CN210721340U - High-efficient heat dissipation frame of notebook - Google Patents
High-efficient heat dissipation frame of notebook Download PDFInfo
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- CN210721340U CN210721340U CN201922298282.9U CN201922298282U CN210721340U CN 210721340 U CN210721340 U CN 210721340U CN 201922298282 U CN201922298282 U CN 201922298282U CN 210721340 U CN210721340 U CN 210721340U
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- Prior art keywords
- heat dissipation
- backup pad
- water tank
- notebook
- dissipation water
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Abstract
The utility model discloses a high-efficient heat dissipation frame of notebook computer belongs to the computer technology field, including first backup pad, the top of first backup pad is provided with the second backup pad, and the lower surface of second backup pad is provided with the safety cover, the lower surface both ends of second backup pad are provided with stop screw, and stop screw's bottom threaded connection has a stop sleeve, and the upper surface both ends of first backup pad are provided with the spacing bearing corresponding with the stop sleeve, and the below of second backup pad is provided with heat dissipation mechanism, and heat dissipation mechanism includes the heat dissipation water tank, and the top of heat dissipation water tank is provided with the installation foot corresponding with the second backup pad, and the below of heat dissipation water tank is provided with the heating panel; the utility model discloses simple structure, convenient to use has good heat dissipation function, can prevent effectively that the notebook from influencing its normal operating because the radiating effect is relatively poor to promote the user and experience the use of heat dissipation frame.
Description
Technical Field
The utility model belongs to the technical field of the computer, concretely relates to high-efficient heat dissipation frame of notebook.
Background
Chinese patent (publication No. CN 205405401U) discloses a high-efficient heat dissipation rack for notebook computer, including the notebook computer place the seat, the support frame, the rubber pad, radiator fan and heat dissipation water tank, the tank lid sets up in the centre of water tank topshell, water tank fixed connection is at the lower surface of water tank topshell, the fin has a plurality ofly, the even setting of a plurality of fins is in the inside of ventiduct, support frame fixed connection is at the lower extreme that the seat was placed to the notebook computer, the rubber pad sets up on the bottom surface of support frame, two radiator fan set up respectively in the inside left and right sides of support frame.
The utility model has the advantages of can dispel the heat to the notebook to prevent that the notebook from influencing its normal operating because the high temperature.
However, the heat dissipation frame has a simpler structure, so that the heat dissipation effect of the heat dissipation frame on the notebook computer is poor, the normal operation of the notebook computer is still easily affected due to poor heat dissipation, and the use experience of a user on the heat dissipation frame is affected.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-efficient heat dissipation frame of notebook to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient heat dissipation frame of notebook, includes first backup pad, the top of first backup pad is provided with the second backup pad, the lower surface of second backup pad is provided with the safety cover, the lower surface both ends of second backup pad are provided with stop screw, stop screw's bottom threaded connection has stop sleeve, the upper surface both ends of first backup pad are provided with the spacing bearing corresponding with stop sleeve, the below of second backup pad is provided with heat dissipation mechanism, heat dissipation mechanism includes the heat dissipation water tank, the top of heat dissipation water tank is provided with the installation foot corresponding with the second backup pad, the below of heat dissipation water tank is provided with the heating panel, the lower surface of heat dissipation water tank is provided with the semiconductor refrigeration piece corresponding with the heating panel, the lower surface of heating.
As a further aspect of the present invention: the mounting foot is the integrated into one piece structure with the heat dissipation water tank, and the below of heating panel is provided with first heat dissipation fan, and the both ends of first heat dissipation fan are provided with the connecting piece corresponding with the heating panel.
As a further aspect of the present invention: the two ends of the heat dissipation water tank are provided with second heat dissipation fans, the heat dissipation water tank is connected with the second heat dissipation fans through glue in a bonding mode, heat dissipation square pipes corresponding to the second heat dissipation fans are arranged on the heat dissipation water tank, and heat dissipation through holes corresponding to the second heat dissipation fans are formed in the two ends of the protection cover.
As a further aspect of the present invention: the heat dissipation square pipe is of a hollow cuboid structure, the heat dissipation square pipe is fixedly connected with the heat dissipation water tank in a welding mode, the heat dissipation fins are of a cuboid structure, and the heat dissipation fins are fixedly connected with the heat dissipation plate in a welding mode.
As a further aspect of the present invention: the both ends of safety cover are provided with the dust screen corresponding with the heat dissipation through-hole, and the material of dust screen is nylon, and the dust screen passes through glue bonding with the safety cover and is connected.
