CN220272498U - Light-emitting diode packaging structure - Google Patents
Light-emitting diode packaging structure Download PDFInfo
- Publication number
- CN220272498U CN220272498U CN202321138792.XU CN202321138792U CN220272498U CN 220272498 U CN220272498 U CN 220272498U CN 202321138792 U CN202321138792 U CN 202321138792U CN 220272498 U CN220272498 U CN 220272498U
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- CN
- China
- Prior art keywords
- pin
- emitting diode
- cover body
- basal portion
- light emitting
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model relates to the technical field of diode packaging, in particular to a light-emitting diode packaging structure which comprises a first base part, a second base part, a diode wafer, a first pin, a second pin, a packaging cover body and a top disc.
Description
Technical Field
The present utility model relates to the field of diode packaging technology, and in particular, to a light emitting diode packaging structure.
Background
The light-emitting diode is a semiconductor electronic element capable of converting electric energy into light energy, and the main functional element is a diode wafer, so that the light-emitting diode is conveniently used, and is generally packaged in a packaging mode, so that the light-emitting diode is convenient to use, longer in service life and more stable in work.
The LED packaging structure generally comprises a base, pins and a packaging cover body, wherein the packaging cover body packages the base, the packaging cover body, a diode wafer and a part of the pins, the whole packaging cover body is of a hemispherical structure, the other part of the pins extends out of the packaging cover body and is used for being connected with the pins in an action mode, when the structure is installed with a circuit board, the bottom of the packaging cover body cannot be directly propped against the circuit board, the packaging cover body can be inclined under stress, the pins are bent, and repeated bending is used for breaking.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a light-emitting diode packaging structure.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a light emitting diode packaging structure, includes first basal portion, second basal portion, diode wafer, the diode wafer is fixed at the top of first basal portion, and the first utmost point electric connection of first basal portion and diode wafer, the second basal portion is through wiring and the second utmost point electric connection of diode wafer, the outside of first basal portion, second basal portion, diode wafer, wiring is provided with the encapsulation cover body, the bottom fixedly connected with first pin of first basal portion, the side of first pin is provided with first side exhibition portion, the bottom fixedly connected with second pin of second basal portion, the side of second pin is provided with second side exhibition portion, and second side exhibition portion, first side exhibition portion are in same height to be provided with the top dish between.
As a further description of the above technical solution:
the top of first basal portion is provided with the round platform notch of round platform shape, and the inside of round platform notch is provided with the reflector layer, diode wafer is located the inside of round platform notch.
As a further description of the above technical solution:
the first pin is a short pin, and the second pin is a long pin.
As a further description of the above technical solution:
the top tray is parallel to the bottom surface of the packaging cover body, and the distance between the top tray and the packaging cover body is 5-30MM.
As a further description of the above technical solution:
the bottom of the top disc is a plane, and a supporting table protruding upwards is arranged at the center of the top disc.
As a further description of the above technical solution:
the top tray and the packaging cover body are made of transparent resin.
The utility model has the following beneficial effects:
1. compared with the prior art, the LED packaging structure has the advantages that the first side expanding part is arranged on the side face of the first pin, the second side expanding part is arranged on the side face of the second pin, the top disc is arranged between the first side expanding part and the second side expanding part, the bottom of the top disc can be contacted with the upper surface of the circuit board when the LED is mounted on the circuit board, a tight fitting state is formed, the packaging cover body and the inside packaged structure are not easy to bend, the pins are protected well, the pins are not easy to break, a gap still exists between the bottom of the packaging cover body and the top of the packaging cover body, the heat dissipation performance of the LED is not affected, and the LED packaging structure has longer service life.
Drawings
Fig. 1 is a perspective view of a light emitting diode package structure according to the present utility model;
fig. 2 is a front view of a light emitting diode package structure according to the present utility model;
fig. 3 is an internal perspective view of the led package structure according to the present utility model.
Legend description:
1. a first base; 2. a second base; 3. a first pin; 31. a first side display; 4. a second pin; 41. a second side spreading portion; 5. a circular truncated cone notch; 6. a diode wafer; 7. wiring; 8. a top tray; 9. and packaging the cover body.
Detailed Description
Referring to fig. 1-3, the light emitting diode package structure provided by the present utility model: comprising a first base 1, a second base 2, a diode die 6, a first pin 3, a second pin 4, and a top disk 8.
