CN111447755B - Manufacturing and assembling method of controller - Google Patents
Manufacturing and assembling method of controller Download PDFInfo
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- CN111447755B CN111447755B CN202010297011.6A CN202010297011A CN111447755B CN 111447755 B CN111447755 B CN 111447755B CN 202010297011 A CN202010297011 A CN 202010297011A CN 111447755 B CN111447755 B CN 111447755B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/64—Electric machine technologies in electromobility
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a manufacturing and assembling method of a controller. At the moment, because the position of the power tube is not fixed, the first guarantee that the pressing sheet acts on the power tube to enable the power tube to be tightly attached to the radiating wall; and secondly, the power tube can be ensured to have no installation stress. And then wave soldering is carried out on the PCBA board and the whole radiating shell which are assembled with the power tube and the capacitor. Therefore, the heat dissipation effect of the power tube is ensured, and the installation stress of the power tube is eliminated. The risk of cracking or tube explosion of the power tube is avoided.
Description
Technical Field
The invention relates to a motor controller, in particular to a manufacturing and assembling method of the motor controller.
Background
The new energy electric automobile is more and more widely applied, and the requirement on an electric automobile controller is higher and higher. The controller of the electric vehicle is a core component for controlling the starting, running, advancing and retreating, speed stopping of the motor of the electric vehicle and other electronic devices of the electric vehicle. The controller controls the motor of the electric automobile through various power elements such as capacitors, resistors, sensors and the like arranged in the controller.
The existing motor controller comprises a PCB (printed circuit board), wherein power elements such as a capacitor and a power tube, a positive and negative wiring and a UVW wiring are arranged on the PCB. In the working process, power elements such as a capacitor and a power tube generate heat seriously, and a cooling liquid channel needs to be designed on a shell of the controller to cool the power elements such as the capacitor and the power tube so as to ensure the working reliability of the power elements. In the manufacturing and assembling process of the existing motor controller, after power elements such as a capacitor and a power tube are mounted on a PCB, the PCB is subjected to wave soldering, so that the power elements such as the capacitor and the power tube are fixed on the PCB. Then, a pressing sheet is arranged in a placing cavity of the heat dissipation shell with the cooling water channel, power elements such as a power tube and the like fixed on the PCB are pressed and fixed on the wall of the placing cavity of the heat dissipation shell through the pressing sheet, a cooling liquid channel is arranged in the placing cavity, and the heat generated by the power tube, a capacitor and the like in the working process is taken away by utilizing the cooling liquid in the cooling water channel to cool the cavity wall, so that the normal working of the controller is ensured.
However, with the above-mentioned manufacturing and assembling method, in the long-term practical use of the inventor, the following problems still exist: first, although the heat generated by the power tube is carried away by the coolant in the coolant channel, there is still a case where the power tube is overheated and explodes. Secondly, the power tube has the condition of excessive stress and cracking after a period of use.
Chinese patent CN106655814B discloses a method for manufacturing an ac electronic controller, and specifically discloses a method for manufacturing an ac motor controller, which includes a heat dissipation bottom plate and three power modules; each power module comprises a first PCB substrate, a first positive copper bar, a first negative copper bar, a current output copper bar and two IGBT module groups, wherein a plurality of first through holes and a plurality of second through holes are formed in the first PCB substrate; the first PCB substrate is also provided with a plurality of bonding pads, and one first through hole and one second through hole are positioned in one bonding pad; each group of IGBT module group comprises more than two IGBT modules which are connected in parallel; the manufacturing method of the alternating current motor controller comprises the following steps: carrying out surface mounting processing on the first PCB substrate; inserting a first pin of the first positive copper bar onto one first through hole; inserting a second pin of the first negative copper bar onto the other first through hole; inserting a third pin of the current output copper bar onto another first through hole; inserting a fourth pin of the IGBT module of each IGBT module group into a second through hole; respectively performing wave soldering on the first pin, the second pin and the third pin with the first through hole, and simultaneously performing wave soldering on the fourth pin with the second through hole; the positioning holes in the first PCB substrate are matched and connected with the positioning pins on the radiating bottom plate, the two IGBT module groups face the radiating bottom plate, an insulating heat-conducting plate is arranged between the two IGBT module groups and the radiating bottom plate, and the insulating heat-conducting plate is abutted between the radiating bottom plate and the two IGBT module groups; mounting a positive terminal on the first positive copper bar, and enabling the positive terminal to penetrate through the first PCB substrate; and mounting a negative terminal on the first negative copper bar, and enabling the negative terminal to penetrate through the first PCB substrate. Although this patent provides a method for making a controller, it does not address the problems associated with overheating and bursting of the power tube and excessive stress cracking.
