CN207764732U - A kind of heat sink for household small switch chip - Google Patents
A kind of heat sink for household small switch chip Download PDFInfo
- Publication number
- CN207764732U CN207764732U CN201820157302.3U CN201820157302U CN207764732U CN 207764732 U CN207764732 U CN 207764732U CN 201820157302 U CN201820157302 U CN 201820157302U CN 207764732 U CN207764732 U CN 207764732U
- Authority
- CN
- China
- Prior art keywords
- chip
- hole
- thermal
- silicon rubber
- rubber cushion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims 5
- 239000007787 solid Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 239000000741 silica gel Substances 0.000 description 11
- 229910002027 silica gel Inorganic materials 0.000 description 11
- 229920001296 polysiloxane Polymers 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
技术领域technical field
本实用新型属于涉及一种芯片散热装置领域,具体地说是一种家用小型交换机芯片散热器。The utility model belongs to the field of a chip radiator, in particular to a chip radiator for a small household switch.
背景技术Background technique
芯片散热器是一种对各类芯片散热的装置,加速芯片的散热,使芯片温度适当能够延长芯片持续工作时间及使用寿命;但现有的芯片散热器结构复杂,组装与固定困难,不方便对芯片散热器进行检修与清理,不能满足实际需要,故我们需要设计一种新型的家用小型交换机芯片散热器。The chip heat sink is a device for dissipating heat from various chips. It accelerates the heat dissipation of the chip and makes the chip temperature appropriate to prolong the continuous working time and service life of the chip. However, the existing chip heat sink has a complex structure, difficult assembly and fixing, and is inconvenient. Carrying out maintenance and cleaning to the chip heat sink can not meet the actual needs, so we need to design a new type of chip heat sink for small household switches.
实用新型内容Utility model content
本实用新型提供一种家用小型交换机芯片散热器,用以解决现有技术中的缺陷。The utility model provides a heat sink for a small household switch chip, which is used to solve the defects in the prior art.
本实用新型通过以下技术方案予以实现:The utility model is realized through the following technical solutions:
一种家用小型交换机芯片散热器,包括芯片,芯片的顶面均匀固定连接数个散热柱的底面,芯片的正上方设有导热硅胶垫,导热硅胶垫的底面分别开设与散热柱对应的第一通孔,散热柱能够分别沿对应的第一通孔上、下滑动,导热硅胶垫的底面与芯片的顶面接触配合;导热硅胶垫的正上方设有散热片,散热片的底面分别开设与散热柱对应的第二通孔,散热柱能够分别沿对应的第二通孔上、下滑动,散热片的底面与导热硅胶垫的顶面接触配合,散热片的左、右两侧分别铰链连接前后对称的竖杆,竖杆的下端分别固定连接弹簧的上端,左侧或右侧的两个弹簧的下端分别固定连接同一个横杆的两端,芯片的左、右两侧分别固定安装前后对称的挂钩,横杆分别与对应的挂钩活动配合;散热板前、后侧的中间分别铰链连接螺杆的下端,散热柱的顶面活动安装散热风扇,散热风扇的底面对应螺杆分别开设第三通孔,螺杆的上部分别位于对应的第三通孔内,螺杆能够分别沿对应的第三通孔上、下移动,螺杆的上端螺纹安装螺母,螺母的底面能够分别与散热风扇的顶面接触配合。A chip heat sink for a small household switch, including a chip, the top surface of the chip is evenly fixed and connected to the bottom surfaces of several heat dissipation columns, a heat-conducting silica gel pad is provided directly above the chip, and first heat-conducting silica gel pads corresponding to the heat dissipation columns are provided on the bottom surface of the heat-conducting silica gel pad. Through holes, the heat dissipation column can slide up and down along the corresponding first through hole, and the bottom surface of the heat conduction silica gel pad is in contact with the top surface of the chip; a heat sink is provided directly above the heat conduction silica gel pad, and the bottom surface of the heat sink is respectively set up with the top surface of the chip. The second through hole corresponding to the heat dissipation column, the heat dissipation column can slide up and down along the corresponding second through hole, the bottom surface of the heat sink is in contact with the top surface of the heat conduction silicone pad, and the left and right sides of the heat sink are hinged respectively Front and back symmetrical vertical rods, the lower ends of the vertical rods are respectively fixedly connected to the upper ends of the springs, the lower ends of the two springs on the left or right are respectively fixedly connected to the two ends of the same horizontal rod, and the left and right sides of the chip are respectively fixed and installed before and after Symmetrical hooks, crossbars are movably matched with the corresponding hooks; the middle of the front and rear sides of the cooling plate are respectively hinged to the lower ends of the screw rods, the top surface of the cooling column is movable to install the cooling fan, and the bottom surface of the cooling fan corresponds to the screw rod and respectively has a third through hole , the upper parts of the screw rods are respectively located in the corresponding third through holes, the screw rods can move up and down along the corresponding third through holes respectively, the upper ends of the screw rods are threaded with nuts, and the bottom surfaces of the nuts can respectively contact and cooperate with the top surface of the cooling fan.
