CN217307968U - Mix conducting material circuit board - Google Patents
Mix conducting material circuit board Download PDFInfo
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- CN217307968U CN217307968U CN202122458823.7U CN202122458823U CN217307968U CN 217307968 U CN217307968 U CN 217307968U CN 202122458823 U CN202122458823 U CN 202122458823U CN 217307968 U CN217307968 U CN 217307968U
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Abstract
The utility model discloses a mixed conducting material circuit board, including the first circuit layer, insulating layer, second circuit layer, adhesive layer and the third circuit layer of laminating in proper order, first circuit layer and third circuit layer are the copper foil, and second circuit layer is the aluminium foil, and the circuit board is equipped with the via hole that first circuit layer leads to on the third circuit layer, adds the metal strip or the sheetmetal that can weld with the tin cream when applying the tin cream soldering on the via hole; the utility model provides a mixed conducting material circuit board that copper product and aluminium mix. The technical problem that the aluminum can not be soldered is solved, the copper material and the aluminum material can be effectively conducted by the solder paste, and meanwhile, the complete stacking state of the solder paste is ensured.
Description
Technical Field
The utility model relates to a LED circuit board, more specifically say, especially relate to a mix conducting material circuit board.
Background
It is known that aluminum metal is very easy to oxidize, and is easy to corrode under acid and alkali conditions, and can not be used for mounting electronic components and soldering on the surface of aluminum directly. The double-sided integrated circuit board is provided with electronic components, and has another important function of conducting two layers of integrated circuits, and based on the reasons that aluminum is very easy to oxidize and is very easy to corrode by acid and alkali, the conducting methods such as an electroplating conducting method, a through silver conducting method, a through copper conducting method, a through carbon conducting method, a through tin welding conducting method and the like which are well known in the prior art can not safely and effectively conduct a double-sided circuit board with a double-sided aluminum structure or a double-sided aluminum-copper structure. Particularly, when the common soldering is adopted, irregular tin stacks are formed on the surface of the circuit board, and effective soldering conduction cannot be realized.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is not enough to the above-mentioned of prior art, a mixed conducting material circuit board that copper product and aluminium mix is provided. The technical problem that the aluminum can not be soldered is solved, the copper material and the aluminum material can be effectively conducted through the solder paste, and meanwhile, the complete stacking state of the solder paste is guaranteed.
The utility model discloses set the circuit board for three-layer or the circuit layer structure more than the three-layer, will need fall into two-layer thinner circuit layer with the circuit layer of thick copper, play the transmission efficiency on this two-layer circuit layer's copper foil thickness sum single layer circuit layer.
The technical scheme of the utility model is like this: the utility model provides a mix conducting material circuit board, includes first circuit layer, insulating layer, second circuit layer, adhesive layer and the third circuit layer of laminating in proper order, wherein: the first circuit layer and the third circuit layer are made of copper foil, the second circuit layer is made of aluminum foil, the circuit board is provided with a via hole from the first circuit layer to the third circuit layer, and a tin pile which is high when a metal strip or a metal sheet which can be combined with tin soldering is conducted with the tin soldering is arranged at the via hole.
Adopt above-mentioned technical scheme the utility model discloses, through add can with tin cream welded metal strip or sheetmetal when applying the tin cream soldering on the conducting hole, metal strip or sheetmetal reduce aluminium foil and soldering repulsion effect, help tin cream forms complete heap high state at the face, tin is piled and is become integrative heap high state with metal strip or sheetmetal behind the soldering to realize that the aluminium foil replaces the copper poise and do not influence the technological effect that the soldering switched on when adopting the soldering. The technical problem that the aluminum cannot be soldered is solved when the mixed conductive material circuit board with the mixed copper material and the mixed aluminum is realized, the copper material and the aluminum material can be effectively soldered and conducted, and meanwhile, the complete stacking state of the solder paste is ensured. After tin welding, tin bodies in the conducting holes form tin piles on the surface of the first circuit layer board, effective welding conduction is formed on the surface of the third circuit layer board, and the aluminum foil layer of the second circuit layer is clamped and arranged in the first circuit layer board through riveting heads at two ends to achieve an effective conduction state. The technical problems that aluminum cannot be soldered and the aluminum material of the first circuit layer and the third circuit layer and the aluminum material of the second circuit layer can be effectively soldered and conducted are solved, and the technical effect that the aluminum cannot be soldered and the aluminum material of the first circuit layer and the third circuit layer falls off after being soldered is achieved. Through copper product and aluminum product effective combination switch on, realize that copper product and aluminum product can effectively switch on simultaneously through utilizing the realization of aluminum product heat radiation characteristic to have good heat conduction effect, have safety, transmission signal and heat conduction effectively, heat dissipation and the longer technological effect of life who lets electronic components. The technical effect of saving cost is realized under the condition of not influencing the quality and the efficacy of the product.