Disclosure of Invention
The invention aims to provide a manufacturing and assembling method of a controller, which can eliminate stress on a power tube mounting pin in the controller, avoid cracking of the power tube pin and avoid overheating and cracking of the power tube.
In order to achieve the above object, the present invention is realized by: the manufacturing and assembling method of the controller comprises a shell, wherein the shell comprises a heat dissipation bottom shell and a cover body, and further comprises a PCBA (printed circuit board assembly) plate, a capacitor element, a power tube, a communication connector and an auxiliary power transformer; a cavity for installing the capacitor element is arranged on the heat dissipation bottom shell, a cooling liquid channel is arranged in the side wall of the cavity, a step is arranged in the middle of the side wall of the cavity, and an installation table for installing the power tube is formed above the step;
the manufacturing and assembling steps are as follows:
step (1): the pre-treatment of the heat-dissipating bottom shell,
an insulating sheet is attached to the side wall, used for installing the power tube, in the heat dissipation bottom shell; the bottom in the cavity is provided with a U-shaped pressing sheet, two sides of the U-shaped pressing sheet are provided with pressing tongues, the pressing tongues are opposite to the side wall of the cavity and are used for pressing the power tube, and two ends of the U-shaped pressing sheet are provided with fixing pieces for fixing the U-shaped pressing sheet and the heat dissipation bottom shell;
step (2): the pre-treatment of the PCBA board,
firstly, carrying out paster processing on the PCBA, arranging a plurality of paster nuts on the back of the PCBA, carrying out AOI detection on the PCBA after reflow soldering, carrying out needle bed inspection on the PCBA, and inspecting whether the paster nut soldering tin on the PCBA is full; inserting the power tube and the capacitor element on the tool of the PCBA from the back, inserting the auxiliary transformer and the communication connector on the tool of the PCBA from the back, and sleeving a sealing ring arranged between the heat dissipation bottom shell and the cover body on the communication connector;
and (3): the PCBA board and the heat dissipation bottom shell are integrally wave-soldered,
placing the PCBA in the step (2) with the back side facing upwards, downwards buckling an opening of the heat dissipation bottom case in the step (1) on the PCBA in the step (2), enabling a capacitor element inserted in the PCBA to be located in a U-shaped pressing sheet arranged in the cavity, enabling a power tube inserted in the PCBA to be located on an installation table and pressed on the side wall of the cavity by the pressing tongue, turning the PCBA and the heat dissipation bottom case integrally to enable the front side of the PCBA to face upwards after buckling is finished, fixing the PCBA to the heat dissipation bottom case by using screws, then performing wave soldering on the PCBA and the heat dissipation bottom case integrally, and performing AOI detection and performance inspection after wave soldering;
and (4): the terminal is mounted on the base plate,
assembling a copper column on the PCBA board in the step (3), wherein the copper column is in threaded connection with a patch nut on the back of the PCBA board, then installing a current sensor electrically connected with the copper column, and connecting a shell of the current sensor with the patch nut on the back of the PCBA board through a screw; then, a cover body is arranged on a heat dissipation bottom shell, the cover body is fixedly connected with the heat dissipation bottom shell through screws, an opening is formed in the top of the cover body, the copper column is located at the opening, a wiring through hole is formed in the side wall of the cover body, a wiring extends into the cover body through the wiring through hole and is sleeved on the copper column, and the wiring is in threaded connection with an inner hole of the copper column through the screws;
and (5): a cover plate is installed on the base plate,
and (4) after the wiring in the step (4) is finished, sealing the opening of the cover body by adopting a cover plate, and installing a waterproof joint at the wiring through hole on the cover body.
By adopting the manufacturing and mounting steps, the stress on the mounting pin of the power tube can be eliminated, the power tube is prevented from cracking, the power tube can be tightly attached to the side wall of the cavity with the cooling liquid channel, the heat dissipation effect of the power tube is improved, and the power tube is prevented from being cracked due to overheating.
In addition, in the above manufacturing and assembling method, the mounting order of the step (1) and the step (2) may be reversed to each other.
Further, the method also comprises the following step (a): the side wall of the heat dissipation bottom shell is provided with a water channel inlet and a water channel outlet, a water inlet pipe is installed at the water channel inlet, a water outlet pipe is installed at the water channel outlet, and a water plate is installed at the bottom of the heat dissipation bottom shell; the step (a) may be located before the step (1), after the step (5), or at any position between the steps (1) to (5).
