CN220290802U - High-efficient radiating rectifier subassembly - Google Patents
High-efficient radiating rectifier subassembly Download PDFInfo
- Publication number
- CN220290802U CN220290802U CN202321490344.6U CN202321490344U CN220290802U CN 220290802 U CN220290802 U CN 220290802U CN 202321490344 U CN202321490344 U CN 202321490344U CN 220290802 U CN220290802 U CN 220290802U
- Authority
- CN
- China
- Prior art keywords
- plate
- chip
- bottom plate
- public electrode
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 239000004332 silver Substances 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims 3
- 238000000429 assembly Methods 0.000 claims 3
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a rectifier component with high-efficiency heat dissipation, which comprises the following components: a housing base, a housing cover, a base plate, and an internal component; the internal element is provided with two groups of chip components which are arranged in parallel, the chip components are sequentially provided with a public electrode plate, a chip, a pressing block, a silver sheet, an electrode seat, an insulating sleeve, a flat gasket, a butterfly spring, a pressing plate, a connecting plate, a flat gasket, a spring gasket and an M10 bolt from bottom to top, and the chip is pressed on the public electrode plate by the pressing block; the bottom of the shell seat is in an opening shape, the bottom plate is fixed at the bottom of the shell seat, and a heat conducting plate is arranged between the public electrode plate and the bottom plate; the water channel is arranged in the bottom plate, and the water inlet joint and the water outlet joint of the water channel are positioned on the same side surface of the bottom plate. According to the utility model, the heat conducting plate is arranged at the lower part of the chip, the heat conducting plate is spliced with the bottom plate, the water channel is arranged in the bottom plate, and the heat is taken away by flowing water, so that the function of rapid heat dissipation is realized, and the wire efficiency and the service life can be improved.
Description
Technical Field
The utility model belongs to the technical field of electronic components, and particularly relates to a rectifier component with efficient heat dissipation.
Background
The rectifier component is connected into an electric circuit to change alternating current with direction and magnitude into unidirectional pulsating electricity with direction unchanged and magnitude changed, then the pulsating electricity is changed into direct current which can be used by an electric appliance through a filter circuit and a voltage stabilizing circuit, the rectifier component is connected into the alternating current to work, a large amount of heat can be generated after a long time, the high temperature can influence the conductive efficiency and the service life of the rectifier component, and the high-efficiency heat dissipation rectifier component is provided for solving the problem.
Disclosure of Invention
In view of the above, the technical problem to be solved by the present utility model is to provide a rectifier assembly with high heat dissipation, which solves the problem of poor heat dissipation of the rectifier assembly in the prior art.
In order to solve the above technical problems, the present utility model discloses a rectifier assembly with efficient heat dissipation, comprising: a housing base, a housing cover, a base plate, and an internal component; the internal element is provided with two groups of chip components which are arranged in parallel, the chip components are sequentially provided with a public electrode plate, a chip, a pressing block, a silver sheet, an electrode seat, an insulating sleeve, a flat gasket, a butterfly spring, a pressing plate, a connecting plate, a flat gasket, a spring gasket and an M10 bolt from bottom to top, and the chip is pressed on the public electrode plate by the pressing block; the bottom of the shell seat is in an opening shape, the bottom plate is fixed at the bottom of the shell seat, and a heat conducting plate is arranged between the public electrode plate and the bottom plate; the water channel is arranged in the bottom plate, and the water inlet joint and the water outlet joint of the water channel are positioned on the same side surface of the bottom plate.
Further, the bottom surface of the heat conducting plate is provided with a plurality of heat conducting columns.
Further, the heat conducting plate is inserted on the bottom plate.
Further, the material of the heat conducting plate is copper material.
Compared with the prior art, the method has the following technical effects:
according to the utility model, the heat conducting plate is arranged at the lower part of the chip, the heat conducting plate is spliced with the bottom plate, the water channel is arranged in the bottom plate, and the heat is taken away by flowing water, so that the function of rapid heat dissipation is realized, and the wire efficiency and the service life can be improved.
Of course, it is not necessary for any of the products of the present application to be implemented simultaneously with all of the technical effects described above.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
FIG. 1 is a schematic cross-sectional view of a rectifier assembly of an embodiment of the utility model;
fig. 2 is a top view of a base plate of an embodiment of the present utility model.
Drawings
The device comprises a shell seat 1, a shell cover 2, a bottom plate 3, a public electrode plate 4, a chip 5, a pressing block 6, a silver sheet 7, an electrode seat 8, an insulating sleeve 9, a flat gasket 10, a belleville spring 11, a pressing plate 12, a connecting plate 13, a spring gasket 14, an M10 bolt 15, an M6 bolt, a heat conducting plate 17, a water channel 18, a water inlet joint 19, a water outlet joint 20 and a heat conducting column 21.
Detailed Description
The embodiments of the present application will be described in detail below with reference to the accompanying drawings and examples, so that the implementation process of how the technical means are applied to solve the technical problems and achieve the technical effects of the present application can be fully understood and implemented accordingly.
