CN111933778A - Thermoelectric separation type LED support and LED lamp bead - Google Patents

Thermoelectric separation type LED support and LED lamp bead Download PDF

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Publication number
CN111933778A
CN111933778A CN202010825805.5A CN202010825805A CN111933778A CN 111933778 A CN111933778 A CN 111933778A CN 202010825805 A CN202010825805 A CN 202010825805A CN 111933778 A CN111933778 A CN 111933778A
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CN
China
Prior art keywords
electrode
separation type
bonding pad
led support
thermoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010825805.5A
Other languages
Chinese (zh)
Inventor
皮保清
谢春望
熊林权
王小强
杨进
张瑶
聂伟苹
石红丽
闫玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Mulinsen Electronic Co ltd
Original Assignee
Zhongshan Mulinsen Electronic Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhongshan Mulinsen Electronic Co ltd filed Critical Zhongshan Mulinsen Electronic Co ltd
Priority to CN202010825805.5A priority Critical patent/CN111933778A/en
Publication of CN111933778A publication Critical patent/CN111933778A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/10—Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The invention discloses an LED lamp bead which comprises a thermoelectric separation type LED support and an LED chip arranged on the thermoelectric separation type LED support, wherein the thermoelectric separation type LED support comprises an optical cup, a bonding pad and an electrode which forms a spacing space with the bonding pad are arranged on one side of the optical cup, a reflecting cavity which enables the bonding pad to be exposed is formed in the optical cup, the LED chip fixed on the bonding pad is arranged in the reflecting cavity, and the LED chip is electrically connected with the electrode. In this structure, the pad and the electrode interval with LED chip lug connection set up for the heat that the LED chip produced is dispelled by the pad and the heat can't lead to the electrical property problem on a large amount of direct conduction to the electrode, promotes the optical property and the life of LED lamp.