In order to further ensure that the pressure applied by the U-shaped pressing sheet to the power tube is certain and further avoid the change of the position of the U-shaped pressing sheet, an upward bulge is arranged at the bottom of the cavity of the heat dissipation bottom shell, and a through hole matched with the bulge is arranged on the bottom surface of the U-shaped pressing sheet.
In order to further ensure that the pressure applied by the U-shaped pressing sheet to the power tube is constant, a plurality of pressing tongues are upwards extended from two sides of the bottom surface of the U-shaped pressing sheet and are provided with outwards inclined surfaces upwards extended from the edge of the bottom surface, outwards protruded arc-shaped outer convex surfaces connected with the outwards inclined surfaces and inwards concaved arc-shaped inner concave surfaces connected with the outwards protruded arc-shaped outer convex surfaces, and the outwards protruded arc-shaped outer convex surfaces are opposite to the side wall of the cavity on the upper portion of the mounting table.
In order to further ensure that the pressure applied to the power tube by the U-shaped pressing sheet is certain and further avoid the change of the position of the U-shaped pressing sheet, two end parts of the bottom surface of the U-shaped pressing sheet are provided with limiting holes, L-shaped fixing parts are further installed at two end parts of the bottom surface of the U-shaped pressing sheet and are provided with transverse arms and vertical arms, limiting support legs are arranged at the end parts of the vertical arms of the L-shaped fixing parts and are inserted into the limiting holes to limit the U-shaped pressing sheet, and the transverse arms are connected with the radiating shell through screws.
Preferably, be connected with five on the PCBA board and copper post, two of them copper posts are used for being connected with positive negative pole, and three other copper posts connect and are used for connecing UVW, and wherein be used for connecing two arbitrary copper posts in the UVW to be provided with current sensor.
For further guaranteeing the use reliability of controller, still include dustproof cover plate, dustproof cover plate is located the opening part of lid and adopt the screw with the interior wall connection of lid set up the via hole on the dustproof cover plate, the copper post stretches into in the via hole and be provided with the sealing washer between the via hole with the copper post, via hole department with the wiring through-hole department that sets up on the lid is provided with the wiring line groove.
For further improving the radiating efficiency and reducing water resistance the back of heat dissipation drain pan is provided with the water course structure, the water course structure has water course entry and water course export, the water course entry is connected with import main water course, the water course export is connected with export main water course be provided with many parallelly connected distributive passageways between import main water course and the export main water course, each distributive passageway transversely runs through respectively the cavity lateral wall, just the distributive passageway is the wave setting along the runner of rivers direction.
In order to further improve the heat dissipation efficiency and reduce water resistance, an arc-shaped chamfer is arranged on the inlet side of the water channel, which is away from the water flow inlet end of the water diversion channel, and an inclined plane or a plane is arranged on the inlet side, which faces the water channel, of the water flow inlet end of the water diversion channel; an arc-shaped chamfer is arranged on the side, facing the water channel, of the water flow outlet end of the water diversion channel, and an inclined plane or a plane is arranged on the side, facing the water channel, of the water flow outlet end of the water diversion channel.
Has the advantages that:
the invention provides a manufacturing and assembling method for a motor controller. The inventor researches and discovers that although a heat dissipation structure for a power element, such as a cooling water channel, is arranged in the conventional controller, the problems of large stress cracking of a power tube and overheating tube explosion of the power tube still easily occur in the conventional controller. The main reasons are: in the manufacturing and assembling process of the prior controller, the power tube is welded on the PCBA board by wave soldering in advance, then the PCBA board is installed on the heat dissipation shell, and the power tube is pressed to be attached to the heat dissipation wall by the pressing sheet. Because the power tube is firstly wave-soldering and then installed, the situation that the pressing sheet cannot be tightly pressed when the power tube is pressed by the pressing sheet can be caused, so that the power tube cannot be attached to the heat dissipation wall, and the situation that the power tube is overheated and explodes is caused; it also causes the power tube to be stressed by the tongue depressor, resulting in cracking problems.
The power tube and the capacitor element are inserted on the PCBA board in advance, and then the PCBA board and the heat dissipation bottom shell are fixed. At the moment, because the position of the power tube is not fixed, the first guarantee that the pressing sheet acts on the power tube to enable the power tube to be tightly attached to the radiating wall; and secondly, the power tube can be ensured to have no installation stress. And then wave soldering is carried out on the PCBA board and the whole radiating shell which are assembled with the power tube and the capacitor. Thus, the above two problems can be solved simultaneously. The heat dissipation effect of the power tube is ensured, and the installation stress of the power tube is eliminated. The risk of cracking or tube explosion of the power tube is avoided.
