CN220547740U

CN220547740U - Solder ball repair equipment for BGA element

Info

Publication number: CN220547740U
Application number: CN202322152158.8U
Authority: CN
Inventors: 刘可心
Original assignee: Inspur Power Commercial Systems Co Ltd
Current assignee: Inspur Power Commercial Systems Co Ltd
Priority date: 2023-08-10
Filing date: 2023-08-10
Publication date: 2024-03-01
Anticipated expiration: 2033-08-10

Abstract

The utility model relates to the field of BGA element products, and discloses solder ball repairing equipment of a BGA element, which comprises the following components: the repairing platform is provided with three repairing areas, namely a solder paste printing area, a solder ball planting area and a heating curing area, which are sequentially arranged; heating and solidifying the printing plate and the ball-planting plate; wherein, the printing plate is provided with printing meshes, the ball planting plate is provided with ball planting holes, and the heating curing plate is provided with heating through holes; a heating device arranged right above the heating curing zone; and the BGA carrier is used for carrying the BGA component to be repaired and sequentially moving through the three repair areas. The utility model discloses a need not to dispose high-cost equipment such as manipulator among this application, can realize that the ball of soldering tin is restoreed, and be the printing plate of assembly line overall arrangement, plant ball board and heating curing board on repairing the platform, promote the utilization ratio of three platelike structure and realize the high efficiency restoration of soldering tin ball to promote the repair efficiency of BGA component on low-cost basis.

Description

Solder ball repair equipment for BGA element

Technical Field

The utility model relates to the field of BGA element products, in particular to solder ball pin repair equipment of a BGA element.

Background

With miniaturization of electronic products, the elements of common packages have far failed to meet the requirements of product design, so BGA elements, i.e., solder ball array package elements, are widely implemented in products, in which array solder balls are fabricated on the bottom of a package substrate as I/O terminals of a circuit to interconnect with a PCB.

However, in the SMD process, some BGA components are inevitably soldered poorly for various reasons, so that the BGA components of the portion cannot be used, the removed BGA components have no functional abnormality, and only the solder balls at the lower ends of the BGA components cannot be soldered secondarily; therefore, directly discarding the BGA component of this portion causes waste of material, and to realize secondary use of the BGA component with damaged solder balls, it is necessary to replace the BGA component with solder balls.

The existing repair mode of the BGA element can adopt two modes of automatic repair of a machine or manual repair, but the automatic repair of the machine can cause relatively higher repair cost, and the manual repair efficiency is relatively lower, so that the repair of the BGA element and the ball implantation are difficult to a certain extent.

Disclosure of Invention

The utility model aims to provide solder ball repairing equipment for a BGA element, which realizes the solder ball Gao Xiu rate ball-planting repairing of the BGA element on the basis of low cost.

In order to solve the above technical problems, the present utility model provides a solder ball repairing apparatus for BGA devices, comprising:

the repairing platform is provided with three repairing areas, namely a solder paste printing area, a solder ball planting area and a heating curing area, which are sequentially arranged;

the solder ball mounting device comprises a repair platform, a printing plate, a ball mounting plate and a heating curing plate, wherein the repair platform is arranged on the repair platform, the printing plate can move to the solder paste printing area, the ball mounting plate can move to the solder ball mounting area, and the heating curing plate can move to the heating curing area; the printing plate is provided with printing meshes, the ball planting plate is provided with ball planting holes, and the heating curing plate is provided with heating through holes;

a heating device disposed directly above the heat curing zone;

the BGA bearing piece is used for bearing the BGA element to be repaired and sequentially moves through the three repair areas;

the printing plate is used for being pressed on the BGA bearing piece which moves to the solder paste printing area so as to print solder paste on the BGA component to be repaired on the BGA bearing piece;

the ball-implanting plate is used for being pressed on the BGA bearing piece which moves to the solder ball-implanting area so as to implant balls on the BGA element to be repaired;

the heat curing plate is used for being pressed on the BGA bearing piece moving to the heat curing area so as to heat and cure the ball mounting area on the BGA element to be repaired.

Optionally, each repair area on the repair platform is provided with at least two movable positioning inserts; the BGA bearing piece is provided with a positioning jack matched with the positioning plug-in;

the positioning insert is movably inserted into or withdrawn from the positioning receptacle when the BGA carrier moves to the three repair areas, respectively.