如上所述的一种家用小型交换机芯片散热器,所述的散热片采用铜质的材料。According to the above-mentioned heat sink for small household switches, the heat sink is made of copper.
如上所述的一种家用小型交换机芯片散热器,所述的螺母为蝴蝶螺母。According to the above-mentioned heat sink for small household switches, the nuts are butterfly nuts.
本实用新型的优点是:本实用新型结构简单,组装与固定便捷,方便对芯片散热器进行检修与清理,能够满足实际需求,适合推广。使用时,将芯片固定安装在电路板上,芯片的顶面先活动安装导热硅胶垫,导热硅胶垫的顶面再活动安装散热片,分别拉动横杆,使横杆分别与对应的挂钩接触配合,松开横杆,导热硅胶垫、散热片被固定在芯片的上方,导热硅胶垫能够减缓散热片与芯片之间的震动或摩擦,使本实用新型能够适应颠簸的工作环境,同时导热硅胶垫、散热片的固定便捷,方便拆卸;分别转动螺杆至与水平面垂直,并将螺杆分别插入对应第三通孔内,使散热风扇的底面与散热柱的顶面接触配合,拧紧螺母,螺母的底面与散热风扇的顶面紧密接触配合,散热风扇被固定;本实用新型的组装与固定便捷,方便经常检修或清理。The utility model has the advantages of simple structure, convenient assembly and fixing, convenient maintenance and cleaning of the chip radiator, can meet actual needs, and is suitable for popularization. When in use, the chip is fixedly installed on the circuit board, the top surface of the chip is firstly installed with a thermally conductive silicone pad, and then the top surface of the thermally conductive silicone pad is movably installed with a heat sink, and the crossbars are respectively pulled to make the crossbars contact and cooperate with the corresponding hooks. , loosen the cross bar, the heat-conducting silicone pad and the heat sink are fixed above the chip, the heat-conducting silicone pad can slow down the vibration or friction between the heat sink and the chip, so that the utility model can adapt to the bumpy working environment, and the heat-conducting silicone pad 1. The fixing of the heat sink is convenient and easy to disassemble; respectively turn the screw rods to be perpendicular to the horizontal plane, and insert the screw rods into the corresponding third through holes respectively, so that the bottom surface of the cooling fan is in contact with the top surface of the cooling column, and tighten the nuts, the bottom surface of the nuts The cooling fan is fixed in close contact with the top surface of the cooling fan; the utility model is convenient for assembly and fixing, and is convenient for frequent maintenance or cleaning.
附图说明Description of drawings
为了更清楚地说明本实用新型实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the appended drawings in the following description The drawings are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings on the premise of not paying creative labor.
图1是本实用新型的结构示意图;图2是图1的俯视图;图3是图1的A向视图;图4是图1的Ⅰ局部放大图。Fig. 1 is a schematic structural view of the utility model; Fig. 2 is a top view of Fig. 1; Fig. 3 is an A-direction view of Fig. 1; Fig. 4 is a partial enlarged view of I of Fig. 1 .
