CN220508265U - Temperature calibration device - Google Patents
Temperature calibration device Download PDFInfo
- Publication number
- CN220508265U CN220508265U CN202322145763.2U CN202322145763U CN220508265U CN 220508265 U CN220508265 U CN 220508265U CN 202322145763 U CN202322145763 U CN 202322145763U CN 220508265 U CN220508265 U CN 220508265U
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- chip
- calibration device
- thermocouple
- temperature calibration
- plate
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- 238000012360 testing method Methods 0.000 claims abstract description 60
- 239000000523 sample Substances 0.000 claims abstract description 30
- 230000000149 penetrating effect Effects 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 229920001971 elastomer Polymers 0.000 claims description 2
- 239000000806 elastomer Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 21
- 238000003475 lamination Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present utility model provides a temperature calibration device, comprising: the supporting body is provided with a support column for supporting the baffle; the bracket comprises an upper supporting plate and a plurality of longitudinal holes penetrating through the upper supporting plate, wherein a thermocouple correspondingly penetrates through one longitudinal hole and is fixed; the elastic element is arranged between the top surface of the bracket and the baffle; the carrier further includes an opening through which the thermocouple probe passes and is below the lower surface of the upper carrier plate. The chip to be tested is fixed on the chip test seat; the chip test seat is fixed in the accommodating cavity of the carrier, and the thermocouple probe contacts the chip. The temperature calibration device can be used for testing the temperature of a plurality of chips, detects a plurality of chips through one-time lamination, and is higher in efficiency. And the elastic structure of the detection point ensures the stability and safety of the contact between the thermocouple and the chip, and further synchronously reads the multipoint temperature. The fixed design of the detection points ensures that the thermocouple detection parts are the same and the chip tested parts are the same in each test, and ensures the accuracy and consistency of the detection results.
Description
Technical Field
The utility model belongs to the technical field of integrated circuit manufacturing, and particularly relates to a temperature calibration device.
Background
When the chip in the semiconductor industry is produced in mass, the chip needs to be tested at high temperature, and the accuracy, stability and high efficiency of the test temperature are particularly important for the chip. And (5) measuring whether the chip reaches a preset temperature or not by adopting a thermocouple. In the current manual testing method, a plurality of chips are fixed on a chip testing seat, thermocouple probes are respectively stuck to the center of the chip one by manually using a high-temperature adhesive tape for testing the temperature of the chip, the efficiency is low, the thermocouple is not specially fixed, the same thermocouple detection part and the same chip tested part in each test cannot be ensured, and the chip temperature detection difference is easily caused.
Disclosure of Invention
The utility model aims to provide a temperature calibration device which can be used for temperature testing of a plurality of chips and detecting the chips at one time, and has higher efficiency. The elastic structure of the detection point ensures the stability and safety of the contact between the thermocouple and the chip, and further synchronously reads the multipoint temperature; the fixed design of the detection points ensures that the thermocouple detection parts are the same and the chip tested parts are the same in each test, and ensures the accuracy and consistency of the detection results. The temperature reading calibration can be performed more quickly and conveniently.
The present utility model provides a temperature calibration device, comprising:
the bearing body comprises an upper bearing plate and side plates, and the upper bearing plate and the side plates of the peripheral ring enclose a containing cavity; the supporting body is provided with a support column for supporting the baffle;
the support comprises an upper support plate and a plurality of longitudinal holes penetrating through the upper support plate, one thermocouple correspondingly penetrates through one longitudinal hole and is fixed in the longitudinal hole, and the thermocouple comprises a thermocouple probe;
the elastic element is arranged between the top surface of the bracket and the baffle;
the bearing body further comprises an opening penetrating through the upper bearing plate, and the thermocouple probe penetrates through the opening and is lower than the lower surface of the upper bearing plate;
the chip test seat is used for fixing a chip;
the chip test seat is fixed in the accommodating cavity of the supporting body, and the thermocouple probe contacts the chip.
Further, the temperature calibration device further includes: the limiting column is positioned between the upper bearing plate of the bearing body and the upper supporting plate of the bracket.
Further, the limit posts are located in the middle area of the upper bearing plate, and the openings are symmetrically distributed on two sides of the limit posts along the length direction on the upper bearing plate.
Further, the support still includes: and the bracket extending column extends downwards from the upper supporting plate, and the longitudinal hole also penetrates through the bracket extending column.
Further, the thermocouple probe is fixed with the side wall of the longitudinal hole through threaded connection or is tightly matched and fixed through a gasket.