Referring to fig. 1 and 2, fig. 1 is a schematic cross-sectional view of a rectifier assembly according to an embodiment of the utility model; fig. 2 is a top view of a base plate of an embodiment of the present utility model. A high efficiency heat dissipating rectifier assembly comprising: a housing base 1, a housing cover 2, a base plate 3, and internal components; the internal element is provided with two groups of chip components which are arranged in parallel in the shell seat 1, the chip components are sequentially provided with a public electrode plate 4, a chip 5, a pressing block 6, a silver sheet 7, an electrode seat 8, an insulating sleeve 9, a flat gasket 10, a belleville spring 11, a pressing plate 12, a connecting plate 13, the flat gasket 10, a spring gasket 14 and an M10 bolt 15 from bottom to top, two M6 bolts 16 penetrate through the pressing plate 12, the belleville spring 11, the flat gasket 10, the insulating sleeve 9, the electrode seat 9, the pressing block 6 and the public electrode plate 4 to be fixed with the bottom plate 3, the chip 5 is pressed on the public electrode plate 4 by the pressing block 6, and the two M10 bolts 15 penetrate through the connecting plate 13 to be respectively fixed on the two electrode seats 8; the bottom of the shell seat 1 is in an opening shape, the bottom plate 3 is fixed at the bottom of the shell seat 1, and a heat conducting plate 17 is arranged between the public electrode plate 4 and the bottom plate 3; the bottom plate 3 is internally provided with a water channel 18, and a water inlet joint 19 and a water outlet joint 20 of the water channel 18 are positioned on the same side surface of the bottom plate 3.
The lower part of the public electrode plate 4 is provided with two heat conducting plates 17, the two heat conducting plates 17 are respectively right opposite to the lower parts of the two chips 5, the bottom surface of each heat conducting plate 17 is provided with six heat conducting columns 21, the heat conducting plates 17 are inserted into insertion holes on the top surface of the bottom plate 3, and the heat conducting plates 17 are made of copper materials.
According to the utility model, the heat conducting plate 17 is arranged at the lower part of the chip 5, the heat conducting plate 17 is spliced with the bottom plate 3, the water channel 18 is arranged in the bottom plate 3, and the heat is taken away by flowing water, so that the function of rapid heat dissipation is realized, and the wire efficiency and the service life can be improved.
While the foregoing description illustrates and describes the preferred embodiments of the present utility model, it is to be understood that the utility model is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of numerous other combinations, modifications and environments and is capable of changes or modifications within the scope of the inventive concept as described herein, either as a result of the foregoing teachings or as a result of the knowledge or technology in the relevant art. And that modifications and variations which do not depart from the spirit and scope of the utility model are intended to be within the scope of the appended claims.
Claims (4)
1. A high efficiency heat dissipating rectifier assembly comprising: a housing base, a housing cover, a base plate, and an internal component;
the chip assembly is characterized in that the internal element is provided with two groups of chip assemblies, the two groups of chip assemblies are arranged in parallel, the chip assemblies are sequentially provided with a public electrode plate, a chip, a pressing block, a silver sheet, an electrode holder, an insulating sleeve, a flat gasket, a belleville spring, a pressing plate, a connecting plate, a flat gasket, a spring gasket and an M10 bolt from bottom to top, and the chip is pressed on the public electrode plate by the pressing block; the bottom of the shell seat is in an opening shape, the bottom plate is fixed at the bottom of the shell seat, and a heat conducting plate is arranged between the public electrode plate and the bottom plate; the inside of the bottom plate is provided with a water channel, and a water inlet joint and a water outlet joint of the water channel are positioned on the same side surface of the bottom plate.
2. The high efficiency heat dissipating rectifier assembly of claim 1, wherein said thermally conductive plate bottom surface has a plurality of thermally conductive posts.
3. The high efficiency heat dissipating rectifier assembly of claim 1, wherein said thermally conductive plate is plugged onto the base plate.
4. The high efficiency heat dissipating rectifier assembly of claim 1, wherein said thermally conductive plate is copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321490344.6U CN220290802U (en) | 2023-06-13 | 2023-06-13 | High-efficient radiating rectifier subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321490344.6U CN220290802U (en) | 2023-06-13 | 2023-06-13 | High-efficient radiating rectifier subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220290802U true CN220290802U (en) | 2024-01-02 |
Family
ID=89336642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321490344.6U Active CN220290802U (en) | 2023-06-13 | 2023-06-13 | High-efficient radiating rectifier subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220290802U (en) |
-
2023
- 2023-06-13 CN CN202321490344.6U patent/CN220290802U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1423838A (en) | Parallel-plate/pin-fin hybrid copper heat sink for coding high-powered microprocessor | |
| CN111447755B (en) | Manufacturing and assembling method of controller | |
| CN207531242U (en) | A kind of floating type radiator and its elastic support | |
| RU2299496C2 (en) | Heat radiation system | |
| CN220290802U (en) | High-efficient radiating rectifier subassembly | |
| CN114334458A (en) | SMD high-voltage capacitor | |
| CN112509994A (en) | Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device | |
| CN217694104U (en) | Single-tube IGBT parallel driver | |
| RU2350055C1 (en) | Module consisting of base, power instruments, electrical circuit and heat removal | |
| CN215578527U (en) | Thyristor assembly with efficient heat dissipation function | |
| CN214592129U (en) | Pcb assembling structure | |
| CN206341527U (en) | A kind of metal-oxide-semiconductor mounting structure of Switching Power Supply | |
| CN211453706U (en) | Power processing clamp for sheet resistor | |
| CN210120749U (en) | Power supply structure | |
| CN201374331Y (en) | Automotive rectifier bridge with press-fit diode | |
| US20160111556A1 (en) | High temperature solar cell mount | |
| CN201636635U (en) | Large-power LED lamp | |
| CN106170188A (en) | A kind of electric motor car CAN communication controller | |
| CN217486664U (en) | PTC heater with strong heat dissipation performance | |
| CN213755120U (en) | Controller and electrical apparatus subassembly | |
| CN111800021A (en) | Rectifier for a welding transformer of a welding system and method for producing such a rectifier | |
| CN205596026U (en) | Rectifier is resumeed soon to high -power | |
| CN219642822U (en) | Heat dissipation device for power device and electronic equipment comprising power device | |
| CN109671686A (en) | A kind of encapsulating structure of crimp type IGBT | |
| CN213782008U (en) | Semiconductor device fixing device and heat dissipation assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |