CN220381417U - Backlight source with high heat dissipation efficiency - Google Patents
Backlight source with high heat dissipation efficiency Download PDFInfo
- Publication number
- CN220381417U CN220381417U CN202322004054.2U CN202322004054U CN220381417U CN 220381417 U CN220381417 U CN 220381417U CN 202322004054 U CN202322004054 U CN 202322004054U CN 220381417 U CN220381417 U CN 220381417U
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- CN
- China
- Prior art keywords
- heat dissipation
- lamp strip
- high heat
- heat
- fixedly connected
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Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 43
- 239000010949 copper Substances 0.000 claims abstract description 43
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 12
- 239000010439 graphite Substances 0.000 claims abstract description 12
- 238000010521 absorption reaction Methods 0.000 claims abstract description 10
- 229910052742 iron Inorganic materials 0.000 claims abstract description 7
- 239000000110 cooling liquid Substances 0.000 claims description 9
- 239000000084 colloidal system Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 8
- 230000009471 action Effects 0.000 abstract description 6
- 239000006096 absorbing agent Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a backlight source with high heat dissipation efficiency, which relates to the technical field of display, and comprises a graphite sheet and an iron frame, wherein one side of the graphite sheet is fixedly provided with a connecting wire, the other end of the connecting wire is connected with a lamp strip, the surface of the lamp strip is fixedly provided with a plurality of LED chips, the back surface of the lamp strip is fixedly provided with a plurality of heat dissipation copper sheets, the surface of the heat dissipation copper sheets is provided with a plurality of through holes, one side of the heat dissipation copper sheets is fixedly connected with a plurality of fins, and the other side of the fins is fixedly connected with a heat absorbing piece; according to the technical scheme provided by the utility model, the copper layers on the front and back sides of the lamp strip are connected through the copper layers in the through holes under the action of the through holes, so that the copper layers on the back side can realize the electric conduction effect and the heat dissipation effect, and then the heat on the heat dissipation copper sheet can be conducted to the heat absorption piece through the fins, and the heat dissipation treatment can be further accelerated under the action of the heat absorption piece.
Description
Technical Field
The utility model relates to the technical field of display, in particular to a backlight source with high heat dissipation efficiency.
Background
With the increasing application of electronic products in daily life, the liquid crystal display technology is rapidly developed, and many aspects of life are not separated from the liquid crystal display device. The demand of ultra-thin, environment-friendly and low-carbon LED displays is increasing, the technical development is rapid, and the ultra-thin, environment-friendly and low-carbon LED displays are expected to become the main stream of display industry. In the existing treatment process, a backlight source with high brightness requirement generally adopts a light bar with a plurality of LED chips, the plurality of LED chips adopted by the backlight source can generate a large amount of heat during working to influence the working quality of the backlight source, and the light bar and the LED chips can be damaged when serious, so that the backlight source with high heat dissipation efficiency is provided.
Disclosure of Invention
The utility model aims to solve the technical problems of overcoming the defects of the prior art and providing a backlight source with high heat dissipation efficiency, which is used for solving the problems that a plurality of LED chips adopted by the backlight source in the prior art generate a large amount of heat during working, the working quality of the LED chips is influenced, and the lamp bars and the LED chips are damaged seriously.
In view of the above, the utility model provides a backlight source with high heat dissipation efficiency, which comprises a graphite sheet and an iron frame, wherein one side of the graphite sheet is fixedly provided with a connecting wire, the other end of the connecting wire is connected with a lamp strip, the surface of the lamp strip is fixedly provided with a plurality of LED chips, the back surface of the lamp strip is fixedly provided with a plurality of heat dissipation copper sheets, the surface of the heat dissipation copper sheets is provided with a plurality of through holes, one side of the heat dissipation copper sheets is fixedly connected with a plurality of fins, and the other side of the fins is fixedly connected with a heat absorbing piece.
Preferably: the graphite flake is attached to the back of the iron frame.
Preferably: and pins of the LED chip are connected with the output lines of the circuit board on the lamp strip.
Preferably: the radiating copper sheet is fixedly connected to the back of the lamp strip through the colloid, and the through hole is in a hollow state.