Further, a positioning pin is arranged on one side of the lower surface of the upper bearing plate and used for positioning the bearing body and the chip test seat.
Further, the elastic element comprises a spring or a columnar elastic body.
Further, the chip test seat comprises a base, wherein a plurality of floating plates are formed on the base and used for fixing the chip to be tested.
Further, a spring is formed between the lower middle region of the floating plate and the base, and a heating element is formed between the lower peripheral region of the floating plate and the base.
Further, be provided with two at least buckles on the supporting body, the buckle is including buckle handle and the jack catch that are connected, presses the buckle handle, the buckle is opened, the chip test seat gomphosis in the holding intracavity of supporting body, unclamp the buckle handle, the jack catch card the chip test seat, will the chip test seat with the supporting body is fixed together.
Compared with the prior art, the utility model has the following beneficial effects:
the present utility model provides a temperature calibration device, comprising: the bearing body comprises an upper bearing plate and side plates, and the upper bearing plate and the side plates of the peripheral ring enclose a containing cavity; the supporting body is provided with a support post for supporting the baffle; the bracket comprises an upper supporting plate and a plurality of longitudinal holes penetrating through the upper supporting plate, wherein a thermocouple correspondingly penetrates through one longitudinal hole and is fixed; the elastic element is arranged between the top surface of the bracket and the baffle; the carrier further includes an opening through which the thermocouple probe passes and is below the lower surface of the upper carrier plate. The chip test seat is used for fixing the chip. The chip test seat is fixed in the accommodating cavity of the carrier, and the thermocouple probe contacts the chip. The temperature calibration device can be used for temperature testing of a plurality of chips, and is higher in efficiency when detecting the chips in a one-time pressing mode. Multiple chips can be calibrated synchronously. The elastic structure of the detection point ensures the stability and safety of the contact between the thermocouple and the chip, and further synchronously reads the multipoint temperature; the fixed design of the detection point ensures that the thermocouple detection parts are the same and the chip tested parts are the same in each test, and ensures the stability of the detection result. The temperature reading calibration can be performed more quickly and conveniently.
Drawings
Fig. 1 is a front view of a temperature calibration device according to an embodiment of the present utility model.
Fig. 2 is a three-dimensional perspective view of a temperature calibration device according to an embodiment of the utility model.
Fig. 3 is a three-dimensional perspective view of another view of the temperature calibration device according to the embodiment of the present utility model.
Fig. 4 is a bottom view of the temperature calibration device according to the embodiment of the utility model.
Fig. 5 is a top view of a chip test socket in a temperature calibration apparatus according to an embodiment of the utility model.
Wherein, the reference numerals are as follows:
10-a carrier; 10 a-upper carrier plate; 10 b-side panels; 11-struts; 12-baffle; 13-locating pins; 14-clamping; 14 a-a snap handle; 14 b-jaws; 15-a bracket; 15 a-an upper support plate; 15 b-a stent extension column; 16-limit posts; 17-an elastic element; 21-a thermocouple; 21 a-thermocouple wire outlet end; 21 b-thermocouple probe; 30-a chip test socket; 31-a base; 32-floating plates; 33-chip; k-opening; f-bottom surface.
Detailed Description
The utility model is described in further detail below with reference to the drawings and the specific examples. The advantages and features of the present utility model will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are not to scale precisely, but rather merely for the purpose of facilitating and clearly aiding in the description of the embodiments of the utility model.
For ease of description, some embodiments of the present application may use spatially relative terms such as "above" …, "" below "…," "top," "below," and the like to describe one element or component's relationship to another element(s) or component(s) as illustrated in the various figures of the embodiments. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or components described as "below" or "beneath" other elements or components would then be oriented "above" or "over" the other elements or components. The terms "first," "second," and the like, herein below, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that such terms so used are interchangeable under appropriate circumstances.
The embodiment of the utility model provides a temperature calibration device, which comprises:
the bearing body comprises an upper bearing plate and side plates, and the upper bearing plate and the side plates of the peripheral ring enclose a containing cavity; the supporting body is provided with a support column for supporting the baffle;
the support comprises an upper support plate and a plurality of longitudinal holes penetrating through the upper support plate, one thermocouple correspondingly penetrates through one longitudinal hole and is fixed in the longitudinal hole, and the thermocouple comprises a thermocouple probe;
the elastic element is arranged between the top surface of the bracket and the baffle;
the bearing body further comprises an opening penetrating through the upper bearing plate, and the thermocouple probe penetrates through the opening and is lower than the lower surface of the upper bearing plate;
the chip test seat is used for fixing a chip;
the chip test seat is fixed in the accommodating cavity of the supporting body, and the thermocouple probe contacts with the chip.
