CN220254791U - Buried wire covered metal plate, circuit board and LED lamp strip - Google Patents

Abstract

The utility model discloses a buried wire covered metal plate, a circuit board and an LED lamp strip, wherein the circuit board comprises a back solder mask layer, a middle circuit layer and a front circuit layer, the back solder mask layer, the middle circuit layer and the front circuit layer are sequentially overlapped up and down, the buried wire covered metal plate further comprises an adhesive, the back solder mask layer, the middle circuit layer and the front circuit layer are combined together by the adhesive, the front circuit layer and the middle circuit layer are overlapped at partial positions to form a double-layer metal position, the front circuit layer and the middle circuit layer are not overlapped at partial positions to form a single-layer metal position, the metal thickness of the double-layer metal position is larger than that of the single-layer metal position, the front circuit layer and the middle circuit layer are fixedly bonded through the adhesive, and the front circuit layer and the middle circuit layer are communicated; the front solder mask layer is arranged on the front circuit layer or/and the middle circuit layer. And an intermediate insulating film is omitted, and the manufacturing cost of the circuit board and the LED lamp strip is reduced.

Description

Buried wire covered metal plate, circuit board and LED lamp strip

Technical Field

The utility model relates to the field of LED lamp strips, in particular to a buried wire covered metal plate, a circuit board and an LED lamp strip.

Background

The LED lamp strip is manufactured by welding an element containing LEDs on a single-layer flexible circuit board or a double-layer flexible circuit board. For manufacturing the lamp strip by the double-layer circuit board, as the lamp strip is provided with the upper layer circuit and the lower layer circuit, one layer of circuit is generally special for arranging a main line connected with a power supply, a wider main line can be arranged, the current carrying is large, and the lamp strip is suitable for manufacturing a longer lamp strip; the lamp strip is manufactured by the single-layer circuit board, and the main line and all other circuits can only be arranged on one layer of circuit, so that the space occupied by the main line is smaller, the arranged main line is narrower, the current carrying is low, and the lamp strip is not suitable for being used as a longer lamp strip. The flexible circuit board is manufactured by removing unnecessary copper from a flexible metal-clad plate through etching or die cutting to form a circuit. The prior art is a flexible metal-clad plate formed by bonding and insulating two layers of copper foils through a polyimide film, wherein the flexible metal-clad plate is formed by bonding and insulating two layers of copper foils through a polyimide film, and is called as an adhesive-free flexible metal-clad plate in the industry, and the polyimide has good insulativity and stability; the second type is to make adhesive on both sides of polyimide film, generally epoxy adhesive or acrylic adhesive, and two layers of copper foil are respectively bonded together to form a double-layer flexible metal-clad plate, which is called as an adhesive double-layer metal-clad plate, and the insulating layer has three layers, because of the polyimide film in the middle, and the insulating property and stability in the middle are good. And thirdly, two layers of copper foils are respectively adhered by using adhesives manufactured on two sides of a PET or PEN film to form a double-layer flexible metal-clad plate, and the PET or PEN film has good insulativity and stability in the middle.

For the intermediate insulating layer, it acts as two: (1) bonding: connecting the front circuit layer and the back circuit layer into a whole; (2) insulation effect: the front wiring layer and the back wiring layer are insulated from each other by an insulating film. This structure has the following drawbacks: (1) the insulating film is arranged, and the circuits on two sides are insulated and separated through the insulating film, so that the insulating film occupies higher cost in the LED lamp strip circuit board, and the production cost of the LED lamp strip is difficult to further reduce; (2) the front circuit layer and the back circuit layer are conducted by arranging a conductive layer on the wall of the conducting hole and then copper plating; or two layers of circuits are conducted through soldering tin in the holes, so that the cost is increased, and cheaper aluminum can not be used for replacing copper in the two conducting modes, because the copper electroplating process is complex on the surface of the aluminum, and the copper plating conducting cost is higher; aluminum has poor solder properties and is not suitable for soldering to conduct two-sided wiring. Copper is much more expensive than aluminum, which also limits further cost reductions in manufacturing LED strips using double sided boards.

For this reason, improvements and optimizations are necessary to existing LED light strips.

Disclosure of Invention

The present utility model aims to solve at least one of the problems of the prior art. Therefore, the utility model provides the buried wire covered metal plate, the circuit board and the LED lamp strip, which omits an intermediate insulating film, allows one circuit layer to be manufactured by using cheaper metals such as aluminum and the like, and reduces the manufacturing cost of the circuit board and the LED lamp strip.

The technical scheme adopted for solving the technical problems is as follows:

in a first aspect, an embodiment of the present utility model provides a method for manufacturing a buried wire metal-clad plate, including:

preparing a wire, a metal foil and an adhesive, bonding and fixing the wire on the metal foil through the adhesive, manufacturing a back solder mask layer on the wire, and forming an intermediate circuit layer by the wire; or preparing metal foil and adhesive, bonding two layers of metal foil together through the adhesive, die-cutting one layer of metal foil through a die-cutting method, removing unnecessary metal to form an intermediate circuit layer, and manufacturing a back solder mask layer on the intermediate circuit layer; or preparing a film, a metal foil and a wire, manufacturing an adhesive on the metal foil or the metal foil and the film, and overlapping the film, the wire and the metal foil up and down to integrate the film, the wire and the metal foil, wherein the wire is positioned between the film and the metal foil, and the wire forms an intermediate circuit layer; or preparing a film with a metal layer and a metal foil, manufacturing the metal layer on the film into an intermediate circuit layer by an etching method or a die cutting method, manufacturing an adhesive on the metal foil or the intermediate circuit layer, and overlapping the film with the intermediate circuit layer and the metal foil up and down so that the film, the intermediate circuit layer and the metal foil are integrated, and the intermediate circuit layer is positioned between the film and the metal foil;

The metal foil is overlapped with the middle circuit layer at part of the positions to form a double-layer metal position, the metal foil is arranged at the position of the non-middle circuit layer to form a single-layer metal position, the metal thickness of the double-layer metal position is larger than that of the single-layer metal position, and the metal foil and the middle circuit layer are fixedly bonded through an adhesive and are communicated.