Optionally, the positioning insert is a vertical rod that can protrude from or retract below the surface of the repair platform; and the positioning plug-in is connected with an operating piece through a linkage structure, and the operating piece is used for controlling the protrusion and contraction of the positioning plug-in.

Optionally, the printing plate, the ball-planting plate and the heat-curing plate are all connected with the repairing platform through hinge components.

Optionally, a locking spring is disposed within the hinge member.

Optionally, the printing plate, the ball mounting plate and the heat curing plate are all provided with a fastening component for fastening the printing plate, the ball mounting plate and the heat curing plate to the BGA carrier.

Optionally, the printing plate comprises a first annular frame, and a printing steel mesh with printing meshes detachably arranged in an inner ring of the first annular frame;

the ball planting plate comprises a second annular frame and a ball planting steel plate which is detachably arranged in the inner ring of the second annular frame and provided with ball planting holes;

the BGA bearing piece comprises a bearing plate and a limit clamping groove piece detachably connected with the bearing plate; and the limiting clamping groove piece is provided with a clamping groove for accommodating the BGA component to be repaired.

Optionally, a ball implanting groove for bearing solder balls is arranged on the surface of the ball implanting steel plate; the bottom of the ball planting groove is provided with the ball planting hole penetrating through the bottom of the ball planting groove; the depth of each ball-planting hole is not smaller than the radius of the soldering tin ball; the ball planting steel plate is also provided with a cover plate which can seal or open the notch of the ball planting groove; the surface of the ball-planting steel plate, on which the ball-planting groove is arranged, is the surface, which is away from the BGA element to be repaired when the ball-planting steel plate is attached to the BGA element to be repaired.

Optionally, the heating device is a heating gun; the air outlet of the heating gun is the same as the heating through hole on the heating curing plate in size and shape.

Optionally, the repairing platform is further provided with a sliding track sequentially penetrating through the three repairing areas; the BGA bearing piece is arranged on the sliding rail and can slide along the sliding rail;

the sliding track is an annular track; and at least two groups of printing plates, ball planting plates and heating curing plates are arranged along the extending direction of the annular track.

The utility model provides solder ball repair equipment for BGA components, which comprises: the repairing platform is provided with three repairing areas, namely a solder paste printing area, a solder ball planting area and a heating curing area, which are sequentially arranged; the device comprises a printing plate which is arranged on a repairing platform and can move to a solder paste printing area, a ball planting plate which can move to a solder ball planting area and a heating curing plate which can move to a heating curing area; wherein, the printing plate is provided with printing meshes, the ball planting plate is provided with ball planting holes, and the heating curing plate is provided with heating through holes; a heating device arranged right above the heating curing zone; the BGA bearing piece is used for bearing the BGA component to be repaired and sequentially moves through the three repair areas; the printing plate is used for pressing on the BGA bearing piece moving to the solder paste printing area so as to print the solder paste on the BGA component to be repaired on the BGA bearing piece; the ball-implanting plate is used for pressing on the BGA bearing piece moving to the solder ball-implanting area so as to implant balls on the BGA component to be repaired; the heat curing plate is used for pressing on the BGA bearing piece moving to the heat curing area so as to heat and cure the ball-planting area on the BGA element to be repaired.

In the method, three different repair areas of a solder paste printing area, a solder ball implanting area and a heating curing area are respectively arranged on a repair platform, and a printing plate, a ball implanting plate and a heating curing plate are respectively arranged, so that when a BGA bearing piece drives a BGA element to be repaired to sequentially move to the three repair areas, three different repair processes of solder paste printing, solder ball implanting and heating curing of the BGA element can be respectively realized, and the ball implanting repair of the solder balls on the BGA element to be repaired can be completed; therefore, in the method, the three plate-shaped structures for realizing the ball placement of the solder balls of the BGA elements to be repaired are only arranged on the repair platform, so that the ball placement repair of the solder balls can be realized, the whole device is simple in structure and low in cost, and compared with the manual ball placement, the ball placement efficiency of the solder balls on each element to be repaired can be improved;

on this basis, set gradually the solder paste printing district, solder ball plants ball district and three different repair district in heating solidification district for solder paste printing, solder ball plants ball and three different repair processes of heating solidification can be gone on in different district respectively, make in solder paste printing district, solder ball plants ball district and heating solidification district form a assembly line, can carry out the repair of three to-be-repaired BGA component simultaneously in three different district in solder paste printing district, solder ball planting ball district and heating solidification district, thereby improve the utilization ratio of printing plate, planting ball board and heating solidification board, also promote the repair efficiency of to-be-repaired BGA component to a certain extent.