In the circuit board made of the mixed conducting material, the second circuit layer and the third circuit layer have a thickening effect mutually and keep conduction along the length direction. The circuit board is set to be three-layer or more than three-layer circuit layer structure, still is equipped with the third circuit layer that plays the thickening effect to it through the second circuit layer outward, will need to divide into two-layer thinner circuit layer with the circuit layer of thick copper, plays the electric effect sum on this two-layer circuit layer, reaches the electric effect with single circuit layer, plays material saving cost and reduces the effect of making the degree of difficulty.
In the circuit board made of the mixed conducting material, the second circuit layer and the third circuit layer are arranged uninterruptedly along the length direction. Through setting up along the incessant second circuit layer and the third circuit layer that sets up of length direction, realize the technological effect of each other's thickening effect.
In the circuit board made of the mixed conductive material, the adhesive layer between the second circuit layer and the third circuit layer is a conductive or non-conductive pure adhesive film or an insulating film with an adhesive on both sides.
In the mixed conducting material circuit board, the metal strip or the metal sheet is horizontally arranged on the via hole. The metal strip or the metal sheet is horizontally arranged on the through hole, so that the solder paste is helped to form a horizontal complete stacking state on the board surface.
According to the mixed conductive material circuit board, the metal strips or the metal sheets are automatically subjected to surface mounting soldering or manual soldering through the surface mounting machine.
In the mixed conducting material circuit board, the conducting holes penetrating through the first circuit layer, the insulating layer, the second circuit layer and the adhesive layer are arranged at the corresponding positions of the lamp strip, and solder paste is applied to the conducting holes to conduct the first circuit layer, the second circuit layer and the third circuit layer. First circuit layer, second circuit layer and third circuit layer are switched on simultaneously through the tin cream, realize second circuit layer and third circuit layer and play the thickening effect each other and keep the technological effect who switches on along length direction. The utility model discloses set for the circuit layer structure more than three-layer or three-layer with the circuit board, will need fall into two-layer thinner circuit layer with the circuit layer of thick copper, the centre bonds with the pure plastic film, predetermine the conducting hole of having the welding, this conducting hole is when circuit board pastes dress electronic components, the tin cream is printed on in the lump, the welding switches on, like this, the circuit layer welding of two-layer thinner copper foil preparation is in the same place, just can play the transmission efficiency on this two-layer circuit layer's copper foil thickness sum single layer circuit layer.
In the mixed conducting material circuit board, the through hole penetrating through the first circuit layer and the insulating layer in the same position is larger than the through hole penetrating through the second circuit layer and the adhesive layer. Through the via hole that forms first circuit layer and insulating layer is greater than the via hole that passes second circuit layer and adhesive layer, realizes that whole via hole is the horn mouth, strengthens connecting the face when soldering through connection and guarantees the conduction effect.
In the circuit board made of the mixed conductive material, the first circuit layer, the second circuit layer and the third circuit layer are applied with the solder paste when the electronic element is pasted and conducted after passing through a welding furnace.
In the circuit board made of the mixed conductive material, the electronic component is attached to the first circuit layer. And mounting and conducting the electronic element through the positive and negative electrode combination of the first circuit layer.
The utility model relates to a tin soldering conduction method of a mixed conducting material circuit board,
the first circuit layer and the third circuit layer of the mixed conducting material circuit board are copper foils, the second circuit layer is aluminum foil,
the first circuit layer, the insulating layer, the second circuit layer and the adhesive layer are respectively provided with corresponding through holes,
the first circuit layer, the insulating layer, the second circuit layer, the adhesive layer and the third circuit layer which are sequentially attached form a via hole which is communicated from the first circuit layer to the third circuit layer,
and adding metal bars or metal sheets which can be welded with the tin into the through holes to conduct soldering tin conduction.
