CN212811953U - Back of body advances sound formula microphone with two pads - Google Patents
Back of body advances sound formula microphone with two pads Download PDFInfo
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- CN212811953U CN212811953U CN201922440883.9U CN201922440883U CN212811953U CN 212811953 U CN212811953 U CN 212811953U CN 201922440883 U CN201922440883 U CN 201922440883U CN 212811953 U CN212811953 U CN 212811953U
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Abstract
The embodiment of the utility model discloses back of body advances sound formula microphone with two pads, including a circuit substrate, a lock joint packaging shell on the circuit substrate, circuit substrate's top installation microphone subassembly, circuit substrate is last to set up first pin, second pin and third pin, circuit substrate's bottom surface sets up: an acoustic via; the inner bonding pad is arranged on the bottom surface of the circuit substrate and is connected with the first pin; the outer bonding pad is arranged around the outer side of the inner bonding pad and connected with the first pin; a plurality of supplementary pads, an at least rectangle pad is connected with the second pin, and an at least rectangle pad is connected with the third pin, the utility model discloses a mode of pad in outer pad encirclement has increased the connection area of pad, has avoided the not enough problem of gas tightness of single pad, and electric elements is connected to two pads, has improved the gas tightness of microphone pad, makes the microphone of background sound formula advance the sound and has not had the loss, and the microphone sound is bigger, more clear.
Description
Technical Field
The utility model relates to a microphone field especially relates to a carry on back and advance sound formula microphone with two pads.
Background
The pad structure on the PCB board of the conventional microphone is a ring shape. When the surface mounting process on the microphone PCB is performed, a gap may be generated between the external circuit of the microphone and the pad, thereby generating a gap or a void, which may cause a problem of poor air tightness. Especially, in the microphone (the sound inlet hole is arranged on the PCB) with sound entering from the back, poor air tightness can cause sound to slide away from the hole or the gap, and the problems of small sound, unclear sound and the like are caused.
Disclosure of Invention
An object of the utility model is to provide a back of body advances sound formula microphone with two pads, solves above technical problem.
The utility model provides a technical problem can adopt following technical scheme to realize:
a microphone with double pads comprises
The circuit substrate is buckled with a packaging shell, a microphone assembly is installed at the top of the circuit substrate, a first pin, a second pin and a third pin are arranged on the circuit substrate, and the bottom surface of the circuit substrate is provided with:
an acoustic via;
the inner bonding pad is in a closed ring shape and is connected with the first pin;
the outer bonding pad is in a closed ring shape, is arranged around the outer side of the inner bonding pad and is connected with the first pin;
and at least one rectangular bonding pad is connected with the second pin, and at least one rectangular bonding pad is connected with the third pin.
Preferably, the package shell is a metal shell, and the circuit substrate is a ceramic PCB.
Preferably, the distance between the inner bonding pad and the outer bonding pad and the acoustic sensor is not less than 2mm, and the distance between the inner bonding pad and the outer bonding pad and the application specific integrated chip is not less than 2 mm.
Preferably, the inner bonding pad and the outer bonding pad are both annular, and the inner bonding pad and the outer bonding pad are concentric.
Preferably, the inner pad and the outer pad are connected by a strip pad.
Preferably, the inner pad, the outer pad and the bar pad are electrically connected to the circuit substrate.
Preferably, the first pin, the inner pad and the outer pad are output terminals, the second pin and the rectangular pad connected to the second pin are power input terminals, and the third pin and the rectangular pad connected to the third pin are ground terminals.
Preferably, the microphone assembly comprises an acoustic sensor, and the acoustic sensor is arranged corresponding to the position of the acoustic through hole.
Has the advantages that: the utility model discloses a mode of pad in outer pad surrounds has increased the connection area of pad, has avoided the not enough problem of gas tightness of single pad, and electric elements is connected to two pads, has improved the gas tightness of microphone pad, makes the microphone of background sound formula advance the sound lossless, and the microphone sound is bigger, more clear.
Drawings
Fig. 1 is a schematic cross-sectional view of a back-to-back microphone according to the present invention;
fig. 2 is a schematic diagram of the back structure of the circuit substrate of the present invention.
In the figure: 1-a circuit substrate; 2-packaging the shell; 3-an acoustic via; 4-an acoustic sensor; 5-an outer pad; 6-inner pads; 7-rectangular pads; 8-strip-shaped bonding pads;
11-a first pin; 12-a second pin; 13-third pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be further described with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.
