CN220324089U - Integrated heat dissipation display screen - Google Patents

Integrated heat dissipation display screen Download PDF

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Publication number
CN220324089U
CN220324089U CN202321838650.4U CN202321838650U CN220324089U CN 220324089 U CN220324089 U CN 220324089U CN 202321838650 U CN202321838650 U CN 202321838650U CN 220324089 U CN220324089 U CN 220324089U
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China
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heat dissipation
display screen
drum
initiative
semiconductor
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CN202321838650.4U
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Chinese (zh)
Inventor
陈式豹
夏孔林
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Huafa Taizhou Photoelectric Technology Co ltd
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Huafa Taizhou Photoelectric Technology Co ltd
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Abstract

The utility model discloses an integrated heat dissipation display screen, which comprises: the display panel, initiative accuse temperature subassembly, initiative wind drum and fixed paste in the samming board of display panel one side, initiative accuse temperature subassembly includes heat dissipation baffle and semiconductor refrigeration piece, semiconductor refrigeration piece pastes and is fixed in one side of heat dissipation baffle, and the opposite side of semiconductor refrigeration piece is laminated mutually with one side of samming board, the inboard of heat dissipation baffle is equipped with a plurality of parallel arrangement's radiating fin, and be equipped with the air channel between the adjacent radiating fin, the one end of air channel is linked together with one side of initiative wind drum, initiative wind drum includes changes drum barrel, driving motor and wind drum. According to the utility model, by arranging the active cooling structure, the cooling surface is generated on one side of the semiconductor cooling sheet under the action of the energizing current by utilizing the Peltier effect of the semiconductor cooling sheet, and the display screen is actively cooled by the temperature equalizing plate, so that the low-temperature long-acting operation of the display screen is realized, and the cooling effect is good.

