CN219106133U

CN219106133U - Power semiconductor module

Info

Publication number: CN219106133U
Application number: CN202223329836.5U
Authority: CN
Inventors: 张乐
Original assignee: Shenzhen Yingchuang Zhilian Technology Co ltd
Current assignee: Shenzhen Yingchuang Zhilian Technology Co ltd
Priority date: 2022-12-09
Filing date: 2022-12-09
Publication date: 2023-05-30
Anticipated expiration: 2032-12-09

Abstract

The utility model discloses a power semiconductor module, which comprises a base and a semiconductor power module; the opposite sides of the base are provided with a clearance groove, and a shapable fixing bracket is movably arranged in the clearance groove; the surface of the base is provided with a groove, and a telescopic component is arranged between the groove and the shapable fixing bracket; more than one locking component is arranged on two opposite sides of the groove, the semiconductor power module is arranged in the groove, and more than one locking component is arranged at the upper end of the semiconductor power module; according to the utility model, the position avoidance grooves are formed on two opposite sides of the base, the shapable fixing support is movably arranged in the position avoidance grooves, the grooves are formed on the surface of the base, the telescopic components are arranged between the grooves and the shapable fixing support, the telescopic length of the shapable fixing support in the position avoidance grooves is controlled by the telescopic components, so that the shapable fixing support can be attached to an arc surface or a cylindrical surface, and the shapable fixing support has the characteristic of wide adaptability.

Description

Power semiconductor module

Technical Field

The present utility model relates to a power semiconductor module, and more particularly, to a power semiconductor module.

Background

Along with the continuous improvement of people's environmental protection, energy saving and emission reduction consciousness, new energy automobiles have become hot spots for the development of various large automobile enterprises and related institutions in the world. The power semiconductor module in the electric automobile controller is used as one of key parts of the new energy automobile;

most of the power semiconductor modules in the prior art are of an integrated structure, screw holes used for being connected with a plane fixing plate are formed in the power semiconductor modules, the power semiconductor modules cannot be mounted on the fixing plates with cambered surfaces or cylindrical fixing columns, and mounting positions are limited.

Disclosure of Invention

The technical problem to be solved by the utility model is to provide a power semiconductor module and a power semiconductor module; the technical problem that the power semiconductor module mentioned in the background art cannot be mounted on the fixing plate with the cambered surface or the cylindrical fixing column is solved, and the expansion of the mounting mode is realized.

The power semiconductor module is realized by the following technical scheme: the power supply comprises a base and a semiconductor power module; the opposite sides of the base are provided with a clearance groove, and a shapable fixing bracket is movably arranged in the clearance groove; the surface of the base is provided with a groove, and a telescopic component is arranged between the groove and the shapable fixing bracket;

the semiconductor power module is arranged in the groove, and the locking components are arranged at the upper end of the semiconductor power module.

As the preferable technical scheme, the surface of the groove is provided with a first chute, the side surface of the avoidance groove is provided with a through groove, and the other end of the shapable fixing bracket passes through the through groove and is arranged in the first chute;

the telescopic component comprises more than one first limiting block, a fixed block and more than one first elastic element; the other end surface of the shapable fixing support is provided with a first limiting block, and a fixing block is arranged in the middle of the first sliding groove; more than one first elastic element is arranged between the first limiting block and the fixed block.

As a preferred technical scheme, the locking assembly comprises more than one limiting plug block and more than one second elastic element; more than one limiting jack is arranged on the surfaces of the two opposite sides of the groove, and the limiting plug block is arranged in the limiting jack;

the second elastic element is arranged between the limiting plug block and the limiting jack, more than one second sliding groove is formed in the surface of the base, a sliding block connected with the limiting plug block is arranged in the second sliding groove, and a linkage deflector rod is arranged between the sliding blocks which are oppositely arranged on two sides.

As the preferable technical scheme, a heat conducting aluminum plate is relatively arranged in the groove, and the heat conducting aluminum plate is attached to the semiconductor power module; the upper end of the base is provided with a cover plate, and two opposite sides of the cover plate are provided with supporting blocks; the supporting block is arranged in the groove;

the heat conduction aluminum plate is provided with a first silica gel layer, the lower surface of the supporting block is provided with a second silica gel layer, and the first silica gel layer and the second silica gel layer are arranged up and down oppositely; the heat conduction aluminum plate surface is provided with the radiator fan subassembly.

As the preferable technical scheme, the side surface of each corner of the base is provided with a telescopic avoidance groove, and the surface of the base is provided with more than one first through hole connected with the telescopic avoidance groove;

each corner of the lower surface of the cover plate is provided with more than one threaded rod; the other end of the threaded rod is inserted and installed in the telescopic position avoiding groove, a nut is installed on the threaded rod, and a third elastic element is installed on the threaded rod;

the two ends of the third elastic element respectively support against the nut and the telescopic clearance groove.