In addition, the water diversion channels of the main water channel are connected in series and in parallel, and the flow channel of each water diversion channel is in a wave-shaped design, so that when the cooling liquid flows to the middle of the water diversion channels, the cooling liquid can continuously impact the corrugated side walls of the water diversion channels by utilizing liquid pressure, heat generated by the power element during working is taken away to the greatest extent, and the heat dissipation effect is good.
Moreover, an arc-shaped chamfer is arranged on the inlet side of the back water channel of the water flow inlet end of the water diversion channel, and an inclined plane or a plane is arranged on the inlet side of the water inlet channel; an arc chamfer is arranged on the side of the water outlet of the water flow outlet end of the water diversion channel, and an inclined plane or a plane is arranged on the side of the water outlet of the water channel; the water resistance can be reduced, the pressure loss is ensured to be within the standard range of the controller, the stability and uniformity of water flow are ensured, and the heat dissipation effect is improved.
Drawings
FIG. 1 is a structural diagram of a heat dissipation bottom case in an embodiment;
FIGS. 2 and 3 are diagrams of the heat dissipation bottom case in step (1) of the embodiment;
FIG. 4 is a view showing the mounting of a pressing sheet in the heat dissipation base case in the step (1) of the embodiment;
FIG. 5 is a front view of a wafer;
FIG. 6 is an isometric view of a tablet;
FIG. 7 is an isometric view of an L-shaped retention tab;
fig. 8 is a water passage arrangement diagram of the heat radiating bottom case;
FIG. 9 is a front view of a PCBA board in step (2) in accordance with the present example;
FIG. 10 is a diagram of a pre-processed back side of a PCBA board in example step (2);
FIGS. 11 and 12 are schematic views showing the mounting of terminals on the PCBA board in step (4) of the embodiment;
FIG. 13 is an isometric view of the dust cover;
fig. 14 is an isometric view of the controller in an example embodiment after installation.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings, but the present invention is not limited to these embodiments, and any modifications or substitutions in the basic spirit of the embodiments will still fall within the scope of the present invention as claimed in the claims.
Example (b): as shown in fig. 1-14, the present invention provides a method of manufacturing and assembling a controller. The controller can be used for controlling the motor, and is particularly applied to controlling the starting, running, advancing and retreating, speed stopping and the like of the motor in the new energy electric vehicle. The controller generally has a housing, in which a circuit board and a power element are disposed, and a heat dissipation structure for dissipating heat from the power element is generally disposed. And the shell is also provided with positive and negative terminals for connecting a power supply and terminals for controlling and monitoring UVW.
The controller in the embodiment comprises a shell, wherein the shell comprises a heat dissipation bottom shell 1, a cover body 2, a PCBA (printed circuit board assembly) plate 3, a capacitor element 4, a power tube 5, a communication connector 6 and an auxiliary power transformer 7; the heat dissipation bottom shell is provided with a cavity 101 used for installing the capacitor element, a cooling liquid channel is arranged in the side wall of the cavity, the middle part of the side wall of the cavity is provided with a step 102, and an installation platform used for installing the power tube is formed above the step.
The controller is manufactured and assembled according to the following steps:
step (1): as shown in fig. 1-8, the heat dissipation bottom case is pre-treated,
insulating sheets are attached to the side wall and the top wall of the heat dissipation bottom shell, which are used for installing the power tubes; the bottom in the cavity is provided with a U-shaped pressing sheet 8, two sides of the U-shaped pressing sheet are provided with pressing tongues 801, the pressing tongues are opposite to the side wall of the cavity and are used for pressing the power tube, and fixing pieces are arranged at two ends of the U-shaped pressing sheet and are used for fixing the U-shaped pressing sheet and the heat dissipation bottom shell;
step (2): referring to fig. 9-10, pcba board pre-treatment,
firstly, carrying out surface mounting treatment on the PCBA, arranging a plurality of surface mounting nuts 301 on the back of the PCBA, carrying out AOI detection on the PCBA after double-sided reflow soldering, carrying out needle bed inspection on the PCBA, and inspecting whether surface mounting nut soldering tin on the PCBA is full; inserting the power tube and the capacitor element on the tool of the PCBA plate from the back, inserting the auxiliary transformer and the communication connector on the tool of the PCBA plate from the back, and sleeving the sealing ring 9 arranged between the heat dissipation bottom shell and the cover body on the communication connector;
and (3): the PCBA board and the heat dissipation bottom shell are integrally wave-soldered,