Description

Thermoelectric separation type LED support and LED lamp bead
[ technical field ] A method for producing a semiconductor device
The application relates to the field of LED illumination, especially relates to thermoelectric separation's LED support and LED lamp pearl.
[ background of the invention ]
LED refers to a light emitting diode, which generally consists of an LED support and an LED chip packaged on the LED support. The luminous purity and luminous intensity of the LED lamp are severely affected by temperature. The temperature of the LED lamp is increased, so that the spectral width is increased, and the vividness of the light is influenced; the temperature of the LED lamp is increased, and meanwhile, the luminous intensity of the LED lamp is reduced, so that the service life of the product is influenced.
The luminous intensity of the LED lamp is positively correlated with the power of the LED lamp and the input current. The higher the power and the higher the input current, the more heat is generated. Due to the poor heat dissipation structure of the existing high-power LED lamp, the existing high-power LED lamp has serious light attenuation and short service life.
[ summary of the invention ]
The invention provides an improved high-power LED lamp, aiming at the problems of serious light attenuation and short service life of the high-power LED lamp caused by poor heat dissipation structure of the existing high-power LED lamp, and provides a thermoelectric separation type LED bracket which comprises a bonding pad for connecting and fixing an LED chip and an electrode which forms an interval space with the bonding pad and is used for being electrically connected with the LED chip.
The improved thermoelectric separation type LED support comprises an optical cup, wherein the bonding pad and the electrode are arranged on one side of the optical cup, and an embedding part which extends and is embedded into the interval space is arranged on the optical cup.
As an improvement of the thermoelectric separation type LED support, the electrode is provided with an electrode pin which protrudes outwards to be connected with electricity, and the electrode pin extends out of the outer side of the light cup.
As an improvement of the thermoelectric separation type LED support, the electrode includes a plurality of positive plates and a plurality of negative plates, and the positive plates and the negative plates are disposed at intervals on the outer peripheral side of the bonding pad.
As an improvement of the thermoelectric separation type LED support, the electrode is provided with a through hole penetrating through the electrode.
As an improvement of the thermoelectric separation type LED support, the electrodes are arranged in a step shape from large to small in a direction away from the reflective cavity.
As an improvement of the thermoelectric separation type LED support, the bonding pads are arranged in a step shape from large to small in a direction away from the reflective cavity.
As an improvement of the thermoelectric separation type LED support, a reflection cavity enabling the bonding pad to be exposed is formed in the light cup, the reflection cavity comprises a first reflection cavity, a second reflection cavity and a third reflection cavity which are sequentially arranged in the direction far away from the bonding pad, and the first reflection cavity, the second reflection cavity and the third reflection cavity are all in an inverted cone shape.
As an improvement of the thermoelectric separation type LED bracket, the bonding pad extends and protrudes towards the side surface of the light cup to form a bonding pad pin.
The invention provides an LED lamp bead, which is improved aiming at the problems of serious light attenuation and short service life of a high-power LED lamp caused by poor heat dissipation structure of the existing high-power LED lamp.
Compared with the prior art, the invention has the following advantages:
the invention provides an LED lamp bead which comprises a thermoelectric separation type LED support and an LED chip arranged on the thermoelectric separation type LED support, wherein the thermoelectric separation type LED support comprises an optical cup, a bonding pad and an electrode which forms a spacing space with the bonding pad are arranged on one side of the optical cup, a reflecting cavity which enables the bonding pad to be exposed is formed in the optical cup, the LED chip fixed on the bonding pad is arranged in the reflecting cavity, and the LED chip is electrically connected with the electrode. In this structure, the pad and the electrode interval with LED chip lug connection set up for the heat that the LED chip produced is dispelled by the pad and the heat can't lead to the electrical property problem on a large amount of direct conduction to the electrode, promotes the optical property and the life of LED lamp.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a perspective view of an LED lamp bead of the present application;
FIG. 2 is a cross-sectional view of an LED lamp bead of the present application;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is an exploded view of an LED lamp bead of the present application;
FIG. 5 is a schematic diagram of an electrical connection of an LED chip according to the present application;
FIG. 6 is a cross-sectional view in the direction of the front view of an LED lamp bead of the present application;
fig. 7 is a partial enlarged view of fig. 6 at B.
[ detailed description ] embodiments