In summary, the solder ball repairing device for the BGA component provided by the application can realize ball implantation repairing of the solder ball without configuring high-cost devices such as a manipulator, and the printed board, the ball implantation board and the heating curing board which are arranged on the repairing platform in a production line manner, so that the utilization rate of three plate-shaped structures is improved, the high-efficiency repairing of the solder ball is realized, and the repairing efficiency of the BGA component is improved on the basis of low cost.

Drawings

For a clearer description of embodiments of the utility model or of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from them without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a solder ball repairing apparatus for a BGA device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a BGA carrier according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a ball-implanting plate according to an embodiment of the present application.

Detailed Description

In most factories that use BGA components to produce electronic products, the BGA components are essentially obtained by purchasing, i.e., the enterprises that use the BGA components often do not have the ability to produce BGA components. In the process of using the BGA device, solder balls on the BGA device inevitably have poor soldering, and the BGA device with poor soldering is directly discarded, which obviously leads to increased production cost of electronic products.

For this reason, it is necessary to repair the solder balls on the BGA device, and the original damaged solder balls are generally removed, and the solder balls are replaced. The current common equipments for realizing solder ball placement on BGA devices are mostly equipments with high cost components such as manipulators used by manufacturers for producing BGA devices, and are suitable for mass production of BGA devices. However, for enterprises using BGA components, the repair yield of the BGA components is far from the scale of mass production, and the adoption of the equipment can certainly increase the repair cost of solder balls on the BGA components; moreover, the existing ball placement device for BGA devices and the device for preparing other component structures on BGA devices are often integrated, and are not suitable for enterprises that only need to place balls on solder balls of BGA devices. However, with manual repair of BGA components, each solder ball needs to be repaired one by one, which makes the repair efficiency of BGA components too low.

Therefore, the application provides the solder ball repairing equipment for the BGA element, which can ensure the repairing efficiency of the solder balls on the BGA element on the basis of low cost.

In order to better understand the aspects of the present utility model, the present utility model will be described in further detail with reference to the accompanying drawings and detailed description. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic structural diagram of a solder ball repairing apparatus for a BGA component according to an embodiment of the present application; fig. 2 is a schematic structural diagram of a BGA carrier according to an embodiment of the present application; fig. 3 is a schematic structural diagram of a ball-implanting plate according to an embodiment of the present application.

In a specific embodiment of the present application, the solder ball repair apparatus of a BGA component may include:

the repairing platform 10 is provided with three repairing areas, namely a solder paste printing area 101, a solder ball planting area 102 and a heating curing area 103, which are sequentially arranged;

a printing plate 20 which is arranged on the repairing platform 10 and can move to a solder paste printing area 101, a ball-planting plate 30 which can move to a solder ball-planting area 102 and a heat curing plate 40 which can move to a heat curing area 103; wherein, the printing plate 20 is provided with a printing mesh 201, the ball planting plate is provided with a ball planting hole 301, and the heating curing plate 40 is provided with a heating through hole 401;

a heating device disposed directly above the heat curing zone 103;

a BGA carrier 50 for carrying the BGA component to be repaired and sequentially moving through the three repair areas;

the printing plate 20 is used for pressing on the BGA carrier 50 moving to the solder paste printing area so as to perform solder paste printing on the BGA component to be repaired on the BGA carrier 50;

the ball-implanting plate 30 is used for pressing on the BGA bearing piece 50 moving to the solder ball-implanting area so as to implant balls on the BGA component to be repaired;

the heat curing plate 40 is used for pressing on the BGA carrier 50 moved to the heat curing area so as to heat cure the ball-mounting area on the BGA element to be repaired.

It should be noted that, the solder ball placement of the BGA device can be mainly divided into three processes of solder paste printing, ball placement and heat curing. The solder paste printing is to print and set liquid solder paste at a plurality of different positions on the BGA element, the ball embedding process is to bond and set solder balls at the positions printed with the solder paste on the BGA element, the heating and curing is to cure and heat the solder paste, and then the solder balls are tightly bonded with the BGA element body through the cured solder paste.