具体实施方式Detailed ways
为使本实用新型实施例的目的、技术方案和优点更加清楚,下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the utility model more clear, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the utility model. Obviously, the described The embodiments are some embodiments of the present utility model, but not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
一种家用小型交换机芯片散热器,如图所示,包括芯片1,芯片1的顶面均匀固定连接数个散热柱2的底面,芯片1的正上方设有导热硅胶垫3,导热硅胶垫3的底面分别开设与散热柱2对应的第一通孔4,散热柱2能够分别沿对应的第一通孔4上、下滑动,导热硅胶垫3的底面与芯片1的顶面接触配合;导热硅胶垫3的正上方设有散热片5,散热片5的底面分别开设与散热柱2对应的第二通孔6,散热柱2能够分别沿对应的第二通孔6上、下滑动,散热片5的底面与导热硅胶垫3的顶面接触配合,散热片5的左、右两侧分别铰链连接前后对称的竖杆7,竖杆7的下端分别固定连接弹簧8的上端,左侧或右侧的两个弹簧8的下端分别固定连接同一个横杆9的两端,芯片1的左、右两侧分别固定安装前后对称的挂钩10,横杆9分别与对应的挂钩10活动配合;散热板5前、后侧的中间分别铰链连接螺杆11的下端,散热柱2的顶面活动安装散热风扇12,散热风扇12的底面对应螺杆11分别开设第三通孔13,螺杆11的上部分别位于对应的第三通孔13内,螺杆11能够分别沿对应的第三通孔13上、下移动,螺杆11的上端螺纹安装螺母14,螺母14的底面能够分别与散热风扇12的顶面接触配合。本实用新型结构简单,组装与固定便捷,方便对芯片散热器进行检修与清理,能够满足实际需求,适合推广。使用时,将芯片1固定安装在电路板上,芯片1的顶面先活动安装导热硅胶垫3,导热硅胶垫3的顶面再活动安装散热片5,分别拉动横杆9,使横杆9分别与对应的挂钩10接触配合,松开横杆9,导热硅胶垫3、散热片5被固定在芯片1的上方,导热硅胶垫3能够减缓散热片5与芯片1之间的震动或摩擦,使本实用新型能够适应颠簸的工作环境,同时导热硅胶垫3、散热片5的固定便捷,方便拆卸;分别转动螺杆11至与水平面垂直,并将螺杆11分别插入对应第三通孔13内,使散热风扇12的底面与散热柱2的顶面接触配合,拧紧螺母14,螺母14的底面与散热风扇12的顶面紧密接触配合,散热风扇12被固定;本实用新型的组装与固定便捷,方便经常检修或清理。A chip heat sink for a small household switch, as shown in the figure, includes a chip 1, the top surface of the chip 1 is evenly fixed and connected to the bottom surface of several heat dissipation columns 2, and a heat-conducting silica gel pad 3 is provided directly above the chip 1, and a heat-conducting silica gel pad 3 The bottom surface of the heat dissipation column 2 is respectively provided with the first through hole 4 corresponding to the heat dissipation column 2, and the heat dissipation column 2 can slide up and down along the corresponding first through hole 4 respectively, and the bottom surface of the heat conduction silica gel pad 3 is in contact with the top surface of the chip 1; A heat sink 5 is arranged directly above the silicone pad 3, and the bottom surface of the heat sink 5 is provided with a second through hole 6 corresponding to the heat dissipation column 2, and the heat dissipation column 2 can slide up and down along the corresponding second through hole 6 to dissipate heat. The bottom surface of the sheet 5 is in contact with the top surface of the heat-conducting silicone pad 3, and the left and right sides of the heat sink 5 are respectively hinged to the front and rear symmetrical vertical bars 7, and the lower ends of the vertical bars 7 are fixedly connected to the upper ends of the springs 8, respectively. The lower ends of the two springs 8 on the right are respectively fixedly connected to the two ends of the same crossbar 9, and the left and right sides of the chip 1 are respectively fixed with front and back symmetrical hooks 10, and the crossbars 9 are respectively movably matched with the corresponding hooks 10; The middle of the front and rear sides of the cooling plate 5 is respectively hinged to the lower end of the screw rod 11, and the top surface of the cooling column 2 is movably installed with a cooling fan 12, and the bottom surface of the cooling fan 12 corresponds to the screw rod 11 to provide a third through hole 13 respectively, and the top of the screw rod 11 is respectively Located in the corresponding third through hole 13, the screw rod 11 can move up and down along the corresponding third through hole 13, the upper end of the screw rod 11 is threaded with a nut 14, and the bottom surface of the nut 14 can contact the top surface of the cooling fan 12 respectively Cooperate. The utility model has the advantages of simple structure, convenient assembly and fixing, convenient maintenance and cleaning of the chip heat sink, can meet actual needs, and is suitable for popularization. When in use, the chip 1 is fixedly installed on the circuit board, the top surface of the chip 1 is first movable to install the heat conduction silica gel pad 3, and then the top surface of the heat conduction silica gel pad 3 is movable to install the heat sink 5, and the cross bar 9 is respectively pulled to make the cross bar 9 Contact and cooperate with the corresponding hooks 10 respectively, loosen the cross bar 9, and the thermally conductive silicone pad 3 and the heat sink 5 are fixed above the chip 1. The thermally conductive silicone pad 3 can slow down the vibration or friction between the heat sink 5 and the chip 1. The utility model can adapt to the bumpy working environment, and at the same time, the heat-conducting silica gel pad 3 and the heat sink 5 are conveniently fixed and easy to disassemble; the screw rods 11 are respectively rotated to be perpendicular to the horizontal plane, and the screw rods 11 are respectively inserted into the corresponding third through holes 13, Make the bottom surface of the heat dissipation fan 12 contact and cooperate with the top surface of the heat dissipation column 2, tighten the nut 14, the bottom surface of the nut 14 is in close contact with the top surface of the heat dissipation fan 12, and the heat dissipation fan 12 is fixed; the assembly and fixing of the utility model are convenient, Convenient for frequent maintenance or cleaning.