As the preferable technical scheme, the surface of the shapable fixing support is provided with a threaded hole, and the surface of the clearance groove is provided with a second through hole which is arranged up and down relative to the threaded hole.

As a preferable technical scheme, a power supply assembly is arranged in the base.

The beneficial effects of the utility model are as follows: the telescopic component is arranged between the groove and the shapable fixed support, the telescopic length of the shapable fixed support in the shapable fixed support is controlled by the telescopic component, and the shapable fixed support can be attached to an arc surface or a cylindrical surface to be arranged.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a power semiconductor module according to the present utility model;

FIG. 2 is a schematic diagram of a power semiconductor module according to the present utility model;

FIG. 3 is a schematic diagram of a power semiconductor module according to the present utility model;

FIG. 4 is an enlarged schematic view at A;

fig. 5 is a schematic view of a base.

Detailed Description

All of the features disclosed in this specification, or all of the steps in a method or process disclosed, may be combined in any combination, except for mutually exclusive features and/or steps.

As shown in fig. 1, a power semiconductor module of the present utility model includes a base 3 and a semiconductor power module 11; the opposite two sides of the base 3 are provided with a clearance groove 14, and a shapable fixing bracket 4 is movably arranged in the clearance groove 14; the surface of the base 3 is provided with a groove 7, and a telescopic component is arranged between the groove 7 and the shapable fixing bracket 4; the telescopic component is used for controlling the telescopic length of the shapable fixing support in the clearance groove, so that the shapable fixing support can be attached to the cambered surface or the cylindrical surface, and the telescopic fixing support has the characteristic of wide adaptability.

The opposite sides of the groove 7 are provided with more than one locking component, the semiconductor power module 11 is arranged in the groove 7, and more than one locking component is arranged at the upper end of the semiconductor power module 11.

In this embodiment, the surface of the groove 7 is provided with a first chute 10, the side surface of the avoidance groove 14 is provided with a through groove 32, and the other end of the shapable fixing bracket 4 passes through the through groove 32 and is arranged in the first chute 10; the telescopic assembly comprises more than one first limiting block 5 and fixed block 8 and more than one first elastic element 9; the other end surface of the shapable fixing bracket 4 is provided with a first limiting block 5, and a fixing block 8 is arranged in the middle of the first chute 10; more than one first elastic element 9 is arranged between the first limiting block 5 and the fixed block 8.

In this embodiment, the locking assembly includes one or more limit inserts 22 and one or more second elastic elements 27; more than one limiting jack 25 is arranged on the surfaces of the two opposite sides of the groove 7, and the limiting plug 22 is arranged in the limiting jack 25; the second elastic element 27 is arranged between the limiting plug block 22 and the limiting jack 25, more than one second sliding groove 26 is arranged on the surface of the base 3, a sliding block 23 connected with the limiting plug block 22 is arranged in the second sliding groove 26, and a linkage deflector rod 24 is arranged between the sliding blocks 23 which are oppositely arranged on two sides.

In the embodiment, a heat conducting aluminum plate 15 is relatively arranged in the groove 7, and the heat conducting aluminum plate 15 is attached to the semiconductor power module 11; the upper end of the base 3 is provided with a cover plate 28, and two opposite sides of the cover plate 28 are provided with supporting blocks 29; the supporting block 29 is arranged in the groove 7; the heat conduction aluminum plate 15 is provided with a first silica gel layer 6, the lower surface of the supporting block 29 is provided with a second silica gel layer 17, and the first silica gel layer 6 and the second silica gel layer 17 are arranged up and down oppositely; the lead wire connected with the power semiconductor module is arranged between the first silica gel layer and the second silica gel layer, and liquid permeates from the joint of the upper cover and the base; the heat-conducting aluminum plate 15 is provided with a heat dissipation fan assembly 16 on the surface, the heat-conducting aluminum plate transfers heat generated by the power semiconductor module, and the heat dissipation fan assembly rapidly dissipates the heat.

In the embodiment, the side surfaces of each corner of the base 3 are provided with telescopic avoidance grooves 18, and the surface of the base 3 is provided with more than one first through hole 2 connected with the telescopic avoidance grooves 18; more than one threaded rod 21 is arranged at each corner of the lower surface of the cover plate 28; the other end of the threaded rod 21 is inserted and installed in the telescopic avoidance groove 18, a nut 19 is installed on the threaded rod 21, and a third elastic element 20 is installed on the threaded rod 21; the third elastic element 20 is respectively supported by the nut 19 and the telescopic avoiding groove 18 at two ends, and liquid or dust enters the module connection part of the power semiconductor module.

