating piece is arranged in the through hole in a penetrating mode and at least partially stretches out of the glue filling box, and can exchange heat with wind flow, so that the electric control board is radiated, the second circuit unit is located in the containing area at least partially, and the second circuit unit is fixed in the glue filling box through the sealing of the pouring glue. The electric control board module can radiate, shield and package the electric control board through setting up radiating piece, shielding cover and encapsulating box to do not influence each other between radiating effect, shielding effect, the encapsulation effect.

Description

Electric control board module, radio frequency thawing device and refrigerator

Technical Field

The application belongs to the technical field of circuit board packaging structures, and particularly relates to an electric control board module, a radio frequency thawing device and a refrigerator.

Background

A plurality of circuit modules are usually arranged on the circuit board, and the circuit modules need to be shielded, heat dissipation and packaged during use. For example, the circuit board is arranged in the refrigeration equipment, the temperature in the refrigeration equipment is low, heat can be generated in the working process of the circuit board, condensation can be generated by cold and hot impact, and the exposed electric devices are easy to damage. The heat productivity of partial circuits is large when in work, such as a power amplifier module of a radio frequency thawing system, and a heat dissipation structure is also required to be arranged for dissipating heat of the circuit board.

In the prior art, the circuit board is generally packaged in a manner of being mounted in a shell or integrally encapsulated. Heat is radiated through an air radiating mode or a pouring sealant heat conducting mode, but the heat radiating effect is poor. If the air blowing and heat dissipation are adopted, the shielding cover or the shell can have a certain influence on the flow of the air flow, the heat dissipation effect is poor, and overheat damage is easy to generate.

Disclosure of Invention

For solving the technical problems that the existing circuit board packaging structure cannot achieve shielding, heat dissipation and packaging, the application provides an electric control board module, a radio frequency thawing device and a refrigerator.

In a first aspect of the present application: there is provided an electronic control board module including:

a heat sink;

the electric control board is provided with a first circuit unit and a second circuit unit and is arranged on the radiating piece;

the shielding cover is covered on the first circuit unit;

the glue filling box is provided with a containing area and a through hole;

wherein the heat dissipation piece is arranged in the through hole in a penetrating way; the second circuit unit is at least partially located in the accommodating area and is fixed to the glue filling box in a sealing mode through pouring sealant.

In some embodiments, the glue-pouring box comprises a box bottom, an inner partition plate and a surrounding edge surrounding the box bottom edge, the through hole is positioned at the box bottom, and the inner partition plate is arranged at the edge of the through hole so as to surround the surrounding edge to form the containing area.

In some embodiments, the height of the inner partition is lower than the peripheral edge, so that the electric control plate is at least partially positioned in the box cavity of the glue-pouring box.

In some embodiments, the electronic control board integrates a power amplifier module, a control module, and a tuning module; at least one of the power amplifier module, the control module and the tuning module is arranged on the first circuit unit, and the rest is arranged on the second circuit unit.

In some embodiments, the power amplifier module and the control module are disposed in the first circuit unit, and the tuning module is disposed in the second circuit unit.

In some embodiments, the heat sink, the shielding cover, the glue-pouring box, and the electronic control board are hermetically connected by the potting adhesive, and the potting adhesive encapsulates the tuning module.

In a second aspect of the present application: there is provided a radio frequency thawing apparatus comprising:

the box body assembly is provided with a first shielding cavity and a second shielding cavity which are mutually independent;

the drawer assembly is arranged in the first shielding cavity and is used for accommodating food to be thawed;

the electric control board module of the first aspect is disposed in the second shielding cavity, and at least one of the power amplifier module, the control module, the power supply module and the tuning module is integrated on the electric control board;

and the polar plate is arranged in the first shielding cavity, is electrically connected with the electric control plate and is used for radiating radio frequency energy into the drawer assembly so as to defrost the food to be defrosted.

In some embodiments, in the case that the electric control board is integrated with the power amplification module, the control module and the tuning module, the radio frequency thawing device further includes a power module, where the power module is electrically connected with both the power amplification module and the control module, and is used for supplying power to both the power amplification module and the control module.

