CN220485334U

CN220485334U - MEMS chip packaging structure and electronic equipment

Info

Publication number: CN220485334U
Application number: CN202322186645.6U
Authority: CN
Inventors: 庄瑞芬; 胡维; 李刚
Original assignee: Memsensing Microsystems Suzhou China Co Ltd
Current assignee: Memsensing Microsystems Suzhou China Co Ltd
Priority date: 2023-08-15
Filing date: 2023-08-15
Publication date: 2024-02-13
Anticipated expiration: 2033-08-15

Abstract

The application discloses a MEMS chip packaging structure and electronic equipment. Comprising the following steps: the MEMS device comprises a substrate, a shell, an MEMS chip and an ASIC chip, wherein the substrate is fixedly connected with the shell to form a cavity, and the MEMS chip and the ASIC chip are both positioned in the cavity; the substrate is provided with a supporting structure facing one side of the shell, the supporting structure comprises a supporting part and a connecting part, a gap is reserved between the supporting part and the substrate in the thickness direction of the substrate, the supporting part is connected to one side, far away from the substrate, of the connecting part, the MEMS chip is fixedly connected with the supporting part, and the ASIC chip is located in the gap between the supporting part and the substrate. By adopting the technical scheme provided by the application, the contact area between the MEMS chip and the substrate is reduced, the stress transmission caused by high overload impact can be reduced to a certain extent, and the integral high overload resistance of the MEMS chip is improved.

Description

MEMS chip packaging structure and electronic equipment

Technical Field

The application relates to the technical field of chip packaging, in particular to an MEMS chip packaging structure and electronic equipment.

Background

MEMS (Micro-Electro-Mechanical System, micro-electromechanical system) chip packages in the conventional art are generally packaged by using a plastic package material, and mechanical stress introduced by the package is stress caused by unequal volume changes between the MEMS chip and the package material due to different thermal expansion coefficients of the plastic package material and the MEMS chip. The introduction of thermal stress can cause abnormal deformation of a MEMS structure sensitive to the stress, so that performance parameters such as resolution, sensitivity, stability and the like of the MEMS device are inhibited; particularly severe, can lead to device failure.

Accordingly, improvements in the art are needed.

Disclosure of Invention

The utility model aims to at least solve one of the technical problems in the prior art and provides a MEMS chip packaging structure and electronic equipment.

According to an aspect of the present application, the present application provides a MEMS chip package structure, including: the MEMS device comprises a substrate, a shell, an MEMS chip and an ASIC chip, wherein the substrate is fixedly connected with the shell to form a cavity, and the MEMS chip and the ASIC chip are both positioned in the cavity;

the substrate is provided with a supporting structure facing one side of the shell, the supporting structure comprises a supporting part and a connecting part, a gap is reserved between the supporting part and the substrate in the thickness direction of the substrate, the supporting part is connected to one side, far away from the substrate, of the connecting part, the MEMS chip is fixedly connected with the supporting part, and the ASIC chip is located in the gap between the supporting part and the substrate.

Further, the material of the supporting structure is silicon.

Optionally, the support structure is a cantilever structure or a bracket structure.

Further, the support structure is fixedly connected with the substrate through an adhesive.

Further, in the thickness direction of the substrate, projections of the MEMS chip and the ASIC chip overlap.

Further, the ASIC chip is provided with a ball-mounting device, and the ASIC chip is electrically connected with the substrate by ball-mounting welding.

Further, the arrangement of the implant balls is centrosymmetric.

Further, the substrate is a PCB substrate.

Further, a first bonding pad is arranged on the substrate, a first output terminal is arranged on the MEMS chip and is electrically connected with the first bonding pad on the substrate in a metal lead bonding mode, and the ASIC chip is electrically connected with the first bonding pad through a wiring arranged on the substrate.

Further, the MEMS chip is an inertial sensor chip.

Further, the shell is a metal shell.

Further, a stress relief groove is formed in a surface of the support portion, which faces the MEMS chip, wherein the stress relief groove includes a cross beam structure or an annular structure.

According to another aspect of the present application, there is provided an electronic device including any one of the MEMS chip package structures described above.

By adopting the MEMS chip packaging structure and the electronic equipment provided by the embodiment of the application, the contact area between the MEMS chip and the PCB substrate can be reduced, so that the stress transmission caused by high overload impact is reduced to a certain extent, and the integral high overload resistance of the MEMS chip is improved.

Drawings

Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic diagram of a MEMS chip package structure according to an embodiment of the present application.

Fig. 2 is a schematic diagram of still another MEMS chip package structure according to an embodiment of the present application.

Fig. 3A is a schematic top view of a supporting portion of a supporting structure according to an embodiment of the present application.

Fig. 3B is a schematic top view of a support portion of yet another support structure according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

The MEMS chip package structure and the electronic device in the present application will be described in detail with reference to the accompanying drawings and the specific embodiments.