Adopt above-mentioned technical scheme the utility model discloses a soldering switch-on method carries out soldering tin through carrying out the soldering tin when switching on joining can with soldering's metal strip or sheetmetal in the conducting hole department and switch on. The metal bar or the metal sheet reduces the repulsion of the aluminum foil and the tin soldering, and helps the tin paste to form a complete stacking state on the plate surface, so that the technical effect that the tin soldering conduction is not influenced when the aluminum foil replaces the copper foil and the tin soldering is adopted is realized. The technical problem that the aluminum cannot be soldered is solved when the mixed conductive material circuit board with the mixed copper material and the mixed aluminum is realized, the copper material and the aluminum material can be effectively soldered and conducted, and meanwhile, the complete stacking state of the solder paste is ensured.
According to the soldering conduction method of the mixed conducting material circuit board, the metal strips or the metal sheets are automatically pasted with the sheet solder or manually pasted with the sheet solder by the sheet solder machine.
The utility model discloses the product still has following advantage compared with the conventional art, adopts the ordinary material with low costs of adoption in the three layer construction, separately processes third circuit layer and first, second circuit layer to do simple combination again after finishing separately, its material consumption is few, and the single processing combination, the article are protected the degree of difficulty and are low, and a yield improves by a wide margin. The die cutting process is adopted, the full-automatic integrated equipment processing process is realized, only a die needs to be set, no printing ink, chemical products, water and waste gas are required to be discharged, the consistency of the product is better, and the yield is higher.
Drawings
The invention will be described in further detail with reference to examples of embodiments shown in the drawings, which are not intended to limit the invention in any way.
Fig. 1 is a schematic cross-sectional structure diagram of the embodiment of the present invention before the completion of the conduction;
fig. 2 is a schematic cross-sectional view of the completed conducting package according to the embodiment of the present invention;
Detailed Description
As shown in fig. 1 and fig. 2, a mixed conductive material circuit board comprises a first circuit layer 1, an insulating layer 2, a second circuit layer 3, an adhesive layer 4 and a third circuit layer 5 which are sequentially attached, wherein the first circuit layer 1 and the third circuit layer 5 are copper foils, the second circuit layer 3 is an aluminum foil, the circuit board is provided with a via hole 6 from the first circuit layer 1 to the third circuit layer 5, a metal strip or a metal sheet 7 which can be combined with soldering is arranged at the via hole 6, and a tin pile 8 which is in a pile-up shape is formed when the soldering tin is conducted.
The third line layer 5 and the second line layer 3 act as a thickening and remain conductive along the length direction.
The second line layer 3 and the third line layer 5 are arranged uninterruptedly along the length direction.
The adhesive layer 4 between the second circuit layer 3 and the third circuit layer 5 is a conductive or non-conductive pure adhesive film or an insulating film with adhesive on both sides.
A metal strip or sheet 7 is horizontally disposed over the via 6.
The metal bar or the metal sheet 7 is automatically pasted with a sheet tin solder or manually soldered by a sheet tin solder machine.
And a through hole 6 penetrating through the first circuit layer 1, the insulating layer 2, the second circuit layer 3 and the adhesive layer 4 is arranged at a corresponding position of the lamp strip, and solder paste is applied to the through hole 6 to conduct the first circuit layer 1, the second circuit layer 3 and the third circuit layer 5.
The via hole through the first line layer 1 and the insulating layer 2 in the same position is larger than the via hole through the second line layer 3 and the adhesive layer 4.
The first circuit layer 1, the second circuit layer 3 and the third circuit layer 5 are applied with solder paste when mounting electronic components, and are conducted after passing through a soldering furnace.
The electronic component is attached to the first circuit layer 1.
A tin soldering conduction method of a circuit board made of mixed conductive materials,
the first circuit layer 1 and the third circuit layer 5 of the mixed conducting material circuit board are copper foils, the second circuit layer 3 is an aluminum foil,
the first circuit layer 1, the insulating layer 2, the second circuit layer 3 and the adhesive layer 4 are respectively provided with corresponding through holes,
the first circuit layer 1, the insulating layer 2, the second circuit layer 3, the adhesive layer 4 and the third circuit layer 5 which are sequentially attached form a through hole 6 which is communicated from the first circuit layer 1 to the third circuit layer 5,
and adding a metal bar or a metal sheet 7 which can be soldered with the tin into the through hole 6 to conduct soldering at the same time of conducting soldering.
The metal bar or the metal sheet 7 is automatically pasted with a sheet tin soldering or a manual tin soldering by a sheet sticking machine.
The specific implementation processing steps are as follows:
And 2, printing a first circuit layer on the copper surface of the base material according to the design requirement, and etching to prepare the first circuit layer for later use.