Optionally, the double-layer metal position is provided with a piercing hole, the piercing hole penetrates through the adhesive, or the piercing hole penetrates through the adhesive and the metal foil, or the piercing hole penetrates through the adhesive and the middle circuit layer, or the piercing hole penetrates through the adhesive, the metal foil and the middle circuit layer, so that at part or all of the piercing hole, the metal foil is in contact conduction with the middle circuit layer.

Optionally, the intermediate circuit layer is copper, aluminum, copper-clad aluminum, copper-aluminum clad alloy or copper-clad steel; the metal foil above the intermediate circuit layer is copper, copper-aluminum cladding, aluminum nickel plating or aluminum tin plating.

Optionally, the adhesive is acrylic adhesive, epoxy adhesive or polyurethane adhesive in a semi-cured state.

The embodiment of the first aspect of the utility model has at least one of the following advantages: the middle circuit layer and the metal foil are directly bonded through the adhesive, the characteristic that the metal foil and the middle circuit layer need to be conducted when the circuit board is manufactured is utilized, the technical prejudice that two layers of metals are isolated by using an insulating film in the prior art and conducted between the two layers of metals is realized through the conducting holes in the metal foil is abandoned, the manufacturing cost of the wire-embedding metal-clad plate is reduced, the adhesive is in an uncured state when the middle circuit layer and the metal foil are bonded and fixed through the adhesive, the adhesive between the middle circuit layer and the metal foil is partially squeezed out in the pressing process, the contact conduction between the middle circuit layer and the metal foil is promoted, the conducting holes are manufactured on the metal foil to be unnecessary, the aluminum material is allowed to be selected for one layer of the circuit layers, the problems that copper and soldering tin cannot be combined with aluminum or the working procedure is complicated in the prior art are solved, the manufacturing cost of the wire-embedding metal-clad plate is further reduced, the structure of the wire-embedding metal plate is simplified, the use of the insulating film is eliminated, the weight of the wire-embedding metal plate is also reduced, and the manufactured circuit board and the LED lamp strip have lighter weight and are beneficial to the phenomenon that the LED lamp strip is not to be broken and loose because the LED lamp strip is hung or is not easy to use.

In a second aspect, an embodiment of the present utility model provides a method for manufacturing a circuit board, including the method for manufacturing a buried wire covered metal plate according to any one of the embodiments of the first aspect, further including manufacturing a metal foil above an intermediate circuit layer into a circuit to form a front circuit layer, and manufacturing a front solder mask layer on the front circuit layer.

Optionally, before the adhesive between the metal foil and the middle circuit layer is cured, die cutting the metal foil by a die cutting method, and tearing away unnecessary metal to enable the metal foil to form a front circuit layer; or after the adhesive between the metal foil and the intermediate circuit layer is cured, etching the metal foil to form the front circuit layer by using an etching method.

Optionally, the front circuit layer is manufactured by a die cutting method, the front solder mask layer is a covered film with glue, the covered film is adhered to the front circuit layer, and then the glue on the adhesive and the covered film is solidified by pressing and heating; or the front circuit layer is manufactured by a die cutting method, the front solder mask layer is solder resist ink, the buried wire covered metal plate is die cut to manufacture a circuit, the circuit is pressed, then the solder resist ink is printed on the front circuit layer, and the adhesive and the solder resist ink are cured simultaneously by heating.

Optionally, the front circuit layer is manufactured by an etching method, the metal-clad plate is pressed and heated for solidification, then the metal foil is etched into the front circuit layer, the front solder mask layer is a covered film with glue, the covered film is adhered on the front circuit layer, and then the glue on the covered film is solidified by pressing and heating; or the front circuit layer is manufactured by an etching method, the metal-clad plate is pressed and heated for solidification, then the metal foil is etched into the front circuit layer, the front solder mask layer is solder resist ink, the solder resist ink is printed on the front circuit layer, and the solder resist ink is solidified by heating.

In a second aspect, an embodiment of the present utility model further provides a method for manufacturing a circuit board, including: preparing a single-sided metal-clad plate and a wire, and manufacturing a metal layer on the single-sided metal-clad plate into an intermediate circuit layer by a die cutting method or an etching method; bonding a wire on the front side of the middle circuit layer through an adhesive, forming a front circuit layer by the wire, enabling the front circuit layer and the middle circuit layer to be overlapped at partial positions to form a double-layer metal position, enabling the front circuit layer and the middle circuit layer not to be overlapped at partial positions to form a single-layer metal position, enabling the metal thickness of the double-layer metal position to be larger than that of the single-layer metal position, bonding and fixing the front circuit layer and the middle circuit layer through the adhesive in the double-layer metal position, and conducting the front circuit layer and the middle circuit layer; and a front solder mask layer is arranged on the front circuit layer or/and the middle circuit layer.

Optionally, the double-layer metal position is provided with a piercing hole, the piercing hole penetrates through the adhesive, or the piercing hole penetrates through the adhesive and the front circuit layer, or the piercing hole penetrates through the adhesive and the middle circuit layer, or the piercing hole penetrates through the adhesive, the front circuit layer and the middle circuit layer, so that at part or all of the piercing hole, the front circuit layer is in contact conduction with the middle circuit layer.

The second aspect of the embodiments of the present utility model has at least one of the following advantages: the middle circuit layer and the front circuit layer are directly bonded through the adhesive, the characteristic that the middle circuit layer and the middle circuit layer need to be conducted when the circuit board is manufactured is utilized, the technical prejudice that two layers of metals are isolated by using an insulating film in the prior art and conducted between the two layers of metals is realized through the conducting holes on the front circuit layer is abandoned, the manufacturing cost of the circuit board is reduced, the adhesive is in an uncured state when the middle circuit layer and the front circuit layer are bonded and fixed through the adhesive, the adhesive between the middle circuit layer and the front circuit layer is partially squeezed out in the pressing process, the contact conduction between the middle circuit layer and the front circuit layer is realized, the conducting holes are made of the aluminum material is not required, the problem that the electroplated copper and the soldering tin cannot be combined with the aluminum or the process is complex in the prior art is avoided, the manufacturing cost of the circuit board is further reduced, the structure of the circuit board is simplified, the use of the insulating film is eliminated, the weight of the circuit board is also reduced, the manufactured LED lamp strip has lighter weight, and the LED lamp strip is favorable for hanging the LED lamp strip to be used for preventing the LED lamp strip from being loose or broken.