placing the PCBA in the step (2) with the back side facing upwards, downwards buckling an opening of the heat dissipation bottom case in the step (1) on the PCBA in the step (2), enabling a capacitor element inserted in the PCBA to be located in a U-shaped pressing sheet arranged in the cavity, enabling a power tube inserted in the PCBA to be located on an installation table and pressed on the side wall of the cavity by the pressing tongue, turning the PCBA and the heat dissipation bottom case integrally to enable the front side of the PCBA to face upwards after buckling is finished, fixing the PCBA to the heat dissipation bottom case by using screws, then performing wave soldering on the PCBA and the heat dissipation bottom case integrally, and performing AOI detection and performance inspection after wave soldering;
and (4): as shown in fig. 11-13, the mounting terminals,
assembling a copper column 302 on the PCBA board in the step (3), wherein the copper column is in threaded connection with a patch nut on the back of the PCBA board, then installing a current sensor 303 electrically connected with the copper column, and connecting a shell of the current sensor with the patch nut on the back of the PCBA board through a screw; then, a cover body 2 is installed on a heat dissipation bottom shell, the cover body is fixedly connected with the heat dissipation bottom shell through screws, an opening 201 is formed in the top of the cover body, the copper column is located at the opening, a wiring through hole 202 is formed in the side wall of the cover body, a wiring 10 extends into the cover body from the wiring through hole and is sleeved on the copper column, and the wiring is in threaded connection with an inner hole of the copper column through screws;
and (5): see fig. 14, the cover plate is installed,
and (4) after the wiring in the step (4) is finished, sealing the opening of the cover body by adopting a cover plate 11, and installing a waterproof joint 12 at the wiring through hole on the cover body. In addition, an interface 15 is installed at the installation site of the communication connector.
In the manufacturing and assembling method, the mounting sequence of the step (1) and the step (2) can be reversed. The PCBA board can be pretreated firstly, and then the radiating bottom shell is pretreated.
Further, the method comprises the step (a): the side wall of the heat dissipation bottom shell is provided with a water channel inlet 104 and a water channel outlet 105, a water inlet pipe 106 is installed at the water channel inlet, a water outlet pipe 107 is installed at the water channel outlet, and a water plate is installed at the bottom of the heat dissipation bottom shell; the step (a) may be located before the step (1), after the step (5) or at any position between the step (1) and the step (5).
In this embodiment, the capacitance elements are arranged in two transverse rows on the PCBA board, and a row of power tubes is respectively arranged on both sides of each row of capacitance elements. Then, two transverse chambers are correspondingly arranged on the heat dissipation bottom shell respectively, a chamber partition plate is formed between the two transverse chambers, two sides of the chamber partition plate are respectively chamber side walls, and the other side of the two chambers, which is away from each other, is also provided with a chamber side wall. That is, 4 chamber sidewalls are provided, and a lateral step is provided at the middle of each chamber sidewall for mounting the power tube. In this embodiment, the insulating sheet in step (1) is attached to the sidewall of the chamber at the upper part of the step and the top of the chamber, i.e. where the insulating sheet contacts the power tube. The insulating sheet is adhered to the cavity wall by a double-faced adhesive tape, and air bubbles and unevenness cannot be detected after the insulating sheet is adhered tightly.
In addition, the U-shaped pressing plate in this embodiment has a bottom surface 802, an upward protrusion 103 is provided at the bottom of the cavity of the heat dissipation bottom case, and a through hole 803 matching with the protrusion is provided at the bottom surface of the U-shaped pressing plate 8. The number of the projections in this embodiment is 3, but may be 2, 4, 5, or the like. During installation, the through hole on the bottom plate of the U-shaped pressing sheet is sleeved on the bulge at the bottom of the cavity. An L-shaped retainer 13 is also provided in this embodiment, having a transverse arm 131 and a vertical arm 132, the end of the vertical arm of the L-shaped retainer having a spacing foot 133. And two end parts of the bottom surface of the U-shaped pressing sheet are provided with limiting holes 804. During installation, limiting support legs arranged on the vertical wall of the L-shaped fixing piece are inserted into the limiting holes to limit the U-shaped pressing piece, and the transverse arm of the L-shaped fixing piece is connected with the radiating shell through a screw. A plurality of pressing tongues 801 extend upwards from two sides of the bottom surface of the U-shaped pressing sheet, each pressing tongue is provided with an outward inclined surface 801a extending upwards from the edge of the bottom surface, an arc-shaped outer convex surface 801b connected with the outward inclined surface and protruding outwards, and an arc-shaped inner concave surface 801c connected with the arc-shaped outer convex surface and recessed inwards, and the arc-shaped outer convex surface is opposite to the side wall of the cavity at the upper part of the mounting table. Above, guaranteed the rigidity of U-shaped preforming in the heat dissipation drain pan through arch and spacing stabilizer blade to further guaranteed the position of tongue depressor, make the tongue depressor give the power tube the pressure certain.