The embodiment of the application provides a MEMS chip packaging structure, which comprises: the MEMS device comprises a substrate, a shell, an MEMS chip and an ASIC chip, wherein the substrate is fixedly connected with the shell to form a cavity, and the MEMS chip and the ASIC chip are both positioned in the cavity;

By adopting the technical scheme provided by the embodiment of the application, the stress transmission caused by high overload impact can be reduced to a certain extent by reducing the contact area between the MEMS chip and the substrate, and the integral high overload resistance of the MEMS chip is improved.

Referring to fig. 1, an embodiment of the present application provides a MEMS chip package structure, including: the MEMS device comprises a substrate 2, a shell 1, an MEMS chip 3 and an ASIC chip 4, wherein the substrate 2 is fixedly connected with the shell 2 to form a cavity 11, and the MEMS chip 3 and the ASIC chip 4 are both positioned in the cavity 11; wherein, the substrate 2 is provided with the bearing structure 6 towards one side of casing 1, bearing structure 6 includes supporting part 61 and connecting portion 62, in the thickness direction of substrate 2, support part 61 with have the clearance between the substrate 2, supporting part 61 connects the connecting portion 62 keep away from one side of substrate 2, MEMS chip 3 with supporting part 61 fixed connection, ASIC chip 4 is located the supporting part 61 with the clearance between the substrate 2.

Illustratively, in the claimed embodiment, the substrate 2 is a PCB (Printed Circuit Board ) substrate. The PCB substrate is a support for electronic components (e.g., MEMS chips and ASIC chips) and is also a carrier for electrical interconnection of the electronic components, for example, copper plating is performed on the PCB substrate as a connection wire. The substrate 2 is a wiring board based on a multi-layered copper-clad design as a connecting wire, and may include, for example, a base material layer, a metal layer, and a solder resist layer.

In the conventional technology, after the MEMS chip 3 is manufactured, the bottom surface of the substrate of the MEMS chip 3 is soldered to the PCB substrate to electrically connect with the signal processing circuit on the PCB substrate, but in the soldering process, the PCB substrate is deformed due to heating, and the deformation on the PCB substrate is conducted to the MEMS chip 3, so that the sensitive structure on the MEMS chip 3 is caused to generate stress concentration and generate unnecessary deformation, so that the detection sensitivity of the MEMS chip 3 is reduced.

In order to reduce stress caused by deformation of the PCB substrate due to soldering between the bottom surface of the substrate of the MEMS chip and the PCB substrate, a common technique is to attach the PCB substrate by means of an adhesive, however, stress received by the PCB substrate is transferred to the MEMS chip by means of the adhesive, resulting in drift of output.

Further, the supporting structure 6 is made of silicon, which is not only easy to obtain, but also convenient to manufacture.

Further, the support structure 6 is fixedly connected with the substrate 2 by an adhesive. Illustratively, the connection portion 62 of the support structure 6 is attached to the substrate 2 by means of a die-bonding adhesive; the MEMS chip 3 is attached to the support portion 61 of the support structure 6 by means of an adhesive sheet.

In some embodiments, the support structure 6 is a cantilever structure or a bracket structure.

Referring to fig. 1 and 2, the bracket structure is adopted, and compared with the cantilever structure, the bracket structure has solid supporting points around, so that the overall mounting difficulty is smaller than that of the cantilever structure.

Referring to fig. 1 and 2, compared with the support structure, the cantilever structure can realize fixed connection between one end and the substrate 2, and the suspension part of the cantilever structure is suspended on the substrate 2, so that the contact area between the cantilever structure and the substrate 2 can be smaller, and the stress of the received substrate 2 is also smaller. When stress acts on the whole device, the structure of the suspended part is deformed, and the MEMS chip 3 is integrally attached to the suspended part, so that the deformation is not transmitted to the inside of the MEMS chip 3, and the output of the MEMS chip 3 is not affected.

Further, in the embodiment of the present application, in the thickness direction of the substrate 2, the projections of the MEMS chip 3 and the ASIC chip 4 overlap, so that the space of the package structure can be effectively utilized, and the area occupied by the whole device can be reduced.

Further, the ASIC chip 4 is provided with a ball mounting 41, and the ASIC chip 4 is electrically connected to the substrate 2 by soldering the ball mounting 41. That is, the ASIC chip 4 may be directly attached to the substrate 2 by the ball 41, so that electrical connection with the substrate 2 by wire bonding is not required, and the mounting difficulty of the cantilever structure can be reduced, and since only the MEMS chip 3 is attached to the cantilever structure, the MEMS chip 3 can be placed in a central symmetry position of the whole package structure as much as possible, so that the MEMS chip 3 is insensitive to the external temperature and the stresses can be substantially offset.

Further, the ASIC chip 4 may be disposed in the center of the entire package, and the placement of the balls is centrosymmetric, so that the influence of stress may be reduced to the greatest extent.