In the embodiment, the surface of the shapable fixing support 4 is provided with a threaded hole 1, and the surface of the clearance groove 14 is provided with a second through hole 13 which is arranged opposite to the threaded hole 1 up and down; a power supply assembly is arranged in the base 3.

The beneficial effects of the utility model are as follows: a first chute is arranged on the surface of the groove, a through groove is arranged on the side surface of the avoidance groove, and the other end of the shapable fixing bracket passes through the through groove and is arranged in the first chute; the other end surface of the shapable fixing support is provided with a first limiting block, and a fixing block is arranged in the middle of the first sliding groove; more than one first elastic element is arranged between the first limiting block and the fixed block; the flexible distance of the shapable fixed support in the first sliding groove is controlled through the elastic element, meanwhile, the elastic element has the function of pulling the shapable fixed support, and when the shapable fixed support is not required to stretch out, the shapable fixed support is always arranged in the avoidance groove, so that the power semiconductor can adapt to various mounting positions.

The foregoing is merely illustrative of specific embodiments of the present utility model, and the scope of the utility model is not limited thereto, but any changes or substitutions that do not undergo the inventive effort should be construed as falling within the scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope defined by the claims.

Claims

1. A power semiconductor module comprising a base (3) and a semiconductor power module (11); the method is characterized in that: the two opposite sides of the base (3) are provided with a clearance groove (14), and a shapable fixing bracket (4) is movably arranged in the clearance groove (14); the surface of the base (3) is provided with a groove (7), and a telescopic component is arranged between the groove (7) and the shapable fixing bracket (4);

more than one locking component is arranged on two opposite sides of the groove (7), the semiconductor power module (11) is arranged in the groove (7), and more than one locking component is arranged at the upper end of the semiconductor power module (11).

2. The power semiconductor module of claim 1, wherein: the surface of the groove (7) is provided with a first chute (10), the side surface of the avoidance groove (14) is provided with a through groove (32), and the other end of the shapable fixing bracket (4) passes through the through groove (32) and is arranged in the first chute (10);

the telescopic assembly comprises more than one first limiting block (5) and a fixed block (8), and more than one first elastic element (9); a first limiting block (5) is arranged on the surface of the other end of the shapable fixing bracket (4), and a fixing block (8) is arranged in the middle of the first chute (10); more than one first elastic element (9) is arranged between the first limiting block (5) and the fixed block (8).

3. The power semiconductor module of claim 1, wherein: the locking assembly comprises more than one limiting plug block (22) and more than one second elastic element (27); more than one limiting jack (25) is arranged on the surfaces of the two opposite sides of the groove (7), and the limiting plug (22) is arranged in the limiting jack (25);

the second elastic element (27) is arranged between the limiting plug block (22) and the limiting jack (25), more than one second sliding groove (26) is arranged on the surface of the base (3), a sliding block (23) connected with the limiting plug block (22) is arranged in the second sliding groove (26), and a linkage deflector rod (24) is arranged between the sliding blocks (23) which are oppositely arranged on two sides.

4. The power semiconductor module of claim 1, wherein: a heat conduction aluminum plate (15) is arranged in the groove (7) relatively, and the heat conduction aluminum plate (15) is attached to the semiconductor power module (11); a cover plate (28) is arranged at the upper end of the base (3), and supporting blocks (29) are arranged on two opposite sides of the cover plate (28); the supporting block (29) is arranged in the groove (7);

a first silica gel layer (6) is arranged on the heat conduction aluminum plate (15), a second silica gel layer (17) is arranged on the lower surface of the supporting block (29), and the first silica gel layer (6) and the second silica gel layer (17) are arranged in a vertically opposite mode; the surface of the heat conduction aluminum plate (15) is provided with a heat dissipation fan assembly (16).

5. The power semiconductor module of claim 4, wherein: the side surfaces of each corner of the base (3) are provided with telescopic avoidance grooves (18), and the surface of the base (3) is provided with more than one first through hole (2) connected with the telescopic avoidance grooves (18);

each corner of the lower surface of the cover plate (28) is provided with more than one threaded rod (21); the other end of the threaded rod (21) is inserted and installed in the telescopic avoidance groove (18), a nut (19) is installed on the threaded rod (21), and a third elastic element (20) is installed on the threaded rod (21);

both ends of the third elastic element (20) respectively support against the nut (19) and the telescopic clearance groove (18).

6. The power semiconductor module of claim 4, wherein: the surface of the shapable fixing support (4) is provided with a threaded hole (1), and the surface of the clearance groove (14) is provided with a second through hole (13) which is arranged up and down relative to the threaded hole (1).

7. The power semiconductor module of claim 1, wherein: a power supply component is arranged in the base (3).