In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clear and obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The LED lamp bead shown in fig. 1-7 includes a thermoelectric separation type LED support and an LED chip 8 disposed on the thermoelectric separation type LED support, the thermoelectric separation type LED support includes an insulating light cup 1, a pad 2 and an electrode 3 forming an interval space 100 with the pad 2 are disposed on one side of the light cup 1, an embedding portion 200 extending into the interval space 100 is disposed on the light cup 1, and specifically, the light cup 1 is made of plastic, such as an anti-aging and heat-resistant material: PPA, PCT, EMC, SMC, etc.; electrode 3 outwards protrudes and forms electrode pin 4 that is used for connecing the electricity, electrode pin 4 stretch out in 1 week outside of light cup, be formed with the messenger on the light cup 1 the 2 exposed reflection chambeies in upper end of pad 5, be equipped with in the reflection chamber 5 and fix on the pad 2 LED chip 8, LED chip 8 with electrode 3 electricity is connected, specifically, pad 2 is the five metals pad. In this structure, due to the obstruction of the space 100 and the embedding portion 200 disposed in the space 100, the heat generated by the LED chip 8 cannot be directly conducted to the electrode 3 in a large amount to raise the temperature of the electrode 3, thereby preventing the electrical problem caused by the over-high temperature, further raising the temperature of the LED chip 8 and affecting the brilliance of the light; meanwhile, the bonding pad 2 can quickly dissipate heat generated by the LED chip 8, and the influence of overhigh ambient temperature of the LED chip 8 on the luminous intensity of the LED lamp is prevented. In conclusion, the LED support adopts a thermoelectric separation structure, so that the electrical problem of the LED lamp caused by poor heat dissipation in the use process can be effectively reduced, and the optical performance and the service life of the LED lamp are improved.
Further, the area of the bonding pad 2 is larger than 150mm2The area of the reflecting cavity 5 is increased, so that the heat dissipation can be further accelerated, the optical performance of the product is further improved, and the service life of the product is further prolonged. Meanwhile, the area of the reflecting cavity 5 is increased, so that the number of the LED chips 8 which can be placed in the reflecting cavity is increased, and a single LED lamp is improvedThe light effect of the beads meets the requirements of different customers.
Specifically, the electrode 3 includes a plurality of positive electrode tabs 31 and negative electrode tabs 32, and the positive electrode tabs 31 and the negative electrode tabs 32 are spaced apart from each other on the outer peripheral side of the pad 2. The customer can flexibly adjust the circuit scheme according to the use requirement, and the circuit scheme can be connected in series or in parallel.
Further, the electrodes 3 are arranged in a step shape from big to small in the direction away from the reflection cavity 5; the bonding pad 2 is arranged in a step shape from big to small in the direction far away from the reflection cavity 5. The electrode 3 and the pad 2 are flattened by edge extension to form a step shape, and the structure enables the embedded part 200 extending into the interval space 100 to be fixedly connected to the electrode 3 and the pad 2 better, so that the combination degree and the sealing property of a product are improved.
Further, a through hole 6 penetrating through the electrode 3 is formed in the electrode 3. The light cup 1 is extended and embedded into the through hole 6, and the structure further improves the combination degree and the sealing property of the electrode 3 and the light cup 1.
Further, the reflective cavity 5 includes a first reflective cavity 51, a second reflective cavity 52 and a third reflective cavity 53 which are sequentially arranged in a direction away from the pad 2, and the first reflective cavity 51, the second reflective cavity 52 and the third reflective cavity 53 are all in an inverted straight cone shape. The reflecting cavity 5 is bowl-shaped, so that subsequent packaging of packaging glue is facilitated. Specifically, the included angle of the top of the right cone where the first reflection cavity 51 is located is 5-20 degrees, and preferably 10 degrees; the included angle of the top of the right cone where the second reflecting cavity 52 is located is 80-100 degrees, and preferably 94 degrees; the included angle of the top of the right cone where the third reflecting cavity 53 is located is 5-30 degrees, preferably 10 degrees, and the structure is beneficial for the cup wall of the reflecting cavity 5 to reflect the light emitted by the LED chip 8, so that the light emitting quantity is improved, and the structure is large in light emitting angle, uniform in light emitting and small in light spot.
Further, the bonding pad 2 extends and protrudes towards the side surface of the optical cup 1 to form a bonding pad pin 7. Pad pin 7 is in when electrode pin 4 damages failure, replace electrode pin 4 avoids electrode pin 4 damages the product of abandoning promptly when malfunctioning, prolongs the live time of product, practices thrift the cost.
It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present application. Furthermore, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing is illustrative of one or more embodiments provided in connection with the detailed description and is not intended to limit the disclosure to the particular forms disclosed. Similar or identical methods, structures, etc. as used herein, or several technical inferences or substitutions made on the concept of the present application should be considered as the scope of the present application.

