CN220545330U - Heat conduction boss structure of radiator - Google Patents
Heat conduction boss structure of radiator Download PDFInfo
- Publication number
- CN220545330U CN220545330U CN202321060308.6U CN202321060308U CN220545330U CN 220545330 U CN220545330 U CN 220545330U CN 202321060308 U CN202321060308 U CN 202321060308U CN 220545330 U CN220545330 U CN 220545330U
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- China
- Prior art keywords
- radiator
- heat conduction
- heat
- conduction boss
- boss
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- 239000000463 material Substances 0.000 abstract description 13
- 238000010438 heat treatment Methods 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 239000004519 grease Substances 0.000 abstract description 7
- 239000012782 phase change material Substances 0.000 abstract description 7
- 229920001296 polysiloxane Polymers 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the technical field of electronic products of circuits and modules, in particular to a heat conduction boss structure of a radiator, which comprises a radiator, wherein a heat pipe is arranged in the radiator, one side of the radiator is provided with a heat conduction boss, the heat pipe is positioned between the heat conduction boss and the radiator, four corners of the heat conduction boss are respectively provided with one end of a spring, the other end of the spring is arranged on the radiator, and four corners of the heat conduction boss are respectively movably sleeved with a screw which is fixed on the radiator. When the heat dissipation design of the high-power-consumption heating device uses the heat conduction silicone grease and the phase change material as the interface filling material, the reliable contact and pressure can be ensured no matter the thickness tolerance of the heat dissipation design, and the heat dissipation effect is achieved.
Description
Technical Field
The utility model relates to the technical field of electronic products such as circuits and modules, in particular to a heat conduction boss structure of a radiator.
Background
In the thermal design of electronic products, the interface material filling needs to be added between the heating chip and the radiator, and the common heat conduction interface material comprises heat conduction potting gel, a heat conduction silica gel pad, heat conduction silicone grease, a phase change material and the like, so that the heat conduction effect and the use environment of various materials are different. In the design, the common interface filling materials are a heat-conducting silica gel pad, heat-conducting silicone grease and a desired material, wherein the heat-conducting silica gel pad has relatively low heat conductivity coefficient, but has relatively thick thickness (conventional 0.25-5 mm), high elastic deformation rate, relatively similar heat-conducting silicone grease and phase-change material, relatively high heat conductivity coefficient, relatively thin thickness (conventional 0.01-0.5 mm) and almost no elastic deformation amount. Therefore, in the design process, the heat-conducting silica gel pad is mostly applied to the heating chip with lower power consumption as an interface filling material, and the heat-conducting silica gel pad and the phase-change material are mostly applied to the high-power-consumption heating chip as the interface filling material.
Disadvantages of the prior art:
when the power consumption of the heating chip is higher, the prior art mainly has the following problems:
(1) When the heat-conducting silica gel pad is used as an interface filling material, the heat conduction coefficient is relatively low, the heat conduction effect is relatively poor, and when the chassis environment is relatively fixed and the power consumption of the heating chip is high, the heat dissipation requirement of a system may not be met.
(2) When the heat conduction silicone grease and the phase change material are used as interface filling materials, the thickness is thinner, and the elastic deformation is almost avoided, so that the requirements on the machining precision of the heat conduction cold plate machine and the thickness tolerance after the welding of the chips are higher, the machining precision requirement can be met by optimizing the machining process, but the thickness tolerance difference of different chips after the welding is more, and for the chips with larger thickness tolerance, the traditional design mode can not ensure the reliable contact between the heating chip and the radiator.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a heat conduction boss structure of a radiator.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a radiator heat conduction boss structure, includes the radiator, install the heat pipe in the radiator, and the heat conduction boss is installed to one side of radiator, the heat pipe is located between heat conduction boss and the radiator, the one end of spring is all installed to the four corners position of heat conduction boss, and the other end of spring is installed on the radiator, the equal activity in four corners position of heat conduction boss has cup jointed the screw, and the screw fixation is on the radiator.
Preferably, the radiator is provided with a groove, and the heat conduction boss is arranged in the groove.
Preferably, through holes are formed in four corners of the heat conduction boss, and the screws penetrate through the through holes.
Preferably, the spring is sleeved on the screw.
Preferably, the heat pipe is welded with the radiator and the heat conduction boss in sequence.