In some embodiments, the box assembly comprises a shielding shell, a shielding baffle and a shielding cover, wherein the shielding baffle is connected with one end of the shielding shell to form the first shielding cavity, and the shielding cover is connected with the shielding baffle to form the second shielding cavity;

the electric control board module is connected with the shielding cover or the shielding partition board.

In a third aspect of the present application: there is provided a refrigerator comprising a refrigerator main body and the radio frequency thawing device of the second aspect, wherein the radio frequency thawing device is arranged in the refrigerator main body.

According to the technical scheme, the electric control board module comprises a heat radiating piece, an electric control board, a shielding cover and a glue filling box, wherein electronic elements are arranged on the electric control board and distributed on the first circuit unit and the second circuit unit, the electric control board is connected with the heat radiating piece, the heat radiating piece exchanges heat with the electric control board, and heat of the electric control board is led out through the heat radiating piece; the shielding cover is covered on the first circuit unit of the electric control board and used for shielding and protecting electronic elements positioned on the first circuit unit; the glue filling box is used for carrying out glue filling and sealing on an electronic element located in the second circuit unit, the glue filling box is provided with a containing area and a through hole, and the radiating piece is arranged in the through hole in a penetrating mode. Therefore, the electronic control board module provided by the first aspect of the application can radiate, shield and package the electronic control board through the heat radiating piece, the shielding cover and the glue filling box, and the heat radiating effect, the shielding effect and the packaging effect are not mutually influenced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electric control board module according to some embodiments of the present application.

Fig. 2 shows a front view of the electronic control board module of fig. 1.

Figure 3 shows a cross-sectional view A-A of figure 2.

Fig. 4 shows an exploded view of the electric control board module of fig. 1.

Fig. 5 shows a block diagram of the electric control board in the electric control board module of fig. 1.

Fig. 6 is a schematic structural diagram of a radio frequency thawing device in some embodiments of the present application.

Fig. 7 shows an exploded view of the housing assembly of the rf thawing apparatus of fig. 5.

Fig. 8 illustrates an exploded view of a radio frequency thawing device in some embodiments of the present application.

Fig. 9 is a schematic view showing a structure of a refrigerator in some embodiments of the present application.

Fig. 10 is a view showing a structure of an arrangement of a radio frequency thawing device in a liner in the refrigerator of fig. 9.

Reference numerals illustrate: 101-a power amplification module, 102-a control module, 103-a tuning module and 104-a power supply module; 106-a detection circuit; 107-tuning the inductance; 110-an electric control board, 113-a first circuit unit, 114-a second circuit unit; 120-shielding cover, 124-mounting lugs; 130-heat radiating piece, 131-heat radiating plate, 132-heat radiating fin; 140-of a glue filling box, 141-of a containing area, 142-of a through hole, 143-of a box bottom, 144-of an inner partition board and 145-of a surrounding edge; 150-an electric control board module; 160-fasteners; 200-radio frequency thawing device, 201-first shielding cavity, 202-second shielding cavity, 203-tuning cavity; 210-box components, 211-shielding shells, 212-shielding partition plates, 213-shielding cases, 2131-air inlets, 2132-air outlets and 214-protruding parts; 220-drawer assembly; 230-a fan; 240-wind guide piece; 1000-refrigerator, 300-refrigerator main body, 301-refrigerating chamber, 310-first storage box, 320-small drawer, 330-second storage box, 340-water tank, 350-inner container, 351-back plate, 352-return air inlet.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

In the related art, the circuit board packaging structure has the technical problem that shielding, heat dissipation and packaging cannot be simultaneously achieved. The embodiment of the application provides an electric control board module, a radio frequency thawing device and a refrigerator, which at least can solve the technical problems to a certain extent. The present application is described below with reference to specific embodiments in conjunction with the accompanying drawings:

in a first aspect of embodiments of the present application, an electric control board module 150 is provided, as shown in fig. 1, 2, 3 and 4, which respectively illustrate an overall block diagram, a front view, a cross-sectional view and an exploded view of the electric control board module 150 in some embodiments. The electric control board module 150 comprises a heat dissipation member 130, an electric control board 110, a shielding cover 120 and a glue filling box 140, wherein electronic elements are arranged on the electric control board 110 and distributed on the first circuit unit 113 and the second circuit unit 114, the electric control board 110 is connected with the heat dissipation member 130, the electric control board 110 is in heat transfer contact with the heat dissipation member 130, and the electric control board 110 and the heat dissipation member 130 can be selectively connected and fixed or only in contact. The heat sink 130 exchanges heat with the electronic control board 110, and heat of the electronic control board 110 is conducted out through the heat sink 130. The heat dissipation member 130 may be a metal member or a semiconductor refrigeration member, the metal member can conduct out heat of the electric control board 110, and the semiconductor refrigeration member can automatically generate cold energy to cool the electric control board 110 through heat exchange with air. In some embodiments, the heat sink 130 is provided with an airflow channel that is capable of carrying away heat from the heat sink 130 when wind flows through the airflow channel.

The shielding cover 120 covers the first circuit unit 113 of the electronic control board 110, and shields and protects the electronic components located in the first circuit unit 113. The shielding cover 120 and the heat sink 130 are disposed at different sides of the electronic control board 110, respectively, such that the shielding cover 120 and the heat sink 130 do not interfere with each other. The shielding cover 120 is made of metal, and can also play a role in heat dissipation to a certain extent.

In order to satisfy the installation and heat dissipation of the electric control board 110, referring to fig. 4, the heat dissipation member 130 includes a heat dissipation plate 131 and a plurality of heat dissipation fins 132, the heat dissipation fins 132 are distributed on one surface of the heat dissipation plate 131, and each heat dissipation fin 132 is distributed at intervals, so that gaps between the heat dissipation fins 132 form an airflow channel, and the specific number and intervals of the heat dissipation fins 132 depend on the heat dissipation requirement of the electric control board 110. In some embodiments, the heat dissipating plate 131 is integrally formed with the heat dissipating fins 132. The heat dissipation plate 131 has a large installation plane, the electronic control board 110 is installed on the installation plane of the heat dissipation plate 131 by the fastening member 160, and the electronic control board 110 is at least partially in contact with the heat dissipation plate 131.

Because the metal is electrically conductive, in order to guarantee that automatically controlled board 110 and heating panel 131 fully contact as far as possible, in some embodiments, be equipped with a plurality of avoidance blind holes on the mounting plane of heating panel 131, the quantity and the position of avoiding the blind hole correspond with the quantity and the distribution of the conductor (pin, soldering tin portion, wire etc.) of automatically controlled board 110 completely, the hole size of dodging is greater than the conductor that corresponds on the automatically controlled board 110 for the conductor stretches into in dodging the blind hole, can not contact with heating panel 131 simultaneously, can ensure from this that automatically controlled board 110 closely laminates with heating panel 131, area of contact is bigger is favorable to the heat dissipation, and automatically controlled board 110 overall structure is more stable. Avoid the blind hole because design as the blind hole, can avoid the design to lead to conductor and water contact and the problem of electric leakage as the through-hole.

The heat sink 130 has a structural strength higher than that of the electronic control board 110, and thus the heat sink 130 serves as a mounting base for both the electronic control board 110 and the shielding cover 120, and the electronic control board 110 and the shielding cover 120 are mounted on the heat sink 130 by the fasteners 160, as shown in fig. 3. In some embodiments, at least two mounting lugs 124 are disposed on the heat dissipating plate 131 and/or the shielding cover 120, where the mounting lugs 124 may be disposed on the heat dissipating plate 131 or the shielding cover 120 according to actual needs, and fixing holes for installing the fasteners 160 are disposed in the mounting lugs 124, and the fixing holes may be light holes or threaded holes, and the fasteners 160 may adopt structures such as screws, rivets, pins, and the like, which is not limited in this application.

The glue-pouring box 140 is used for performing glue-pouring sealing on the electronic component located in the second circuit unit 114, the glue-pouring box 140 is provided with a containing area 141 and a through hole 142, the through hole 142 is an opening penetrating through the glue-pouring box 140, the heat dissipation piece 130 is arranged in the through hole 142 in a penetrating manner, the heat dissipation piece 130 can at least partially extend out of the glue-pouring box 140 through the through hole 142, the part, extending out of the glue-pouring box 140, of the heat dissipation piece 130 can exchange heat with wind flow, so that heat dissipation can be performed on the electronic control board 110, in some embodiments, the heat dissipation plate 131 of the heat dissipation piece 130 is located in a box cavity of the glue-pouring box 140, and the heat dissipation fins 132 extend out of the glue-pouring box 140.