具体而言,如图所示,本实施例所述的散热片5采用铜质的材料。采用铜质材料的散热片5,便于散热片5的加工生产,增加散热片5的导热、散热性能。Specifically, as shown in the figure, the heat sink 5 described in this embodiment is made of copper. The heat sink 5 made of copper material facilitates the processing and production of the heat sink 5 and increases the heat conduction and heat dissipation performance of the heat sink 5 .
具体的,如图所示,本实施例所述的螺母14为蝴蝶螺母。将螺母14设计成蝴蝶螺母,方便螺母14的紧固,不用借助工具,散热风扇12固定更加便捷。Specifically, as shown in the figure, the nut 14 in this embodiment is a butterfly nut. The nut 14 is designed as a butterfly nut, which facilitates the fastening of the nut 14, and the fixing of the cooling fan 12 is more convenient without using tools.
最后应说明的是:以上实施例仅用以说明本实用新型的技术方案,而非对其限制;尽管参照前述实施例对本实用新型进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本实用新型各实施例技术方案的精神和范围。Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present utility model, and are not intended to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit of the technical solutions of the various embodiments of the present invention. and range.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820157302.3U CN207764732U (en) | 2018-01-30 | 2018-01-30 | A kind of heat sink for household small switch chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820157302.3U CN207764732U (en) | 2018-01-30 | 2018-01-30 | A kind of heat sink for household small switch chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207764732U true CN207764732U (en) | 2018-08-24 |
Family
ID=63182390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820157302.3U Expired - Fee Related CN207764732U (en) | 2018-01-30 | 2018-01-30 | A kind of heat sink for household small switch chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207764732U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259513A (en) * | 2020-10-22 | 2021-01-22 | 湖南国芯半导体科技有限公司 | Double-sided heat dissipation power module and packaging method thereof |
-
2018
- 2018-01-30 CN CN201820157302.3U patent/CN207764732U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259513A (en) * | 2020-10-22 | 2021-01-22 | 湖南国芯半导体科技有限公司 | Double-sided heat dissipation power module and packaging method thereof |
| CN112259513B (en) * | 2020-10-22 | 2023-09-26 | 湖南国芯半导体科技有限公司 | Double-sided heat dissipation power module and packaging method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207764732U (en) | A kind of heat sink for household small switch chip | |
| CN209311964U (en) | Protective device for computer motherboard | |
| CN211406665U (en) | Server mainboard heat abstractor | |
| CN209861243U (en) | A new heat dissipation circuit board | |
| CN209563078U (en) | Cooling fins for servers with interchangeable cooling fins | |
| CN220105653U (en) | Cold plate attaching structure for reducing CPU contact thermal resistance | |
| CN201248224Y (en) | Radiating device | |
| CN211240604U (en) | Reinforced radiator | |
| CN211720810U (en) | Circuit board that heat dispersion is high | |
| CN216414913U (en) | Insulating heat-conducting gasket with heat radiator | |
| CN208141318U (en) | A kind of computer heat radiating device | |
| CN218831127U (en) | Power module is with heat dissipation base convenient to installation | |
| CN215301248U (en) | Graphite product heat conduction device | |
| CN213021149U (en) | Radiator capable of avoiding internal dust deposition | |
| CN206633367U (en) | A hot runner temperature control box | |
| CN218336281U (en) | Novel network switch | |
| CN219536721U (en) | Locking structure for electronic module with heat conduction cooling structure | |
| CN221240670U (en) | Heat dissipation cover plate of scooter controller | |
| CN205726817U (en) | A heat dissipation structure of a power device and its application to a motor controller | |
| CN111490265A (en) | Radiator structure for fuel cell | |
| CN219392961U (en) | Radiating fin with mounting structure | |
| CN219042268U (en) | Graphene photovoltaic circuit board | |
| CN223110379U (en) | A new type of DCS cooling cabinet | |
| CN221652700U (en) | A switch with interface dust-proof structure | |
| CN219512613U (en) | CPU radiator with fan convenient to replace |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180824 Termination date: 20190130 |