CN111010637A - Back of body advances sound formula microphone with two pads - Google Patents
Back of body advances sound formula microphone with two pads Download PDFInfo
- Publication number
- CN111010637A CN111010637A CN201911397905.6A CN201911397905A CN111010637A CN 111010637 A CN111010637 A CN 111010637A CN 201911397905 A CN201911397905 A CN 201911397905A CN 111010637 A CN111010637 A CN 111010637A
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- Prior art keywords
- pad
- pin
- microphone
- circuit substrate
- bonding pad
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- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims description 7
- 230000009977 dual effect Effects 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The embodiment of the invention discloses a back-to-back voice-in microphone with double bonding pads, which comprises a circuit substrate, wherein a packaging shell is buckled on the circuit substrate, a microphone component is arranged at the top of the circuit substrate, a first pin, a second pin and a third pin are arranged on the circuit substrate, and the bottom surface of the circuit substrate is provided with: an acoustic via; the inner bonding pad is arranged on the bottom surface of the circuit substrate and is connected with the first pin; the outer bonding pad is arranged around the outer side of the inner bonding pad and connected with the first pin; the invention adopts a mode that the outer welding disc surrounds the inner welding disc, thereby increasing the connecting area of the welding disc, avoiding the problem of insufficient air tightness of a single welding disc, connecting the double welding discs with an electric element, improving the air tightness of the welding disc of the microphone, ensuring that the sound of the background sound type microphone is not lost, and leading the sound of the microphone to be larger and clearer.
Description
Technical Field
The invention relates to the field of microphones, in particular to a back-to-back sound-inlet microphone with double bonding pads.
Background
The pad structure on the PCB board of the conventional microphone is a ring shape. When the surface mounting process on the microphone PCB is performed, a gap may be generated between the external circuit of the microphone and the pad, thereby generating a gap or a void, which may cause a problem of poor air tightness. Especially, in the microphone (the sound inlet hole is arranged on the PCB) with sound entering from the back, poor air tightness can cause sound to slide away from the hole or the gap, and the problems of small sound, unclear sound and the like are caused.
Disclosure of Invention
The present invention is directed to a back-entry microphone with dual pads, which solves the above problems.
The technical problem solved by the invention can be realized by adopting the following technical scheme:
a microphone with double pads comprises
The circuit substrate is buckled with a packaging shell, a microphone assembly is installed at the top of the circuit substrate, a first pin, a second pin and a third pin are arranged on the circuit substrate, and the bottom surface of the circuit substrate is provided with:
an acoustic via;
the inner bonding pad is in a closed ring shape and is connected with the first pin;
the outer bonding pad is in a closed ring shape, is arranged around the outer side of the inner bonding pad and is connected with the first pin;
and at least one rectangular bonding pad is connected with the second pin, and at least one rectangular bonding pad is connected with the third pin.
Preferably, the package shell is a metal shell, and the circuit substrate is a ceramic PCB.
Preferably, the distance between the inner bonding pad and the outer bonding pad and the acoustic sensor is not less than 2mm, and the distance between the inner bonding pad and the outer bonding pad and the application specific integrated chip is not less than 2 mm.
Preferably, the inner bonding pad and the outer bonding pad are both annular, and the inner bonding pad and the outer bonding pad are concentric.
Preferably, the inner pad and the outer pad are connected by a strip pad.
Preferably, the inner pad, the outer pad and the bar pad are electrically connected to the circuit substrate.
Preferably, the first pin, the inner pad and the outer pad are output terminals, the second pin and the rectangular pad connected to the second pin are power input terminals, and the third pin and the rectangular pad connected to the third pin are ground terminals.
Preferably, the microphone assembly comprises an acoustic sensor, and the acoustic sensor is arranged corresponding to the position of the acoustic through hole.
Has the advantages that: the invention adopts the mode that the inner bonding pad is surrounded by the outer bonding pad, increases the connection area of the bonding pad, avoids the problem of insufficient air tightness of a single bonding pad, and improves the air tightness of the bonding pad of the microphone by connecting the double bonding pads with the electric element, so that the background sound type microphone has no sound loss, and the microphone has larger and clearer sound.