In this embodiment, three plate-like members, namely, a printing plate 20, a ball-mounting plate 30 and a heat curing plate 40, for realizing the above three processes are provided on the repair platform; the above three plate structures can be moved to three repair areas of the solder paste printing area 101, the solder ball mounting area 102 and the heat curing area 103, respectively.

Furthermore, a BGA carrier 50 is provided which can carry the BGA component to be repaired. In the repair process of the BGA component to be repaired, the BGA component carrier 50 is first moved to the solder paste printing area 101, the printing plate 20 is also moved to the solder paste printing area 101, and the printing plate 20 is pressed on the upper surface of the BGA carrier 50, so that the area of the BGA component to be repaired on the BGA carrier 50, which is required to be ball-mounted, and the printing mesh area on the printing plate 20 are mutually attached.

Referring to fig. 1, a middle area of a printing plate 20 is provided with printing meshes 201 arranged in an array; when the printed board 20 is attached to the BGA device to be repaired, the liquid solder paste is repeatedly brushed on the solder paste printing screen by using a brush on the side of the printed board 20 away from the BGA device to be repaired, so that the solder paste can be printed on a specific plurality of position points on the BGA device to be repaired through the printing mesh 201, and the specific plurality of position points are the position points where the solder balls need to be arranged.

Considering that the types of the BGA components to be repaired can exist in multiple types, the number and arrangement modes of solder balls corresponding to each type of BGA components to be repaired can be different; to this end, in an alternative embodiment of the present application, the printing plate 20 may comprise a first annular frame, and a printing steel mesh with printing mesh 201 detachably arranged in an inner ring of the first annular frame.

Because the printing steel mesh on the printing plate 20 can be detachably connected with the first annular frame, the printing steel mesh can be replaced with a steel mesh structure with different mesh arrangement at will so as to be suitable for different types of BGA components to be repaired. But whatever type of BGA component is being repaired, it should be ensured that the aperture size of each printed mesh should be slightly smaller than the diameter of the solder ball.

After printing of the solder paste on the BGA device to be repaired is achieved, the printing plate 20 can be removed from the BGA carrier 50, and the BGA device to be repaired is driven to move to the solder ball mounting region 102 by the BGA carrier 50; at this time, the ball-mounting board 30 may be moved to the solder ball-mounting area 102 and pressed onto the BGA carrier 50, so that the area of the ball-mounting hole 301 on the ball-mounting board 30 is attached to the BGA device to be repaired.

Since the location points of the printed solder paste and the location points of the ball placement on the BGA component to be repaired are the same, in order to achieve repair of different types of BGA components, in an alternative embodiment of the present application, the ball placement plate 30 may include a second annular frame 31, and a ball placement steel plate 32 detachably disposed in an inner ring of the second annular frame 31 and having ball placement holes.

Further, a ball placement groove 321 for carrying solder balls can be arranged on the surface of the ball placement steel plate 32; the bottom of the ball-planting groove 321 is provided with a ball-planting hole 301 penetrating through the bottom of the ball-planting groove 321; the depth of each ball-planting hole 301 is not smaller than the radius of the solder ball; the ball-planting steel plate 32 is also provided with a cover plate 33 which can seal or open the notch of the ball-planting groove 321; the surface of the ball-implanting steel plate 32 provided with the ball-implanting groove 321 is the surface facing away from the BGA element to be repaired when the ball-implanting steel plate 32 is attached to the BGA element to be repaired.

In the process of soldering tin ball placement, a plurality of soldering tin balls can be placed in the ball placement groove 321, and the soldering tin balls are repeatedly stirred to the area where the ball placement holes 301 are located through the scraping plate, so that the soldering tin balls can quickly fall into the ball placement holes 301 and are mutually adhered with solder paste on the BGA element to be repaired. In order to ensure that solder balls in the ball-planting holes 301 cannot easily roll out of the ball-planting holes, the depth of each ball-planting hole 301 can be set to be not smaller than the diameter of a single solder ball; the aperture size of each ball-mounting hole 301 should be slightly larger than the diameter of a single solder ball.