In a third aspect, an embodiment of the present utility model provides a buried wire covered metal plate, including a back solder mask layer, an intermediate circuit layer, and a metal foil, where the back solder mask layer, the intermediate circuit layer, and the metal foil are stacked up and down in order, an adhesive is provided between the back solder mask layer and the metal foil, the adhesive bonds the back solder mask layer, the intermediate circuit layer, and the metal foil together, where the metal foil overlaps the intermediate circuit layer at a part of the positions to form a double-layer metal position, the metal foil forms a single-layer metal position at a non-intermediate circuit layer, where the metal thickness of the double-layer metal position is greater than that of the single-layer metal position, and where the metal foil is fixed with the intermediate circuit layer by adhesive bonding, and where the metal foil is conducted with the intermediate circuit layer.

Optionally, the double-layer metal position is provided with a piercing hole, the piercing hole penetrates through the adhesive, or the piercing hole penetrates through the adhesive and the metal foil, or the piercing hole penetrates through the adhesive and the middle circuit layer, or the piercing hole penetrates through the adhesive, the metal foil and the middle circuit layer, so that at part or all of the piercing hole, the metal foil is in contact conduction with the middle circuit layer.

Optionally, the intermediate circuit layer is copper, aluminum, copper-clad aluminum, copper-aluminum clad alloy or copper-clad steel; the metal foil above the intermediate circuit layer is copper, copper-aluminum cladding, aluminum nickel plating or aluminum tin plating.

The embodiment of the third aspect of the utility model has at least one of the following advantages: the middle circuit layer and the metal foil are directly bonded through the adhesive, the characteristic that the metal foil and the middle circuit layer need to be conducted when the circuit board is manufactured is utilized, the technical prejudice that two layers of metals are isolated by using an insulating film in the prior art and conducted between the two layers of metals is realized through the conducting holes in the metal foil is abandoned, the manufacturing cost of the wire-embedding metal-clad plate is reduced, the adhesive is in an uncured state when the middle circuit layer and the metal foil are bonded and fixed through the adhesive, the adhesive between the middle circuit layer and the metal foil is partially squeezed out in the pressing process, the contact conduction between the middle circuit layer and the metal foil is promoted, the conducting holes are manufactured on the metal foil to be unnecessary, the aluminum material is allowed to be selected for one layer of the circuit layers, the problems that copper and soldering tin cannot be combined with aluminum or the working procedure is complicated in the prior art are solved, the manufacturing cost of the wire-embedding metal-clad plate is further reduced, the structure of the wire-embedding metal plate is simplified, the use of the insulating film is eliminated, the weight of the wire-embedding metal plate is also reduced, and the manufactured circuit board and the LED lamp strip have lighter weight and are beneficial to the phenomenon that the LED lamp strip is not to be broken and loose because the LED lamp strip is hung or is not easy to use.

In a fourth aspect, an embodiment of the present utility model provides a circuit board, including a back solder mask layer, an intermediate circuit layer, and a front circuit layer, where the back solder mask layer, the intermediate circuit layer, and the front circuit layer are sequentially stacked up and down, and further including an adhesive, where the adhesive combines the back solder mask layer, the intermediate circuit layer, and the front circuit layer together, where the front circuit layer and the intermediate circuit layer overlap at a part of positions to form a double-layer metal position, where the front circuit layer and the intermediate circuit layer do not overlap at a part of positions to form a single-layer metal position, where the metal thickness of the double-layer metal position is greater than that of the single-layer metal position, where the front circuit layer and the intermediate circuit layer are fixed by adhesive bonding, and where the front circuit layer and the intermediate circuit layer are conducted; the front surface solder mask is arranged on the front surface circuit layer or/and the middle circuit layer.

Optionally, the double-layer metal position is provided with a piercing hole, the piercing hole penetrates through the adhesive, or the piercing hole penetrates through the adhesive and the front circuit layer, or the piercing hole penetrates through the adhesive and the middle circuit layer, or the piercing hole penetrates through the adhesive, the front circuit layer and the middle circuit layer, so that at part or all of the piercing hole, the front circuit layer is in contact conduction with the middle circuit layer.

Optionally, the thickness of the adhesive between the front circuit layer and the middle circuit layer is 3um-100um.

Optionally, the front surface solder mask layer is a cover film or solder mask ink.

Optionally, the front circuit layer and the middle circuit layer are one or two of copper, aluminum, copper-aluminum combination, copper-steel combination, aluminum-nickel combination or aluminum-tin combination, and the metals of the front circuit layer and the middle circuit layer are the same or different.

Optionally, when one layer is aluminum, the other layer is a metal other than aluminum.

Optionally, the adhesive is acrylic adhesive, epoxy adhesive or polyurethane adhesive.

The fourth aspect of the present utility model has at least one of the following advantages: the middle circuit layer and the front circuit layer are directly bonded through the adhesive, the characteristic that the middle circuit layer and the middle circuit layer need to be conducted when the circuit board is manufactured is utilized, the technical prejudice that two layers of metals are isolated by using an insulating film in the prior art and conducted between the two layers of metals is realized through the conducting holes on the front circuit layer is abandoned, the manufacturing cost of the circuit board is reduced, the adhesive is in an uncured state when the middle circuit layer and the front circuit layer are bonded and fixed through the adhesive, the adhesive between the middle circuit layer and the front circuit layer is partially squeezed out in the pressing process, the contact conduction between the middle circuit layer and the front circuit layer is realized, the conducting holes are made of the aluminum material is not required, the problem that the electroplated copper and the soldering tin cannot be combined with the aluminum or the process is complex in the prior art is avoided, the manufacturing cost of the circuit board is further reduced, the structure of the circuit board is simplified, the use of the insulating film is eliminated, the weight of the circuit board is also reduced, the manufactured LED lamp strip has lighter weight, and the LED lamp strip is favorable for hanging the LED lamp strip to be used for preventing the LED lamp strip from being loose or broken.