The second circuit unit 114 is at least partially located in the accommodating area 141, and when the second circuit unit 114 is filled with glue, the accommodating area 141 can store the glue solution, so that the second circuit unit 114 is sealed and fixed on the glue filling box 140 through the pouring sealant. Thus, the electric control board module 150 can radiate, shield and package the electric control board 110 by providing the radiator 130, the shielding cover 120 and the glue-pouring box 140, and the radiating effect, the shielding effect and the packaging effect are not affected each other.

The glue-pouring box 140 is a box body with an opening at one side, and the size of the box cavity of the glue-pouring box should be larger than the area of the electric control plate 110, so that the electric control plate 110 can be conveniently placed in the box cavity of the glue-pouring box 140. Referring to fig. 4, in some embodiments, the glue-pouring box 140 includes a bottom 143, an inner partition 144, and a peripheral edge 145 surrounding the edge of the bottom 143, and the through-hole 142 is formed by hollowing out a portion of the bottom 143. The inner partition 144 is disposed at the edge of the through hole 142, and the inner partition 144 may be disposed close to the edge of the through hole 142, or may have a certain interval with the edge of the through hole 142, where the end of the inner partition 144 is connected to the peripheral edge 145 and the bottom is connected to the bottom of the case 143, so that the inner partition 144 and the peripheral edge 145 enclose the accommodating area 141. The various portions of the glue cartridge 140 may be fixedly attached by bonding, welding, or the like, and in some embodiments, the glue cartridge 140 is integrally formed by injection molding.

Referring to fig. 4, in some embodiments, the height of the inner partition 144 of the glue-pouring box 140 is lower than the surrounding edge 145, so that when the electronic control board 110 is placed in the box cavity of the glue-pouring box 140, the substrate of the electronic control board 110 is located in the box cavity of the glue-pouring box 140, and the electronic components of the electronic control board 110 are at least partially located in the box cavity, so that the potting compound can stay in the area surrounded by the substrate of the electronic control board 110, the inner partition 144 and the surrounding edge 145, thereby at least encapsulating the connection between the electronic components in the accommodating area 141 and the substrate, or encapsulating the electronic components in the accommodating area 141 entirely, and the potting compound fully encapsulates the pins, wires and the electronic components, thereby not only preventing water, dust and insects, but also playing a role of increasing heat dissipation.

In some embodiments, the heat sink 130, the shielding cover 120, the glue-pouring box 140 and the electric control board 110 are connected in a sealing manner through a potting adhesive filled integrally, the potting adhesive wraps the tuning module, and the potting adhesive wraps the junction of the heat sink 130, the shielding cover 120, the glue-pouring box 140 and the electric control board 110, so that the heat sink 130, the shielding cover 120, the glue-pouring box 140 and the electric control board 110 form a whole, and the whole is installed as one component during installation, and the installation is convenient. In other embodiments, the heat dissipation member 130, the shielding cover 120, the glue-pouring box 140 and the electronic control board 110 may be connected by threaded fasteners, so as to facilitate the disassembly and maintenance of the components.

The circuit configuration and circuit function on the electronic control board 110 are not limited in this application. The first circuit unit 113 and the second circuit unit 114 may be a set of different electronic components of the same functional circuit on the substrate, or may be different circuit modules on the substrate. In short, the portion of the electric control board 110 covered by the shielding cover 120 is the first circuit unit 113, the portion located outside the shielding cover 120 and sealed by the potting adhesive is the second circuit unit 114, and the second circuit unit 114 may be all the portions located outside the shielding cover 120 in the electric control board 110 or may be a part of the portions.