Claims (10)

1. The thermoelectric separation type LED support is characterized by comprising a bonding pad (2) for connecting and fixing an LED chip (8), and an electrode (3) forming a spacing space (100) with the bonding pad (2) and electrically connected with the LED chip (8).
2. The thermoelectric separation type LED support according to claim 1, comprising an optical cup (1), wherein the bonding pad (2) and the electrode (3) are disposed on one side of the optical cup (1), and an embedding portion (200) extending into the spacing space (100) is disposed on the optical cup (1).
3. The thermoelectric separation type LED support according to claim 2, wherein the electrode (3) is provided with an electrode pin (4) protruding outwards for connecting with electricity, and the electrode pin (4) protrudes out of the light cup (1).
4. The thermoelectric separation type LED support according to claim 1, wherein the electrode (3) comprises a plurality of positive electrode sheets (31) and negative electrode sheets (32), and the positive electrode sheets (31) and the negative electrode sheets (32) are arranged at intervals on the outer peripheral side of the pad (2).
5. The thermoelectric split LED support according to claim 1, wherein the electrode (3) is provided with a through hole (6) disposed through the electrode (3).
6. The thermoelectric separation type LED support according to claim 1, wherein the electrodes (3) are arranged in a step shape from large to small in a direction away from the reflection cavity (5).
7. The thermoelectric separation type LED support according to claim 1, wherein the bonding pads (2) are arranged in a step shape from big to small in a direction away from the reflection cavity (5).
8. The thermoelectric separation type LED support according to claim 2, wherein a reflective cavity (5) exposing the bonding pad (2) is formed on the light cup (1), the reflective cavity (5) comprises a first reflective cavity (51), a second reflective cavity (52) and a third reflective cavity (53) which are sequentially arranged in a direction away from the bonding pad (2), and the first reflective cavity (51), the second reflective cavity (52) and the third reflective cavity (53) are all in an inverted cone shape.
9. The thermoelectric split LED support according to claim 2, wherein said bonding pad (2) extends and protrudes towards the side of said light cup (1) to form a bonding pad pin (7).
LED lamp bead, characterized in that it comprises a thermoelectric LED support according to any one of claims 1 to 9 and an LED chip (8) mounted on said thermoelectric LED support, said LED chip (8) being fixedly connected to said bonding pad (2) and electrically connected to said electrode (3).
CN202010825805.5A 2020-08-17 2020-08-17 Thermoelectric separation type LED support and LED lamp bead Pending CN111933778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010825805.5A CN111933778A (en) 2020-08-17 2020-08-17 Thermoelectric separation type LED support and LED lamp bead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010825805.5A CN111933778A (en) 2020-08-17 2020-08-17 Thermoelectric separation type LED support and LED lamp bead

Publications (1)

Publication Number Publication Date
CN111933778A true CN111933778A (en) 2020-11-13

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CN202010825805.5A Pending CN111933778A (en) 2020-08-17 2020-08-17 Thermoelectric separation type LED support and LED lamp bead

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904147A (en) * 2014-09-05 2019-06-18 光宝光电(常州)有限公司 Substrate and light emitting device comprising the substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101510542A (en) * 2008-02-13 2009-08-19 张秀梅 Encapsulation structure and manufacturing method for high power light-emitting diode chip
CN202434564U (en) * 2011-12-15 2012-09-12 深圳市长盈精密技术股份有限公司 LED (Light-Emitting Diode) thermoelectric separation bracket
JP2015162656A (en) * 2014-02-28 2015-09-07 Ｓｈマテリアル株式会社 Lead frame for led
CN209729952U (en) * 2019-06-05 2019-12-03 福建天电光电有限公司 A kind of high voltage bearing EMC supporting structure of thermoelectric separated

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101510542A (en) * 2008-02-13 2009-08-19 张秀梅 Encapsulation structure and manufacturing method for high power light-emitting diode chip
CN202434564U (en) * 2011-12-15 2012-09-12 深圳市长盈精密技术股份有限公司 LED (Light-Emitting Diode) thermoelectric separation bracket
JP2015162656A (en) * 2014-02-28 2015-09-07 Ｓｈマテリアル株式会社 Lead frame for led
CN209729952U (en) * 2019-06-05 2019-12-03 福建天电光电有限公司 A kind of high voltage bearing EMC supporting structure of thermoelectric separated

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904147A (en) * 2014-09-05 2019-06-18 光宝光电(常州)有限公司 Substrate and light emitting device comprising the substrate
CN109904147B (en) * 2014-09-05 2023-04-11 光宝光电(常州)有限公司 Substrate and light emitting device comprising same

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Application publication date: 20201113