In a fifth aspect, an embodiment of the present utility model provides an LED strip, including the circuit board according to any one of the embodiments of the fourth aspect, and further including an electronic component soldered on the front circuit layer or the intermediate circuit layer.

Optionally, the double-layer metal position is provided with a plurality of piercing holes, and part or all of the piercing holes are provided with conductive objects, and the conductive objects conduct the front circuit layer and the middle circuit layer.

Optionally, the conductive material is tin or copper

The fifth aspect of the embodiments of the present utility model has at least one of the following advantages: the middle circuit layer and the front circuit layer are directly bonded through the adhesive, the characteristic that the middle circuit layer and the middle circuit layer need to be conducted when the circuit board is manufactured is utilized, the technical prejudice that two layers of metals are isolated by using an insulating film in the prior art and conducted between the two layers of metals is realized through the conducting holes on the front circuit layer is abandoned, the manufacturing cost of the circuit board is reduced, the adhesive is in an uncured state when the middle circuit layer and the front circuit layer are bonded and fixed through the adhesive, the adhesive between the middle circuit layer and the front circuit layer is partially squeezed out in the pressing process, the contact conduction between the middle circuit layer and the front circuit layer is realized, the conducting holes are made of the aluminum material is not required, the problem that the electroplated copper and the soldering tin cannot be combined with the aluminum or the process is complex in the prior art is avoided, the manufacturing cost of the circuit board is further reduced, the structure of the circuit board is simplified, the use of the insulating film is eliminated, the weight of the circuit board is also reduced, the manufactured LED lamp strip has lighter weight, and the LED lamp strip is favorable for hanging the LED lamp strip to be used for preventing the LED lamp strip from being loose or broken.

Drawings

FIG. 1 is a schematic view of the front structure of a film according to an embodiment of the present utility model;

FIG. 2 is a schematic cross-sectional view of the film of FIG. 1 after being rubberized;

FIG. 3 is a schematic plan view of a wire bonded to the adhesive film of FIG. 2;

FIG. 4 is a schematic cross-sectional view of FIG. 3;

FIG. 5 is a schematic plan view of a non-porous metal foil;

FIG. 6 is a schematic plan view of the metal foil of FIG. 5 after bonding to the structure of FIG. 3;

FIG. 7 is a schematic plan view of the structure of FIG. 6 with metal foil etched into the front side wiring layer;

FIG. 8 is a schematic plan view of the structure of FIG. 7 when a front side solder mask is fabricated;

FIG. 9 is a schematic plan view of a perforated glued metal foil;

FIG. 10 is a schematic plan view of the adhesive metal foil of FIG. 9 after bonding to the structure of FIG. 3;

FIG. 11 is a schematic plan view of the structure of FIG. 10 with metal foil etched into the front side wiring layer;

FIG. 12 is a schematic plan view of the structure of FIG. 11 when a front side solder mask is fabricated;

FIG. 13 is an exploded view of the film and foil with adhesive applied thereto;

FIG. 14 is a schematic cross-sectional view of the buried wire clad metal plate of FIG. 13 when the structures are integrated;

FIG. 15 is an exploded view of the metal foil with adhesive applied thereto;

FIG. 16 is a schematic cross-sectional view of the buried wire clad metal plate of FIG. 15 when the structures are integrated;

fig. 17 is a schematic plan view of a structure in which a wire is attached to an intermediate wiring layer (the wire forms a front wiring layer);

FIG. 18 is a schematic plan view of the front side solder mask layer of FIG. 17;

FIG. 19 is a schematic view of the cross-sectional structure of A-A in FIG. 17 (rotated 90 counterclockwise for ease of presentation of the drawings);

FIG. 20 is a schematic cross-sectional view of the front side solder mask layer of FIG. 19;

fig. 21 is a schematic view of a lateral cross section of a single wiring board (a longitudinal cross section, a cross section not passing through the front wiring layer, and thus not embodying the front wiring layer);

FIG. 22 is a schematic cross-sectional view of the front side solder mask of FIG. 21;

fig. 23 is a schematic longitudinal cross-sectional view (width-direction cross-section) of a single wiring board;

FIG. 24 is a schematic cross-sectional view of the front side solder mask layer of FIG. 23

Reference numerals illustrate: 1-film, 2-wire, 3-metal foil, 4-back solder mask, 5-middle circuit layer, 6-front circuit layer, 7-adhesive, 8-double-layer metal site, 9-single-layer metal site, 10-front solder mask, 11-bonding pad, 12-piercing hole.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, embodiments of the present utility model will be described in detail hereinafter with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments and features in the embodiments described below may be arbitrarily combined with each other.

The following provides many different embodiments, or examples, for implementing the methods and structures of the utility model.

Referring to fig. 1 to 20, an embodiment of a first aspect of the present utility model provides a method for manufacturing a buried wire metal plate:

example 1:

preparing an aluminum wire, a copper metal foil and an adhesive, wherein the adhesive is an acrylic adhesive (commercially available), the aluminum wire is adhered and fixed on the copper metal foil through the adhesive, specifically, the adhesive can be coated on the aluminum wire or the copper metal foil, then the aluminum wire and the copper metal foil are directly adhered, after the adhesion is finished, a PET film is selected as a back solder mask layer, the adhesive is coated on the back solder mask layer, then the back solder mask layer is adhered on the aluminum wire, the adhesive on the back solder mask layer is adhered with the copper metal foil at the same time, so that the aluminum wire, the copper metal foil and the back solder mask layer are firmly integrated to form a buried wire covered metal plate, an intermediate circuit layer is formed between the wire clamp and the copper metal foil, and after the adhesion, the buried wire covered metal plate can be pressed through a press, and the force and the condition of the pressing are well known technologies in the field, and the like, and are not repeated herein.

Example 2:

preparing copper metal foils and an adhesive, wherein the adhesive is epoxy adhesive (commercially available), coating an adhesive on one surface of a part of copper metal foils, bonding the copper metal foils coated with the adhesive and the copper metal foils not coated with the adhesive face to face, so that the two layers of metal foils can be combined together through the adhesive, or bonding all copper metal foils coated with the adhesive face to face, bonding the two layers of metal foils together, die-cutting one of the metal foils by a die-cutting method before the adhesive is cured, removing unnecessary metal to form an intermediate circuit layer, ensuring that the adhesive is not cured so that cut waste copper can be torn off when the die-cutting method is used for die-cutting, manufacturing a back solder mask on the intermediate circuit layer, and bonding and fixing the back solder mask on the intermediate circuit layer through the adhesive.

