CN213274645U - Temperature rise test fixture for circuit board device - Google Patents
Temperature rise test fixture for circuit board device Download PDFInfo
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- CN213274645U CN213274645U CN202022460740.7U CN202022460740U CN213274645U CN 213274645 U CN213274645 U CN 213274645U CN 202022460740 U CN202022460740 U CN 202022460740U CN 213274645 U CN213274645 U CN 213274645U
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- temperature sensing
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- 238000012360 testing method Methods 0.000 title claims abstract description 47
- 239000000523 sample Substances 0.000 claims abstract description 32
- 238000001514 detection method Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
An embodiment of the utility model provides a circuit board device temperature rise test fixture relates to circuit board detection technology field. The temperature rise test jig for the circuit board device comprises a jig shell, a first support, a second support and a third support, wherein the first support is connected to the jig shell in a sliding mode, the sliding direction is the first direction, the temperature sensing assembly is connected to the first support, the second support is connected to the jig shell in a sliding mode, the sliding direction is the first direction, the temperature sensing assembly is connected to the second support, the third support is connected to the jig shell in a sliding mode, the sliding direction is the second direction, the second direction is perpendicular to the first direction, the third support is located between the first support and the second support, and the third support is used for bearing a circuit board. The temperature rise test fixture for the circuit board device can be used for saving the test time and improving the working efficiency without frequently adhering and detaching the temperature sensing probe.
Description
Technical Field
The utility model relates to a circuit board detects technical field, particularly, relates to a circuit board device temperature rise test fixture.
Background
At present, for the temperature rise test of devices on a PCBA (Printed Circuit Board), usually a tester contacts each temperature sensing probe with a tested device and bonds the temperature sensing probe on the tested device by using instant adhesive, an accelerant needs to be dripped on the instant adhesive so that the instant adhesive can be rapidly solidified, the instant adhesive is dissolved by using a debonding agent after the test is finished so that the temperature sensing probe can be taken down from the tested device, and the temperature sensing probe needs to be bonded and detached once every test, so that the operation is time-consuming, the working efficiency is low, and meanwhile, the temperature sensing probe is easy to damage.
Therefore, the temperature rise test fixture for the circuit board device is designed, the temperature sensing probe does not need to be frequently adhered and detached, the test time is saved, and the working efficiency is improved, which is a technical problem which is urgently needed to be solved at present.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a circuit board device temperature rise test fixture, it can not need frequently to bond and dismantle temperature sensing probe, practices thrift test time, improves work efficiency.
The embodiment of the utility model is realized like this:
a temperature rise test fixture for circuit board devices comprises:
a jig shell;
the first support is connected to the jig shell in a sliding mode, the sliding direction is the first direction, and the first support is connected with a temperature sensing assembly;
the second support is connected to the jig shell in a sliding mode, the sliding direction is the first direction, and the temperature sensing assembly is connected to the second support;
the third support is connected to the jig shell in a sliding mode, the sliding direction of the third support is the second direction, the second direction is perpendicular to the first direction, the third support is located between the first support and the second support, and the third support is used for bearing a circuit board.
In an optional embodiment, the jig housing is provided with a first bar-shaped hole, a second bar-shaped hole and a third bar-shaped hole, the first bar-shaped hole and the second bar-shaped hole are arranged in parallel or in a collinear manner, the third bar-shaped hole is perpendicular to the first bar-shaped hole, and the first support, the second support and the third support are respectively connected to the first bar-shaped hole, the second bar-shaped hole and the third bar-shaped hole in a sliding manner.
In an alternative embodiment, the first bracket comprises:
the first screen plate is connected with the temperature sensing assembly;
and the first bolt is in threaded connection with the side surface of the first net plate and is in sliding connection with the first strip-shaped hole.
In an optional embodiment, the first mesh plate is provided with a fourth hole, the fourth hole is parallel to the third strip-shaped hole, and the temperature sensing assembly is slidably connected to the fourth hole.
In an alternative embodiment, the second bracket comprises:
the second screen plate is connected with the temperature sensing assembly;
and the second bolt is in threaded connection with the side surface of the second net plate and is in sliding connection with the second strip-shaped hole.
In an optional embodiment, the second mesh plate is provided with a fifth strip-shaped hole, the fifth strip-shaped hole is parallel to the third strip-shaped hole, and the temperature sensing assembly is slidably connected to the fifth strip-shaped hole.
In an alternative embodiment, the third bracket comprises:
the two support rods are arranged in parallel at intervals, grooves are formed in two opposite sides of the two support rods, and the circuit board is accommodated in the grooves;
and the third bolt is in threaded connection with the end part of the supporting rod and is in sliding connection with the third strip-shaped hole.