The temperature calibration device according to the embodiment of the present utility model will be described in detail with reference to fig. 1 to 5. Fig. 1 is a front view of a temperature calibration device according to an embodiment of the present utility model. Fig. 2 is a three-dimensional perspective view of a temperature calibration device according to an embodiment of the utility model. Fig. 3 is a three-dimensional perspective view of another view of the temperature calibration device according to the embodiment of the present utility model. Fig. 4 is a bottom view of the temperature calibration device according to the embodiment of the utility model. Fig. 5 is a top view of a chip test socket in a temperature calibration apparatus according to an embodiment of the utility model. As shown in fig. 1 to 5, a temperature calibration device according to an embodiment of the present utility model includes: carrier 10, frame 15, spring 17, bezel 12, die test pad 30, etc.
Specifically, the carrier 10 includes an upper carrier plate 10a and a side plate 10b, and the upper carrier plate 10a and the side plate 10b of the peripheral ring enclose a containing cavity; the carrier 10 is provided with a post 11 supporting a baffle 12.
The support 15 is used for fixing the thermocouple 21, the support 15 comprises an upper support plate 15a and a plurality of longitudinal holes penetrating through the upper support plate 15a, one thermocouple 21 correspondingly penetrates through one longitudinal hole and is fixed, and the thermocouple 21 comprises a thermocouple probe 21b and a thermocouple wire outlet end 21a. In other examples, the bracket 15 includes an upper support plate 15a and a bracket extension post 15b extending downward from the upper support plate 15 a; the support 15 is provided with a longitudinal hole perpendicular to the upper surface of the carrier 10, which penetrates the upper support plate 15a and the support extension post 15b, and the thermocouple 21 penetrates the longitudinal hole and is fixed to the support 15. The thermocouple probe 21b faces downwards, the thermocouple probe 21b and the side wall of the longitudinal hole on the bracket 15 can be fixed through threaded connection, or can be fixed through tight fit of a gasket and the like, and the lead wire of the thermocouple 21 can also pass through the longitudinal hole.
At least one elastic element 17 is arranged between the top surface of the bracket 15 and the baffle 12, one end of the elastic element 17 is fixed on the baffle 12, and the other end is fixed on the bracket 15. The elastic element 17 may comprise a spring or a cylindrical elastomer. One, two or more elastic elements 17 may be provided between the top surface of the support 15 and the baffle 12, configured according to actual needs. In fig. 1, two elastic elements 17 are shown symmetrically distributed along the length of the frame 15. The thermocouple wire outlet end 21a is an end of the thermocouple 21 near the elastic member 17.
The carrier 10 is further provided with an opening K (fig. 2) penetrating the upper carrier plate 10a, through which the bracket extension column 15b passes; illustratively, two openings K are symmetrically distributed on the upper carrier plate 10 a. The number of the longitudinal holes provided in the bracket 15 in each opening K area is not limited, and may be set according to actual needs, and the number of the longitudinal holes provided in the bracket 15 in each opening K area may be any one of 1 to 10, for example, and more than 10 may be possible. Accordingly, the number of longitudinal holes in the support 15 (i.e., the number of fixed thermocouples 21) corresponds to the number of chips 33 on the chip test socket 30.
The chip 33 is fixed on the chip test seat 30; specifically, as shown in fig. 5, the chip test socket 30 includes a base 31, a plurality of floating plates 32 are formed on the base 31, the chip 33 is fixed on the floating plates 32 for testing, and springs are formed between the floating plates 32 and the base 31 to enable the chip 33 to flexibly contact during the mounting, fixing and testing processes, so as to prevent the chip 33 from being damaged. Illustratively, a spring is formed between the lower middle region of the floating plate 32 and the base 31. In the longitudinal direction (direction perpendicular to the upper surface of the carrier 10), the top is provided with an elastic element 17 for adjustment, a spring is arranged below a floating plate 32 for placing the chip 33, and the thermocouple 21 is integrally formed in the longitudinal direction to be in flexible (elastic adjustment) contact with the chip 33, so that the chip 33 is not damaged in the process of testing the chip 33 by the thermocouple 21.
A heating element, such as a heating ring or a heating wire, is formed between the lower peripheral region of the floating plate 32 and the base 31. The heating element solves the heat source problem of test requirements in a high-temperature environment, and can be powered and heated by a 5V power supply, for example. The heating element in this embodiment may be provided with a temperature adjusting circuit to adjust the magnitude of the output current, and the current flows through the heating element (power resistor) with a small resistance value to generate heat to heat the chip 33. The back of each floating plate 32 is provided with a heating element, the chip 33 is placed on the floating plate 32 for heating, after the chip is heated to a preset temperature, the thermocouple 21 is used for testing whether the actual temperature value of the heated chip 33 reaches the preset temperature, and temperature calibration is realized.
