CN220456402U - Power module and power equipment - Google Patents
Power module and power equipment Download PDFInfo
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- CN220456402U CN220456402U CN202322097085.7U CN202322097085U CN220456402U CN 220456402 U CN220456402 U CN 220456402U CN 202322097085 U CN202322097085 U CN 202322097085U CN 220456402 U CN220456402 U CN 220456402U
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- circuit board
- power module
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- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
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- 239000000463 material Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 12
- 239000000758 substrate Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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Abstract
The utility model discloses a power module and power equipment, wherein the power module comprises a power device chip, a circuit board, a heat conduction insulating pad and a temperature equalizing plate; the circuit board is positioned above the heat-conducting insulating pad, and the power device chip is arranged on the top surface of the heat-conducting insulating pad; the bottom surface of the heat conduction insulating pad is fixedly adhered with the temperature equalizing plate; the problem that the heat dissipation efficiency of the power device chip in the current power module is limited, the heat dissipation effect needs to be improved by means of a large-size radiator, and the expansion of the power section of the small-size motor driver is limited is solved, the heat dissipation mode of the power device chip is optimized, the heat dissipation efficiency of the power device chip is improved, and the expansion effect of the power section of the small-size motor driver is facilitated.
Description
Technical Field
The present utility model relates to the field of power devices, and in particular, to a power module and a power device.
Background
The power device is a key device of a servo and variable frequency driving system, and has heavy influence on the cost and reliability of a motor driver. In the running process of the servo or variable frequency driving system, the power device bears the action of electrothermal stress caused by conducting and switching actions, and in order to improve the long-term reliability of the power device, the heat dissipation effect of the power device needs to be improved.
Most of the power devices in the current motor driver adopt power modules, and the motor driver also comprises a PCB (printed circuit board) provided with a preset circuit and a radiator. In the motor driver assembly process, heat dissipation silicone grease is coated on a radiator for a region contacted with a power module, then the power module is locked and attached to the radiator, a PCB is placed, and pins of the power module are welded to positions, corresponding to the power module, on the PCB.
However, the heat dissipation efficiency of the power module is related to the heat sink, and the larger the heat sink, the better the heat dissipation, but the larger the heat sink, the larger the size of the motor driver, resulting in limited expansion of the power segment of the small-sized motor driver.
Disclosure of Invention
The utility model mainly aims to provide a power module and power equipment, and aims to solve the problem that the expansion of a power section of a small-size motor driver is limited.
In order to achieve the above object, the present utility model provides a power module, including: the power device comprises a power device chip, a circuit board, a heat conduction insulating pad and a temperature equalizing plate;
the circuit board is positioned above the heat-conducting insulating pad, and the power device chip is arranged on the top surface of the heat-conducting insulating pad;
the power device chip is electrically connected with the conductive pattern on the circuit board;
the bottom surface of the heat conduction insulating pad is fixedly adhered with the temperature equalizing plate.
Optionally, the bottom surface of the power device chip is fixed on the top surface of the heat conducting insulating pad;
when the number of the power device chips is a plurality of, at least part of the power device chips are electrically connected through the conductive piece.
Optionally, the top surface of the heat conducting insulating pad is further provided with a conductive layer, and the power device chip is fixed on the conductive layer;
when the number of the power device chips is a plurality of, at least part of the power device chips are electrically connected through the conductive layer.
Optionally, the power device chip is wire bonded or ribbon bonded to the conductive pattern on the circuit board.
Optionally, a metal frame is further disposed on the top surface of the heat conducting insulating pad, and the power device chip is fixed on a slide area of the metal frame;
at least part of the power device chips are electrically connected through the metal frame;
the power device chip is electrically connected with the conductive patterns on the circuit board through pins of the metal frame.
Optionally, when the number of the power device chips is multiple, at least part of the power device chips are electrically connected through the conductive piece.
Optionally, the bottom surface of the circuit board is adhered and fixed to the top surface of the heat conducting insulating pad.
Optionally, the circuit board is disposed above the heat conductive insulating pad through a support.
Optionally, a chip avoidance hole is formed in the circuit board, and the power device chip is arranged on the heat conducting insulating pad corresponding to the chip avoidance hole.
Optionally, the bottom of samming board still is provided with the fin.
Optionally, the power device chip is covered by an insulating glue or a plastic package.
Optionally, the circuit board is further provided with at least one of a driving circuit and a connecting terminal.