In addition, in the ball placement process of each BGA component to be repaired, a large number of solder balls are often placed in the ball placement groove 321, that is, after the ball placement process of one PGA component to be repaired is completed, a large number of solder balls remain, so that in order to avoid the solder balls rolling out of the ball placement groove 321, a cover plate 33 capable of sealing the notch of the ball placement groove 321 may be further provided, and when new solder balls need to be added into the ball placement groove 321 or the solder balls in the ball placement groove 321 need to be stirred, the cover plate 33 may be opened.

The process of printing the solder paste and implanting the solder balls can be completed by manual operation; although manual operation is adopted, obviously, for each BGA element to be repaired, the solder paste printing and the solder ball implanting of each position point are completed at one time, and each position point is not required to be repaired in sequence, so that the repair efficiency is improved to a great extent compared with the existing manual repair mode.

After the BGA device to be repaired completes the process of soldering the solder balls, the ball mounting plate 20 pressed on the BGA carrier 50 is removed, the BGA carrier 50 is moved to the thermal curing area 103, the thermal curing plate 40 is pressed on the BGA carrier 50, and the thermal through holes 401 on the thermal curing plate 40 are opposite to the area on the BGA device to be repaired where the solder balls are disposed. On the basis, a heating device right above the heating curing area 103 is adopted to heat the area in the heating through hole 401, so that the solder paste on the position where the solder paste and the solder balls are arranged on the BGA element to be repaired is cured, and therefore the repair of the solder balls of the BGA element to be repaired can be completed.

The heating device may be a heating gun disposed above the heat curing area 103, and the air outlet of the heating gun and the heating through hole 401 on the heat curing plate 40 have the same size and shape; in addition, the heating gun can also move up and down, when the heating curing plate 40 is pressed on the BGA bearing plate 50, the heating gun can be moved downwards to be attached to the heating curing plate 40, and the air outlet of the heating gun is opposite to the heating through hole 401, so that solder paste in the heating through hole 401 is heated and cured.

Based on the above discussion, in the solder ball repairing apparatus in the present application, three plate-shaped components including the printing plate 20, the ball-implanting plate 30 and the heat curing plate 40, which are required to be used in the solder ball repairing process, are arranged on the repairing platform 10, so that each BGA component to be repaired can be quickly and sequentially repaired, and components such as a mechanical arm with complex structure and high cost are not required in the whole apparatus, namely, on the basis of saving cost, the repairing efficiency is ensured.

On the basis, the solder paste printing area 101, the solder ball planting area 102 and the heating curing area 103 are further arranged in three different areas on the repairing platform, so that a working assembly line can be formed by solder paste printing, ball planting and heating curing; that is, in the repair process of the BGA components to be repaired, one BGA carrier 50 may be placed in the solder paste printing area 101, the solder ball mounting area 102 and the heat curing area 103 at the same time, so that the printing board 20, the ball mounting board 30 and the heat curing board 40 respectively complete different repair processes for different BGA components to be repaired, and after each repair BGA component completes one repair process, the BGA components can be synchronously moved to the next repair area, so that the printing board 20, the ball mounting board 30 and the heat curing board 40 are in a working state of being used at the same time, thereby greatly improving the utilization rate of the printing board 20, the ball mounting board 30 and the heat curing board 40 and also improving the repair efficiency of the BGA components to be repaired.

Further, in order to ensure that the BGA carrier 50 can move among the solder paste printing area 101, the solder ball mounting area 102 and the heat curing area 103 in sequence, a sliding track 13 penetrating through the three repairing areas in sequence may be further provided on the repairing platform 10; the BGA carrier is disposed on the slide rail 13 and is slidable along the slide rail 13.

In the embodiment shown in fig. 1, the sliding rail 13 is a linear rail, and in another alternative embodiment of the present application, the sliding rail 13 may be provided as an annular rail, and at least two sets of the printing plate 20, the ball mounting plate 30, and the heat curing plate 40 may be provided along the extending direction of the annular rail; therefore, more BGA components to be repaired can be synchronously repaired in the repair areas corresponding to the different printing plates 20, the ball mounting plates 30 and the heating curing plates 40, and the repair efficiency is further improved.

As previously mentioned, there may be a plurality of different types of BGA components to be repaired, whereby BGA carrier 50 carrying the BGA components to be repaired should also be differentiated for the different types of BGA components to be repaired. In an alternative embodiment of the present application, BGA carrier 50 may include carrier plate 51 and retaining clip groove member 525 removably coupled to carrier plate 51; the limiting clamping groove piece 52 is provided with a clamping groove 521 for accommodating the BGA component to be repaired.