Preferably: the fins are fixedly connected to the side wall of the radiating copper sheet close to the through holes, and the thickness of each fin is 1-1.5mm.
Preferably: a cavity is formed in the heat absorbing piece, and cooling liquid is arranged in the cavity.
From the above technical solutions, the embodiment of the present utility model has the following advantages:
1. according to the backlight source with high heat dissipation efficiency, the heat dissipation treatment is realized by adopting the installed heat dissipation copper sheet, the copper layers are covered in the through holes, the copper layers on the front side and the back side of the lamp strip are connected through the copper layers in the through holes under the action of the through holes, so that the copper layers on the back side can realize the electric conduction effect, the heat dissipation effect can also be realized, then the heat on the heat dissipation copper sheet can be conducted to the heat absorption piece through the fins, and the heat dissipation treatment can be further accelerated under the action of the heat absorption piece.
2. According to the backlight source with high heat dissipation efficiency, the heat absorption member is provided with the cavity, and the cooling liquid is arranged in the cavity, so that the cooling liquid is filled in the heat absorption member, and the overall heat absorption and dissipation capacity of the cooling liquid can be improved.
These features and advantages of the present utility model will be disclosed in detail in the following detailed description and the accompanying drawings.
Drawings
The utility model is further described with reference to the accompanying drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a turnover structure of a light bar according to the present utility model;
fig. 3 is an enlarged view of fig. 2 a in accordance with the present utility model.
Reference numerals illustrate: 1. a graphite sheet; 2. an iron frame; 3. a light bar; 4. an LED chip; 5. a connecting wire; 6. a heat dissipation copper sheet; 61. a through hole; 7. a fin; 8. a heat absorbing member; 9. and (5) cooling liquid.
Detailed Description
The technical solutions of the embodiments of the present utility model will be explained and illustrated below with reference to the drawings of the embodiments of the present utility model, but the following embodiments are only preferred embodiments of the present utility model, and not all embodiments. Based on the examples in the implementation manner, other examples obtained by a person skilled in the art without making creative efforts fall within the protection scope of the present utility model.
The following describes a backlight source with high heat dissipation efficiency according to an embodiment of the present utility model in detail with reference to the accompanying drawings.
Example 1
In order to facilitate understanding, referring to fig. 1 to 3, an embodiment of a backlight source with high heat dissipation efficiency provided by the utility model comprises a graphite sheet 1 and an iron frame 2, wherein one side of the graphite sheet 1 is fixedly provided with a connecting wire 5, the other end of the connecting wire 5 is connected with a lamp strip 3, the surface of the lamp strip 3 is fixedly provided with a plurality of LED chips 4, the back surface of the lamp strip 3 is fixedly provided with a plurality of heat dissipation copper sheets 6, the surface of the heat dissipation copper sheets 6 is provided with a plurality of through holes 61, one side of the heat dissipation copper sheets 6 is fixedly connected with a plurality of fins 7, and the other side of the fins 7 is fixedly connected with a heat absorbing piece 8; the graphite sheet 1 is attached to the back surface of the iron frame 2.
It should be noted that, the plurality of LED chips 4 adopted by the backlight source generate a large amount of heat during operation of the plurality of LED chips 4, which affects the working quality of the LED chips, and the damage of the light bar 3 and the LED chips 4 is caused when serious, the heat dissipation treatment is realized by adopting the installed heat dissipation copper sheet 6, and the copper layer is covered in the through hole 61, the copper layers on the front and the back of the light bar 3 are connected through the copper layer in the through hole 61 under the action of the through hole 61, so that the copper layer on the back can realize the electric conduction function, the heat dissipation function can also be realized, then the heat on the heat dissipation copper sheet 6 can be conducted to the heat absorption piece 8 through the fin 7, and the heat dissipation treatment can be further accelerated under the action of the heat absorption piece 8;
wherein the fins 7 are made of copper material, and the heat absorbing member 8 is made of non-conductive ceramic material.
In an alternative embodiment: pins of the LED chip 4 are connected with output lines of the circuit board on the light bar 3.