In an alternative embodiment, the temperature sensing assembly comprises:
the supporting seat is connected to the first bracket or the second bracket in a sliding mode;
and the temperature sensing probe is connected to the supporting seat.
In an alternative embodiment, the support seat comprises:
the two convex parts are arranged at intervals and clamped on the first bracket or the second bracket;
the flexible portion is connected on the convex part and is close to one end of the circuit board, and the temperature sensing probe extends out of the flexible portion.
In an alternative embodiment, the temperature sensing probe extends from the flexible portion over a length range of: 1 mm-2 mm.
The embodiment of the utility model provides a circuit board device temperature rise test fixture's beneficial effect includes:
the circuit board is fixed on the third support, the first support and the second support which can slide perpendicular to the circuit board are arranged on two sides of the circuit board respectively, the temperature sensing assemblies are connected on the first support and the second support, the temperature sensing assemblies can be in contact with the components on two sides of the circuit board to be tested by sliding the first support, the second support and the third support on the jig shell, the temperature rise of the components on two sides of the circuit board can be conveniently tested, the existing mode of testing the temperature rise of the components is replaced, instant adhesive, accelerant and debonding agent do not need to be used any more, a temperature sensing probe does not need to be frequently adhered and detached, the testing time is saved, and the working efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a circuit board device temperature rise test fixture provided by an embodiment of the present invention;
fig. 2 is an exploded schematic view of a temperature rise testing jig for a circuit board device provided in an embodiment of the present invention;
fig. 3 is a schematic view of an internal structure of a temperature rise testing jig for a circuit board device according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a temperature sensing assembly;
FIG. 5 is an exploded view of the temperature sensing assembly;
fig. 6 is a flowchart of the temperature rise testing jig for the circuit board device.
Icon: 100-a temperature rise test fixture for a circuit board device; 110-a fixture housing; 111-a first strip aperture; 112-a second strip-shaped hole; 113-a third bar aperture; 120-a first scaffold; 121-a first mesh sheet; 122-fourth aperture; 123-a first bolt; 130-a second bracket; 131-a second mesh sheet; 132-a fifth strip-shaped hole; 133-a second bolt; 140-a third support; 141-a support bar; 142-a groove; 143-a third bolt; 150-a temperature sensing component; 151-supporting seat; 152-a convex part; 153-a flexible portion; 154-temperature sensing probe; 200-circuit board.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 and fig. 2, the present embodiment provides a temperature rise test fixture 100 for testing a temperature rise of a component on a circuit board 200, where the circuit board 200 includes a PCBA.
The temperature rise testing jig 100 for circuit board devices comprises a jig housing 110, a first support 120, a second support 130, a third support 140 and a temperature sensing assembly 150. The fixture housing 110 is a frame structure, and the circuit board 200 to be tested is disposed inside the fixture housing 110, so as to prevent a user from contacting a high voltage inside the fixture housing 110 and protect the user. The third bracket 140 is used for carrying the circuit board 200, the third bracket 140 is disposed between the first bracket 120 and the second bracket 130, the temperature sensing assemblies 150 are disposed on the first bracket 120 and the second bracket 130, and the temperature rise of the components on the circuit board 200 on the third bracket 140 can be conveniently tested by adjusting the positions of the first bracket 120 and the second bracket 130.
Specifically, first bar hole 111, second bar hole 112 and third bar hole 113 have been seted up on tool shell 110, wherein, first bar hole 111 and second bar hole 112 have all been seted up on four lateral walls of tool shell 110, third bar hole 113 has been seted up on two relative lateral walls of tool shell 110, first bar hole 111 and second bar hole 112 are parallel or the collineation setting, third bar hole 113 is perpendicular to first bar hole 111, first support 120, second support 130 and third support 140 are sliding connection respectively in first bar hole 111, second bar hole 112 and third bar hole 113.
In this embodiment, the sliding direction of the first bracket 120 and the second bracket 130 is a first direction, and the sliding direction of the third bracket 140 is a second direction perpendicular to the first direction, where the first direction may be the height direction of the fixture housing 110, and the second direction may be the length direction of the fixture housing 110. In other embodiments, the first direction may be a length direction of the jig housing 110, and the second direction may be a height direction of the jig housing 110.
Referring to fig. 3, the first bracket 120 includes a first screen 121 and a first bolt 123, wherein the first screen 121 is provided with a fourth hole 122, the fourth hole 122 is parallel to the third hole 113, the temperature sensing element 150 is slidably connected to the fourth hole 122, and the temperature sensing element 150 can test the temperature rise of the component on the top of the circuit board 200. The first bolt 123 is screwed on the side of the first net plate 121 and slidably connected with the first bar-shaped hole 111. Therefore, the first net plate 121 can slide along the first strip-shaped hole 111 by loosening the first bolt 123, so as to adjust the position of the first bracket 120, and then the position of the first bracket 120 can be fixed by screwing the first bolt 123.
