CN220272472U - Heat dissipation type memory chip - Google Patents

Abstract

The utility model discloses a heat dissipation type memory chip in the technical field of memory chips, which comprises a chip body and a heat conduction shell, wherein the heat conduction shell is fixedly connected to the outer side wall of the chip body, the top and the bottom of the chip body are provided with mounting grooves, heat conduction fins are embedded in inner cavities of the mounting grooves at the upper side and the lower side, the outer side wall of the heat conduction fins at the upper side and the lower side is fixedly connected with a silica gel heat dissipation layer, heat dissipation holes are formed in the top of the silica gel heat dissipation layer and are uniformly distributed, heat dissipation pipes are embedded in the silica gel heat dissipation layer, and two ends of each heat dissipation pipe penetrate through the heat dissipation holes and extend to the inner part of the heat conduction shell.

Description

Heat dissipation type memory chip

Technical Field

The utility model relates to the technical field of memory chips, in particular to a heat dissipation type memory chip.

Background

The memory chip is a specific application of the concept of an embedded system chip in the memory industry, and realizes multiple functions and high performance by embedding software in a single chip, and the memory chip can quickly integrate all memory functions into one single chip, ensure the high performance of the optimized system, realize multiple functions and high performance by embedding software in the single chip, and support multiple protocols, multiple hardware and different applications.

The existing memory chip can generate heat during operation, if the memory chip cannot timely dissipate heat, the memory chip can be overheated and damaged, the temperature of the surrounding environment can be increased after the existing memory chip generates heat, and the memory chip can also influence the service life of the memory chip after working in a high-temperature environment for a long time.

Disclosure of Invention

The utility model aims to provide a heat dissipation type memory chip, which solves the problems that in the prior art, heat is generated when the conventional memory chip works, if the memory chip cannot timely dissipate heat, the memory chip is possibly overheated and damaged, the temperature of the surrounding environment is increased after the conventional memory chip generates heat, and the service life of the memory chip is influenced when the memory chip works in a high-temperature environment for a long time.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a heat dissipation formula memory chip, includes chip body and heat conduction casing, heat conduction casing fixed connection is in the lateral wall of chip body, open at the top and the bottom of chip body has the mounting groove, upper and lower both sides the inner chamber of mounting groove is embedded to have the conducting strip.

As a further description of the above technical solution:

and the outer side walls of the heat conducting fins on the upper side and the lower side are fixedly connected with a silica gel heat dissipation layer.

As a further description of the above technical solution:

the top of silica gel heat dissipation layer is opened there is the louvre, and evenly distributed.

As a further description of the above technical solution:

and a radiating pipe is embedded in the silica gel radiating layer.

As a further description of the above technical solution:

the two ends of the radiating pipe penetrate through the radiating holes and extend to the inside of the heat conducting shell.

As a further description of the above technical solution:

the upper side and the lower side of the front side wall and the rear side wall of the heat conduction shell are fixedly connected with exhaust holes, and the exhaust holes are communicated with the radiating pipes.

Compared with the prior art, the utility model has the beneficial effects that:

1. this heat dissipation formula memory chip, when storing the chip at the during operation, absorb the heat of chip body through the conducting strip in the mounting groove rather than direct contact on the chip body, transmit for silica gel heat dissipation layer afterwards, make outside air flow into silica gel heat dissipation layer by the louvre on the silica gel heat dissipation layer and cool down it to can last cooling down it at the chip body during operation.

2. This heat dissipation formula memory chip when the memory chip is in the during operation, through the louvre on the silica gel heat dissipation layer when the memory chip is in the rise of inside gas temperature, makes external gas blow to the high temperature gas around the heat conduction piece, and then high temperature gas is by the cooling tube quilt that runs through the louvre by the exhaust silica gel heat dissipation layer, is carried to the external world through the exhaust hole on the heat conduction casing to can get rid of the high temperature gas around the chip body, reduced the temperature of chip during operation surrounding environment.

Drawings

FIG. 1 is a schematic perspective view of a heat dissipation type memory chip according to the present utility model;

FIG. 2 is a schematic diagram illustrating a left-hand cross-sectional structure of a heat dissipation type memory chip according to the present utility model;

FIG. 3 is a schematic diagram of a heat dissipation type memory chip in front cross-sectional structure according to the present utility model;

fig. 4 is an enlarged schematic diagram of a heat dissipation type memory chip shown in fig. 2.