It should be noted that the LED chip 4 is installed reasonably, so that it is convenient for normal use.
In an alternative embodiment: the heat dissipation copper sheet 6 is fixedly connected to the back of the light bar 3 through a colloid, and the through hole 61 is in a hollow state.
It should be noted that, through adopting the colloid can realize the connection of heat dissipation copper sheet 6 and lamp strip 3, the subsequent heat conduction cooling treatment of being convenient for, through-hole 61 is the cavity state and guarantees wherein not filling the colloid, conveniently realizes heat dissipation treatment.
In an alternative embodiment: the fins 7 are fixedly connected to the side wall of the radiating copper sheet 6 close to the through holes 61, and the thickness of each fin 7 is 1-1.5mm.
It should be noted that, by adopting the fins 7 with a reasonable thickness, a larger degree of heat dissipation and heat conduction can be achieved under the condition of reducing the cost.
Example 2
In some embodiments, as shown in fig. 3, the heat absorbing member 8 has a cavity formed therein, and the cooling liquid 9 is disposed in the cavity.
By filling the cooling liquid 9 in the heat absorbing material 8, the heat absorbing and dissipating capacity of the entire cooling liquid 9 can be improved.
Working principle: in the use, a plurality of LED chips 4 that the backlight adopted, a plurality of LED chips 4 can produce a large amount of heat at work, influence its operating quality, can cause the damage of lamp strip 3 and LED chip 4 when serious, adopt the radiating copper sheet 6 of installing to realize the heat dissipation and handle, and the through-hole 61 is interior to be covered with the copper layer, make the copper layer of lamp strip 3 front and back pass through the copper layer in the through-hole 61 under the effect of through-hole 61 and connect, thereby make the copper layer at the back can realize electrically conductive effect, also can realize the heat dissipation effect, then the heat on the radiating copper sheet 6 can heat conduction to the heat absorber 8 through fin 7, can further accelerate the heat dissipation under the effect of heat absorber 8.
The above embodiments are merely for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (6)
1. A backlight source with high heat dissipation efficiency is characterized in that: including graphite flake (1) and chase (2), one side fixed mounting of graphite flake (1) has connecting wire (5), just the other end of connecting wire (5) is connected with lamp strip (3), just the fixed surface of lamp strip (3) installs a plurality of LED chip (4), the back fixed mounting of lamp strip (3) has a plurality of heat dissipation copper sheet (6), a plurality of through-hole (61) have been seted up on the surface of heat dissipation copper sheet (6), one side fixedly connected with a plurality of fin (7) of heat dissipation copper sheet (6), and a plurality of opposite side fixedly connected with heat absorption piece (8) of fin (7).
2. The high heat dissipation backlight as defined in claim 1, wherein: the graphite flake (1) is attached to the back surface of the iron frame (2).
3. The high heat dissipation backlight as defined in claim 1, wherein: pins of the LED chip (4) are connected with output lines of the circuit board on the lamp strip (3).
4. The high heat dissipation backlight as defined in claim 1, wherein: the radiating copper sheet (6) is fixedly connected to the back of the lamp strip (3) through colloid, and the through hole (61) is in a hollow state.
5. The high heat dissipation backlight as defined in claim 1, wherein: the fins (7) are fixedly connected to the side wall of the radiating copper sheet (6) close to the through holes (61), and the thickness of each fin (7) is 1-1.5mm.
6. The high heat dissipation backlight as defined in claim 1, wherein: a cavity is formed in the heat absorbing piece (8), and cooling liquid (9) is arranged in the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322004054.2U CN220381417U (en) | 2023-07-27 | 2023-07-27 | Backlight source with high heat dissipation efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322004054.2U CN220381417U (en) | 2023-07-27 | 2023-07-27 | Backlight source with high heat dissipation efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220381417U true CN220381417U (en) | 2024-01-23 |
Family
ID=89566645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322004054.2U Active CN220381417U (en) | 2023-07-27 | 2023-07-27 | Backlight source with high heat dissipation efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220381417U (en) |
-
2023
- 2023-07-27 CN CN202322004054.2U patent/CN220381417U/en active Active
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