The die test pad 30 is secured within the receiving cavity of the carrier 10 and the thermocouple probe 21b contacts the die 33. Illustratively, the die test socket 30 is engaged in the receiving cavity of the carrier 10. Optionally, a positioning pin 13 is disposed on one side of the lower surface of the upper carrier plate 10a of the carrier 10 for positioning the carrier 10 and the die test pad 30. Illustratively, a set of positioning pins 13 (fig. 4) are distributed diagonally on each side of the lower surface of the upper carrier plate 10 a.
The die test pad 30 and the carrier 10 may be secured by the clip 14. The clasp 14 includes a clasp handle 14a and a clasp jaw 14b connected. The two sides of the carrier 10 along the length direction can be provided with buckles 14, and the buckles 14 can also be arranged on two sides of the carrier 10 along the width direction. The clip 14 can be opened by pressing the clip handle 14a, the die test holder 30 is placed (embedded) in the accommodating cavity of the carrier 10, the clip handle 14a is released, and the claw 14b clamps the die test holder 30, so that the die test holder 30 and the carrier 10 are fixed together. The bottom surface f of the upper bearing plate 10a of the bearing body 10 is a contact surface of the bearing body 10 and the chip test seat 30 after being buckled.
In the longitudinal direction (perpendicular to the upper surface direction of the carrier 10), when the chip test seat 30 is not mounted (i.e. the initial state of the carrier 10), the thermocouple probe 21b is lower than the bottom surface f of the upper carrier 10a, the chip test seat 30 is buckled with the carrier 10, an upward pushing force is given to the thermocouple probe 21b, the thermocouple probe 21b rebounds, the thermocouple 21 is fixed on the support 15, the thermocouple 21 is relatively static with the support 15, and the elastic element 17 correspondingly gives a reaction force (resilience force) to the support 15, so that the process of contacting the thermocouple 21 with the chip 33 is a flexible (elastic adjustment) contacting process, and the chip 33 is prevented from being hard and hard damaged. The thermocouple probe 21b is in direct contact with the chip 33, and reads the temperature of the chip 33.
In the initial state of the carrier 10, the thermocouple probe 21b is lower than the bottom surface f of the upper carrier plate 10 a. The thermocouple probe 21b is lower than the bottom surface f of the upper carrier plate 10a in the initial state by adjusting the elastic modulus of the matching elastic member 17, the weight of the thermocouple probe 21b, and the weight of the holder 15. The initial state of the carrier 10, the spring element 17 in the stretched state, the unstretched, uncompressed free state and the compressed state are all possible.
Further, a limit post 16 may be disposed between the upper bearing plate 10a of the bearing body 10 and the upper supporting plate 15a of the supporting frame 15, so that the supporting frame 15 does not sink to a larger stroke. If the limiting post 16 is not arranged, the bracket 15 and the thermocouple 21 are suspended and hung by the elastic element 17, and the gravity of the bracket 15 and the thermocouple 21 is concentrated on the elastic element 17, so that the elastic failure is easily caused by exceeding the critical value of the stretching state of the elastic element 17. The limiting post 16 effectively prevents the elastic element 17 from being excessively stretched to fail.
The temperature calibration device of the utility model directly fixes the carrier 10 and the chip test seat 30 through the buckle 14. The fixed design of the detection points ensures that the detection positions of the thermocouple 21 and the detected positions of the chip 33 are the same in each test, and ensures the accuracy and stability of the detection results. The thermocouple 21 contacts the chip 33 at the corresponding position of the chip test point, and the elastic element 17 is used for rebounding to the bracket 15 for fixing the thermocouple 21, so that the thermocouple 21 contacts the chip 33 in a flexible (elastic adjustment) contact process, thereby ensuring the stability and safety of the contact between the thermocouple 21 and the chip 33, and synchronously reading the multi-point temperature. The temperature reading calibration can be performed more quickly and conveniently; can be reused without auxiliary material loss.