Drawings
Fig. 1 is a schematic cross-sectional view of a back-entry microphone according to the present invention;
fig. 2 is a schematic view of the back structure of the circuit substrate according to the present invention.
In the figure: 1-a circuit substrate; 2-packaging the shell; 3-an acoustic via; 4-an acoustic sensor; 5-an outer pad; 6-inner pads; 7-rectangular pads; 8-strip-shaped bonding pads;
11-a first pin; 12-a second pin; 13-third pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
As shown in fig. 1 and 2, the present invention provides a back-entry microphone having a dual pad, including
A circuit substrate 1, a packaging shell 2 is buckled on the circuit substrate 1, a microphone component is installed on the top of the circuit substrate 1, and the bottom surface of the circuit substrate 1 is provided with: the circuit substrate 1 is provided with a first pin 11, a second pin 12 and a third pin 13,
an acoustic through-hole 3;
a plurality of rectangular pads 7; at least one rectangular pad 7 is connected to the second lead 11, and at least one rectangular pad 7 is connected to the third lead 13.
At least one inner bonding pad 6 which is in a closed ring shape and is arranged on the bottom surface of the circuit substrate 1;
at least one outer bonding pad 5 is a closed ring shape and is arranged around the outer side of the inner bonding pad 6, and the inner bonding pad 3 and the outer bonding pad 5 are both connected with the first pins. The circuit of the microphone is connected with the circuit of the external equipment of the microphone through the inner bonding pad or the outer bonding pad. The circuitry of the microphone transmits signals to the microphone external device through the inner or outer pads.
The invention has the advantages that:
the invention adopts the mode that the inner bonding pad is surrounded by the outer bonding pad, increases the connection area of the bonding pad, avoids the problem of insufficient air tightness of a single bonding pad, and improves the air tightness of the bonding pad of the microphone by connecting the double bonding pads with the electric element, so that the background sound type microphone has no sound loss, and the microphone has larger and clearer sound.
The first pin 11, the inner bonding pad and the outer bonding pad are both output ends, the second pin and the rectangular bonding pad connected with the second pin are both power input ends, and the third pin and the rectangular bonding pad connected with the third pin are both grounding ends.
Or the first pin, the inner pad 6 and the outer pad 5 are both power supply input ends, the second pin 12 and the rectangular pad 7 connected with the second pin are both output ends, and the third pin 13 and the rectangular pad 7 connected with the third pin are both grounding ends.
Or the first pin 11, the inner pad 6 and the outer pad 5 are both grounded, the second pin 12 and the rectangular pad 7 connected with the second pin are both output ends, and the third pin 13 and the rectangular pad 7 connected with the third pin are both output ends.
Preferably, the three pads ensure power input, grounding and signal output of the microphone, and ensure normal operation of the microphone.
The microphone assembly comprises an acoustic sensor 4, and the acoustic sensor 4 is arranged corresponding to the position of the acoustic through hole 3.
As a preferred embodiment of the present invention, the package case 2 is a metal case, which can well protect the electronic devices in the microphone, and protect the electronic devices from being damaged by external force and electromagnetic or electrostatic interference.
The circuit substrate 1 is a ceramic PCB. Mems microphones are highly accurate but fragile and therefore cannot be stressed too much. The expansion coefficient of the ceramic in the ceramic PCB (Printed Circuit Board) is close to that of the silicon in the chip material, and thus, large stress is not generated during packaging or temperature change. The copper layer of the ceramic printed circuit board does not contain an oxidation layer, has the characteristics of corrosion resistance and the like in various complex environments, and improves the stability and the reliability. And the ceramic PCB also has good heat-conducting property and high-temperature resistance, so that the service life of the microphone of the micro electro mechanical system is prolonged, and the adaptability of the microphone to severe environment is improved.
As a preferred embodiment of the present invention, the acoustic sensor 4 is electrically connected to the circuit substrate 1. The internal circuitry of circuit substrate 1 provides the necessary current and voltage support for acoustic sensor 4 to ensure proper operation of acoustic sensor 4.