Description

Integrated heat dissipation display screen
Technical Field
The utility model relates to the technical field of display screens, in particular to an integrated heat dissipation display screen.
Background
With the development of technology, mobile terminals have become an indispensable device in people's daily life. In mobile terminals, the display is one of the most important components. However, the main heating devices of the display screen, including the driving IC and its peripheral circuits, the backlight LED lamp, etc., generate a lot of heat when used for a long time, resulting in a gradual increase in the temperature of the display screen, which affects the life and performance of the device.
To solve this problem, in the prior art, a stainless steel plate is provided on the bottom inner surface of the display screen to support the display screen and assist in heat dissipation, thereby lowering the temperature of the display screen. And sticking a layer of graphite heat dissipation film on the bottom surface of the stainless steel plate to dissipate heat of the heating device. The graphite heat dissipation film is a material with good heat conduction performance, has high heat conduction efficiency and heat capacity, can effectively transfer heat generated by the display screen to the steel plate rapidly, then radiates through the steel plate, has poor passive heat dissipation effect, and still cannot effectively improve the high temperature problem in the work of the display screen. In view of the above, the present utility model provides an integrated heat dissipation display screen, which solves the existing problems and aims to solve the problems and improve the practical value by the technology.
Disclosure of Invention
The present utility model aims to solve one of the technical problems existing in the prior art or related technologies.
The technical scheme adopted by the utility model is as follows: an integrated heat dissipating display screen comprising: the display panel, initiative accuse temperature subassembly, initiative wind drum and fixed paste in the samming board of display panel one side, initiative accuse temperature subassembly includes heat dissipation baffle and semiconductor refrigeration piece, semiconductor refrigeration piece pastes and is fixed in one side of heat dissipation baffle, and the opposite side of semiconductor refrigeration piece is laminated mutually with one side of samming board, the inboard of heat dissipation baffle is equipped with a plurality of parallel arrangement's radiating fin, and is equipped with the air current way between the adjacent radiating fin, the one end of air current way is linked together with one side of initiative wind drum, initiative wind drum includes changes drum barrel, driving motor and wind drum, driving motor fixed mounting is connected in the inboard of drum barrel and output and the tip of wind drum, wind drum rotation is installed in the inboard of drum barrel.
The present utility model may be further configured in a preferred example to: the inside of samming board is cavity structure, and samming board's inside is filled with the refrigerant liquid.
The present utility model may be further configured in a preferred example to: the driving motor is of a double-output motor structure, and the number of the wind drums is two and distributed at two ends of the driving motor.
The present utility model may be further configured in a preferred example to: the surface of the rotary drum cylinder is provided with an air outlet and an air inlet grid hole, and the air flow passage is arranged in the tangential direction of the rotary drum cylinder and one end of the air flow passage is communicated with the air outlet.
The present utility model may be further configured in a preferred example to: and the two sides of the semiconductor refrigerating sheet are respectively provided with a heating surface and a refrigerating surface, and one side of the refrigerating surface is mutually attached to the surface of the temperature equalizing plate.
The present utility model may be further configured in a preferred example to: the temperature equalization plate is of a metal aluminum plate structure, the semiconductor refrigeration piece is located in the center area of the temperature equalization plate, and the joint surfaces of the semiconductor refrigeration piece, the temperature equalization plate and the display panel are all provided with heat conduction silicone grease layers.
The beneficial effects obtained by the utility model are as follows:
1. according to the utility model, by arranging the active cooling structure, the cooling surface is generated on one side of the semiconductor cooling sheet under the action of the energizing current by utilizing the Peltier effect of the semiconductor cooling sheet, and the display screen is actively cooled by the temperature equalizing plate, so that the low-temperature long-acting operation of the display screen is realized, and the cooling effect is good.
2. According to the utility model, the heat dissipation guide plate and the active air drum structure are arranged on the heating surface of the semiconductor refrigerating sheet, the heat of the heating surface of the semiconductor refrigerating sheet is rapidly cooled by air cooling, the continuous and stable operation of the semiconductor refrigerating sheet is ensured, and the integrated structure layout of the active temperature control assembly, the active air drum and the temperature equalization plate is compact, so that the semiconductor refrigerating sheet is suitable for external connection of various mobile terminals.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present utility model;
fig. 2 is a schematic view of a semiconductor refrigeration sheet mounting structure according to an embodiment of the present utility model;
FIG. 3 is a schematic view of an active wind drum and a heat dissipation guide plate according to an embodiment of the present utility model;
fig. 4 is a schematic view of an active wind drum according to an embodiment of the present utility model.
Reference numerals:
100. a display panel;
200. an active temperature control assembly; 210. a heat radiation guide plate; 220. a semiconductor refrigeration sheet; 211. a heat radiation fin; 212. an air flow passage;
300. an active wind drum; 310. a drum; 320. a driving motor; 330. a wind drum; 311. an air outlet; 312. air inlet grid holes;
400. and a temperature equalizing plate.
Description of the embodiments
The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.
An integrated heat dissipating display screen according to some embodiments of the present utility model is described below with reference to the accompanying drawings.
1-4, the integrated heat dissipation display screen provided by the utility model comprises: the display panel 100, the initiative temperature control subassembly 200, initiative wind drum 300 and fix the samming board 400 of pasting in display panel 100 one side, initiative temperature control subassembly 200 includes radiating guide 210 and semiconductor refrigeration piece 220, semiconductor refrigeration piece 220 pastes and is fixed in radiating guide 210's one side, and the opposite side of semiconductor refrigeration piece 220 is laminated with samming board 400's one side mutually, radiating guide 210's inboard is equipped with a plurality of parallel arrangement's radiating fin 211, and be equipped with air current way 212 between the adjacent radiating fin 211, air current way 212's one end is linked together with initiative wind drum 300's one side, initiative wind drum 300 includes changeing drum 310, driving motor 320 and wind drum 330, driving motor 320 fixed mounting is in the inboard of changeing drum 310 and the output is connected with wind drum 330's tip, wind drum 330 rotates the inboard of installing in changeing drum 310.
In this embodiment, the interior of the temperature equalization plate 400 is a cavity structure, and the interior of the temperature equalization plate 400 is filled with a refrigerant liquid.
Specifically, the high specific heat capacity and fluidity of the liquid are utilized to make the surface temperature of the temperature equalization plate 400 uniform, so as to avoid damage to the display panel 100 caused by the assistance of local cooling of the semiconductor refrigeration sheet 220.
In this embodiment, the driving motor 320 has a dual output motor structure, and the number of wind drums 330 is two and distributed at both ends of the driving motor 320.
Specifically, the rotation of the wind drum 330 is utilized to improve the circulation of Zhou Qiliu outside the driving motor 320, thereby cooling the driving motor 320 and ensuring the long-acting operation thereof.
In this embodiment, the surface of the drum 310 is provided with an air outlet 311 and an air inlet grating 312, and the air flow channel 212 is arranged in the tangential direction of the drum 310 and has one end communicating with the air outlet 311.
Specifically, the active air drum 300 is utilized to perform air pumping, so that the air flow flux in the air flow channel 212 is improved, and the heat dissipation effect is improved.
In this embodiment, both sides of the semiconductor refrigeration sheet 220 are respectively provided with a heating surface and a cooling surface, and one side of the cooling surface is adhered to the surface of the temperature uniformity plate 400.
Further, the temperature equalizing plate 400 is a metal aluminum plate structure, the semiconductor cooling plate 220 is located in the central area of the temperature equalizing plate 400, and the bonding surfaces of the semiconductor cooling plate 220, the temperature equalizing plate 400 and the display panel 100 are all provided with heat conduction silicone grease layers.
Specifically, the heat conduction efficiency among the semiconductor refrigeration sheet 220, the temperature equalizing plate 400 and the display panel 100 is improved by coating the heat conductive silicone grease layer.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.