According to the heat conduction boss structure of the radiator, the heat conduction boss of the radiator can freely move in a certain height range and keep certain pressure by utilizing the combination and assembly of the spring and the screw and the scheme of welding the heat pipe, so that the problem that when a high-power-consumption heating device is used as an interface filling material, the heat conduction silicone grease and the phase change material are used as interface filling materials, the poor contact between the device and the heat conduction boss is caused by the fact that the thickness tolerance of the device is large, or the heat dissipation effect is influenced by insufficient pressure is solved greatly.
When the heat dissipation design of the high-power-consumption heating device uses the heat conduction silicone grease and the phase change material as the interface filling material, the reliable contact and pressure can be ensured no matter the thickness tolerance of the heat dissipation design, and the heat dissipation effect is achieved.
Drawings
Fig. 1 is a schematic structural diagram of a heat conduction boss structure of a heat radiator according to the present utility model;
fig. 2 is a schematic diagram of a heat pipe position structure of a heat conduction boss structure of a heat sink according to the present utility model;
fig. 3 is a schematic diagram of a spring and screw position structure of a heat conduction boss structure of a heat sink according to the present utility model.
In the figure: 1 radiator, 2 heat pipe, 3 heat conduction boss, 4 screw, 5 spring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-3, a heat conduction boss structure of a radiator comprises a radiator 1, wherein a heat pipe 2 is installed in the radiator 1, a heat conduction boss 3 is installed on one side of the radiator 1, the heat pipe 2 is located between the heat conduction boss 3 and the radiator 1, one end of a spring 5 is installed at four corners of the heat conduction boss 3, the other end of the spring 5 is installed on the radiator 1, screws 4 are movably sleeved at four corners of the heat conduction boss 3, and the screws 4 are fixed on the radiator 1.
In the utility model, a groove is formed on a radiator 1, and a heat conduction boss 3 is arranged in the groove.
In the utility model, through holes are formed at four corners of the heat conduction boss 3, and the screws 4 penetrate through the through holes.
In the utility model, a spring 5 is sleeved on a screw 4.
In the utility model, a heat pipe 2 is welded with a radiator 1 and a heat conduction boss 3 in sequence.
In the utility model, the grooves are designed at the corresponding positions of the heat conduction bosses on the radiator, the depth of the grooves is required to ensure that the clearance value between the bottommost part of the heat conduction bosses and the radiator after the heat conduction bosses are installed in place is more than 1.3mm (the clearance value is properly adjusted according to the thickness tolerance range of the chip), and a certain movable space of the heat conduction bosses is ensured. Spring supports are used between the four corners of the heat conduction boss and the radiator, the limit is carried out by using screws, and after all parts are assembled in place, the heat pipe is welded with the radiator and the heat conduction boss in sequence;
by utilizing the elasticity of the spring, the thickness of the chip is within the tolerance range, the heating chip and the heat conduction boss can always keep reliable contact and meet the pressure of heat dissipation requirements, and the heat of the heating chip can be ensured to be conducted into the radiator and even the system environment along a designed passage.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (5)
1. The utility model provides a radiator heat conduction boss structure, includes radiator (1), its characterized in that, install heat pipe (2) in radiator (1), and heat conduction boss (3) are installed to one side of radiator (1), and heat pipe (2) are located between heat conduction boss (3) and radiator (1), the one end of spring (5) is all installed in the four corners position of heat conduction boss (3), and the other end of spring (5) is installed on radiator (1), screw (4) have all been cup jointed in the four corners position of heat conduction boss (3) activity, and screw (4) are fixed on radiator (1).
2. The heat conduction boss structure of the radiator according to claim 1, wherein the radiator (1) is provided with a groove, and the heat conduction boss (3) is installed in the groove.
3. The heat conduction boss structure of the radiator according to claim 1, wherein through holes are formed in four corners of the heat conduction boss (3), and screws (4) penetrate through the through holes.
4. A heat-conducting boss structure of a radiator according to claim 1, characterized in that the spring (5) is sleeved on the screw (4).
5. A heat conducting boss structure of a radiator according to claim 1, characterized in that the heat pipe (2) is welded with the radiator (1) and the heat conducting boss (3) in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321060308.6U CN220545330U (en) | 2023-05-06 | 2023-05-06 | Heat conduction boss structure of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321060308.6U CN220545330U (en) | 2023-05-06 | 2023-05-06 | Heat conduction boss structure of radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220545330U true CN220545330U (en) | 2024-02-27 |
Family
ID=89968234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321060308.6U Active CN220545330U (en) | 2023-05-06 | 2023-05-06 | Heat conduction boss structure of radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220545330U (en) |
-
2023
- 2023-05-06 CN CN202321060308.6U patent/CN220545330U/en active Active
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| GR01 | Patent grant |