In a preferred embodiment of the present invention, the distance between the inner pad and the outer pad and the acoustic sensor is not less than 2mm, and the distance between the inner pad and the outer pad and the asic is not less than 2 mm. Because when the bonding pad is welded with an external electronic device of the microphone, the inner bonding pad and the outer bonding pad can generate heat, and the distance between the bonding pad and the acoustic sensor and the special integrated chip is larger than 2mm, the uneven heating and deformation of a chip area on a circuit board can be effectively avoided, so that the stress of each part of the MEMS device is uneven, and the integrity of the important electronic device on the circuit substrate is ensured.
As shown in fig. 2, as a preferred embodiment of the present invention, the inner pad 6 and the outer pad 5 are circular rings, and the inner pad 6 and the outer pad 5 are concentric. The double-circular-ring-shaped bonding pad is simple in processing technology, and a gap is formed between the two circular-ring-shaped bonding pads, so that the area of the bonding pads is saved.
As a preferred embodiment of the present invention, the inner pads 6 and the outer pads 5 are connected by strip-shaped pads 8. The internal circuit of the circuit board 1 can be connected to the external circuit of the microphone regardless of whether the internal pad or the external pad is connected.
As a preferred embodiment of the present invention, the inner pads 6, the outer pads 5, and the strip-shaped pads 8 are electrically connected to the circuit substrate 1.
The strip-shaped bonding pad with the inner bonding pad, the outer bonding pad and the two bonding pads is arranged has the following advantages:
(1) the welding area of the components is increased, so that the possibility of insufficient welding of the components is reduced, and the long-term stable work of the microphone is ensured;
(2) the outer pad is sleeved outside the inner pad, so that the soldering tin area is increased, the pores are reduced, and the air tightness grade of connection between the pad and a microphone external circuit device is improved;
(3) the inner bonding pad, the outer bonding pad and the strip bonding pad are all connected with the circuit of the circuit substrate, the bonding pad is more tightly connected with the circuit, the possibility of falling of the bonding pad is reduced, and the strength of the bonding pad is increased; when any one or two of the bonding pads are damaged or the soldering tin on the corresponding bonding pad falls off, and the other bonding pad is intact, the circuit is still smooth, the fault tolerance of the bonding pad is improved, and the circuit connection of the bonding pad is firmer and more reliable;
(4) interior pad, outer pad and bar pad are a body coupling structure, and processing technology is simple, has the fretwork part between the pad, can not plug up the hole of the outside electronic device of microphone.
The number of the rectangular pads 7 is four, and may be disposed at one side of the inner pads and the outer pads. And rectangle pad 7 is connected through second pin, third pin and circuit substrate's internal circuit electricity, and is in the same place with the external circuit welding of microphone, plays supplementary fixed and connecting circuit's effect, and the combination of a plurality of welding points makes circuit substrate 1 more firm with being connected of microphone, and when circuit substrate suffered external force, the welding of interior pad and outer pad was more difficult for droing, has guaranteed circuit connection's stability.
Supplementarily, for avoiding the bad problem of acoustics through-hole 3 gas tightness, can with acoustics through-hole set up in the middle part of interior pad 3 is downthehole, after the welding, has guaranteed microphone and outside gas tightness, has guaranteed the gas tightness, will enter the sound hole and correspond the setting with acoustics through-hole 3, can guarantee the pure input of sound.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (8)
1. A microphone with double pads and back sound, which is characterized in that the microphone comprises
The circuit substrate is buckled with a packaging shell, a microphone assembly is installed at the top of the circuit substrate, a first pin, a second pin and a third pin are arranged on the circuit substrate, and the bottom surface of the circuit substrate is provided with:
an acoustic via;
the inner bonding pad is in a closed ring shape and is connected with the first pin;
the outer bonding pad is in a closed ring shape, is arranged around the outer side of the inner bonding pad and is connected with the first pin;
and at least one rectangular bonding pad is connected with the second pin, and at least one rectangular bonding pad is connected with the third pin.
