CN211240582U - Linear voltage reduction module - Google Patents
Linear voltage reduction module Download PDFInfo
- Publication number
- CN211240582U CN211240582U CN201922005423.3U CN201922005423U CN211240582U CN 211240582 U CN211240582 U CN 211240582U CN 201922005423 U CN201922005423 U CN 201922005423U CN 211240582 U CN211240582 U CN 211240582U
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- heat dissipation
- dissipation plate
- heat
- heating panel
- circuit board
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Abstract
The utility model discloses a linear voltage reduction module, which comprises a circuit board body, components and parts and heat abstractor generate heat, heat abstractor is including the heating panel and two fixing bases that are located circuit board body top, the inboard in opposite directions of two fixing bases is equipped with the recess respectively, the heating panel is located between two fixing bases, the both sides of heating panel extend to the recess of two fixing bases respectively, the recess is including the support bar that is located the heating panel below and the blend stop that is located the heating panel top, be connected with the guide bar along vertical running through the heating panel between support bar and the blend stop, the cover is equipped with the compression spring who is located between heating panel and the support bar on the guide bar, be connected with the screw on the blend stop, the lower extreme of screw supports the top surface in the heating panel. The utility model relates to a linear voltage reduction module, its is rational in infrastructure to through setting up heat abstractor, can effectually dispel the heat to the components and parts that generate heat on the circuit board body.
Description
Technical Field
The utility model relates to a linear voltage reduction module.
Background
In a circuit system, the voltage reduction module control circuit has wide application and can provide good protection effect for the circuit. In the actual use, can dispel the heat to the components and parts on the module control circuit that steps down through heat abstractor, however, traditional heat abstractor radiating effect is relatively poor, consequently, need design a heat abstractor that the radiating effect is good to dispel the heat to the components and parts on the circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a linear voltage reduction module, its is rational in infrastructure to through setting up heat abstractor, can effectually dispel the heat to the components and parts that generate heat on the circuit board body.
In order to achieve the above object, the present invention provides a linear voltage reduction module, which comprises a circuit board body and a heating element disposed on the top surface of the circuit board body; also comprises a heat dissipation device, the heat dissipation device comprises a heat dissipation plate and two fixed seats, the heat dissipation plate is positioned above the circuit board body, the two fixed seats are respectively and fixedly connected with the circuit board body, the opposite inner sides of the two fixed seats are respectively provided with a groove, the heat dissipation plate is positioned between the two fixed seats, the two sides of the heat dissipation plate extend into the grooves of the two fixing seats respectively, the grooves comprise supporting strips positioned below the heat dissipation plate and barrier strips positioned above the heat dissipation plate, a guide rod which vertically penetrates through the heat dissipation plate is connected between the supporting strip and the blocking strip, the heat dissipation plate is provided with a sliding hole for the guide rod to penetrate through, the guide rod is sleeved with a compression spring positioned between the heat dissipation plate and the supporting bar, the barrier bar is provided with a vertical threaded hole, the vertical threaded hole is connected with a screw, the lower end of the screw abuts against the top surface of the heat dissipation plate, and a heat conduction base plate attached to the heating element is arranged on the bottom surface of the heat dissipation plate.
Preferably, the lower end of the screw is of a spherical crown structure, and the top surface of the heat dissipation plate is provided with a spherical crown groove corresponding to the lower end of the screw.
Preferably, the top surface of the heat dissipation block is provided with a plurality of heat dissipation fins.
Preferably, the heat conduction base plate is a silica gel base plate.
The utility model has the advantages and the beneficial effects that: the utility model provides a linear voltage reduction module, its is rational in infrastructure to through setting up heat abstractor, can effectually dispel the heat to the components and parts that generate heat on the circuit board body. During the use, twist the screw on two fixing bases simultaneously, drive the heat conduction backing plate on heating panel and the heating panel by the screw and remove to the components and parts direction that generates heat, when heat conduction backing plate and the components and parts that generate heat laminating, stop to twist and move the screw, the heat accessible heat conduction backing plate and the heating panel transmission that the components and parts that generate heat produced are gone out to make the components and parts that generate heat cooling. In addition, because the heating panel can be at vertical removal, consequently the height of accessible regulation heating panel realizes dispelling the heat to the components and parts that generate heat of different specifications to heat abstractor's practicality has been improved.
Drawings
Fig. 1 is a schematic diagram of the present invention.