The limiting clamping groove piece 52 has the main function of realizing the limiting fixation of the to-be-repaired BGA component on the BGA bearing piece through the clamping groove 521, and the size and shape of the to-be-repaired BGA components of different types can be different, and the limiting clamping groove piece 52 with the clamping grooves 521 of different sizes can be detached and replaced so as to realize the limiting fixation of the to-be-repaired BGA components of different types on the BGA bearing piece 50.

In addition, in order to ensure that the BGA component to be repaired can be precisely aligned with the printing plate 20, the ball placement plate 30 and the heat curing plate 40 in the solder paste printing area 101, the solder ball placement area 102 and the heat curing area 103 respectively in the practical application process, at least two movable positioning inserts 11 can be further arranged in all three repair areas on the repair platform 10; the BGA carrier 50 is provided with a locating socket 53 which mates with the locating insert 11.

When the BGA carrier slides to each repair area along the sliding track 13 in turn, the positioning plug 11 can be movably inserted into the positioning jack 53 so as to position the BGA carrier 50; as BGA carrier 50 moves out of each repair area along the slide track, locating insert 11 is withdrawn from locating receptacle 53.

Referring to fig. 1 and 2, the positioning insert 51 is a vertical rod that may protrude from the surface of the repair platform 10 or retract below the surface of the repair platform 10; and the positioning insert 11 is connected with an operating member 12 through a linkage structure, and the operating member 12 is used for controlling the protrusion and contraction of the positioning insert 11.

For example, when the operating member 12 is pressed downward, the positioning insert 11 is then retracted into the repair platform 10, and when the operating member 12 is pushed upward, the positioning insert 11 then protrudes above the surface of the repair platform 10.

In the embodiment shown in fig. 2, two circular positioning jacks 53 are arranged on the BGA carrier 50, and two positioning inserts 11 are arranged in three repair areas of the solder paste printing area 101, the solder ball planting area 102 and the heat curing area 103, when each positioning insert 11 protrudes out of the surface of the repair platform 10, the positioning inserts 11 can be just inserted into the positioning jacks 53 of the BGA carrier 50, so that the BGA carrier 50 can be positioned in each repair area; the BGA component to be repaired is fixed to the BGA carrier 50, so that the BGA carrier 50, i.e., the BGA component, is positioned. In addition, the positioning insert 11 needs to be provided with a telescopic structure, which mainly aims to ensure that the BGA component to be repaired can continue to slide along the sliding rail 13 to the next repair area after finishing a repair process, so as to avoid the positioning insert 11 from forming an obstruction.

Of course, in practical application, the method is not limited to this method of positioning the BGA component to be repaired, for example, a notch may be provided on an outer side surface of the BGA carrier 50, and a positioning structure capable of being inserted into the notch and being withdrawn from the notch may be provided on the repair platform 10, so that the BGA carrier 50 may be positioned in each repair area.

In addition, positioning elements may be further disposed on the printed board 20, the ball-mounting board 30 and the heat-curing board 40, and positioning holes may be disposed on the BGA carrier 50, so that the positioning elements on the printed board 20, the ball-mounting board 30 and the heat-curing board 40 are respectively inserted into the positioning holes on the BGA carrier 50, and this positioning effect may also be achieved.

As described above, the printing plate 20, the ball mounting plate 30, and the heat curing plate 40 are movably disposed on the repair platform 10; for convenience of operation, as shown in fig. 1, the printing plate 20, the ball-mounting plate 30, and the heat-curing plate 40 may be respectively provided on the repair platform 10 through the hinge parts 14; when the printing plate 20 needs to be moved to the solder paste printing area 101, the printing plate 20 is turned over to the solder paste printing area 101, and similarly, the ball-planting plate 30 can be turned over to the solder ball-planting area 102 and the heat-curing plate 40 can be turned over to the heat-curing area 103 in a turning manner.

For further convenience, a locking spring may be further disposed in each hinge member 14, so that the printing plate 20, the ball placement plate 30 and the heat curing plate 40 may automatically spring back to the original positions after the solder paste printing, the ball placement of the solder balls and the curing and heating are respectively completed, and then the three repairing areas of the solder paste printing area 101, the ball placement area 102 and the heat curing area 103 are respectively removed.