The diode chip 6 is fixed at the top of the first base 1, the first base 1 is electrically connected with a first pole of the diode chip 6, the second base 2 is electrically connected with a second pole of the diode chip 6 through a wiring 7, the wiring 7 is a gold wire, the outsides of the first base 1, the second base 2, the diode chip 6 and the wiring 7 are provided with a packaging cover 9, the bottom of the first base 1 is fixedly connected with a first pin 3, the side surface of the first pin 3 is provided with a first side expanding part 31, the first side expanding part 31 and the first pin 3 are in an integrated structure, the first pin 3 and the first base 1 are in a welding structure, the bottom of the second base 2 is fixedly connected with a second pin 4, the side surface of the second pin 4 is provided with a second side expanding part 41, the second side expanding part 41 and the second pin 4 are in an integrated structure, the second pin 4 and the second base 2 are in a welding structure, the second side expanding part 41 and the first side expanding part 31 are in the same height, and a top disc 8 is arranged between.
The top plate 8 is spaced from the bottom surface of the package cover 9, and the top portions of the first and second leads 3, 4 are encapsulated inside the package cover 9.
In an embodiment, the top of the first base 1 is provided with a truncated cone shaped truncated cone recess 5, the inside of the truncated cone recess 5 is provided with a reflective layer, and the diode chip 6 is located inside the truncated cone recess 5.
The circular truncated cone notch 5 is arranged as a circular truncated cone with a large upper part and a small lower part, and is opened upwards, and the reflecting layer refracts the diode wafer 6 upwards, so that light rays are basically emitted upwards.
The first pin 3 is a short pin and the second pin 4 is a long pin. So as to distinguish the cathode and the anode, the long pin is set as the anode in the current industry.
The top tray 8 is parallel to the bottom surface of the package cover 9 with a distance between 5 MM and 30MM. The distance between the two is mainly determined according to the size of the package cover 9 and the occurrence of the diode chip 6, and is generally not more than 30MM, and the arrangement of the top tray 8 is meaningless after the distance is more than 30MM.
The bottom of the top tray 8 is a plane, and a supporting table protruding upwards is arranged at the top center of the top tray 8.
The top plate 8 and the packaging cover 9 are made of transparent resin.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (6)
1. The light-emitting diode packaging structure comprises a first base (1), a second base (2) and a diode wafer (6), and is characterized in that: diode wafer (6) are fixed at the top of first basal portion (1), and first basal portion (1) and diode wafer (6) first utmost point electric connection, second basal portion (2) are through wiring (7) and diode wafer (6) second pole electric connection, the outside of first basal portion (1), second basal portion (2), diode wafer (6), wiring (7) is provided with encapsulation cover body (9), the bottom fixedly connected with first pin (3) of first basal portion (1), the side of first pin (3) is provided with first side exhibition portion (31), the bottom fixedly connected with second pin (4) of second basal portion (2), the side of second pin (4) is provided with second side exhibition portion (41), and second side exhibition portion (41), first side exhibition portion (31) are in same height to be provided with top dish (8) between.
2. The light emitting diode package structure of claim 1, wherein: the top of the first base part (1) is provided with a round table notch (5) in a round table shape, the inside of the round table notch (5) is provided with a reflecting layer, and the diode wafer (6) is positioned in the round table notch (5).
3. The light emitting diode package structure of claim 1, wherein: the first pins (3) are short pins, and the second pins (4) are long pins.
4. The light emitting diode package structure of claim 1, wherein: the top tray (8) is parallel to the bottom surface of the packaging cover body (9), and the distance between the top tray and the packaging cover body is 5-30MM.
5. The light emitting diode package structure of claim 1, wherein: the bottom of the top disc (8) is a plane, and a supporting table protruding upwards is arranged at the top center of the top disc (8).
6. The light emitting diode package structure of claim 1, wherein: the top disc (8) and the packaging cover body (9) are made of transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321138792.XU CN220272498U (en) | 2023-05-12 | 2023-05-12 | Light-emitting diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321138792.XU CN220272498U (en) | 2023-05-12 | 2023-05-12 | Light-emitting diode packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220272498U true CN220272498U (en) | 2023-12-29 |
Family
ID=89298772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321138792.XU Active CN220272498U (en) | 2023-05-12 | 2023-05-12 | Light-emitting diode packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220272498U (en) |
-
2023
- 2023-05-12 CN CN202321138792.XU patent/CN220272498U/en active Active
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