And 3, drilling positioning holes on the semi-finished product material prepared in the step 2, and drilling through holes of the first circuit layer 1 and the insulating layer 2 according to design data by adopting a CNC drilling machine tool, wherein the through holes are 6.2 mm-2.3 mm groove-shaped holes.
And 4, taking materials according to the design requirements of the second circuit layer 3, attaching the materials to an acid-resistant and alkali-resistant protective film, printing a circuit pattern of the second circuit layer 3, and etching for later use, wherein the second circuit layer of the embodiment is made of 70-micron pure aluminum foil.
And 5, attaching the second circuit layer manufactured in the step 4 to the adhesive film surface of the base material with the first circuit layer 1 and the conducting hole 6 manufactured in the step 3, and pressing and shaping the adhesive film surface by a fast press, wherein the pressing conditions of the fast press are as follows: the temperature is 180 ℃, the pressure is 120 kg, the prepressing is carried out for 15 seconds, and then the pressing is carried out for 80 seconds.
And 6, removing the acid-resistant and alkali-resistant protective film on the second circuit layer 3, and sticking an adhesive layer 4 (a pure adhesive film) on the exposed aluminum foil surface, wherein the pure adhesive film of the embodiment is an epoxy non-conductive adhesive film (commercially available), and the thickness of the adhesive film is 25 micrometers.
And 7, positioning by using the positioning hole punched in the step 3 on the base material, and drilling a through hole of the second circuit layer 3 and the adhesive layer 4 (a pure glue film) on the semi-finished product after the step 6 by adopting a CNC drilling machine tool, wherein the through hole of the second circuit layer 3 and the adhesive layer 4 (the pure glue film) drilled in the step is smaller than the through hole of the first circuit layer 1 and the insulating layer 2 drilled in the step 3, the through hole drilled in the embodiment is three in-line through holes with the diameter of 1.3mm and the interval of 0.55mm, and is arranged in the middle of the through hole of the first circuit layer 1 and the insulating layer 4 drilled in the step 3.
And 8, taking 70-micrometer copper foil, covering the copper foil on the PI covering film, curing at 150 ℃ for 60min, printing ink on the copper foil according to a designed pattern, etching and the like to manufacture a third circuit layer 5.
And 9, pasting the copper surface of the third circuit layer 5 manufactured in the step 8 to the surface of the semi-finished pure rubber film manufactured in the step 7, and performing press molding by a fast press, wherein the press molding conditions are as follows: the temperature is 180 ℃, the pressure is 120 kg, the prepressing is carried out for 15 seconds, and then the pressing is carried out for 80 seconds.
And 10, manufacturing a front protective layer according to the design, attaching the front protective layer to the copper surface of the first circuit layer 2 of the semi-finished product manufactured in the step 9, and pressing and molding the front protective layer and the copper surface by a pressing machine, wherein the back protective layer of the circuit board is finished in the step 8.
And 11, carrying out anti-oxidation treatment on the semi-finished product printed with the characters in the step 10, and punching and forming to finish the circuit board part of the embodiment.
Step 12, manufacturing a steel mesh for printing the solder paste, and applying the solder paste on the manufactured circuit board, wherein the steel mesh with the thickness of 0.15mm is adopted in the embodiment, and the electronic element bonding pad adopts the following steps of 1: 1.1, and the window of the via hole adopts a ratio of 1: the ratio of 1.2 is stated.
And step 13, pasting electronic elements (lamp beads) on the circuit board printed with the solder paste, pasting metal strips or metal sheets 7 at the positions of the through holes 6 at the same time, manually pasting the metal strips or the metal sheets 7 or pasting the metal strips or the metal sheets 7 by using an automatic chip mounter after weaving, adopting copper strips with the diameter of 0.5mm and the length of 5.5mm in the embodiment, arranging the central position on the surface of the solder paste at the positions of the through holes 6, and finishing pasting through reflow soldering.
And step 14, after the semi-finished product pasted with the electronic element and the metal strip is initially measured, connecting the semi-finished product end to form a 20-meter strip-shaped strip and connecting a wire end, so that the 20-meter high-power LED lamp strip is finished.
The utility model discloses functional data detects the table:
| length of | Rated voltage | Lamp bead/meter | Electric current | Total power | Head end voltage | Tail end voltage | Pressure drop |
| 20m | 24V | 120 | 5.53A | 135 watt | 23.8V | 20.5V | 3.3V |
| 10 m | 24V | 120 | 3.72A | 92W | 23.8V | 22.8V | 1.0V |
According to the measurement results, the 20-meter long high-power lamp strip for the 24V 120 lamp can reach the current of 5.53A and the total power of 135 watts, and the tail end voltage drop is controlled within 3.3V, so that the result is satisfactory.
