CN220528270U - Surface pressure-resistant capacity-improved printed circuit board - Google Patents
Surface pressure-resistant capacity-improved printed circuit board Download PDFInfo
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- CN220528270U CN220528270U CN202321616585.0U CN202321616585U CN220528270U CN 220528270 U CN220528270 U CN 220528270U CN 202321616585 U CN202321616585 U CN 202321616585U CN 220528270 U CN220528270 U CN 220528270U
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- surface pressure
- bonding pad
- insulating layer
- wiring board
- metal substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 77
- 229910052751 metal Inorganic materials 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 238000001465 metallisation Methods 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The application provides a surface pressure endurance capacity promotes formula printed wiring board. The surface pressure resistance capacity improvement type printed circuit board comprises a metal substrate and an insulating layer which are arranged in a stacked mode, wherein a copper circuit pattern and a bonding pad are attached to one side, away from the metal substrate, of the insulating layer, and the bonding pad is electrically connected with the copper circuit pattern. The periphery of the bonding pad is formed by encircling an arc line, or the periphery of the bonding pad is formed by encircling at least two intersecting lines, and the intersection of the two intersecting lines is a round angle. The surface pressure resistance improving type printed circuit board can better improve the surface pressure resistance of the printed circuit board under the condition of original technology and original cost.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a surface pressure-resistant capacity-improved printed circuit board.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, generally a single panel is composed of a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer, the metal base layer is generally smeared with heat conduction slurry and then is contacted with a heat conduction part to conduct heat, so that a good heat dissipation effect is achieved, the module running temperature of the aluminum substrate can be reduced, the service life is prolonged, the power density is improved, the running reliability is enhanced, the aluminum substrate is widely applied to the field of new energy automobiles, such as an automobile power supply controller, an automobile electric drive assembly, a charging pile, an LED automobile headlight and the like, but along with the strong pushing use of the new energy automobiles in China, the high working voltage requirement of a user on the aluminum substrate of the new energy automobiles is gradually improved, such as the Chinese patent application of the application number 201911410416.X, the method for enhancing the surface pressure resistance of the PCB is disclosed, the surface pressure resistance of the PCB is enhanced through the thickness of a PI film, the PCB is modified or the treatment equipment added with the PI film is improved, the surface pressure resistance of the PCB is improved, the PCB processing efficiency is lowered, and the processing cost of the PCB is lowered.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide the surface pressure-resistant capacity-improved printed circuit board which can better realize the improvement of the surface pressure resistance capacity of the printed circuit board under the conditions of the original process and the original cost.
The aim of the utility model is realized by the following technical scheme:
the surface pressure resistance improved printed circuit board comprises a metal substrate and an insulating layer which are stacked, wherein a copper circuit pattern and a bonding pad are attached to one side of the insulating layer far away from the metal substrate, the bonding pad is electrically connected with the copper circuit pattern,
the periphery of the bonding pad is formed by encircling an arc line, or the periphery of the bonding pad is formed by encircling at least two intersecting lines, and the intersection of the two intersecting lines is a round angle.
In one embodiment, the surface voltage endurance improving type printed circuit board comprises two insulating layers, wherein copper circuit patterns and bonding pads are attached to one side, away from the metal substrate, of each insulating layer, first metallized holes are formed in the two insulating layers, corresponding to the copper circuit patterns are avoided, second metallized holes are formed in the metal substrate, the first metallized holes and the second metallized holes are coaxially arranged, the first metallized holes and the second metallized holes are communicated, and the inner walls of the first metallized holes and the inner walls of the second metallized holes are flush.
In one embodiment, the minimum distance between the copper circuit pattern on any one of the insulating layers and the corresponding first metallization hole is 1.6mm to 1.8mm.
In one embodiment, the minimum distance between the copper circuit pattern and the peripheral wall of the metal substrate is 1.6mm to 1.8mm.
In one embodiment, the metal substrate is an aluminum substrate, a copper substrate, an iron substrate, or a silicon steel substrate.
In one embodiment, the aluminum substrate is a tin-plated aluminum substrate, an anti-oxidation aluminum substrate, a silver-plated aluminum substrate, or a gold-plated aluminum substrate.
In one embodiment, the insulating layer is a thermally conductive insulating layer.
In one embodiment, the insulating layer is an FR-4 prepreg, a PVC insulating heat conducting sheet or a ceramic filled epoxy sheet.