In the figure: 100. a chip body; 110. a mounting groove; 120. a heat conductive sheet; 130. a silica gel heat dissipation layer; 131. a heat radiation hole; 140. a heat radiating pipe; 200. a thermally conductive housing; 210. and an exhaust hole.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The utility model provides a heat dissipation type memory chip, which can continuously cool a chip body when the chip body works, can remove high-temperature gas around the chip body, reduces the temperature of the surrounding environment when the chip works, and referring to fig. 1-4, comprises a chip body 100 and a heat conduction shell 200;

referring to fig. 1 to 4 again, the chip body 100 is used for fixing the heat conducting fin 120, the top and the bottom of the chip body 100 are provided with the mounting groove 110, the mounting groove 110 is used for mounting the heat conducting fin 120, the inner cavities of the mounting grooves 110 on the upper side and the lower side are embedded with the heat conducting fin 120, the heat conducting fin 120 is used for absorbing heat of the chip body 100 and transmitting to the silica gel heat dissipation layer 130, the outer side walls of the heat conducting fin 120 on the upper side and the lower side are fixedly connected with the silica gel heat dissipation layer 130, the silica gel heat dissipation layer 130 is used for dissipating heat, the top of the silica gel heat dissipation layer 130 is provided with the heat dissipating holes 131, the heat dissipating holes 131 are used for enabling outside air to flow in the silica gel heat dissipation layer 130 and are uniformly distributed, the heat dissipating pipes 140 are embedded in the interior of the silica gel heat dissipation layer 130 and are used for discharging hot air around the chip body 100, and two ends of the heat pipes 140 penetrate through the heat dissipating holes 131 and extend to the interior of the heat conducting shell 200;

in summary, the chip body 100 can be continuously cooled when working;

referring to fig. 1 to 3 again, the heat conductive housing 200 is used for installing the vent holes 210, the heat conductive housing 200 is fixedly connected to the outer side wall of the chip body 100, the vent holes 210 are fixedly connected to the upper and lower sides of the front and rear side walls of the heat conductive housing 200, the vent holes 210 are used for exhausting the hot air in the heat dissipating tubes 140, the vent holes 210 are communicated with the heat dissipating tubes 140, when the storage chip is in operation, the temperature of the internal air is increased, the external air is blown to the high temperature air around the heat conducting fins 120 through the heat dissipating holes 131 on the silica gel heat dissipating layer 130, and then the high temperature air is exhausted from the heat dissipating tubes penetrating through the heat dissipating holes 131 to the silica gel heat dissipating layer 130 and is conveyed to the outside through the vent holes 210 on the heat conductive housing 200;

in summary, the high temperature gas around the chip body 100 can be removed, so that the temperature of the surrounding environment is reduced when the chip works;

when the chip is used specifically, when the chip is stored and operated, the heat of the chip body 100 is absorbed through the direct contact between the heat conducting fins 120 in the mounting groove 110 on the chip body 100 and the heat conducting fins, and then transferred to the silica gel heat dissipation layer 130, and when the temperature of the internal gas of the chip body 100 is raised, the external gas flows into the silica gel heat dissipation layer 130 to cool the internal gas through the heat dissipation holes 131 on the silica gel heat dissipation layer 130, so that the external gas blows to the high-temperature gas around the heat conducting fins 120, and then the high-temperature gas is discharged out of the silica gel heat dissipation layer 130 through the heat dissipation pipes penetrating through the heat dissipation holes 131 and is conveyed to the outside through the air exhaust holes 210 on the heat conducting shell 200.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (6)

1. A heat dissipation type memory chip, characterized in that: the chip comprises a chip body (100) and a heat conduction shell (200), wherein the heat conduction shell (200) is fixedly connected to the outer side wall of the chip body (100), a mounting groove (110) is formed in the top and the bottom of the chip body (100), and heat conduction sheets (120) are embedded in the inner cavities of the mounting groove (110) at the upper side and the lower side.

2. The heat dissipation type memory chip as set forth in claim 1, wherein: the outer side walls of the heat conducting fins (120) on the upper side and the lower side are fixedly connected with a silica gel heat dissipation layer (130).

3. The heat dissipation type memory chip as set forth in claim 2, wherein: the top of the silica gel heat dissipation layer (130) is provided with heat dissipation holes (131) which are uniformly distributed.

4. A heat dissipation type memory chip as defined in claim 3, wherein: and a radiating pipe (140) is embedded in the silica gel radiating layer (130).

5. The heat dissipation type memory chip as set forth in claim 4, wherein: both ends of the radiating pipe (140) penetrate through the radiating hole (131) and extend to the inside of the heat conducting shell (200).

6. The heat dissipation type memory chip as set forth in claim 5, wherein: the upper side and the lower side of the front side wall and the rear side wall of the heat conduction shell (200) are fixedly connected with exhaust holes (210), and the exhaust holes (210) are communicated with the radiating pipes (140).