Referring to fig. 5, a block diagram of an electric control board 110 in some embodiments is shown, where the electric control board 110 is applied to a radio frequency thawing system, and the radio frequency thawing system includes a power amplifier module 101, a control module 102, a power module 104, a tuning module 103, and a polar plate (not shown in the figure). The electronic control board 110 integrates the power amplifier module 101, the control module 102 and the tuning module 103. At least one circuit module of the power amplifier module 101, the control module 102 and the tuning module 103 is provided in the first circuit unit 113, and the remaining circuit modules are provided in the second circuit unit 114. In some embodiments, the power amplifier module 101 and the control module 102 are disposed on the first circuit unit 113 and shielded by the shielding cover 120; the tuning module 103 is arranged on the second circuit unit 114, and is encapsulated by pouring sealant, so that a waterproof effect is achieved, electronic devices of the tuning module 103 are protected, heat dissipation capacity of the electronic devices of the tuning module 103 is increased after glue pouring, and the heat dissipation effect is improved under the action of wind current.

In the related art, the power amplifier module 101 and the control module 102 are drawn on the same electric control board, meanwhile, because the tuning module 103 has strong electromagnetic radiation, interference is easily caused to the power amplifier module 101 and the control module 102, so the power amplifier module 101 and the control module 102 are placed far away from the tuning module 103 after being connected with the power module 104 through a wire harness, such as placed on the top of a refrigerator or a refrigerator backboard, and then a control signal wire is connected with the tuning module 103 placed in a drawer through a coaxial line. By arranging the power amplifier module 101, the control module 102 and the tuning module 103 on the electric control board 110, no coaxial line is required to be arranged between the power amplifier module 101 and the tuning module 103, and no control signal line is required to be arranged between the control module 102 and the tuning module 103, and after the electric control board 110 is connected with the power module 104 in a line manner and is electrically connected with the polar plate, the polar plate can radiate radio frequency energy outwards. Therefore, the radio frequency thawing system with the electric control board 110 reduces internal wiring, improves the structure installation efficiency and the simplicity, and reduces the cost of the whole radio frequency thawing system. In addition, since the power amplifier module 101, the control module 102 and the tuning module 103 are arranged on the same electric control board 110, signal attenuation caused by long wires is avoided, and performance of the electric control board 110 is improved.

In the rf thawing system, the power amplifier module 101 is configured to generate a power-amplified rf signal. The power amplification module 101 generally includes a signal source and a power amplification circuit electrically connected, where the signal source is configured to generate an initial signal with a set frequency (e.g. 40.68 MHz), the power amplification circuit is configured to power amplify the initial signal, enhance the power of the initial signal, output a radio frequency signal after power amplification, and amplify the radio frequency signal generated by the crystal oscillator step by step to reach a level of hundred watts.

The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of the amplifying circuits at all stages can refer to related publications in the prior art, so that the power amplifying circuit is not limited. In some embodiments, the power amplifying circuit adopts a secondary amplifying circuit, which comprises a primary driver and a secondary power amplifying circuit, wherein the primary driver and the secondary power amplifying circuit are arranged on the electric control board 110, and the signal source, the primary driver, the secondary power amplifying circuit, the tuning module 103 and the polar plate are electrically connected in sequence. The primary driver and the secondary power amplifying circuit amplify the initial signal sent by the signal source step by step, and the secondary power amplifying circuit outputs the amplified signal. The specific circuit structures of the primary driver and the secondary power amplifying circuit can refer to related publications in the prior art, and the application is not limited.

The power module 104 is internally provided with an ac/dc conversion circuit and a voltage regulating circuit, and is used for performing ac/dc conversion and voltage regulation, and supplying low-voltage dc power to the power amplifier module 101 and the control module 102. Referring to fig. 8, in some embodiments, the power module 104 is disposed independently, and the power module 104 may be installed in the same space as the electronic control board 110 or may be disposed in a different space. In some embodiments, the power amplifier module 101, the control module 102, the power module 104 and the tuning module 103 are disposed on the same electric control board 110, so that the whole rf thawing system only includes one electric control board 110 and one polar plate, and the integration level is higher.

The control module 102 is electrically connected with the signal source and the power amplification circuit, and the power amplification module 101 is controlled by a control system (e.g., MCU controller) of the control module 102 when in operation, the control module 102 is electrically connected with an external input device (display screen, operation panel, keyboard, etc.), receives an operation instruction sent by a user, and controls the circuits of the power supply module 104 and the power amplification module 101 to operate. When the output power of the power amplifier module 101 needs to be adjusted, the control module 102 calculates an adjusting voltage control command based on an internal algorithm and sends the adjusting voltage control command to the power module 104, and the power module 104 adjusts the voltage to change the output voltage of the power module 104.