The second bracket 130 includes a second screen 131 and a second bolt 133, wherein the second screen 131 has a fifth strip-shaped hole 132, the fifth strip-shaped hole 132 is parallel to the third strip-shaped hole 113, the temperature sensing assembly 150 is slidably connected to the fifth strip-shaped hole 132, and the temperature sensing assembly 150 is used for testing the temperature rise of the component at the bottom of the circuit board 200. The second bolt 133 is screwed to a side of the second net plate 131 and slidably coupled to the second bar hole 112. Therefore, the second net plate 131 can slide along the second strip-shaped hole 112 by loosening the second bolt 133 to adjust the position of the second bracket 130, and the position of the second bracket 130 can be fixed by screwing the second bolt 133.
The third bracket 140 includes two support rods 141 and a third bolt 143, wherein the two support rods 141 are spaced and arranged in parallel, two opposite sides of the two support rods 141 are provided with grooves 142, the circuit board 200 is accommodated in the grooves 142, and the third bolt 143 is screwed to the end of the support rods 141 and slidably connected to the third bar-shaped hole 113. Therefore, the supporting rod 141 can slide along the third strip-shaped hole 113 by loosening the third bolt 143, so as to adjust the position of the supporting rod 141, not only the distance between the two supporting rods 141 can be adjusted to adapt to circuit boards 200 of various sizes, but also the position of the third bracket 140 can be adjusted to adapt to the position of the temperature sensing assembly 150, and then the position of the third bracket 140 can be fixed by screwing the third bolt 143.
Referring to fig. 4 and 5, the number of the temperature sensing assemblies 150 may be determined according to the number of components on the circuit board 200 to be tested. The temperature sensing assembly 150 comprises a supporting seat 151 and a temperature sensing probe 154, wherein the supporting seat 151 is made of a high temperature resistant material, the supporting seat 151 comprises a convex portion 152 and a flexible portion 153, the two convex portions 152 are arranged at intervals, the two convex portions 152 are clamped on two sides of the fourth strip-shaped hole 122 of the first support 120 or two sides of the fifth strip-shaped hole 132 of the second support 130, the supporting seat 151 is connected to the first support 120 or the second support 130 in a sliding mode, and the flexible portion 153 is connected to one end, close to the circuit board 200, of the convex portion 152.
The temperature sensing probe 154 penetrates the supporting base 151, the temperature sensing probe 154 extends from the flexible portion 153, and the length range of the temperature sensing probe 154 extending from the flexible portion 153 is: 1mm to 2mm to facilitate good contact of the temperature sensing probe 154 with the components. The wire of the temperature sensing probe 154 can be TT-K-30/36-SLE, and the wire is thin and soft and is convenient to bend. Therefore, the supporting base 151 slides along the fourth hole 122 or the fifth hole 132, so that the position of the temperature sensing probe 154 can be adjusted by large displacement, and then the position of the temperature sensing probe 154 can be adjusted by small displacement by changing the shape of the flexible portion 153, so that the temperature sensing probe 154 can contact the components on the circuit board 200, and the stress of the components can be balanced.
Referring to fig. 6, the working process of the temperature rise testing jig 100 for circuit board devices provided in this embodiment is as follows:
s1: the position of the third bracket 140 is adjusted according to the size of the circuit board 200, and the circuit board 200 is fixed to the third bracket 140.
S2: the position of the first bracket 120 is adjusted, then the position of the temperature sensing probe 154 on the first bracket 120 is adjusted to ensure that the temperature sensing probe 154 contacts with the components on the circuit board 200, and finally the position of the first bracket 120 is fixed.
S3: the position of the second bracket 130 is adjusted first, then the position of the temperature sensing probe 154 on the second bracket 130 is adjusted to ensure that the temperature sensing probe 154 contacts with the components on the circuit board 200, and finally the position of the second bracket 130 is fixed.
Wherein, the sequence of S2 and S3 is not strict, and can be carried out sequentially or simultaneously.
S4: the temperature sensing probe 154 is connected to a temperature tester, the temperature tester is started to record data, and the circuit board 200 is operated in a set gear mode.
S5: after the test is finished, the temperature rise test data is exported, the power supply is turned off, and the circuit board 200 is taken down.