Optionally, the heat conductive insulating pad is a thin adhesive pad made of prepreg material.
Optionally, the power device chip includes an IGBT chip and/or a diode chip.
The utility model also proposes a power device comprising a power module as indicated above.
The embodiment of the application provides a power module, including the power device chip, the circuit board, the heat conduction insulating pad, the samming board, the circuit board is located the top of heat conduction insulating pad, the power device chip sets up the top surface at the heat conduction insulating pad, the power device chip is connected with the electrically conductive pattern electricity on the circuit board, the samming board is fixed in the bottom surface bonding of heat conduction insulating pad, the heat that produces when the power device chip operates passes through the heat conduction insulating pad and directly transmits to the samming board, compare in current power module, the medium layer number between the power device chip and the samming board that is used for radiating has been reduced, and the radiating effect of samming board promotes by a wide margin, the radiating effect of power device chip limited in the current power module has been solved, need improve the radiating effect with the help of jumbo size radiator, the limited problem of power section extension of motor driver of small-size has been reached the radiating mode of optimizing the power device chip, the radiating efficiency of power device chip is promoted, the effect of power section extension of small-size motor driver is helped.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a power module according to an embodiment of the present application;
fig. 2 is a top view of a power module according to an embodiment of the present disclosure;
fig. 3 is a cross-sectional view of a power module according to an embodiment of the present disclosure;
fig. 4 is a cross-sectional view of a power module according to an embodiment of the present disclosure;
fig. 5 is a cross-sectional view of a power module according to an embodiment of the present disclosure;
fig. 6 is a schematic diagram of a position between a circuit board and a power device chip in a power module according to an embodiment of the present application;
fig. 7 is a top view of a power module according to an embodiment of the present disclosure;
fig. 8 is a cross-sectional view of a power module according to an embodiment of the present disclosure;
fig. 9 is a cross-sectional view of a power module provided in an embodiment of the present application;
fig. 10 is a top view of a power module provided in an embodiment of the present application;
FIG. 11 is a top view of a power module provided in an embodiment of the present application;
fig. 12 is a cross-sectional view of a power module provided in an embodiment of the present application;
fig. 13 is a cross-sectional view of a power module provided in an embodiment of the present application;
fig. 14 is a cross-sectional view of a power module provided in an embodiment of the present application;
fig. 15 is a cross-sectional view of a power module provided in an embodiment of the present application;
fig. 16 is a cross-sectional view of a power module provided in an embodiment of the present application.
Reference numerals illustrate:
11: a power device chip; 12: a thermally conductive insulating pad; 13: a circuit board; 14: a conductive pattern; 15: a conductive member; 16: a conductive member; 17: chip avoiding holes; 18: a conductive layer; 19: a temperature equalizing plate; 20: a connection terminal; 21: an electronic component; 22: and a heat radiating fin.
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that, in the embodiment of the present application, directional indications (such as up, down, left, right, front, and rear … …) are referred to, and the directional indications are merely used to explain the relative positional relationship, movement conditions, and the like between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.
The conventional insulating substrate for manufacturing the power module is generally of a multilayer structure, and is sequentially a metal layer, an insulating layer and a metal layer, and takes a substrate as a DBC substrate (directly coated with copper ceramic substrate) as an example, wherein the DBC substrate is composed of copper foil and a ceramic wafer, the copper foil on the surface of the ceramic wafer is used for welding power device chips to realize electric connection between the power device chips, and the copper foil is also arranged on the bottom surface of the ceramic wafer for better heat dissipation.
And welding the power device chip on a metal layer on the surface of the substrate during module packaging, then carrying out electric connection treatment and input/output end extraction on the power device chip according to a preset power circuit topology, and then wrapping the power device chip and the substrate by using insulating glue or a plastic package piece.
However, during the operation of the driving system of the motor driver, the heat generated by the power device chip is relatively large, the heat of the power device chip is transferred to the outside of the module through the substrate, the heat dissipation efficiency is affected by the structure of the power module, and in order to improve the heat dissipation efficiency, the size of the heat sink contacting with the power module needs to be increased. The larger the power of the motor driver is, the larger the heating value of the power device chip is, and the larger the size of the required radiator is, so that the expansion of the power section of the motor driver with small volume is limited.
The embodiment of the application provides a power module, as shown in fig. 1, which comprises a power device chip 11, a circuit board 13, a heat conducting insulating pad 12 and a temperature equalizing plate 19.