Synthesize the preparation flow of this embodiment and see that do not need electroplating, do not need chemical materials such as costly dry film, do not need repeated preparation, 140 microns that will be thicker back line split into two thinner (70 microns) circuit layers to bond together through the pure glued membrane, form after the tin soldering and reach 140 microns, the high-power LED lamp area product of gross thickness, and change second circuit layer into the aluminium foil preparation, still greatly reduced the use cost of material when having reduced the preparation degree of difficulty.
In summary, the present invention has been made to practical samples according to the description and the drawings, and after a plurality of use tests, the utility model can be proved to achieve the expected purpose, and the practical value is undoubted. The above-mentioned embodiments are only used for convenience of illustration, and do not limit the present invention in any way, for example, the copper-clad aluminum foil can be used as the same as the pure copper foil in this patent. Any person who knows commonly in any field of technology can make local changes or modifications equivalent embodiments by using the technical content disclosed in the present invention without departing from the technical features of the present invention, and the technical content of the present invention does not depart from the technical features of the present invention, and all the technical contents still belong to the technical features of the present invention.
Claims (9)
1. The utility model provides a mix conducting material circuit board, includes first circuit layer (1), insulating layer (2), second circuit layer (3), adhesive layer (4) and third circuit layer (5) of laminating in proper order, its characterized in that: the first circuit layer (1) and the third circuit layer (5) are made of copper foil, the second circuit layer (3) is made of aluminum foil, the circuit board is provided with a through hole (6) from the first circuit layer (1) to the third circuit layer (5), a metal strip or a metal sheet (7) capable of being combined with tin soldering is arranged at the through hole (6), and a tin pile (8) in a pile height shape is formed when the tin soldering is conducted.
2. The circuit board of claim 1, wherein: the second circuit layer (3) and the third circuit layer (5) are arranged uninterruptedly along the length direction.
3. A circuit board of mixed conducting material according to claim 1, wherein: the adhesive layer (4) between the second circuit layer (3) and the third circuit layer (5) is a conductive or non-conductive pure adhesive film or an insulating film with adhesive on both sides.
4. The circuit board of claim 1, wherein: the metal strip or the metal sheet (7) is horizontally arranged on the through hole (6).
5. A circuit board of mixed conducting material according to claim 1 or 4, characterized in that: the metal bar or the metal sheet (7) is automatically attached with a sheet solder or manually soldered by a sheet solder machine.
6. The circuit board of claim 1, wherein: a through hole (6) penetrating through the first circuit layer (1), the insulating layer (2), the second circuit layer (3) and the adhesive layer (4) is formed in the corresponding position of the lamp strip, and solder paste is applied to the through hole (6) to conduct the first circuit layer (1), the second circuit layer (3) and the third circuit layer (5).
7. The circuit board of claim 5, wherein: the via hole penetrating through the first circuit layer (1) and the insulating layer (2) in the same position is larger than the via hole penetrating through the second circuit layer (3) and the adhesive layer (4).
8. The circuit board of claim 7, wherein: the first circuit layer (1), the second circuit layer (3) and the third circuit layer (5) are applied with solder paste when mounting electronic components, and are conducted after passing through a soldering furnace.
9. A circuit board of mixed conducting material according to claim 8, wherein: the electronic element is attached to the first circuit layer (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122458823.7U CN217307968U (en) | 2021-10-12 | 2021-10-12 | Mix conducting material circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122458823.7U CN217307968U (en) | 2021-10-12 | 2021-10-12 | Mix conducting material circuit board |
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| Publication Number | Publication Date |
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| CN217307968U true CN217307968U (en) | 2022-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122458823.7U Active CN217307968U (en) | 2021-10-12 | 2021-10-12 | Mix conducting material circuit board |
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| CN (1) | CN217307968U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905511A (en) * | 2021-10-12 | 2022-01-07 | 深圳市静宇鑫照明科技有限公司 | Mixed conductive material circuit board and soldering conduction method |
-
2021
- 2021-10-12 CN CN202122458823.7U patent/CN217307968U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905511A (en) * | 2021-10-12 | 2022-01-07 | 深圳市静宇鑫照明科技有限公司 | Mixed conductive material circuit board and soldering conduction method |
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