The beneficial effects of the circuit board device temperature rise test fixture 100 provided by the embodiment include:
1. the jig can conveniently test the temperature rise of components on two sides of the circuit board 200, and does not need to repeatedly connect and disassemble the temperature sensing probe 154, thereby not only avoiding the damage of the temperature sensing probe 154, but also saving the test time and improving the working efficiency;
2. the jig replaces the existing mode of testing the temperature rise of components, does not need to use instant adhesive, accelerator and debonder, and saves the testing cost;
2. the third bracket 140 may be suitable for fixing circuit boards 200 of various sizes, so that the fixture has better applicability.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a circuit board device temperature rise test fixture which characterized in that, circuit board device temperature rise test fixture includes:
a jig housing (110);
the first support (120) is connected to the jig shell (110) in a sliding mode, the sliding direction is the first direction, and the temperature sensing assembly (150) is connected to the first support (120);
the second support (130) is connected to the jig shell (110) in a sliding mode, the sliding direction is the first direction, and the temperature sensing assembly (150) is connected to the second support (130);
the third support (140) is slidably connected to the jig housing (110) and has a second sliding direction, the second sliding direction is perpendicular to the first sliding direction, the third support (140) is located between the first support (120) and the second support (130), and the third support (140) is used for bearing a circuit board (200).
2. The temperature rise test fixture for circuit board devices according to claim 1, wherein a first bar-shaped hole (111), a second bar-shaped hole (112) and a third bar-shaped hole (113) are formed in the fixture housing (110), the first bar-shaped hole (111) and the second bar-shaped hole (112) are arranged in parallel or in a collinear manner, the third bar-shaped hole (113) is perpendicular to the first bar-shaped hole (111), and the first support (120), the second support (130) and the third support (140) are respectively connected to the first bar-shaped hole (111), the second bar-shaped hole (112) and the third bar-shaped hole (113) in a sliding manner.
3. The temperature rise test fixture for circuit board devices of claim 2, characterized in that said first bracket (120) comprises:
the first screen plate (121) is connected with the temperature sensing assembly (150);
and the first bolt (123) is in threaded connection with the side surface of the first net plate (121) and is in sliding connection with the first strip-shaped hole (111).
4. The temperature rise testing jig for circuit board devices as claimed in claim 3, wherein the first screen (121) is formed with a fourth hole (122), the fourth hole (122) is parallel to the third hole (113), and the temperature sensing assembly (150) is slidably connected to the fourth hole (122).
5. The temperature rise test fixture for circuit board devices of claim 2, characterized in that said second bracket (130) comprises:
the second screen plate (131) is connected with the temperature sensing assembly (150);
and the second bolt (133) is in threaded connection with the side surface of the second net plate (131) and is in sliding connection with the second strip-shaped hole (112).
6. The temperature rise testing jig for circuit board devices according to claim 5, wherein the second screen (131) is provided with a fifth bar-shaped hole (132), the fifth bar-shaped hole (132) is parallel to the third bar-shaped hole (113), and the temperature sensing assembly (150) is slidably connected to the fifth bar-shaped hole (132).
7. The temperature rise test fixture for circuit board devices of claim 2, characterized in that said third bracket (140) comprises:
the two support rods (141) are arranged in parallel at intervals, grooves (142) are formed in two opposite sides of the two support rods (141), and the circuit board (200) is accommodated in the grooves (142);
and the third bolt (143) is in threaded connection with the end part of the support rod (141) and is in sliding connection with the third strip-shaped hole (113).
8. The temperature rise test fixture for circuit board devices according to claim 1, wherein the temperature sensing assembly (150) comprises:
a support base (151) slidably connected to the first bracket (120) or the second bracket (130);
and the temperature sensing probe (154) is connected to the supporting seat (151).
9. The temperature rise test fixture for circuit board devices of claim 8, wherein said supporting base (151) comprises:
two protrusions (152) which are arranged at intervals, wherein the two protrusions (152) are clamped on the first bracket (120) or the second bracket (130);
and a flexible part (153) connected to one end of the convex part (152) close to the circuit board (200), wherein the temperature sensing probe (154) extends from the flexible part (153).
10. The temperature rise test fixture for circuit board devices according to claim 9, wherein the temperature sensing probe (154) extends from the flexible portion (153) in a length range of: 1 mm-2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022460740.7U CN213274645U (en) | 2020-10-29 | 2020-10-29 | Temperature rise test fixture for circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022460740.7U CN213274645U (en) | 2020-10-29 | 2020-10-29 | Temperature rise test fixture for circuit board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213274645U true CN213274645U (en) | 2021-05-25 |
Family
ID=75953495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022460740.7U Expired - Fee Related CN213274645U (en) | 2020-10-29 | 2020-10-29 | Temperature rise test fixture for circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213274645U (en) |
-
2020
- 2020-10-29 CN CN202022460740.7U patent/CN213274645U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210525 |