The circuit board 13 is located above the heat conductive insulating pad 12, the power device chip 11 is disposed on the top surface of the heat conductive insulating pad 12, and the power device chip 11 is electrically connected to the conductive pattern 14 on the circuit board 12.
The circuit board 12 is provided with a predetermined circuit, the surface of the circuit board 12 is provided with a conductive pattern 14, the conductive pattern 14 is used for being electrically connected with the power device chip 11, and the power device chip 11 is electrically connected with the predetermined circuit on the circuit board 12 through the conductive pattern 14 so as to realize complete circuit functions.
The heat conduction insulating pad has the characteristics of high heat conduction and insulation, the heat conduction coefficient of the heat conduction insulating pad is determined according to the power device chip, and the embodiment of the application is not limited to the heat conduction insulating pad. For example, the heat dissipation coefficient of the heat conduction insulating pad is 6W/(m.K), or 8W/(m.K), or the heat dissipation coefficient of the heat conduction insulating pad is smaller than 6W/(m.K) or higher than 6W/(m.K) according to the heat dissipation requirements of different products.
The heat conductive insulating pad has an adhesive property. A temperature equalizing plate is adhered and fixed on the bottom surface of the heat conducting insulating pad 19.
Optionally, the bottom surface of the heat conducting insulating pad is adhered to the top surface of the temperature equalizing plate 19, the heat conducting insulating pad and the temperature equalizing plate Wen Banjin are heated at high temperature, and the heat conducting insulating pad is solidified and adhered to the top surface of the temperature equalizing plate 19.
When the power device chip on the heat conducting insulating pad heats, the heat conducting insulating pad rapidly and efficiently transfers the heat of the power device chip to the temperature equalizing plate, the temperature equalizing plate accelerates the heat diffusion, and the heat dissipation effect of the power device chip is improved.
Alternatively, the temperature equalizing plate is made of a general temperature equalizing plate, or the temperature equalizing plate is made of an ultrathin temperature equalizing plate (Vapor Chamber).
The circuit board, the heat conduction insulating pad and the temperature equalization layer are arranged in a laminated mode, and the occupied area of the power module is reduced.
In summary, the power module provided by the embodiment of the application, including the power device chip, the circuit board, the heat conduction insulating pad, the samming board, the circuit board is located the top of heat conduction insulating pad, the power device chip sets up the top surface at the heat conduction insulating pad, the power device chip is connected with the electrically conductive pattern electricity on the circuit board, the samming board is fixed in the bottom surface bonding of heat conduction insulating pad, the heat that produces when the power device chip operates directly transmits samming board through the heat conduction insulating pad, compare in current power module, the medium layer number between power device chip and the samming board that is used for radiating has been reduced, and the radiating effect of samming board promotes by a wide margin, the limited radiating effect of power device chip has been solved in the current power module with the help of jumbo radiator, the limited problem of power section extension of motor drive of small-size has been reached, the radiating mode of optimizing the power device chip, the radiating efficiency of power device chip promotes the radiating effect of power section extension of small-size motor drive.
Optionally, the heat conductive insulating pad is a thin pad made of Prepreg (Preimpregnated Materials, abbreviated as Prepreg) material. The top surface and the bottom surface of the heat conduction insulating pad are sticky, and can play roles of adhesion, insulation and heat conduction.
Optionally, a heat dissipation fin is further arranged at the bottom of the temperature equalization plate, and the heat dissipation fin is made of the same material as the temperature equalization plate. The heat exchange can be further accelerated by the heat radiating fins, and the heat radiating efficiency of the power module is improved.
Optionally, the top surface of the temperature equalization plate is larger than or equal to the size of the heat conduction insulating pad, and the heat conduction insulating pad is borne by the top surface of the temperature equalization plate.
In an alternative embodiment based on the above embodiment, the circuit board is located above the thermally conductive insulating pad, and the bottom surface of the circuit board 13 is adhesively fixed to the top surface of the thermally conductive insulating pad 12, as shown in fig. 2.
Optionally, the surface of the heat-conducting insulating pad 12 has an adhesive property, and after the circuit board 13 is directly adhered to the top surface of the heat-conducting insulating pad 12, high-temperature curing is performed to fix the circuit board 13 and the top surface of the heat-conducting insulating pad 12 together.