Detailed Description
The following description will further describe embodiments of the present invention with reference to the accompanying drawings and examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
The utility model discloses the technical scheme who specifically implements is:
as shown in fig. 1, a linear voltage-reducing module includes a circuit board body 1, and a heating element 2 disposed on a top surface of the circuit board body 1; the heat dissipation device comprises a heat dissipation plate 3 and two fixing seats 4, wherein the heat dissipation plate 3 and the two fixing seats 4 are positioned above a circuit board body 1, the two fixing seats 4 are respectively fixedly connected with the circuit board body 1, the opposite inner sides of the two fixing seats 4 are respectively provided with a groove, the heat dissipation plate 3 is positioned between the two fixing seats 4, two sides of the heat dissipation plate 3 respectively extend into the grooves of the two fixing seats 4, the grooves comprise a supporting bar 5 positioned below the heat dissipation plate 3 and a blocking strip 6 positioned above the heat dissipation plate 3, a guide rod 7 vertically penetrating through the heat dissipation plate 3 is connected between the supporting bar 5 and the blocking strip 6, the heat dissipation plate 3 is provided with a sliding hole for the guide rod 7 to penetrate through, the guide rod 7 is sleeved with a compression spring 8 positioned between the heat dissipation plate 3 and the supporting bar 5, the blocking strip 6 is, the lower end of the screw 9 is abutted against the top surface of the heat dissipation plate 3, and the bottom surface of the heat dissipation plate 3 is provided with a heat conduction base plate 10 attached to the heating element 2.
The lower end of the screw 9 is in a spherical crown structure, and the top surface of the heat dissipation plate 3 is provided with a spherical crown groove corresponding to the lower end of the screw 9.
The top surface of the radiating block 3 is provided with a plurality of radiating fins 11.
The heat conductive pad 10 is a silica gel pad.
The utility model has the advantages and the beneficial effects that: the utility model provides a linear voltage reduction module, its is rational in infrastructure to through setting up heat abstractor, can effectually dispel the heat to the heating element and part 2 on the circuit board body 1. During the use, twist simultaneously and move screw 9 on two fixing bases 4, drive heat-conducting backing plate 10 on heating panel 3 and the heating panel 3 by screw 9 and remove to the 2 directions of heating element, when heat-conducting backing plate 10 and 2 laminating of heating element, stop to twist and move screw 9, heat accessible heat-conducting backing plate 10 and the 3 transmissions of heating panel that heating element 2 produced to make heating element 2 cool down. In addition, because the heating panel 3 can be in vertical removal, consequently the height of accessible regulation heating panel 3 realizes dispelling the heat to the heating element and device 2 of different specifications to heat abstractor's practicality has been improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the technical principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (4)
1. A linear voltage-reducing module comprises a circuit board body and a heating element arranged on the top surface of the circuit board body, and is characterized by further comprising a heat dissipation device, wherein the heat dissipation device comprises a heat dissipation plate and two fixing seats, the heat dissipation plate and the two fixing seats are positioned above the circuit board body, the two fixing seats are respectively and fixedly connected with the circuit board body, the opposite inner sides of the two fixing seats are respectively provided with a groove, the heat dissipation plate is positioned between the two fixing seats, two sides of the heat dissipation plate respectively extend into the grooves of the two fixing seats, the grooves comprise a supporting bar positioned below the heat dissipation plate and a blocking bar positioned above the heat dissipation plate, a guide bar which vertically penetrates through the heat dissipation plate is connected between the supporting bar and the blocking bar, the heat dissipation plate is provided with a sliding hole for the guide bar to penetrate through, a compression spring positioned, the vertical threaded hole is connected with a screw, the lower end of the screw abuts against the top surface of the heat dissipation plate, and a heat conduction base plate attached to the heating element is arranged on the bottom surface of the heat dissipation plate.
2. The linear voltage reduction module of claim 1, wherein the lower end of the screw is in a spherical crown shape, and the top surface of the heat dissipation plate is provided with a spherical crown groove corresponding to the lower end of the screw.
3. The linear voltage reduction module of claim 2, wherein the top surface of the heat dissipation plate is provided with a plurality of heat dissipation fins.
4. The linear voltage reduction module of claim 3, wherein the thermally conductive pad is a silicone pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922005423.3U CN211240582U (en) | 2019-11-20 | 2019-11-20 | Linear voltage reduction module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922005423.3U CN211240582U (en) | 2019-11-20 | 2019-11-20 | Linear voltage reduction module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211240582U true CN211240582U (en) | 2020-08-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922005423.3U Active CN211240582U (en) | 2019-11-20 | 2019-11-20 | Linear voltage reduction module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211240582U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113950223A (en) * | 2021-09-17 | 2022-01-18 | 杭州电子科技大学 | Heat dissipation end cover under airtight space |
-
2019
- 2019-11-20 CN CN201922005423.3U patent/CN211240582U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113950223A (en) * | 2021-09-17 | 2022-01-18 | 杭州电子科技大学 | Heat dissipation end cover under airtight space |
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