As a further aspect of the present invention: the lower surface of first backup pad is provided with anti-skidding backing plate, and anti-skidding backing plate is the cuboid structure, and the material of anti-skidding backing plate is rubber, and first backup pad passes through the glue bonding with anti-skidding backing plate and is connected.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, convenient to use has good heat dissipation function, can prevent effectively that the notebook from influencing its normal operating because the radiating effect is relatively poor to promote the user and experience the use of heat dissipation frame, secondly, this device has altitude mixture control function, can highly adjust heat dissipation frame according to user's in-service use demand, makes the use of heat dissipation frame more humanized, in addition, the utility model discloses have good non-skid property, be worth promoting and using.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of a corresponding heat dissipation mechanism of the present invention;
FIG. 3 is a schematic structural view of a heat dissipation water tank according to the present invention;
in the figure: 1-a first supporting plate, 2-an anti-skid base plate, 3-a limiting sleeve, 4-a limiting screw rod, 5-a second supporting plate, 6-a heat dissipation mechanism, 7-a protective cover, 8-a heat dissipation through hole, 9-a dustproof net, 10-a limiting bearing, 61-a heat dissipation fin, 62-a first heat dissipation fan, 63-a semiconductor refrigeration sheet, 64-a heat dissipation plate, 65-a mounting pin, 66-a heat dissipation water tank, 67-a connecting piece, 68-a heat dissipation square tube and 69-a second heat dissipation fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1-3, the present invention provides a technical solution: a high-efficiency heat dissipation frame for a notebook computer comprises a first supporting plate 1, wherein a second supporting plate 5 is arranged above the first supporting plate 1, a protective cover 7 is fixed on the lower surface of the second supporting plate 5 through bolts, limiting screw rods 4 are fixed at two ends of the lower surface of the second supporting plate 5 through bolts, limiting sleeves 3 are connected to the bottom ends of the limiting screw rods 4 in a threaded mode, limiting bearings 10 corresponding to the limiting sleeves 3 are arranged at two ends of the upper surface of the first supporting plate 1, and a heat dissipation mechanism 6 is arranged below the second supporting plate 5;
in order to improve the heat dissipation effect of the heat dissipation mechanism 6, the heat dissipation mechanism 6 comprises a heat dissipation water tank 66, the top end of the heat dissipation water tank 66 is provided with a mounting foot 65 corresponding to the second support plate 5, a heat dissipation plate 64 is arranged below the heat dissipation water tank 66, the lower surface of the heat dissipation water tank 66 is provided with a semiconductor refrigeration sheet 63 corresponding to the heat dissipation plate 64, and the lower surface of the heat dissipation plate 64 is provided with heat dissipation fins 61;
in order to make the use of the mounting foot 65 more reliable, in the embodiment, preferably, the mounting foot 65 and the heat dissipation water tank 66 are in an integral structure, a first heat dissipation fan 62 is disposed below the heat dissipation plate 64, and two ends of the first heat dissipation fan 62 are provided with connecting pieces 67 corresponding to the heat dissipation plate 64;
in order to improve the heat dissipation effect of the heat dissipation water tank 66, in this embodiment, preferably, the two ends of the heat dissipation water tank 66 are provided with second heat dissipation fans 69, the heat dissipation water tank 66 and the second heat dissipation fans 69 are bonded and connected through glue, the heat dissipation water tank 66 is provided with heat dissipation square pipes 68 corresponding to the second heat dissipation fans 69, and the two ends of the protection cover 7 are provided with heat dissipation through holes 8 corresponding to the second heat dissipation fans 69;
in order to improve the heat dissipation effect of the heat dissipation square tube 68, in this embodiment, preferably, the heat dissipation square tube 68 is a hollow rectangular structure, and the heat dissipation square tube 68 is disposed to penetrate through the heat dissipation water tank 66, so that air can transversely penetrate through the heat dissipation water tank 66, thereby facilitating heat dissipation of the heat dissipation water tank 66;
in order to make the use of the heat dissipation square pipe 68 more reliable, in this embodiment, preferably, the heat dissipation square pipe 68 is fixedly connected with the heat dissipation water tank 66 by welding, the heat dissipation fin 61 is of a rectangular structure, the heat dissipation fin 61 is fixedly connected with the heat dissipation plate 64 by welding, and the heat dissipation water tank 66 is filled with water which can flow in the heat dissipation square pipe 68.
Example 2:
on the basis of the embodiment 1, in order to enrich the functions of the heat dissipation frame, in the embodiment, preferably, dust screens 9 corresponding to the heat dissipation through holes 8 are arranged at two ends of the protection cover 7, the dust screens 9 are made of nylon, and the dust screens 9 are bonded and connected with the protection cover 7 through glue;
in order to make the antiskid effect of heat dissipation frame better, in this embodiment, it is preferred, the lower surface of first backup pad 1 is provided with anti-skidding backing plate 2, anti-skidding backing plate 2 is the cuboid structure, the material of anti-skidding backing plate 2 is rubber, first backup pad 1 passes through the glue bonding with anti-skidding backing plate 2 and is connected, play anti-skidding effect through anti-skidding backing plate 2 during the use, thereby make the use of heat dissipation frame more reliable, further promote the user and experience the use of heat dissipation frame.