Claims (6)

1. An integrated heat dissipating display screen, comprising: the display panel (100), initiative accuse temperature subassembly (200), initiative wind drum (300) and fixed paste in samming board (400) of display panel (100) one side, initiative accuse temperature subassembly (200) are including heat dissipation baffle (210) and semiconductor refrigeration piece (220), semiconductor refrigeration piece (220) paste and are fixed in one side of heat dissipation baffle (210), and the opposite side of semiconductor refrigeration piece (220) is laminated with one side of samming board (400), the inboard of heat dissipation baffle (210) is equipped with a plurality of parallel arrangement's radiating fin (211), and is equipped with air flow channel (212) between adjacent radiating fin (211), one end of air flow channel (212) is linked together with one side of initiative wind drum (300), initiative wind drum (300) are including rotary drum (310), driving motor (320) and wind drum (330), driving motor (320) fixed mounting is connected with the tip of wind drum (330) in the inboard of rotary drum (310).
2. The integrated heat dissipation display screen as set forth in claim 1, wherein the interior of the temperature equalization plate (400) is a cavity structure, and the interior of the temperature equalization plate (400) is filled with a refrigerant liquid.
3. The integrated heat dissipation display screen as set forth in claim 1, wherein the driving motor (320) is of a dual-output motor structure, and the number of the wind drums (330) is two and distributed at two ends of the driving motor (320).
4. An integrated heat dissipation display screen according to claim 1, wherein the surface of the drum (310) is provided with an air outlet (311) and an air inlet grid hole (312), and the air flow channel (212) is arranged in the tangential direction of the drum (310) and one end is communicated with the air outlet (311).
5. The integrated heat dissipation display screen as set forth in claim 1, wherein the semiconductor cooling sheet (220) has a heating surface and a cooling surface on both sides thereof, and one side of the cooling surface is adhered to the surface of the temperature equalization plate (400).
6. The integrated heat dissipation display screen as set forth in claim 1, wherein the temperature equalization plate (400) is a metal aluminum plate structure, the semiconductor cooling sheet (220) is located in a central area of the temperature equalization plate (400), and heat conduction silicone grease layers are disposed on bonding surfaces of the semiconductor cooling sheet (220), the temperature equalization plate (400) and the display panel (100).
CN202321838650.4U 2023-07-13 2023-07-13 Integrated heat dissipation display screen Active CN220324089U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321838650.4U CN220324089U (en) 2023-07-13 2023-07-13 Integrated heat dissipation display screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321838650.4U CN220324089U (en) 2023-07-13 2023-07-13 Integrated heat dissipation display screen

Publications (1)

Publication Number Publication Date
CN220324089U true CN220324089U (en) 2024-01-09

Family

ID=89416467

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321838650.4U Active CN220324089U (en) 2023-07-13 2023-07-13 Integrated heat dissipation display screen

Country Status (1)

Country Link
CN (1) CN220324089U (en)

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