In addition, the PCBA board in this embodiment is connected with five and copper posts, two of them copper posts are used for being connected with positive negative pole, and the other three copper posts are connected and are used for connecting UVW, wherein be used for connecting arbitrary two copper posts in UVW and be provided with current sensor. The middle of the bottom of the copper column is provided with a screw rod, and the middle of the top of the copper column is provided with a screw hole. Wherein the bottom screw is adapted to threadedly engage a patch nut on the back of the PCBA board and the top screw is adapted to engage a screw to lock the wiring. The current sensor in this embodiment has a bowl-shaped housing 304 with a hole in the middle through the copper post. And the bowl-shaped casing both ends are stretched out and are had journal stirrup 305, be provided with the via hole on the journal stirrup, adopt the screw to pass the via hole and with the paster nut spiro union at the PCBA board back, and then with the current sensor installation.
As another implementation manner in this embodiment, the cover body further includes a dustproof cover plate 14, and the dustproof cover plate is located at the opening of the cover body and is connected to the inner wall of the cover body in advance by using screws. And a copper pillar via hole 142 is formed in the dustproof cover plate, so that the copper pillar can penetrate through the copper pillar via hole. And a sealing ring 15 is arranged between the copper pillar via hole and the copper pillar. In addition, a wire passing groove 141 is formed in the top surface of the dustproof cover plate from a wiring through hole formed in the cover body to a copper column through hole formed in the dustproof cover plate, and the wire passing groove is a one-way through groove and facilitates the wiring to extend into the cover body from the wiring through hole.
As another implementation manner, the present embodiment provides a heat dissipation structure of a heat dissipation bottom case. Specifically, a cooling water passage is provided on the back surface (the surface opposite to the chamber) of the heat dissipation bottom case. The structure of the cooling water channel comprises a water channel inlet 104 and a water channel outlet 105, the water channel inlet is connected with an inlet main water channel 108, the water channel outlet is connected with an outlet main water channel 109, a plurality of water diversion channels 110 which are connected in parallel are arranged between the inlet main water channel and the outlet main water channel, each water diversion channel transversely penetrates through the inner part of the side wall of the cavity, and the water diversion channels are arranged in a wave shape along the flow channel of the water flow direction. In addition, an arc-shaped chamfer is arranged on the inlet side of the water channel, which is away from the water flow inlet end of the water diversion channel, and an inclined plane or a plane is arranged on the inlet side, which faces the water channel, of the water flow inlet end of the water diversion channel; the water diversion channel is characterized in that an arc-shaped chamfer is arranged on the side, facing the water channel, of the water outlet end of the water diversion channel, and an inclined plane or a plane is arranged on the side, facing the water channel, of the water outlet end of the water diversion channel. And a deflection water channel 111 which deflects to one side is arranged at the joint of the water channel inlet and the inlet main water channel, and a deflection water channel 111 which deflects to one side is arranged at the joint of the water channel outlet and the outlet main water channel. The cross section area of the inlet main water channel or the outlet main water channel is larger than the sum of the cross section areas of the water diversion channels.
In this embodiment, since there are four rows of power tubes, four water distribution channels are correspondingly disposed, two water distribution channels are disposed in the chamber partition, and another water distribution channel is disposed in the opposite side walls of the two chambers, which is four in total. And the flow of each water diversion channel is the same.
In the manufacturing and assembling method of the controller of this embodiment, the power tube and the capacitor element are inserted into the PCBA board, and then the PCBA board is fixed to the heat dissipation bottom case. At the moment, the power tube is not fixed, so that the pressing sheet can act on the power tube to enable the power tube to be tightly attached to the radiating wall; and secondly, the power tube can be ensured to be free from installation stress. And then wave soldering is carried out on the PCBA board with the power tube and the capacitor and the whole radiating shell. Thus, the above two problems can be solved simultaneously. The heat dissipation effect of the power tube is ensured, and the power tube is prevented from generating installation stress. The risk of cracking or tube explosion of the power tube is avoided.
In addition, by means of the arrangement mode of the series-parallel main water channel water diversion channels, and the flow channel of each water diversion channel is in a wave-shaped design, when the cooling liquid flows to the middle of the water diversion channel, the cooling liquid can continuously impact the corrugated side wall of the water diversion channel by using liquid pressure, so that heat generated by the power element during working can be taken away to the greatest extent, and the heat dissipation effect is good.