When the bottom surface of the circuit board 13 is fixed on the surface of the heat conducting insulating pad 12, the heat of the circuit board 13 can be transferred to the temperature equalizing plate by utilizing the heat conducting insulating pad 12 to dissipate heat, namely when the bottom surface of the circuit board is fixed on the top surface of the heat conducting insulating pad, the temperature equalizing plate dissipates heat for the power device chip and the circuit board at the same time, and the heat dissipation effect of the power module is improved.
It should be noted that, when the bottom surface of the circuit board 13 is fixed to the top surface of the heat conductive insulating pad 12, the bottom surface of the circuit board 13 may be all fixed to the top surface of the heat conductive insulating pad 12, that is, the bottom surface of the circuit board 13 may all contact with the top surface of the heat conductive insulating pad, or the bottom surface of the circuit board 13 may be partially fixed to the top surface of the heat conductive insulating pad 12, that is, a portion of the bottom surface of the circuit board 13 contacts with the top surface of the heat conductive insulating pad, and no heat conductive insulating pad is located below a portion of the bottom surface, which is not limited in the embodiment of the present application.
In an alternative embodiment based on the above embodiment, the circuit board is located above the thermally conductive insulating pad, and the circuit board 13 is placed above the thermally conductive insulating pad 12 by a bracket.
As shown in fig. 4, the circuit board 13 is disposed above the heat conductive insulating pad 12 by a bracket (not shown), and the bottom surface of the circuit board 13 is not in contact with the top surface of the heat conductive insulating pad 12.
When the circuit board 13 is located above the heat conductive insulating pad and the bottom surface of the circuit board 13 is not in contact with the top surface of the heat conductive insulating pad 12, the size of the heat conductive insulating pad 12 may be reduced, which is advantageous for reducing the cost of the power module, for example, the size of the heat conductive insulating pad 12 matches with the power device chip 11 to be provided, the heat conductive insulating pad 12 is not located directly under the circuit board 13, as shown in fig. 5, or a part of the bottom surface of the circuit board 13 is opposite to the heat conductive insulating pad 13.
It should be noted that, the number of circuit boards electrically connected to the power device chip in the power module is determined according to practical situations, which is not limited in this embodiment of the present application, for example: the number of the circuit boards is 1, the 1 circuit boards are provided with preset circuits, the power device chips are electrically connected with the conductive patterns on the circuit boards, or the number of the circuit boards is multiple, and the power device chips on the heat conducting insulating pad are electrically connected with the circuit boards.
In an alternative embodiment based on the above embodiment, the circuit board 13 is provided with a chip avoidance hole 17, as shown in fig. 6, and the power device chip 11 is disposed on the heat conductive insulating pad corresponding to the chip avoidance hole 17, as shown in fig. 7, where the chip avoidance hole on the circuit board 13 is used for avoiding the power device chip 11, so that the power device chip 11 is electrically connected with the conductive pattern 14 on the circuit board 13.
When the chip avoidance holes are formed in the circuit board, the power device chips are arranged corresponding to the chip avoidance holes, so that the circuit board and the power device chips can be placed more compactly, and the occupied plane area of the power device chips and the circuit board can be reduced.
In an alternative embodiment based on the above embodiment, the bottom surface of the power device chip 11 is fixed to the top surface of the heat conductive insulating pad 12, taking fig. 3, 4, 5, 8, and 9 as examples; wire bonding (or clip bonding) of the power device chip to a conductive pattern on the circuit board, for example, fig. 1, the power device chip 11 is wire bonded to a conductive pattern 14 on the circuit board 13 through a metal wire 15, so as to electrically connect the power device chip 11 to a predetermined circuit on the circuit board 13.
When the number of the power device chips is multiple, at least part of the power device chips on the heat conduction insulating pad are electrically connected through the electric conduction piece, and the power device chips on the heat conduction insulating pad are electrically connected to form a power topology.
When a plurality of power device chips are arranged, the insulation performance of the heat conduction insulating pad can be utilized to reduce the example among the power device chips, reduce the occupied area of the power device chips and further reduce the size of the power module.
Taking fig. 7 as an example, 4 power device chips 11 are directly fixed on the top surface of the heat conducting insulating pad 12, and two power device chips located on the left side are electrically connected through a conductive piece 16, and two power device chips 11 located on the right side are electrically connected through a conductive piece 16.
When the number of the power device chips is plural, the electrical connection relationship between the power device chips is determined according to a predetermined power topology.
Optionally, the conductive element is a metal wire (wire) or a metal strap (clip).
Optionally, the top surface of the heat conductive insulating pad 12 has an adhesive property, and after the bottom surface of the power device chip 11 is adhered to the top surface of the heat conductive insulating pad 12, high-temperature curing is performed to fix the bottom surface of the power device chip 11 and the top surface of the heat conductive insulating pad 12 together.
Alternatively, when the bottom surface of the circuit board 13 is also fixed to the top surface of the thermally conductive and insulating pad 12, after the power device chip 11 and the circuit board 13 are both adhered to the top surface of the thermally conductive and insulating pad 12, high-temperature curing may be performed, so that the power device chip 11 and the circuit board 13 are both fixed to the top surface of the thermally conductive and insulating pad 12.
In another alternative embodiment based on the above embodiment, the top surface of the thermally conductive and insulating pad is further provided with an electrically conductive layer to which the power device chip is fixed.
Optionally, the power device die is soldered to the conductive layer.
As shown in fig. 10, 11, 12, 13, 14, the top surface of the thermally conductive insulating pad 12 is provided with an electrically conductive layer 18.
When the number of the power device chips 11 is plural, at least part of the power device chips 11 are electrically connected through the conductive layer; wire bonding (or ribbon bonding) of the power device chip to a conductive pattern on the circuit board, enables electrical connection of the power device chip 11 to predetermined circuitry on the circuit board 13.
Optionally, the conductive element is a metal wire (wire) or a metal strap (clip).
Optionally, when the number of the power device chips 11 is plural, if the conductive layer cannot enable the power device chips to form a predetermined power topology, at least some of the power device chips may be electrically connected through the conductive member, and the power device chips form the predetermined power topology by using the conductive layer and the conductive member.
In yet another alternative embodiment based on the above embodiment, the top surface of the heat conductive insulating pad is further provided with a metal frame, the power device chips are fixed on a carrier region of the metal frame, at least part of the power device chips are electrically connected through the metal frame, and the power device chips are electrically connected with the conductive patterns on the circuit board through pins of the metal frame.
Optionally, the power device die is soldered to the carrier region of the leadframe.
Optionally, the surface of the heat conductive insulating pad 12 has an adhesive property, and after the bottom surface of the metal frame is adhered to the top surface of the heat conductive insulating pad, high-temperature curing is performed to fix the bottom surface of the metal frame and the top surface of the heat conductive insulating pad together.
Optionally, when the number of the power device chips is multiple, if the carrier region on the metal frame cannot enable the power device chips to form a predetermined power topology, at least part of the power device chips can be electrically connected through the conductive piece, and the power device chips form the predetermined power topology by using the conductive layer and the conductive piece.
Optionally, the conductive element is a metal wire (wire) or a metal strap (clip).
In an alternative embodiment based on the above embodiment, the circuit board is further provided with at least one of a driving circuit, a connection terminal.
Optionally, a connection terminal is provided on the circuit board, for example, to connect with the drive board using the connection terminal.
Optionally, the circuit board is a driving board, and the circuit board is further provided with a driving chip and a driving circuit connected with the driving chip, and when the driving board comprises a wiring terminal, the wiring terminal is connected with external equipment or other circuit boards.
Optionally, the circuit board is a driving control integrated board, and the circuit board is further provided with a driving chip, a control chip, a driving circuit connected with the driving chip, a control circuit connected with the control chip, and a wiring terminal, and is connected with external equipment by using the wiring terminal.
In one example, taking fig. 1 as an example, the power module includes a temperature equalizing plate 19, a heat dissipating fin 22, an insulating heat conducting pad 12, a circuit board 13, and a power device chip 11, where a connection terminal 20 and an electronic component 21 for forming a predetermined circuit are disposed on the circuit board 13, the power device chip 11 is disposed on the top surface of the insulating heat conducting pad 12, a chip avoidance hole is disposed on the circuit board 13, the power device chip 11 is disposed corresponding to the chip avoidance hole, and the power device chip 11 is electrically connected with the conductive pattern 14 on the circuit board 13 through a conductive member 15.
In an alternative embodiment based on the above embodiment, in the power module, the power device chip is covered with an insulating glue or a plastic package. And after the power device chip is electrically connected, protecting the power device chip by using insulating glue or a plastic package.
In the embodiment of the application, the power topology formed by the power device chip can comprise at least one of a rectification topology, an H-bridge topology, a full-bridge topology, a half-bridge topology, a braking topology and an inversion topology, wherein the rectification topology comprises a controllable rectification topology and an uncontrolled rectification topology, and the inversion topology comprises a single-phase inversion topology, a two-phase inversion topology and a three-phase inversion topology.
In an embodiment of the application, the power device chip comprises an IGBT chip and/or a diode chip.
The application further provides a power device, which includes the power module provided by the above embodiment, and the specific structure of the power module refers to the above embodiment, and since the power device adopts all the technical solutions of all the above embodiments, at least the power device has all the beneficial effects brought by the technical solutions of the above embodiments, and will not be described in detail herein.
Optionally, the power device is a motor driver.
The foregoing description is only of the preferred embodiments of the present application, and is not intended to limit the scope of the claims, and all equivalent structural changes made by the specification and drawings of the present application or direct/indirect application in other related technical fields are included in the scope of the claims of the present application.
Claims (15)
1. The power module is characterized by comprising a power device chip, a circuit board, a heat conduction insulating pad and a temperature equalizing plate;
the circuit board is positioned above the heat-conducting insulating pad, and the power device chip is arranged on the top surface of the heat-conducting insulating pad;
the power device chip is electrically connected with the conductive pattern on the circuit board;
the bottom surface of the heat conduction insulating pad is fixedly adhered with the temperature equalizing plate.
2. The power module of claim 1, wherein a bottom surface of the power device chip is secured to a top surface of the thermally conductive insulating pad;
when the number of the power device chips is a plurality of, at least part of the power device chips are electrically connected through the conductive piece.
3. The power module of claim 1, wherein the top surface of the thermally conductive and insulating pad is further provided with an electrically conductive layer to which the power device chip is secured;
when the number of the power device chips is a plurality of, at least part of the power device chips are electrically connected through the conductive layer.
4. A power module according to claim 2 or 3, wherein the power device chip is wire-bonded or ribbon-bonded to a conductive pattern on the circuit board.
5. The power module of claim 1, wherein the top surface of the thermally conductive and insulating pad is further provided with a metal frame, and the power device chip is fixed to a carrier region of the metal frame;
at least part of the power device chips are electrically connected through the metal frame;
the power device chip is electrically connected with the conductive patterns on the circuit board through pins of the metal frame.
6. The power module of claim 3 or 5, wherein when the number of the power device chips is plural, at least part of the power device chips are further electrically connected by a conductive member.
7. The power module of any one of claims 1, 2, 3, and 5, wherein the bottom surface of the circuit board is adhesively secured to the top surface of the thermally conductive insulating mat.
8. The power module of any one of claims 1, 2, 3, 5 wherein the circuit board is disposed above the thermally conductive insulating pad by a support.
9. The power module according to any one of claims 1, 2, 3, and 5, wherein a chip avoidance hole is provided on the circuit board, and the power device chip is disposed on the heat-conducting insulating pad corresponding to the chip avoidance hole.
10. The power module of any one of claims 1, 2, 3, 5, wherein the bottom of the temperature equalization plate is further provided with heat dissipating fins.
11. The power module of any one of claims 1, 2, 3, 5, wherein the power device chip is covered with an insulating glue or a plastic package.
12. The power module according to any one of claims 1, 2, 3, and 5, wherein the circuit board is further provided with at least one of a driving circuit and a connection terminal.
13. The power module of any one of claims 1, 2, 3, 5 wherein the thermally conductive and insulating pad is a thin adhesive pad made of prepreg material.
14. The power module of any of claims 1, 2, 3, 5, wherein the power device chip comprises an IGBT chip and/or a diode chip.
15. A power device, characterized in that it comprises a power module according to any of claims 1 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322097085.7U CN220456402U (en) | 2023-08-04 | 2023-08-04 | Power module and power equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322097085.7U CN220456402U (en) | 2023-08-04 | 2023-08-04 | Power module and power equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220456402U true CN220456402U (en) | 2024-02-06 |
Family
ID=89731466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322097085.7U Active CN220456402U (en) | 2023-08-04 | 2023-08-04 | Power module and power equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220456402U (en) |
-
2023
- 2023-08-04 CN CN202322097085.7U patent/CN220456402U/en active Active
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