The tuning module 103 is electrically connected with the power amplification circuit of the power amplification module 101, and the tuning module 103 is used for balancing the impedance of the load end so as to realize impedance matching, so that the radio frequency thawing device 200 can reach the optimal impedance through the impedance matching, and the thawing effect is improved. The polar plate is electrically connected with the tuning module 103 and is used for radiating radio frequency energy to achieve the purpose of thawing food materials.

In some embodiments, referring to fig. 5, the radio frequency thawing system is further provided with a detection circuit 106, where the detection circuit 106, the power amplifier module 101, the control module 102 and the tuning module 103 are disposed on the same electronic control board 110. The detection circuit 106 is configured to detect the output power of the rf signal after power amplification, and feed back the output power to the control module 102. Specifically, the control module 102 is electrically connected to the detection circuit 106, and the detection circuit 106 is configured to detect the reflected power reflected by the tuning module 103 and feed back the reflected power to the control module 102, where the control module 102 performs related control on the signal source, the power amplifying circuit, and the power supply module 104 through an internal algorithm.

In a second aspect of the present application, a radio frequency thawing device 200 is provided, and referring to fig. 6, an overall structure diagram of the radio frequency thawing device 200 is shown. The rf thawing apparatus 200 includes a housing assembly 210, a drawer assembly 220, a polar plate (not visible in the drawing) and the electric control board module 150 according to the embodiment of the first aspect, that is, the electric control board 110 is applied to the rf thawing system in the electric control board module 150 according to the embodiment of the first aspect. Referring to fig. 7, the case assembly 210 has a first shielding cavity 201 and a second shielding cavity 202 which are independent from each other, the drawer assembly 220 is installed in the first shielding cavity 201, the drawer assembly 220 is internally used for accommodating food to be thawed, the polar plate is arranged in the first shielding cavity 201 and is used for radiating radio frequency energy into the drawer assembly 220 to defrost the food to be thawed, and the electric control board module 150 is arranged in the second shielding cavity 202.

Referring to fig. 7, in some embodiments, the box assembly 210 includes a shielding shell 211, a shielding partition 212 and a shielding cover 213, where the shielding partition 212 is connected to one end of the shielding shell 211 to form a first shielding cavity 201, and one end of the shielding shell 211 is open for the drawer assembly 220 to be pulled and moved. The shield 213 is connected to the shield 212 to form the second shielded cavity 202, and the electronic panel module 150 is selectively connected to either the shield 213 or the shield 212. In some embodiments, the power module 104 is also disposed within the second shielded cavity 202.

The electric power of the electric control board module 150 may be provided by a separate power module or may be provided by an electric device mounted on the electric control board module 150. In some embodiments, the electric control board module 150 is powered by a separate power module, referring to fig. 8, the power module 104 is disposed outside the second shielding cavity 202, and the power module 104 is connected to the shielding case 213, so as to shorten the wiring length between the power module 104 and the electric control board 110.

Referring to fig. 6 and 7, in some embodiments, a protruding portion 214 is disposed at the bottom of the shielding shell 211, the protruding portion 214 protrudes from the shielding shell 211 in a direction away from the first shielding cavity 201, so that the first shielding cavity 201 is expanded inside the protruding portion 214 to form the tuning cavity 203, and the polar plate of the rf thawing system 100 is disposed in the tuning cavity 203. In addition, the protruding portion 214 serves as the tuning cavity 203 to accommodate the polar plate, and also serves to strengthen the structural strength of the shielding shell 211, so that the occurrence probability of the magnetic leakage caused by the damage of the shielding shell 211 can be reduced to a certain extent.

Referring to fig. 8, in some embodiments, the tuning inductor 107 of the tuning module 103 is disposed outside the electric control board 110, and specifically is located in the second shielding cavity 202, and the shape of the shielding cover 213 is designed according to the shapes of the electric control board module 150 and the tuning inductor 107, for example, the electric control board module 150 is substantially rectangular and boxed, the tuning inductor 107 is an air-core winding inductor, and is cylindrical as a whole, and then the shielding cover 213 includes two rectangular portions for accommodating the electric control board module 150 and the tuning inductor 107, respectively.