Moreover, a deflection water channel is arranged at the main water channel, an arc-shaped chamfer is arranged on the inlet side of a water channel at the back of the water flow inlet end of the water diversion channel, and an inclined plane or a plane is arranged on the inlet side of a water facing channel; an arc chamfer is arranged on the side of the water outlet of the water flow outlet end of the water diversion channel, and an inclined plane or a plane is arranged on the side of the water outlet of the water channel; the water resistance can be reduced, and the pressure loss is ensured to be within the standard range of the controller; and the water flow in each set of water diversion channel can be ensured to be sufficient, the swirling flow at the joint of the main water channel and the water diversion channel is avoided, and the stability of the water flow is ensured. The heat dissipation effect is improved.
Claims (10)
1. The manufacturing and assembling method of the controller comprises a shell, wherein the shell comprises a heat dissipation bottom shell and a cover body, and further comprises a PCBA (printed circuit board assembly) plate, a capacitor element, a power tube, a communication connector and an auxiliary power transformer; a cavity for installing the capacitor element is arranged on the heat dissipation bottom shell, a cooling liquid channel is arranged in the side wall of the cavity, a step is arranged in the middle of the side wall of the cavity, and an installation table for installing the power tube is formed above the step;
the manufacturing and assembling steps are as follows:
step (1): the pre-treatment of the heat-dissipating bottom shell,
an insulating sheet is attached to the side wall of the heat dissipation bottom shell, which is used for installing the power tube; the bottom in the cavity is provided with a U-shaped pressing sheet, two sides of the U-shaped pressing sheet are provided with pressing tongues, the pressing tongues are opposite to the side wall of the cavity and are used for pressing the power tube, and two ends of the U-shaped pressing sheet are provided with fixing pieces for fixing the U-shaped pressing sheet and the heat dissipation bottom shell;
step (2): the pre-treatment of the PCBA board,
firstly, carrying out surface mounting treatment on the PCBA, arranging a plurality of surface mounting nuts on the back of the PCBA, carrying out AOI detection on the PCBA after reflow soldering, carrying out needle bed inspection on the PCBA, and inspecting whether the surface mounting nut soldering tin on the PCBA is full; inserting the power tube and the capacitor element on the tool of the PCBA plate from the back, inserting the auxiliary transformer and the communication connector on the tool of the PCBA plate from the back, and then sleeving the sealing ring arranged between the heat dissipation bottom shell and the cover body on the communication connector;
and (3): the PCBA board and the heat dissipation bottom shell are integrally wave-welded,
placing the PCBA in the step (2) with the back side facing upwards, downwards buckling an opening of the heat dissipation bottom case in the step (1) on the PCBA in the step (2), enabling a capacitor element inserted in the PCBA to be located in a U-shaped pressing sheet arranged in the cavity, enabling a power tube inserted in the PCBA to be located on an installation table and pressed on the side wall of the cavity by the pressing tongue, turning the PCBA and the heat dissipation bottom case integrally to enable the front side of the PCBA to face upwards after buckling is finished, fixing the PCBA to the heat dissipation bottom case by using screws, then performing wave soldering on the PCBA and the heat dissipation bottom case integrally, performing AOI detection after wave soldering, and checking the performance of the whole machine;
and (4): the terminal block is installed, and the terminal block is installed,
and (5): and (6) installing a cover plate.
2. The manufacturing and assembling method of a controller according to claim 1, wherein: the mounting order of step (1) and step (2) may be reversed with respect to each other.
3. The manufacturing and assembling method of a controller according to claim 1 or 2, wherein: further comprising the step (a): the side wall of the heat dissipation bottom shell is provided with a water channel inlet and a water channel outlet, a water inlet pipe is installed at the water channel inlet, a water outlet pipe is installed at the water channel outlet, and a cover plate is installed at the bottom of the heat dissipation bottom shell; the step (a) may be located before the step (1), after the step (5), or at any position between the steps (1) to (5).
4. A method of manufacturing and assembling a controller according to claim 3, wherein:
and (4): the terminal block is installed, and the terminal block is installed,
assembling a copper column on the PCBA board in the step (3), wherein the copper column is in threaded connection with a patch nut on the back of the PCBA board, then installing a current sensor electrically connected with the copper column, and connecting a shell of the current sensor with the patch nut on the back of the PCBA board through a screw; then, a cover body is arranged on a heat dissipation bottom shell, the cover body is fixedly connected with the heat dissipation bottom shell through screws, an opening is formed in the top of the cover body, the copper column is located at the opening, a wiring through hole is formed in the side wall of the cover body, a wiring extends into the cover body through the wiring through hole and is sleeved on the copper column, and the wiring is in threaded connection with an inner hole of the copper column through the screws;
and (5): a cover plate is arranged on the base plate,
and (4) after the wiring in the step (4) is finished, sealing the opening of the cover body by adopting a cover plate, and installing a waterproof joint at the wiring through hole on the cover body.