As described above, the ball-implanting groove 321 for carrying solder balls is provided on the ball-implanting steel plate 32 of the ball-implanting plate 30, and when the ball-implanting plate 30 hinged to the repairing platform is turned over and moved out to a position outside the ball-implanting area 102 for solder balls, the notch of the ball-implanting groove 321 is downward, so that the excessive solder balls can be prevented from rolling out from the ball-implanting hole 301, and the cover plate 33 of the ball-implanting steel plate 32 can prevent solder balls from rolling out from the notch.

In addition, in order to ensure that the printed board 20, the ball-mounting board 30 and the heat-curing board 40 can be fastened and connected with the BGA carrier 50 in three repair areas, the printed board 20, the ball-mounting board 30 and the heat-curing board 40 may be further provided with fastening means for fastening the printed board 20, the ball-mounting board 30 and the heat-curing board 40 with the BGA carrier, respectively.

In summary, the printing plate, the ball-implanting plate and the heat curing plate which can move to the three areas are respectively arranged on the repairing platform in the application, so that solder paste printing, ball-implanting of solder balls and heat curing of BGA elements can be respectively realized, ball-implanting repairing of solder balls can be realized, the structure is simple, the cost is low, and compared with manual ball-implanting, the ball-implanting efficiency of solder balls on each element to be repaired can be improved; and set up above-mentioned three repair area respectively on repairing the platform for form a assembly line in solder paste printing district, solder ball plant ball district and heating solidification district, can carry out the restoration of different BGA components of treating simultaneously in three different areas of solder paste printing district, solder ball plant ball district and heating solidification district, thereby improve the utilization ratio of printing plate, planting ball board and heating solidification board, also promote the restoration efficiency of treating the restoration BGA component to a certain extent.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements is inherent to. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. In addition, the parts of the above technical solutions provided in the embodiments of the present application, which are consistent with the implementation principles of the corresponding technical solutions in the prior art, are not described in detail, so that redundant descriptions are avoided.

The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present utility model and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.

Claims

1. A solder ball repair apparatus for a BGA device, comprising:

a heating device disposed directly above the heat curing zone;

2. The solder ball repair apparatus of a BGA component of claim 1, wherein each of said repair areas on said repair platform is provided with at least two movable positioning inserts; the BGA bearing piece is provided with a positioning jack matched with the positioning plug-in;

3. The solder ball repair apparatus of a BGA component of claim 2, wherein the positioning insert is a stem that can protrude from or retract below a surface of the repair platform; and the positioning plug-in is connected with an operating piece through a linkage structure, and the operating piece is used for controlling the protrusion and contraction of the positioning plug-in.

4. The solder ball repair apparatus of a BGA device of claim 1, wherein the printed board, the ball mounting board, and the heat curing board are each connected to the repair stage by a hinge member.

5. The solder ball repair device of a BGA component of claim 4, wherein a locking spring is disposed within the hinge member.

6. The solder ball repair apparatus of a BGA component of claim 5, wherein the printed board, the ball mounting board and the heat curing board are each provided with a snap-fit member for snap-fitting the printed board, the ball mounting board and the heat curing board with the BGA carrier, respectively.

7. The solder ball repair apparatus of a BGA component of claim 1, wherein the printed board includes a first annular frame, and a printed steel mesh with a printed mesh detachably disposed in an inner ring of the first annular frame;

8. The solder ball repair apparatus of BGA components of claim 7, wherein ball placement grooves for carrying solder balls are provided on the surface of the ball placement steel plate; the bottom of the ball planting groove is provided with the ball planting hole penetrating through the bottom of the ball planting groove; the depth of each ball-planting hole is not smaller than the radius of the soldering tin ball; the ball planting steel plate is also provided with a cover plate which can seal or open the notch of the ball planting groove; the surface of the ball-planting steel plate, on which the ball-planting groove is arranged, is the surface, which is away from the BGA element to be repaired when the ball-planting steel plate is attached to the BGA element to be repaired.

9. The solder ball repair apparatus of a BGA component of claim 1, wherein the heating means is a heat gun; the air outlet of the heating gun is the same as the heating through hole on the heating curing plate in size and shape.

10. The solder ball repair apparatus of a BGA device of claim 1, wherein the repair platform is further provided with a sliding rail penetrating through three of the repair areas in sequence; the BGA bearing piece is arranged on the sliding rail and can slide along the sliding rail;