The utility model discloses a theory of operation and use flow: when the notebook computer cooling device is used, the notebook computer is placed on the second supporting plate 5, then the notebook computer is cooled through the cooling water tank 66, in addition, the power supply of the semiconductor refrigerating sheet 63, the first cooling fan 62 and the second cooling fan 69 is switched on, at the moment, the cold end of the semiconductor refrigerating sheet 63 cools the cooling water tank 66, meanwhile, the second cooling fan 69 further cools the cooling water tank 66, and therefore the cooling effect of the cooling water tank 66 on the notebook computer is better;
in addition, the first heat dissipation fan 62 dissipates heat from the hot end of the semiconductor refrigeration sheet 63, so that the refrigeration effect of the notebook is improved, the normal operation of the notebook is effectively prevented from being influenced due to poor heat dissipation effect, and the use experience of a user on the heat dissipation frame is improved;
when the user need adjust the height of heat dissipation frame, twist and move stop sleeve 3, the length that stop screw 4 deepened in stop sleeve 3 this moment takes place corresponding change, and the user that is can adjust the height of second backup pad 5 according to the in-service use demand, makes the use of heat dissipation frame humanized more, is worth promoting and using.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a high-efficient heat dissipation frame of notebook, includes first backup pad (1), and the top of first backup pad (1) is provided with second backup pad (5), and the lower surface of second backup pad (5) is provided with safety cover (7), its characterized in that: the lower surface both ends of second backup pad (5) are provided with stop screw (4), the bottom threaded connection of stop screw (4) has stop sleeve (3), the upper surface both ends of first backup pad (1) are provided with spacing bearing (10) corresponding with stop sleeve (3), the below of second backup pad (5) is provided with heat dissipation mechanism (6), heat dissipation mechanism (6) are including heat dissipation water tank (66), the top of heat dissipation water tank (66) is provided with installation foot (65) corresponding with second backup pad (5), the below of heat dissipation water tank (66) is provided with heating panel (64), the lower surface of heat dissipation water tank (66) is provided with semiconductor refrigeration piece (63) corresponding with heating panel (64), the lower surface of heating panel (64) is provided with radiating fin (61).
2. The efficient heat dissipation rack for notebooks of claim 1, wherein: the mounting foot (65) and the heat dissipation water tank (66) are of an integrated structure, a first heat dissipation fan (62) is arranged below the heat dissipation plate (64), and connecting pieces (67) corresponding to the heat dissipation plate (64) are arranged at two ends of the first heat dissipation fan (62).
3. The efficient cooling rack for notebook computers according to claim 2, characterized in that: the both ends of heat dissipation water tank (66) are provided with second heat dissipation fan (69), and heat dissipation water tank (66) is connected through glue bonding with second heat dissipation fan (69), is provided with on heat dissipation water tank (66) and dispels the heat square pipe (68) corresponding with second heat dissipation fan (69), and heat dissipation through-hole (8) corresponding with second heat dissipation fan (69) have been seted up at the both ends of safety cover (7).
4. The efficient cooling rack for notebook computers according to claim 3, characterized in that: radiating square pipe (68) are hollow cuboid structure, and radiating square pipe (68) and radiating water tank (66) pass through welding mode fixed connection, and radiating fin (61) are the cuboid structure, and radiating fin (61) pass through welding mode fixed connection with heating panel (64).
5. The efficient cooling rack for notebook computers according to claim 4, characterized in that: the both ends of safety cover (7) are provided with dust screen (9) corresponding with heat dissipation through-hole (8), and the material of dust screen (9) is nylon, and dust screen (9) are connected through the glue bonding with safety cover (7).
6. The efficient heat dissipation rack for notebooks of any of claims 1-5, wherein: the lower surface of first backup pad (1) is provided with anti-skidding backing plate (2), and anti-skidding backing plate (2) are the cuboid structure, and the material of anti-skidding backing plate (2) is rubber, and first backup pad (1) is connected through glue bonding with anti-skidding backing plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922298282.9U CN210721340U (en) | 2019-12-19 | 2019-12-19 | High-efficient heat dissipation frame of notebook |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922298282.9U CN210721340U (en) | 2019-12-19 | 2019-12-19 | High-efficient heat dissipation frame of notebook |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210721340U true CN210721340U (en) | 2020-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922298282.9U Expired - Fee Related CN210721340U (en) | 2019-12-19 | 2019-12-19 | High-efficient heat dissipation frame of notebook |
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| CN (1) | CN210721340U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739162A (en) * | 2020-12-23 | 2021-04-30 | 江苏明茂新能源科技有限公司 | High-efficient photovoltaic fills electric pile |
-
2019
- 2019-12-19 CN CN201922298282.9U patent/CN210721340U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739162A (en) * | 2020-12-23 | 2021-04-30 | 江苏明茂新能源科技有限公司 | High-efficient photovoltaic fills electric pile |
| CN112739162B (en) * | 2020-12-23 | 2023-01-03 | 江苏明茂新能源科技有限公司 | High-efficient photovoltaic fills electric pile |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200609 Termination date: 20201219 |
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| CF01 | Termination of patent right due to non-payment of annual fee |