Referring to fig. 8, in some embodiments, the radio frequency thawing device 200 is further provided with a heat dissipation assembly for dissipating heat from the electric control board 110, the heat dissipation assembly includes a fan 230 and an air guiding member 240, and since the electric control board 110 is installed in the second shielding cavity 202, an air inlet 2131 and an air outlet 2132 are provided on the shielding cover 213 forming the second shielding cavity 202, the air inlet 2131 and the air outlet 2132 are both communicated with the second shielding cavity 202, the fan 230 is installed on the shielding cover 213 or a structural member around the radio frequency thawing device 200, and an air inlet end and an air outlet end of the fan 230 are communicated with the air inlet 2131 and the air guiding member 240 for exhausting air in the second shielding cavity 202 from the air outlet 2132 to the outside of the air guiding member 240.

When the rf thawing device 200 is installed in the refrigerating chamber or the freezing chamber of the refrigerator, since the air intake 2131 is simultaneously communicated with the refrigerating chamber or the freezing chamber, cold air of the refrigerating chamber or the freezing chamber can be introduced into the second shielding chamber 202. After entering the second shielding cavity 202, the cold air exchanges heat with the radiating fins 132, so that the radiating fins 132 cool the electric control board 110. The heat-exchanged hot air is drawn out to the air guide 240 by the blower 230 through the air outlet 2132. Referring to fig. 8, in some embodiments, the air outlet end of the air guide 240 may be connected to the air return opening 352 provided on the back plate 351 of the refrigerator, so that the hot air after heat exchange enters the refrigerating device through the air return channel of the refrigerator, and after heat exchange, the hot air is reformed into cold air, and is returned to the refrigerating chamber or the freezing chamber. In some embodiments, the air outlet end of the air guide 240 may be exposed, and the hot air may be directly discharged to the outside of the refrigerator through the air guide 240.

In a third aspect of the present application, a refrigerator 1000 is provided, referring to fig. 9, a schematic structural diagram of the refrigerator 1000 is shown. The refrigerator 1000 includes a refrigerator main body 300 and the radio frequency thawing device 200 of the above-described second embodiment, and the radio frequency thawing device 200 is provided inside the refrigerator main body 300. Wherein the refrigerator main body 300 is a basic member of the refrigerator 1000, the refrigerator main body 300 may provide a mounting basis for other at least partial components of the refrigerator 1000, and may also serve the purpose of protecting the other at least partial components of the refrigerator 1000.

In some embodiments, the refrigerator main body 300 has a freezing chamber, a refrigerating chamber 301, and a temperature changing chamber, and the rf thawing device 200 may be disposed in any one of the freezing chamber, the refrigerating chamber 301, and the temperature changing chamber. Referring to fig. 10, the rf thawing apparatus 200 is disposed in a refrigerating chamber 301 of a refrigerator 1000. The refrigerating chamber 301 of the refrigerator 1000 is provided with an air duct, the portion of the inner container 350 of the refrigerating chamber 301 of the refrigerator 1000 corresponding to the radio frequency thawing device 200 is partially recessed, the recessed portion is a part of the air duct, and when the radio frequency thawing device 200 is installed in the inner container 350, the protruding portion 214 is located in the recessed portion, so that the protruding portion 214 does not occupy the original installation space of the shielding shell 211 in the refrigerating chamber 301. In some embodiments, the protruding portion 214 is spaced from the inner container 350 to ensure that air flows between the protruding portion 214 and the inner container 350, so as to ensure that heat in the tuning cavity 203 is taken away by the air, and enhance the heat dissipation effect of the tuning cavity 203.

In some embodiments, referring to fig. 10, the refrigerator 1000 further includes a first storage box 310, a small drawer 320, a second storage box 330, and a water tank 340. The small drawer 320 is stacked with the rf thawing device 200 in a height direction and is located at one side of the refrigerator 1000 in a width direction, and the first storage box 310 is placed at the other side of the refrigerator 1000 in the width direction. Considering that the rf thawing apparatus 200 is relatively heavy, the rf thawing apparatus 200 is directly mounted to the liner 350 and is located in the bottom space of the liner 350. The second storage box 330 and the water tank 340 are located at an upper layer of the small drawer 320 and the first storage box 310, and the second storage box 330 and the water tank 340 are also arranged side by side in the width direction of the refrigerator 1000. Other details of the refrigerator 1000 are not described herein, with reference to related disclosures of the prior art.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise" indicate or positional relationships are based on the positional relationships shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.