Example 3:

preparing a PET film, a copper-aluminum clad metal foil and a copper wire, coating an adhesive on the copper-aluminum clad metal foil, wherein the adhesive is epoxy adhesive, or coating the adhesive on the copper-aluminum clad metal foil and the PET film, then superposing the PET film, the copper wire and the copper-aluminum clad metal foil up and down to integrate the PET film, the copper wire and the copper-aluminum clad metal foil, wherein the copper wire is positioned between the PET film and the copper-aluminum clad metal foil, the copper wire forms an intermediate circuit layer, specifically referring to fig. 1, preparing a film 1 made of PET material, then coating the adhesive 7 to obtain the structure shown in fig. 2, bonding the wire 2 on the film 1 to obtain the structure shown in fig. 3 and 4, and bonding the adhesive on the surface of the wire 2 after coating the copper-clad aluminum metal foil 3 without holes with the adhesive to obtain the structure shown in fig. 6.

Example 4:

preparing a film with a metal layer and a metal foil, wherein a glue is arranged between the film and the metal layer, the metal layer is a copper layer, the film with the copper layer is called a single-sided copper-clad plate in the industry, the single-sided copper-clad plate is manufactured in the prior art, the film can also be obtained by directly purchasing from the market, the film is a PI film, and the metal foil is a copper foil; the copper layer on the film is manufactured into an intermediate circuit layer by an etching method or a die cutting method, specifically, when the glue between the film and the metal layer is not cured, the die cutting method can be adopted to manufacture the intermediate circuit layer, and after the glue between the film and the metal layer is cured, the etching method and the die cutting method are conventional technology for manufacturing the circuit layer in the industry and are not repeated here; and manufacturing an adhesive on the copper foil or the intermediate circuit layer, wherein the adhesive is polyurethane adhesive (commercially available), and the film with the intermediate circuit layer and the metal foil are overlapped up and down, so that the film, the intermediate circuit layer and the metal foil are integrated, and the intermediate circuit layer is positioned between the film and the metal foil.

In the above embodiments 1 to 4, the metal foil is overlapped with the intermediate circuit layer at a part of the positions to form a double-layer metal position, and the metal foil is formed at the non-intermediate circuit layer to form a single-layer metal position, so that the metal thickness of the double-layer metal position is larger than that of the single-layer metal position, and the double-layer metal position has larger current load due to the large metal thickness, and the thickness is smaller and the current load is smaller at the single-layer metal position; at double-deck metal level, bond fixedly through the adhesive between metal foil and the intermediate circuit layer for save the use of insulating film (among the prior art, the insulating film uses PI membrane or PET membrane to be numerous) between metal foil and the intermediate circuit layer, because metal foil and intermediate circuit layer are in uncured state when the pressfitting, and its thickness is also not big by oneself, under the effect of receiving the pressfitting, the adhesive between two-layer metal will be partly squeezed apart, can form the contact between metal foil and the intermediate circuit layer, thereby realize the switch-on of metal foil and intermediate circuit layer. More specifically, as shown in fig. 14 and 16, for the intermediate circuit layer, a certain edge angle is formed, and when the intermediate circuit layer is pressed, the edge angle punctures the uncured adhesive, so that a puncture hole is formed in the adhesive, and the edge angle is contacted with the metal foil after penetrating through the puncture hole to realize conduction.

In fig. 14 and 16, the piercing holes only penetrate through the adhesive, so as to realize more reliable conduction between the metal foil and the middle circuit layer, avoid possible conduction faults of the circuit board, and additionally provide independent piercing holes, specifically, a pressing die with a plurality of pressing nails is used, the pressing nails are aligned to the surface of the back solder mask layer and are pressed, the adhesive between the middle circuit layer and the metal foil is squeezed out to form the piercing holes, and the metal foil and the middle circuit layer are contacted at the piercing holes to realize conduction; or the extrusion nails not only extrude the adhesive between the metal foil and the middle circuit layer, but also pierce the middle circuit layer, so that the pierced holes penetrate through the adhesive and the middle circuit layer; or the extrusion nails aim at the surface of the metal foil and extrude the adhesive between the middle circuit layer and the metal foil to form piercing holes, or the extrusion nails extrude the adhesive between the metal foil and the middle circuit layer and pierce the metal foil at the same time, so that the piercing holes penetrate the adhesive and the metal foil; the extrusion nails can be arranged on two sides, namely one side of the extrusion nails is aligned with the surface of the metal foil, the other side of the extrusion nails is aligned with the surface of the back solder mask layer, so that the extrusion nails not only extrude the adhesive, but also pierce the metal foil and the middle circuit layer, and the pierced holes penetrate the adhesive, the metal foil and the middle circuit layer.

In order to achieve a more reliable conduction between the metal foil and the intermediate circuit layer, the puncture hole can also be made in the following way: referring specifically to fig. 9, fig. 9 shows a copper foil with adhesive, that is, the copper foil is already coated with adhesive, then an extrusion nail or a drilling machine is used to pierce the copper foil and the adhesive thereon to obtain piercing holes 12, the glued copper foil with piercing holes 12 shown in fig. 9 is attached to an intermediate circuit layer to obtain the buried wire metal-clad plate shown in fig. 10, when the buried wire metal-clad plate shown in fig. 10 is manufactured into an LED lamp strip, solder can be soldered in the piercing holes 12 to ensure reliable conduction between the front circuit layer and the intermediate circuit layer, and the piercing holes 12 can also be used as pads for welding external power sources, as shown in fig. 12, the piercing holes 12 are located at a cutting position, a consumer can cut the LED lamp strip at the cutting position as required, and then the anode and cathode wires are connected with the piercing holes 12 at the cutting position through solder.

In the above embodiment, the intermediate circuit layer may be any one of copper, aluminum, copper-clad aluminum, copper-aluminum clad or copper-clad steel; the metal foil above the intermediate circuit layer may be any of copper, aluminum copper plating, aluminum nickel plating, or aluminum tin plating.