As shown in fig. 1 and 2, the present invention provides a microphone with double pads, comprising
A circuit substrate 1, a packaging shell 2 is buckled on the circuit substrate 1, a microphone component is installed on the top of the circuit substrate 1, and the bottom surface of the circuit substrate 1 is provided with: the circuit substrate 1 is provided with a first pin 11, a second pin 12 and a third pin 13,
an acoustic through-hole 3;
a plurality of rectangular pads 7; at least one rectangular pad 7 is connected to the second lead 11, and at least one rectangular pad 7 is connected to the third lead 13.
At least one inner bonding pad 6 which is in a closed ring shape and is arranged on the bottom surface of the circuit substrate 1;
at least one outer bonding pad 5 is a closed ring shape and is arranged around the outer side of the inner bonding pad 6, and the inner bonding pad 3 and the outer bonding pad 5 are both connected with the first pins. The circuit of the microphone is connected with the circuit of the external equipment of the microphone through the inner bonding pad or the outer bonding pad. The circuitry of the microphone transmits signals to the microphone external device through the inner or outer pads.
The utility model has the advantages that:
the utility model discloses a mode of pad in outer pad surrounds has increased the connection area of pad, has avoided the not enough problem of gas tightness of single pad, and electric elements is connected to two pads, has improved the gas tightness of microphone pad, makes the microphone of background sound formula advance the sound lossless, and the microphone sound is bigger, more clear.
The first pin 11, the inner bonding pad and the outer bonding pad are both output ends, the second pin and the rectangular bonding pad connected with the second pin are both power input ends, and the third pin and the rectangular bonding pad connected with the third pin are both grounding ends.
Or the first pin, the inner pad 6 and the outer pad 5 are both power supply input ends, the second pin 12 and the rectangular pad 7 connected with the second pin are both output ends, and the third pin 13 and the rectangular pad 7 connected with the third pin are both grounding ends.
Or the first pin 11, the inner pad 6 and the outer pad 5 are both grounded, the second pin 12 and the rectangular pad 7 connected with the second pin are both output ends, and the third pin 13 and the rectangular pad 7 connected with the third pin are both output ends.
Preferably, the three pads ensure power input, grounding and signal output of the microphone, and ensure normal operation of the microphone.
The microphone assembly comprises an acoustic sensor 4, and the acoustic sensor 4 is arranged corresponding to the position of the acoustic through hole 3.
As a preferred embodiment of the present invention, the package housing 2 is a metal shell, which can protect the electronic devices in the microphone well, and protect the electronic devices from external damage, electromagnetic interference or electrostatic interference.
The circuit substrate 1 is a ceramic PCB. Mems microphones are highly accurate but fragile and therefore cannot be stressed too much. The expansion coefficient of the ceramic in the ceramic PCB (Printed Circuit Board) is close to that of the silicon in the chip material, and thus, large stress is not generated during packaging or temperature change. The copper layer of the ceramic printed circuit board does not contain an oxidation layer, has the characteristics of corrosion resistance and the like in various complex environments, and improves the stability and the reliability. And the ceramic PCB also has good heat-conducting property and high-temperature resistance, so that the service life of the microphone of the micro electro mechanical system is prolonged, and the adaptability of the microphone to severe environment is improved.
As a preferred embodiment of the present invention, the acoustic sensor 4 is electrically connected to the circuit board 1. The internal circuitry of circuit substrate 1 provides the necessary current and voltage support for acoustic sensor 4 to ensure proper operation of acoustic sensor 4.
As a preferred embodiment of the utility model, the distance is not less than 2mm between interior pad and outer pad and the acoustic sensor, and the distance is not less than 2mm between interior pad and outer pad and the special integrated chip. Because when the bonding pad is welded with an external electronic device of the microphone, the inner bonding pad and the outer bonding pad can generate heat, and the distance between the bonding pad and the acoustic sensor and the special integrated chip is larger than 2mm, the uneven heating and deformation of a chip area on a circuit board can be effectively avoided, so that the stress of each part of the MEMS device is uneven, and the integrity of the important electronic device on the circuit substrate is ensured.
As shown in fig. 2, as a preferred embodiment of the present invention, the inner pad 6 and the outer pad 5 are both circular rings, and the inner pad 6 and the outer pad 5 are concentric. The double-circular-ring-shaped bonding pad is simple in processing technology, and a gap is formed between the two circular-ring-shaped bonding pads, so that the area of the bonding pads is saved.
As a preferred embodiment of the present invention, the inner pad 6 is connected to the outer pad 5 through a bar pad 8. The internal circuit of the circuit board 1 can be connected to the external circuit of the microphone regardless of whether the internal pad or the external pad is connected.
As a preferred embodiment of the present invention, the inner pad 6, the outer pad 5 and the bar-shaped pad 8 are all electrically connected to the circuit board 1.