2. The microphone of claim 1, wherein the package is a metal case and the circuit substrate is a ceramic PCB.
3. A microphone with dual pads as claimed in claim 1, wherein the distance between the inner and outer pads and the acoustic sensor is not less than 2mm, and the distance between the inner and outer pads and the asic is not less than 2 mm.
4. A double-pad microphone according to claim 1 wherein the inner pad and the outer pad are each circular and concentric.
5. A microphone with dual pads as in claim 1 wherein the inner pad and the outer pad are connected by a strip pad.
6. A microphone having a dual pad backside tone as claimed in claim 5 wherein the inner pad, the outer pad and the bar pad are all electrically connected to the circuit substrate.
7. The microphone of claim 1, wherein the first pin and the inner and outer pads are output terminals, the second pin and the rectangular pad connected to the second pin are power input terminals, and the third pin and the rectangular pad connected to the third pin are ground terminals.
8. A double-pad backside-entry microphone as claimed in claim 1, wherein the microphone assembly comprises an acoustic sensor disposed corresponding to the location of the acoustic via.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911397905.6A CN111010637A (en) | 2019-12-30 | 2019-12-30 | Back of body advances sound formula microphone with two pads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911397905.6A CN111010637A (en) | 2019-12-30 | 2019-12-30 | Back of body advances sound formula microphone with two pads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111010637A true CN111010637A (en) | 2020-04-14 |
Family
ID=70119608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911397905.6A Pending CN111010637A (en) | 2019-12-30 | 2019-12-30 | Back of body advances sound formula microphone with two pads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111010637A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111432325A (en) * | 2020-04-23 | 2020-07-17 | 深圳市当智科技有限公司 | Packaging method of bottom-entry microphone |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120189144A1 (en) * | 2011-01-24 | 2012-07-26 | Analog Devices, Inc. | Packaged Microphone with Reduced Parasitics |
| US20150217991A1 (en) * | 2014-01-31 | 2015-08-06 | Invensense, Inc. | Mems device with split pad package |
| CN204810547U (en) * | 2015-07-17 | 2015-11-25 | 北京卓锐微技术有限公司 | Microphone installation component |
| CN105188004A (en) * | 2014-06-23 | 2015-12-23 | 钰太芯微电子科技（上海）有限公司 | Connection structure of digital electret microphone and digital electret microphone |
| CN208609193U (en) * | 2018-09-14 | 2019-03-15 | 歌尔智能科技有限公司 | A kind of MEMS Mike mould group |
| CN212811953U (en) * | 2019-12-30 | 2021-03-26 | 钰太芯微电子科技（上海）有限公司 | Back of body advances sound formula microphone with two pads |
-
2019
- 2019-12-30 CN CN201911397905.6A patent/CN111010637A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120189144A1 (en) * | 2011-01-24 | 2012-07-26 | Analog Devices, Inc. | Packaged Microphone with Reduced Parasitics |
| US20150217991A1 (en) * | 2014-01-31 | 2015-08-06 | Invensense, Inc. | Mems device with split pad package |
| CN105188004A (en) * | 2014-06-23 | 2015-12-23 | 钰太芯微电子科技（上海）有限公司 | Connection structure of digital electret microphone and digital electret microphone |
| CN204810547U (en) * | 2015-07-17 | 2015-11-25 | 北京卓锐微技术有限公司 | Microphone installation component |
| CN208609193U (en) * | 2018-09-14 | 2019-03-15 | 歌尔智能科技有限公司 | A kind of MEMS Mike mould group |
| CN212811953U (en) * | 2019-12-30 | 2021-03-26 | 钰太芯微电子科技（上海）有限公司 | Back of body advances sound formula microphone with two pads |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111432325A (en) * | 2020-04-23 | 2020-07-17 | 深圳市当智科技有限公司 | Packaging method of bottom-entry microphone |
| CN111432325B (en) * | 2020-04-23 | 2021-05-07 | 深圳市当智科技有限公司 | Packaging method of bottom-entry microphone |
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