In one embodiment, the insulating layer has a thickness of 0.003 inch to 0.006 inch.
In one embodiment, the copper line pattern has a thickness of loz to 10oz.
Compared with the prior art, the utility model has at least the following advantages:
the utility model relates to a surface pressure resistance capacity lifting type printed circuit board, which is characterized in that a copper circuit pattern and a bonding pad are attached to one side of an insulating layer, which is far away from a metal substrate, and the periphery of the bonding pad is surrounded by an arc line or at least two intersecting lines, wherein the intersecting part of the two intersecting lines is a round angle, the periphery of the bonding pad is a projected outline of the bonding pad on the insulating layer or the metal substrate, and when the periphery of the bonding pad is surrounded by an arc line, the projected outline of the bonding pad on the insulating layer or the metal substrate has no edges; in addition, when the peripheral line of the bonding pad is at least two intersecting lines, the projected outline of the bonding pad on the insulating layer or the metal substrate is at least two intersecting lines, the intersecting position of the two intersecting lines is further defined to be a round angle, the projected outline of the bonding pad on the insulating layer or the metal substrate has no edge angle, and the projected outline of the bonding pad on the insulating layer or the metal substrate can be realized only by corresponding adjustment in the original routing design step of the printed circuit board, so that the surface pressure resistance capacity of the printed circuit board can be better improved under the conditions of the original technology and the original cost, the high working voltage requirement required by a new energy automobile is better met, and the market competitiveness of the printed circuit board is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a surface pressure resistance enhancement type printed wiring board according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of another structure of the surface pressure endurance improving type printed circuit board shown in fig. 1.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The application provides a surface pressure endurance capacity promotes formula printed wiring board. The surface pressure endurance capacity promotes formula printed wiring board and is including metal substrate and the insulating layer of range upon range of setting, and the insulating layer is kept away from metal substrate's one side and is attached with copper circuit figure and bonding pad, bonding pad and copper circuit figure electric connection. The peripheral line of the bonding pad is formed by encircling an arc line, or the peripheral line of the bonding pad is formed by encircling at least two intersecting lines, and the intersection of the two intersecting lines is a round angle.
The surface pressure resistance capacity lifting type printed circuit board is characterized in that a copper circuit pattern and a bonding pad are attached to one side, far away from a metal substrate, of an insulating layer, the outer peripheral line of the bonding pad is formed by encircling an arc line in a matching manner, or the outer peripheral line of the bonding pad is formed by encircling at least two intersecting lines, the intersection of the two intersecting lines is a round angle, the outer peripheral line of the bonding pad is a projected outline line of the bonding pad on the insulating layer or the metal substrate, and when the outer peripheral line of the bonding pad is formed by encircling an arc line, the projected outline line of the bonding pad on the insulating layer or the metal substrate has no edges; in addition, when the peripheral line of the bonding pad is at least two intersecting lines, the projected outline of the bonding pad on the insulating layer or the metal substrate is at least two intersecting lines, the intersecting position of the two intersecting lines is further defined to be a round angle, the projected outline of the bonding pad on the insulating layer or the metal substrate has no edge angle, and the projected outline of the bonding pad on the insulating layer or the metal substrate can be realized only by corresponding adjustment in the original routing design step of the printed circuit board, so that the surface pressure resistance capacity of the printed circuit board can be better improved under the conditions of the original technology and the original cost, the high working voltage requirement required by a new energy automobile is better met, and the market competitiveness of the printed circuit board is effectively improved.
In order to better understand the surface pressure-resistant capability-enhanced printed wiring board of the present application, the surface pressure-resistant capability-enhanced printed wiring board of the present application is further explained below:
referring to fig. 1 to 2 together, a surface voltage endurance enhancement type printed circuit board 10 according to an embodiment includes a metal substrate 100 and an insulating layer 200 stacked together, wherein a copper circuit pattern 300 and a bonding pad 400 are attached to a side of the insulating layer 200 away from the metal substrate 100, and the bonding pad 400 is electrically connected to the copper circuit pattern 300. The outer periphery of the bonding pad 400 is defined by an arc line, or the outer periphery of the bonding pad 400 is defined by at least two intersecting lines, and the intersection of the two intersecting lines is a rounded corner.
The surface voltage endurance capability improving type printed circuit board 10 described above, wherein the copper circuit pattern 300 and the bonding pad 400 are attached to the side of the insulating layer 200 far from the metal substrate 100, and the outer peripheral line of the bonding pad 400 is defined by an arc line or at least two intersecting lines, the intersecting position of the two intersecting lines is a rounded corner, the outer peripheral line of the bonding pad 400 is the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100, and when the outer peripheral line of the bonding pad 400 is defined by an arc line, the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100 has no corner; in addition, when the peripheral line of the bonding pad 400 is defined by at least two intersecting lines, the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100 is defined by at least two intersecting lines, and the intersecting point of the two intersecting lines is further defined as a round angle, the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100 has no edge angle, and the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100 has no edge angle, which can be realized only by performing corresponding adjustment in the original tape design step of the printed circuit board, so that the surface pressure endurance capacity of the printed circuit board can be better improved under the condition of original technology and original cost, the high working voltage requirement required by a new energy automobile is better met, and the market competitiveness of the printed circuit board is effectively improved.
It should be noted that, first, any two intersecting lines are straight lines, and the fact that the intersecting point is a round angle means that the intersecting point is a round angle structure; secondly, one of any two intersecting lines is arc-shaped, and the other is straight, and the intersecting point is a round angle, which means that the arc line is in a round angle structure at the intersecting point of the tangent line of the intersecting point and the straight line; and thirdly, any two intersecting lines are arc-shaped, and the fact that the intersecting point is a round angle means that the intersecting point of the tangent lines of the two arc lines is a round angle structure.
Referring to fig. 1 to 2 together, in one embodiment, the surface voltage endurance enhancement type printed circuit board 10 includes two insulating layers 200, wherein a copper circuit pattern 300 and a bonding pad 400 are attached to a side of each insulating layer 200 away from the metal substrate 100, the two insulating layers 200 are formed with a first metallized hole 210 avoiding the corresponding copper circuit pattern 300, a second metallized hole 220 is formed in the metal substrate 100, the first metallized hole 210 and the second metallized hole 220 are coaxially arranged, the first metallized hole 210 and the second metallized hole 220 are communicated, and an inner wall of the first metallized hole 210 is flush with an inner wall of the second metallized hole 220. Further, the minimum distance between the copper circuit pattern 300 on any insulating layer 200 and the corresponding first metallized hole 210 is 1.6 mm-1.8 mm, that is, the marked linear length of a is 1.6 mm-1.8 mm, so that corresponding adjustment can be performed in the original routing design step of the printed circuit board, that is, the surface pressure resistance of the printed circuit board can be better improved under the condition of the original process and the original cost, the high working voltage requirement of a new energy automobile is better met, and the market competitiveness of the printed circuit board is effectively improved.
Referring to fig. 1 to 2 together, in one embodiment, the minimum distance between the copper circuit pattern 300 and the peripheral wall of the metal substrate 100 is 1.6mm to 1.8mm, that is, the marked linear length of B is 1.6mm to 1.8mm, so that corresponding adjustment can be performed in the original routing design step of the printed circuit board, that is, the surface pressure endurance capacity of the printed circuit board can be better improved under the condition of the original process and the original cost, the high working voltage requirement of the new energy automobile is better met, and the market competitiveness of the printed circuit board is effectively improved.
In one embodiment, the metal substrate is an aluminum substrate, a copper substrate, an iron substrate or a silicon steel substrate, so that the heat dissipation performance of the printed circuit board is better ensured.
In one embodiment, the aluminum substrate is a tin-plated aluminum substrate, an anti-oxidation aluminum substrate, a silver-plated aluminum substrate or a gold-plated aluminum substrate, so that the heat dissipation performance of the printed circuit board is further better ensured.
In one embodiment, the insulating layer is a heat-conducting insulating layer, so that the heat dissipation performance of the printed circuit board is better ensured.
In one embodiment, the insulating layer is an FR-4 prepreg, a PVC insulating heat-conducting sheet or a ceramic filled epoxy resin sheet, so that the heat dissipation performance of the printed circuit board is further better ensured.
In one embodiment, the thickness of the insulating layer is 0.003 inch to 0.006 inch, which better ensures the performance of the printed wiring board.
In one embodiment, the thickness of the copper wiring pattern is loz-10 oz, which better ensures the performance of the printed wiring board.