An embodiment of a second aspect of the present utility model provides a method for manufacturing a circuit board, including the method for manufacturing a buried wire covered metal plate according to any one of the embodiments of the first aspect, further including manufacturing a metal foil above an intermediate circuit layer into a circuit to form a front circuit layer, and manufacturing a front solder mask layer on the front circuit layer, where on the basis of the foregoing embodiments 1 to 4, the method specifically includes:

example 5:

before the adhesive between the metal foil and the middle circuit layer is solidified, the metal foil is die-cut by a die-cutting method, unnecessary metal is removed by tearing, the metal foil forms a front circuit layer, the front solder mask layer is a covered film with glue, the covered film is adhered on the front circuit layer, then the covered film is pressed by a press, and after the pressed, the covered film is heated, so that the adhesive on the adhesive and the covered film is solidified, one-time pressed and heated are realized, the adhesive on the adhesive and the covered film can be synchronously solidified, the working procedures are reduced, and the production efficiency is improved.

Example 6:

before the adhesive between the metal foil and the middle circuit layer is solidified, the metal foil is die-cut by a die-cutting method, unnecessary metal is removed by tearing, so that the metal foil forms a front circuit layer, then the front circuit layer and the middle circuit layer are pressed together, so that the adhesion between the front circuit layer and the middle circuit layer is firm, then the front circuit layer is printed with solder resist ink (the solder resist ink is common in the industry), and after the solder resist ink is printed, the heat treatment is carried out, so that the adhesive and the solder resist ink are solidified.

Example 7:

after the adhesive between the metal foil and the intermediate circuit layer is cured, the metal foil is etched to form the front circuit layer using an etching method, and the adhesive is etched after curing, considering that caustic soda solution, particularly sodium hydroxide solution, is used in the etching process, and caustic soda easily breaks down the uncured adhesive. After the front circuit layer is manufactured by an etching method, a covering film with glue is selected as a front solder mask layer, the covering film is adhered to the front circuit layer, and then the glue on the covering film is solidified through pressing and heating procedures, so that the covering film is firmly and reliably combined on the front circuit layer.

Example 8:

after the adhesive between the metal foil and the intermediate circuit layer is cured, the metal foil is etched to form the front circuit layer using an etching method, and the adhesive is etched after curing, considering that caustic soda solution, particularly sodium hydroxide solution, is used in the etching process, and caustic soda easily breaks down the uncured adhesive. After the front circuit layer is manufactured by an etching method, the solder resist ink is selected as a front solder resist layer, the solder resist ink is directly printed on the front circuit layer, and the solder resist ink is solidified through a heating process, so that the solder resist ink is reliably combined with the front circuit layer.

Example 9:

the embodiment of the second aspect of the present utility model also provides another method for manufacturing a circuit board, including: preparing a single-sided metal-clad plate (in the embodiment, a PET film is combined with a copper layer, which is called a single-sided copper-clad plate) and a wire (in the embodiment, copper is selected), wherein the single-sided metal-clad plate comprises a film, a copper layer and glue between the film and the copper layer, the metal layer on the single-sided metal-clad plate is manufactured into an intermediate circuit layer through a die cutting method or an etching method, specifically, the intermediate circuit layer is manufactured through the die cutting method before the glue between the film and the copper layer is uncured, and the intermediate circuit layer is manufactured through the etching method after the glue between the film and the copper layer is cured; bonding a wire on the front side of the middle circuit layer through an adhesive, forming a front circuit layer by the wire, enabling the front circuit layer and the middle circuit layer to be overlapped at partial positions to form a double-layer metal position, enabling the front circuit layer and the middle circuit layer not to be overlapped at partial positions to form a single-layer metal position, enabling the metal thickness of the double-layer metal position to be larger than that of the single-layer metal position, bonding and fixing the front circuit layer and the middle circuit layer through the adhesive in the double-layer metal position, and conducting the front circuit layer and the middle circuit layer; and a front solder mask layer is arranged on the front circuit layer or/and the middle circuit layer. Referring specifically to fig. 17, which is a schematic plan view of the structure of the wires 2 when they are bonded to the intermediate circuit layer 5 by an adhesive, it can be seen that the wires 2 are overlapped on the intermediate circuit layer 5, the intermediate circuit layer 5 is overlapped with wires at the positive and negative main line positions, and the wires 2 are not overlapped at the auxiliary line positions; referring to fig. 18 specifically, after the wires 2 are bonded on the intermediate circuit layer 5, a front solder mask layer 10 is fabricated on the intermediate circuit layer 5, a pad window is opened on the front solder mask layer 10, and when the LED lamp strip is fabricated, the electronic component is soldered on the intermediate circuit layer through the pad window; it will be appreciated that the front side solder mask layer may also be disposed on both the front side wiring layer and the intermediate wiring layer formed by the wires so that the wires are not exposed. Fig. 19 and 20 are divided into sectional views (longitudinal sections) of fig. 17 and 18, fig. 17 to 20 are a plurality of rows of wiring boards (4 rows), and referring to fig. 21, a schematic cross-sectional view of a single wiring board is shown, a single metal level is shown in a section position not passing through the front wiring layer, a schematic longitudinal section of a single wiring board is shown in fig. 23, a double metal level is shown, and the bonding pad 11 is also shown in fig. 23. Embodiment 9 differs from embodiments 5-8 in that in embodiments 5-8, the metal foil is located above the intermediate circuit layer, when the metal foil is die-cut or etched to form the circuit layer, the circuit layer is a front circuit layer, whereas in embodiment 9, when the metal layer on the single-sided metal-clad plate is etched or die-cut to form the circuit layer, the circuit layer is used as the intermediate circuit layer, and the wires are bonded above the intermediate circuit layer by the adhesive, so that the wires form the front circuit layer, embodiment 9 has the same technical effects as embodiments 5-8, namely, in embodiment 9, the front circuit layer and the intermediate circuit layer are overlapped at a part of positions to form a double-layer metal position, and the front circuit layer and the intermediate circuit layer are not overlapped at a part of positions to form a single-layer metal position, thereby, the metal thickness of the double-layer metal position is larger than that of the single-layer metal position, and the double-layer metal position has a larger current load due to the large metal thickness, and the single-layer metal position has a smaller thickness, and the current load is small; the double-layer metal position is formed by bonding and fixing the front circuit layer and the middle circuit layer through the adhesive, so that the use of an insulating film is omitted between the front circuit layer and the middle circuit layer, and the thickness of the adhesive is not large when the front circuit layer and the middle circuit layer are pressed together, and the adhesive is acted by the pressing force, so that the uncured adhesive between the front circuit layer and the middle circuit layer can be locally squeezed out to form piercing holes, the contact between the front circuit layer and the middle circuit layer is realized, and the conduction between the front circuit layer and the middle circuit layer is realized.