In summary, the present utility model provides a temperature calibration device, comprising: the bearing body, the upper bearing plate and the side plate of the peripheral ring enclose a containing cavity; the supporting body is provided with a support post for supporting the baffle; the bracket comprises an upper supporting plate and a plurality of longitudinal holes penetrating through the upper supporting plate, wherein a thermocouple correspondingly penetrates through one longitudinal hole and is fixed; the elastic element is arranged between the top surface of the bracket and the baffle; the carrier further includes an opening through which the thermocouple probe passes and is below the lower surface of the upper carrier plate. The chip to be tested is fixed on the chip test seat; the chip test seat is fixed in the accommodating cavity of the carrier, and the thermocouple probe contacts the chip. The temperature calibration device can be used for temperature testing of a plurality of chips, and is higher in efficiency when detecting the chips in a one-time pressing mode. Multiple chips can be calibrated synchronously. The elastic structure of the detection point ensures the stability and safety of the contact between the thermocouple and the chip, and further synchronously reads the multipoint temperature; the temperature reading calibration can be performed more quickly and conveniently. The fixed design of the detection point ensures that the thermocouple detection parts are the same and the chip tested parts are the same in each test, and ensures the stability of the detection result.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the method disclosed in the embodiment, the description is relatively simple since it corresponds to the device disclosed in the embodiment, and the relevant points refer to the description of the method section.
The foregoing description is only illustrative of the preferred embodiments of the present utility model, and is not intended to limit the scope of the claims, and any person skilled in the art may make any possible variations and modifications to the technical solution of the present utility model using the method and technical content disclosed above without departing from the spirit and scope of the utility model, so any simple modification, equivalent variation and modification made to the above embodiments according to the technical matter of the present utility model fall within the scope of the technical solution of the present utility model.
Claims (10)
1. A temperature calibration device, comprising:
the bearing body comprises an upper bearing plate and side plates, and the upper bearing plate and the side plates of the peripheral ring enclose a containing cavity; the supporting body is provided with a support column for supporting the baffle;
the support comprises an upper support plate and a plurality of longitudinal holes penetrating through the upper support plate, one thermocouple correspondingly penetrates through one longitudinal hole and is fixed in the longitudinal hole, and the thermocouple comprises a thermocouple probe;
the elastic element is arranged between the top surface of the bracket and the baffle;
the bearing body further comprises an opening penetrating through the upper bearing plate, and the thermocouple probe penetrates through the opening and is lower than the lower surface of the upper bearing plate;
the chip test seat is used for fixing a chip;
the chip test seat is fixed in the accommodating cavity of the supporting body, and the thermocouple probe contacts the chip.
2. The temperature calibration device of claim 1, wherein the temperature calibration device further comprises: the limiting column is positioned between the upper bearing plate of the bearing body and the upper supporting plate of the bracket.
3. The temperature calibration device according to claim 2, wherein the limit posts are located in a middle area of the upper bearing plate, and the openings are symmetrically distributed on both sides of the limit posts along the length direction on the upper bearing plate.
4. The temperature calibration device of claim 1, wherein the bracket further comprises: and the bracket extending column extends downwards from the upper supporting plate, and the longitudinal hole also penetrates through the bracket extending column.
5. The temperature calibration device of claim 1, wherein the thermocouple probe is secured to a sidewall of the longitudinal bore by a threaded connection or by a tight fit of a washer.
6. The temperature calibration device of claim 1, wherein a locating pin is provided on a side of a lower surface of the upper carrier plate for locating the carrier with the die test pad.
7. The temperature calibration device of claim 1, wherein the resilient element comprises a spring or a cylindrical elastomer.
8. A temperature calibration device according to any one of claims 1 to 7, wherein the chip test socket comprises a base on which a plurality of floating plates for fixing the chip to be tested are formed.
9. The temperature calibration device of claim 8, wherein a spring is formed between a lower middle region of the floating plate and the base, and a heating element is formed between a lower peripheral region of the floating plate and the base.
10. The temperature calibration device of claim 1, wherein at least two buckles are provided on the carrier, the buckles comprise buckle handles and clamping jaws which are connected, the buckle handles are pressed, the buckles are opened, the chip test seat is embedded in the accommodating cavity of the carrier, the buckle handles are loosened, the clamping jaws clamp the chip test seat, and the chip test seat and the carrier are fixed together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322145763.2U CN220508265U (en) | 2023-08-10 | 2023-08-10 | Temperature calibration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322145763.2U CN220508265U (en) | 2023-08-10 | 2023-08-10 | Temperature calibration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220508265U true CN220508265U (en) | 2024-02-20 |
Family
ID=89881346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322145763.2U Active CN220508265U (en) | 2023-08-10 | 2023-08-10 | Temperature calibration device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220508265U (en) |
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2023
- 2023-08-10 CN CN202322145763.2U patent/CN220508265U/en active Active
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