The strip-shaped bonding pad with the inner bonding pad, the outer bonding pad and the two bonding pads is arranged has the following advantages:
(1) the welding area of the components is increased, so that the possibility of insufficient welding of the components is reduced, and the long-term stable work of the microphone is ensured;
(2) the outer pad is sleeved outside the inner pad, so that the soldering tin area is increased, the pores are reduced, and the air tightness grade of connection between the pad and a microphone external circuit device is improved;
(3) the inner bonding pad, the outer bonding pad and the strip bonding pad are all connected with the circuit of the circuit substrate, the bonding pad is more tightly connected with the circuit, the possibility of falling of the bonding pad is reduced, and the strength of the bonding pad is increased; when any one or two of the bonding pads are damaged or the soldering tin on the corresponding bonding pad falls off, and the other bonding pad is intact, the circuit is still smooth, the fault tolerance of the bonding pad is improved, and the circuit connection of the bonding pad is firmer and more reliable;
(4) interior pad, outer pad and bar pad are a body coupling structure, and processing technology is simple, has the fretwork part between the pad, can not plug up the hole of the outside electronic device of microphone.
The number of the rectangular pads 7 is four, and may be disposed at one side of the inner pads and the outer pads. And rectangle pad 7 is connected through second pin, third pin and circuit substrate's internal circuit electricity, and is in the same place with the external circuit welding of microphone, plays supplementary fixed and connecting circuit's effect, and the combination of a plurality of welding points makes circuit substrate 1 more firm with being connected of microphone, and when circuit substrate suffered external force, the welding of interior pad and outer pad was more difficult for droing, has guaranteed circuit connection's stability.
Supplementarily, for avoiding the bad problem of acoustics through-hole 3 gas tightness, can with acoustics through-hole set up in the middle part of interior pad 3 is downthehole, after the welding, has guaranteed microphone and outside gas tightness, has guaranteed the gas tightness, will enter the sound hole and correspond the setting with acoustics through-hole 3, can guarantee the pure input of sound.
The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and those skilled in the art should be able to realize the equivalent alternatives and obvious variations of the present invention.
Claims (8)
1. A microphone with double pads and back sound, which is characterized in that the microphone comprises
The circuit substrate is buckled with a packaging shell, a microphone assembly is installed at the top of the circuit substrate, a first pin, a second pin and a third pin are arranged on the circuit substrate, and the bottom surface of the circuit substrate is provided with:
an acoustic via;
the inner bonding pad is in a closed ring shape and is connected with the first pin;
the outer bonding pad is in a closed ring shape, is arranged around the outer side of the inner bonding pad and is connected with the first pin;
and at least one rectangular bonding pad is connected with the second pin, and at least one rectangular bonding pad is connected with the third pin.
2. The microphone of claim 1, wherein the package is a metal case and the circuit substrate is a ceramic PCB.
3. A double-pad microphone with back feed as claimed in claim 1, wherein the circuit substrate is provided with a chip, the microphone assembly comprises an acoustic sensor, the distance between the inner pad and the outer pad and the acoustic sensor is not less than 2mm, and the distance between the inner pad and the outer pad and the chip is not less than 2 mm.
4. A double-pad microphone according to claim 1 wherein the inner pad and the outer pad are each circular and concentric.
5. A microphone with dual pads as in claim 1 wherein the inner pad and the outer pad are connected by a strip pad.
6. A microphone having a dual pad backside tone as claimed in claim 5 wherein the inner pad, the outer pad and the bar pad are all electrically connected to the circuit substrate.
7. The microphone of claim 1, wherein the first pin and the inner and outer pads are output terminals, the second pin and the rectangular pad connected to the second pin are power input terminals, and the third pin and the rectangular pad connected to the third pin are ground terminals.
8. A microphone with dual pads as in claim 3 wherein the acoustic sensor is positioned to correspond to the acoustic via location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922440883.9U CN212811953U (en) | 2019-12-30 | 2019-12-30 | Back of body advances sound formula microphone with two pads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922440883.9U CN212811953U (en) | 2019-12-30 | 2019-12-30 | Back of body advances sound formula microphone with two pads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212811953U true CN212811953U (en) | 2021-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922440883.9U Active CN212811953U (en) | 2019-12-30 | 2019-12-30 | Back of body advances sound formula microphone with two pads |
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| CN (1) | CN212811953U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111010637A (en) * | 2019-12-30 | 2020-04-14 | 钰太芯微电子科技（上海）有限公司 | Back of body advances sound formula microphone with two pads |
-
2019
- 2019-12-30 CN CN201922440883.9U patent/CN212811953U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111010637A (en) * | 2019-12-30 | 2020-04-14 | 钰太芯微电子科技（上海）有限公司 | Back of body advances sound formula microphone with two pads |
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