Compared with the prior art, the utility model has at least the following advantages:
the surface voltage endurance capability enhanced printed circuit board 10 of the present utility model is such that a copper circuit pattern 300 and a bonding pad 400 are attached to one side of an insulating layer 200 far from a metal substrate 100, and the outer peripheral line of the bonding pad 400 is defined by an arc line or at least two intersecting lines, the intersecting position of the two intersecting lines is a rounded corner, the outer peripheral line of the bonding pad 400 is the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100, and when the outer peripheral line of the bonding pad 400 is defined by an arc line, the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100 has no corner angle; in addition, when the peripheral line of the bonding pad 400 is defined by at least two intersecting lines, the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100 is defined by at least two intersecting lines, and the intersecting point of the two intersecting lines is further defined as a round angle, the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100 has no edge angle, and the projected contour line of the bonding pad 400 on the insulating layer 200 or the metal substrate 100 has no edge angle, which can be realized only by performing corresponding adjustment in the original tape design step of the printed circuit board, so that the surface pressure endurance capacity of the printed circuit board can be better improved under the condition of original technology and original cost, the high working voltage requirement required by a new energy automobile is better met, and the market competitiveness of the printed circuit board is effectively improved.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. The surface pressure resistance capacity improved printed circuit board comprises a metal substrate and an insulating layer which are stacked, wherein a copper circuit pattern and a bonding pad are attached to one side of the insulating layer far away from the metal substrate, the bonding pad is electrically connected with the copper circuit pattern,
the periphery of the bonding pad is formed by encircling an arc line, or the periphery of the bonding pad is formed by encircling at least two intersecting lines, and the intersection of the two intersecting lines is a round angle.
2. The surface pressure resistant capability enhanced printed wiring board according to claim 1, wherein the surface pressure resistant capability enhanced printed wiring board comprises two insulating layers, wherein a copper circuit pattern and a bonding pad are attached to one side of each insulating layer away from the metal substrate, a first metallization hole is formed on the two insulating layers away from the corresponding copper circuit pattern, a second metallization hole is formed on the metal substrate, the first metallization hole and the second metallization hole are coaxially arranged, the first metallization hole and the second metallization hole are communicated, and the inner wall of the first metallization hole and the inner wall of the second metallization hole are flush.
3. The surface pressure resistant enhanced printed wiring board as set forth in claim 2, wherein a minimum distance between said copper wiring pattern on any one of said insulating layers and a corresponding one of said first metallized holes is 1.6mm to 1.8mm.
4. The surface pressure resistance enhanced printed wiring board according to claim 1, wherein a minimum distance between the copper wiring pattern and the peripheral wall of the metal substrate is 1.6mm to 1.8mm.
5. The surface pressure resistance enhanced printed wiring board according to claim 1, wherein the metal substrate is an aluminum substrate, a copper substrate, an iron substrate, or a silicon steel substrate.
6. The surface pressure resistance enhanced printed wiring board according to claim 5, wherein the aluminum substrate is a tin-plated aluminum substrate, an oxidation-resistant aluminum substrate, a silver-plated aluminum substrate, or a gold-plated aluminum substrate.
7. The surface pressure resistant enhanced printed wiring board of claim 1, wherein the insulating layer is a thermally conductive insulating layer.
8. The surface pressure resistance enhanced printed wiring board according to claim 1, wherein the insulating layer is FR-4 prepreg, PVC insulating heat conductive sheet or ceramic filled epoxy sheet.
9. The surface pressure resistant enhanced printed wiring board of claim 1, wherein the thickness of the insulating layer is 0.003 to 0.006 inches.
10. The surface pressure resistant capability enhanced printed wiring board as claimed in claim 1, wherein,
the thickness of the copper circuit pattern is loz-10 oz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321616585.0U CN220528270U (en) | 2023-06-25 | 2023-06-25 | Surface pressure-resistant capacity-improved printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321616585.0U CN220528270U (en) | 2023-06-25 | 2023-06-25 | Surface pressure-resistant capacity-improved printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220528270U true CN220528270U (en) | 2024-02-23 |
Family
ID=89931609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321616585.0U Active CN220528270U (en) | 2023-06-25 | 2023-06-25 | Surface pressure-resistant capacity-improved printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220528270U (en) |
-
2023
- 2023-06-25 CN CN202321616585.0U patent/CN220528270U/en active Active
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