5. The manufacturing and assembling method of a controller according to claim 4, wherein: a plurality of pressing tongues extend upwards from two sides of the bottom surface of the U-shaped pressing sheet, each pressing tongue is provided with an outward inclined surface extending upwards from the edge of the bottom surface, an arc-shaped outer convex surface connected with the outward inclined surface and protruding outwards, and an arc-shaped inner concave surface connected with the arc-shaped outer convex surface and recessed inwards, and the arc-shaped outer convex surface is opposite to the side wall of the cavity at the upper part of the mounting table.
6. The manufacturing and assembling method of a controller according to claim 5, wherein: the bottom of the cavity of the heat dissipation bottom shell is provided with an upward bulge, the bottom surface of the U-shaped pressing sheet is provided with a through hole matched with the bulge, two end parts of the bottom surface of the U-shaped pressing sheet are provided with limit holes, L-shaped fixing parts are further mounted at two end parts of the bottom surface of the U-shaped pressing sheet and provided with a transverse arm and a vertical arm, the end part of the vertical arm of each L-shaped fixing part is provided with a limit supporting leg, the limit supporting leg is inserted into the limit holes to limit the U-shaped pressing sheet, and the transverse arm is connected with the heat dissipation shell through a screw.
7. The manufacturing and assembling method of a controller according to claim 6, wherein: the PCBA board is connected with five copper columns, wherein two copper columns are used for being connected with a positive electrode and a negative electrode, the other three copper columns are connected and used for connecting UVW, and any two copper columns used for connecting UVW are provided with current sensors.
8. The manufacturing and assembling method of a controller according to claim 7, wherein: still include dustproof cover plate, dustproof cover plate is located the opening part of lid and adopt the screw with the interior wall connection of lid set up the via hole on the dustproof cover plate, the copper post stretches into in the via hole and be in the via hole with be provided with the sealing washer between the copper post, via hole department with the wiring through-hole department that sets up on the lid is provided with the wiring line groove.
9. The manufacturing and assembling method of a controller according to claim 8, wherein: the back of heat dissipation drain pan is provided with the water course structure, the water course structure has water course entry and water course export, the water course entry is connected with import main water course, the water course export is connected with export main water course be provided with many parallelly connected water diversion channels between import main water course and the export main water course, each water diversion channel transversely runs through respectively the cavity lateral wall, just the water diversion channel is the wave setting along the runner of rivers direction.
10. The manufacturing and assembling method of a controller according to claim 9, wherein: an arc-shaped chamfer is arranged on the inlet side of the water channel, which is away from the water flow inlet end of the water diversion channel, and an inclined plane or a plane is arranged on the inlet side of the water channel, which faces the water flow inlet end of the water diversion channel; an arc-shaped chamfer is arranged on the side, facing the water channel, of the water flow outlet end of the water diversion channel, and an inclined plane or a plane is arranged on the side, facing the water channel, of the water flow outlet end of the water diversion channel.
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| CN202010297011.6A CN111447755B (en) | 2020-04-15 | 2020-04-15 | Manufacturing and assembling method of controller |
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| CN202010297011.6A CN111447755B (en) | 2020-04-15 | 2020-04-15 | Manufacturing and assembling method of controller |
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| CN112087919A (en) * | 2020-08-12 | 2020-12-15 | 深圳科士达科技股份有限公司 | Efficient radiator and mounting method thereof |
| CN112453739B (en) * | 2020-11-12 | 2022-11-08 | 宁德丹诺西诚科技有限公司 | New energy automobile high-voltage PTC product processing method and processing equipment |
| CN113747753A (en) * | 2021-08-13 | 2021-12-03 | 浙江奥思伟尔电动科技有限公司 | Vehicle-mounted driving module assembly |
| CN114980724A (en) * | 2022-06-17 | 2022-08-30 | 中国华能集团清洁能源技术研究院有限公司 | MPPT controller assembling process |
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Effective date of registration: 20230815 Address after: 400054 Second Floor of 12 Blocks 126 Yunan Avenue, Banan District, Chongqing Patentee after: Chongqing Zongshen Jiyan Mechanical and Electrical Technology Co.,Ltd. Address before: 400054 2nd floor, building 7, 126 Yunan Avenue, Banan District, Chongqing Patentee before: Chongqing Zongshen Electronic Technology Co.,Ltd. |