Further, the first bonding pad 21 is disposed on the substrate 2, the first output terminal 31 is disposed on the MEMS chip 3, the first output terminal 31 is electrically connected with the first bonding pad 21 on the substrate 2 through a metal wire bonding manner, and the ASIC chip 4 is electrically connected with the first bonding pad 21 through a trace disposed on the substrate 2, so that electrical connection between the MEMS chip 3 and the ASIC chip 4 can be achieved, and the wire-arc height of a metal wire between the MEMS chip 3 and the substrate 2 is reduced, so that the reliability of the device is further improved.

Further, a second bonding pad 22 is further disposed on the substrate 2, the second bonding pad 22 is located at a side of the substrate facing away from the cavity 11, and the second bonding pad 22 is used for electrically connecting with an external electrical connection device.

In some embodiments, the MEMS chip 3 is an inertial sensor chip.

Further, in the embodiment of the present application, the housing 1 is a metal housing. The packaging mode of the metal shell is adopted to replace the plastic packaging mode of the plastic packaging material in the prior art, so that the influence of the plastic packaging material on the output of a product can be reduced to the greatest extent under the condition that the whole packaging size is unchanged. And yet another advantage of the metal housing: the anti-interference capability of the device can be reduced to the greatest extent, for example, the risk of insufficient signal shielding for the MEMS chip 3 and the ASIC chip 4 can be reduced, and therefore the device can be better applied to different use scenes.

In some embodiments, as shown in fig. 3A and 3B, a stress relief groove 5 is provided on a surface of the support portion 61 facing the MEMS chip, wherein the stress relief groove 5 includes a cross beam structure or a ring structure, and the MEMS chip is mounted on the support portion 61, for example, by the stress relief groove 5, the stress to which the MEMS chip is subjected is further reduced.

The utility model also provides electronic equipment, which comprises any MEMS chip packaging structure. The MEMS chip packaging structure can be applied to various electronic devices, such as an accelerometer, an inertial measurement instrument and the like.

Therefore, the MEMS chip packaging structure and the electronic equipment provided by the embodiment of the application can reduce the contact area between the MEMS chip and the substrate, so that the stress transmission caused by high overload impact is reduced to a certain extent, and the integral high overload resistance of the MEMS chip is improved.

In the various embodiments of the application, if there is no specific description or logical conflict, terms or descriptions between the various embodiments have consistency and may mutually refer, technical features in the various embodiments may be combined to form new embodiments according to their inherent logical relationships. In the present application, "at least one" means one or more, and "a plurality" means two or more.

It will be appreciated that the various numerical numbers referred to in the embodiments of the present application are merely for ease of description and are not intended to limit the scope of the embodiments of the present application. The sequence number of each process does not mean the sequence of the execution sequence, and the execution sequence of each process should be determined according to the function and the internal logic.

The MEMS pressure sensor and the electronic device provided by the embodiments of the present application are described in detail, and specific examples are applied herein to illustrate the principles and embodiments of the present application, where the description of the above embodiments is only for helping to understand the MEMS pressure sensor and the core idea of the present application; meanwhile, as those skilled in the art will have modifications in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims

1. A MEMS chip package structure, comprising: the MEMS device comprises a substrate, a shell, an MEMS chip and an ASIC chip, wherein the substrate is fixedly connected with the shell to form a cavity, and the MEMS chip and the ASIC chip are both positioned in the cavity;

2. The MEMS chip package structure of claim 1, wherein,

the supporting structure is made of silicon.

3. The MEMS chip package structure of claim 1, wherein,

the supporting structure is a cantilever beam structure or a bracket structure.

4. The MEMS chip package structure of claim 1, wherein,

the supporting structure is fixedly connected with the substrate through an adhesive.

5. The MEMS chip package structure of claim 1, wherein,

in the thickness direction of the substrate, projections of the MEMS chip and the ASIC chip overlap.

6. The MEMS chip package structure of claim 5, wherein,

the ASIC chip is provided with a ball implant, and is electrically connected with the substrate in a ball implant welding mode.

7. The MEMS chip package structure of claim 6, wherein,

the arrangement of the implant balls is centrosymmetric.

8. The MEMS chip package structure of claim 1, wherein,

the substrate is a PCB substrate.

9. The MEMS chip package structure of claim 8, wherein,

the MEMS chip is characterized in that a first bonding pad is arranged on the substrate, a first output terminal is arranged on the MEMS chip and is electrically connected with the first bonding pad on the substrate in a metal lead bonding mode, and the ASIC chip is electrically connected with the first bonding pad through a wiring arranged on the substrate.

10. The MEMS chip package structure of claim 1, wherein,

the MEMS chip is an inertial sensor chip.

11. The MEMS chip package structure of claim 1, wherein,

the shell is a metal shell.

12. The MEMS chip package structure of claim 1, wherein,

and a stress release groove is formed in the surface of one side of the supporting part, which faces the MEMS chip, wherein the stress release groove comprises a cross beam structure or an annular structure.

13. An electronic device comprising a MEMS chip package as claimed in any one of claims 1 to 12.