Regarding the problem of the conduction of the front-side line layer and the intermediate line layer, in order to achieve more reliable conduction of the front-side line layer and the intermediate line layer, the piercing holes may be realized by a die with an extrusion pin, so that the piercing holes only penetrate the adhesive, or the piercing holes penetrate the adhesive and the intermediate line layer, or the piercing holes penetrate the adhesive and the front-side line layer; or the penetrating holes penetrate through the adhesive, the front circuit layer and the middle circuit layer, when the penetrating holes are formed in the middle circuit layer or the front circuit layer, as the middle circuit layer and the front circuit layer are made of metal, the hole edges of the penetrating holes axially extend to form a burr-like structure, and after the burr structure penetrates through the adhesive, part or all of the penetrating holes are in contact conduction with the middle circuit layer.

On the basis of the methods of examples 1 to 4, examples of the third aspect of the present utility model can be obtained: the utility model provides a buried wire covers metal sheet, includes back solder mask layer, intermediate circuit layer and metal foil, back solder mask layer, intermediate circuit layer and metal foil stack from top to bottom in proper order, have the adhesive between back solder mask layer and the metal foil, the adhesive combines together back solder mask layer, intermediate circuit layer and metal foil, the metal foil overlaps in some positions and has intermediate circuit layer to form double-deck metal level, and the metal foil forms individual layer metal level at non-intermediate circuit level, and the metal thickness of double-deck metal level is greater than the metal thickness of individual layer metal level, and at double-deck metal level, it is fixed through the adhesive bonding between metal foil and the intermediate circuit layer, switches on between metal foil and the intermediate circuit layer.

In this embodiment, the intermediate circuit layer is copper, aluminum, copper-clad aluminum, copper-aluminum clad alloy, or copper-clad steel; the metal foil above the intermediate circuit layer is copper, aluminum copper plating, aluminum nickel plating or aluminum tin plating.

On the basis of the methods of examples 5 to 9, an example of a fourth aspect of the present utility model can be obtained: the circuit board comprises a back solder mask layer 4, a middle circuit layer 5 and a front circuit layer 6, wherein the back solder mask layer 4, the middle circuit layer 5 and the front circuit layer 6 are sequentially overlapped up and down, the circuit board further comprises an adhesive 7, the adhesive 7 is used for combining the back solder mask layer 4, the middle circuit layer 5 and the front circuit layer 6 together, the front circuit layer 6 and the middle circuit layer 5 are overlapped at partial positions to form a double-layer metal position 8, the front circuit layer 6 and the middle circuit layer 5 are not overlapped at partial positions to form a single-layer metal position 9, the metal thickness of the double-layer metal position 8 is larger than that of the single-layer metal position 9, the double-layer metal position 8, the front circuit layer 6 and the middle circuit layer 5 are fixedly bonded through the adhesive 7, and the front circuit layer 6 and the middle circuit layer 5 are conducted; the circuit board further comprises a front solder mask layer 10, the front solder mask layer 10 is arranged on the front circuit layer 6 or/and the middle circuit layer 5, in fig. 19, the circuit board is not provided with the front solder mask layer 10, in fig. 20, the front solder mask layer 10 is provided on the middle circuit layer 5, it is understood that the front solder mask layer can be provided on the front circuit layer only, or provided on both the front circuit layer and the middle circuit layer, and the front solder mask layer can be a solder mask covering film or solder mask ink.

To achieve the conduction between the front wiring layer 6 and the intermediate wiring layer 5, in some embodiments of the present utility model, the double-layer metal site is provided with a penetrating hole (not shown in the drawings, refer to fig. 14, 16) penetrating the adhesive 7; in other embodiments, the pierced holes penetrate the adhesive 7 and the front side wiring layer 6; in other embodiments, the pierced holes penetrate the adhesive 7 and the intermediate wiring layer 5; in other embodiments, the pierced holes penetrate the adhesive 7, the front side wiring layer 6, and the intermediate wiring layer 5. Thereby, the front surface wiring layer 6 is brought into contact conduction with the intermediate wiring layer 5 at part or all of the piercing holes.

In some embodiments of the present utility model, the thickness of the adhesive 7 between the front circuit layer 6 and the middle circuit layer 5 is 3um-100um, and the thickness of the adhesive is too thin to be beneficial to the adhesion between the front circuit layer 6 and the middle circuit layer 5, and the thickness of the adhesive 7 is too thick to be beneficial to the contact conduction between the front circuit layer and the middle circuit layer, and to reduce the manufacturing cost of the circuit board when the adhesive is increased.

In some embodiments of the present utility model, the front circuit layer 6 and the intermediate circuit layer 5 are one or two of copper, aluminum, copper-aluminum bonding, copper-steel bonding, aluminum-nickel bonding, and aluminum-tin bonding, and the metals of the front circuit layer and the intermediate circuit layer are the same or different, so that the usable metal range of the front circuit layer and the intermediate circuit layer is enlarged, in particular, for the circuit layer that does not need to be soldered with an electronic component, aluminum with poor tin affinity can be directly used, as shown in fig. 19 and 20, the front circuit layer 6 can be selected from aluminum, which not only reduces the production cost, but also does not affect the reliable conduction between the front circuit layer and the intermediate circuit layer.

It can be understood that when one layer is aluminum and the other layer is metal other than aluminum, at least one layer of the front circuit layer 6 and the middle circuit layer is used for soldering the electronic component, and when both layers are aluminum, soldering fixation of the electronic component by soldering tin is affected.