In the present application, unless explicitly specified and limited otherwise, the terms "coupled," "secured," and the like are to be construed broadly, and for example, "secured" may be either permanently attached or removably attached, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In addition, descriptions such as those related to "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated in this application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An electric control board module (150), characterized by comprising:

a heat sink (130);

an electric control board (110) provided with a first circuit unit (113) and a second circuit unit (114), wherein the electric control board (110) is installed on the heat dissipation element (130);

a shield cover (120) covering the first circuit unit (113);

a glue filling box (140) provided with a containing area (141) and a through hole (142);

wherein the heat dissipation piece (130) is penetrated in the through hole (142); the second circuit unit (114) is at least partially located in the receiving area (141) and is sealed and fixed to the glue-pouring box (140) by a pouring sealant.

2. The electric control board module (150) of claim 1, characterized in that: the glue filling box (140) comprises a box bottom (143), an inner partition plate (144) and a surrounding edge (145) which surrounds the edge of the box bottom (143), the through hole (142) is formed in the box bottom (143), and the inner partition plate (144) is arranged on the edge of the through hole (142) so as to surround the surrounding edge (145) to form the containing area (141).

3. The electric control board module (150) of claim 2, characterized in that: the height of the inner partition plate (144) is lower than the surrounding edge (145) so that the electric control plate (110) is at least partially positioned in the box cavity of the glue-pouring box (140).

4. An electric control board module (150) according to any of claims 1-3, characterized in that: the electric control board (110) is integrated with the power amplification module (101), the control module (102) and the tuning module (103); at least one of the power amplifier module (101), the control module (102) and the tuning module (103) is arranged on the first circuit unit (113), and the rest is arranged on the second circuit unit (114).

5. The electric control board module (150) of claim 4, characterized in that: the power amplifier module (101) and the control module (102) are arranged on the first circuit unit (113), and the tuning module (103) is arranged on the second circuit unit (114).

6. The electronic control board module (150) of claim 5, wherein the heat sink (130), the shielding cover (120), the glue-pouring box (140), and the electronic control board (110) are sealingly connected by the integrally potted glue, and the glue-pouring wraps the tuning module (103).

7. A radio frequency thawing device (200), characterized in that it comprises:

a housing assembly (210) having a first shielded chamber (201) and a second shielded chamber (202) that are independent of each other;

a drawer assembly (220) mounted within the first shielded cavity (201) for containing food to be thawed;

the electric control board module (150) according to any one of claims 1-6, wherein the electric control board module (150) is disposed in the second shielding cavity, and at least one of the power amplifier module (101), the control module (102), the power supply module (104) and the tuning module (103) is integrated on the electric control board (110);

the polar plate is arranged in the first shielding cavity (201) and is electrically connected with the electric control plate (110) and used for radiating radio-frequency energy into the drawer assembly (220) so as to defrost the food to be defrosted.

8. The radio frequency thawing device (200) as claimed in claim 7, characterized in that: under the condition that the electric control board (110) is integrated with the power amplification module (101), the control module (102) and the tuning module (103), the radio frequency thawing device further comprises a power module (104), and the power module (104) is electrically connected with the power amplification module (101) and the control module (102) and is used for supplying power to the power amplification module (101) and the control module (102).

9. The radio frequency thawing device (200) as claimed in claim 7, characterized in that: the box body assembly (210) comprises a shielding shell (211), a shielding baffle plate (212) and a shielding cover (213), wherein the shielding baffle plate (212) is connected with one end of the shielding shell (211) to form a first shielding cavity (201), and the shielding cover (213) is connected with the shielding baffle plate (212) to form a second shielding cavity (202);

the electric control board module (150) is connected to the shielding cover (213) or the shielding partition plate (212).

10. A refrigerator (1000), characterized by: comprising a refrigerator body (300) and a radio frequency thawing device (200) as claimed in any of claims 7-9, said radio frequency thawing device (200) being provided inside said refrigerator body (300).