In some embodiments of the present utility model, the adhesive 7 is an acrylic adhesive, an epoxy adhesive or a polyurethane adhesive, and the adhesive is easy to be extruded to form piercing holes when pressed by a pressing or extruding nail in an uncured state, and has good bonding force after curing, so that the front circuit layer and the middle circuit layer are well bonded.

An embodiment of the fifth aspect of the present utility model provides an LED strip, including the circuit board according to any one of the embodiments of the fourth aspect, and further including an electronic component soldered on the front circuit layer or the intermediate circuit layer, as shown in fig. 19 and 20, where the front solder resist layer 10 is disposed on the intermediate circuit layer 5, and the electronic component is soldered on the intermediate circuit layer, specifically, soldered on a pad of the intermediate circuit layer exposed at a front solder resist layer pad window.

In order to further improve the conduction reliability of the front circuit layer and the middle circuit layer, in some embodiments of the present utility model, the double-layer metal position is provided with a plurality of piercing holes, and a part or all of the piercing holes are provided with a conductive object, wherein the conductive object conducts the front circuit layer and the middle circuit layer, and the conductive object can be tin or copper, specifically, when an electronic component is soldered, solder can be performed in the piercing holes, or electroplated copper can be formed in the piercing holes by electroplating.

The middle circuit layer and the front circuit layer are directly bonded through the adhesive, the characteristic that the middle circuit layer and the middle circuit layer need to be conducted when the circuit board is manufactured is utilized, the technical prejudice that two layers of metals are isolated by using an insulating film in the prior art and conducted between the two layers of metals is realized through the conducting holes on the front circuit layer is abandoned, the manufacturing cost of the circuit board is reduced, the adhesive is in an uncured state when the middle circuit layer and the front circuit layer are bonded and fixed through the adhesive, the adhesive between the middle circuit layer and the front circuit layer is partially squeezed out in the pressing process, the contact conduction between the middle circuit layer and the front circuit layer is realized, the conducting holes are made of the aluminum material is not required, the problem that the electroplated copper and the soldering tin cannot be combined with the aluminum or the process is complex in the prior art is avoided, the manufacturing cost of the circuit board is further reduced, the structure of the circuit board is simplified, the use of the insulating film is eliminated, the weight of the circuit board is also reduced, the manufactured LED lamp strip has lighter weight, and the LED lamp strip is favorable for hanging the LED lamp strip to be used for preventing the LED lamp strip from being loose or broken.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims (13)

1. A buried wire covered metal plate is characterized in that: the metal foil is overlapped with the middle circuit layer at a part of the position to form a double-layer metal position, the metal foil is positioned at a non-middle circuit layer to form a single-layer metal position, the metal thickness of the double-layer metal position is larger than that of the single-layer metal position, and the metal foil and the middle circuit layer are fixedly bonded through the adhesive at the double-layer metal position, so that the metal foil is communicated with the middle circuit layer.

2. A buried wire clad metal plate according to claim 1, wherein: the double-layer metal position is provided with a piercing hole, the piercing hole penetrates through the adhesive, or the piercing hole penetrates through the adhesive and the metal foil, or the piercing hole penetrates through the adhesive and the middle circuit layer, or the piercing hole penetrates through the adhesive, the metal foil and the middle circuit layer, so that the metal foil is in contact conduction with the middle circuit layer at part or all of the piercing hole.

3. A buried wire coated metal sheet according to claim 1 or 2, characterized in that: the middle circuit layer is copper, aluminum, copper-clad aluminum, copper-aluminum clad alloy or copper-clad steel; the metal foil above the intermediate circuit layer is copper, copper-aluminum cladding, aluminum nickel plating or aluminum tin plating.

4. A circuit board, characterized in that: the back surface solder mask layer, the middle circuit layer and the front surface circuit layer are sequentially overlapped up and down, the back surface solder mask layer, the middle circuit layer and the front surface circuit layer are combined together by the adhesive, the front surface circuit layer and the middle circuit layer are overlapped at partial positions to form a double-layer metal position, the front surface circuit layer and the middle circuit layer are not overlapped at partial positions to form a single-layer metal position, the metal thickness of the double-layer metal position is larger than that of the single-layer metal position, the front surface circuit layer and the middle circuit layer are fixed through adhesive bonding at the double-layer metal position, and the front surface circuit layer is communicated with the middle circuit layer; the front surface solder mask is arranged on the front surface circuit layer or/and the middle circuit layer.

5. The circuit board of claim 4, wherein: the double-layer metal position is provided with a piercing hole, the piercing hole penetrates through the adhesive, or the piercing hole penetrates through the adhesive and the front circuit layer, or the piercing hole penetrates through the adhesive and the middle circuit layer, or the piercing hole penetrates through the adhesive, the front circuit layer and the middle circuit layer, so that at part or all of the piercing hole, the front circuit layer is in contact conduction with the middle circuit layer.

6. The circuit board of claim 4, wherein: the thickness of the adhesive between the front circuit layer and the middle circuit layer is 3um-100um.

7. The circuit board of claim 4, wherein: the front surface solder mask layer is a cover film or solder mask ink.

8. A circuit board according to any one of claims 4-7, wherein: the front circuit layer and the middle circuit layer are one or two of copper, aluminum, copper-aluminum combination, copper-steel combination, aluminum-nickel combination or aluminum-tin combination, and the metals of the front circuit layer and the middle circuit layer are the same or different.

9. The circuit board of claim 8, wherein: and when one layer is aluminum, the other layer is metal except aluminum.

10. The circuit board of claim 4, wherein: the adhesive is acrylic acid series adhesive, epoxy series adhesive or polyurethane series adhesive.

11. The utility model provides a LED lamp area which characterized in that: a circuit board comprising any of claims 4-10, further comprising electronic components soldered to the front side circuit layer or the intermediate circuit layer.

12. An LED light strip as set forth in claim 11, wherein: the double-layer metal position is provided with a plurality of piercing holes, and part or all of the piercing holes are provided with conductive objects, and the conductive objects conduct the front circuit layer and the middle circuit layer.

13. The LED strip of claim 12, wherein: the conductive material is tin or copper.